TWI354347B - Fast substrate loading on polishing head without m - Google Patents

Fast substrate loading on polishing head without m Download PDF

Info

Publication number
TWI354347B
TWI354347B TW096119819A TW96119819A TWI354347B TW I354347 B TWI354347 B TW I354347B TW 096119819 A TW096119819 A TW 096119819A TW 96119819 A TW96119819 A TW 96119819A TW I354347 B TWI354347 B TW I354347B
Authority
TW
Taiwan
Prior art keywords
substrate
elastic film
base member
chamber
central chamber
Prior art date
Application number
TW096119819A
Other languages
English (en)
Chinese (zh)
Other versions
TW200807615A (en
Inventor
Hung Chih Chen
Jeonghoon Oh
Andrew Nagengast
Steven M Zuniga
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200807615A publication Critical patent/TW200807615A/zh
Application granted granted Critical
Publication of TWI354347B publication Critical patent/TWI354347B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/11—Vacuum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW096119819A 2006-06-02 2007-06-01 Fast substrate loading on polishing head without m TWI354347B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US81041506P 2006-06-02 2006-06-02

Publications (2)

Publication Number Publication Date
TW200807615A TW200807615A (en) 2008-02-01
TWI354347B true TWI354347B (en) 2011-12-11

Family

ID=38802256

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096119819A TWI354347B (en) 2006-06-02 2007-06-01 Fast substrate loading on polishing head without m

Country Status (4)

Country Link
US (1) US7527271B2 (https=)
JP (1) JP2009539626A (https=)
TW (1) TWI354347B (https=)
WO (1) WO2007143566A2 (https=)

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FR2898657B1 (fr) * 2006-03-16 2008-04-18 Novatec Sa Procede de mise en oeuvre d'un support intercalaire universel
JP5074125B2 (ja) * 2007-08-09 2012-11-14 リンテック株式会社 固定治具並びにワークの処理方法
KR20100094466A (ko) * 2007-11-20 2010-08-26 신에쯔 한도타이 가부시키가이샤 연마 헤드 및 연마 장치
KR100931197B1 (ko) * 2008-02-22 2009-12-10 주식회사 실트론 웨이퍼 연마장치용 헤드 어셈블리
DE102008018536B4 (de) * 2008-04-12 2020-08-13 Erich Thallner Vorrichtung und Verfahren zum Aufbringen und/oder Ablösen eines Wafers auf einen/von einem Träger
JP5390807B2 (ja) * 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
US8454408B2 (en) * 2008-11-26 2013-06-04 Applied Materials, Inc. Load cup substrate sensing
AT516595B1 (de) * 2009-03-05 2020-10-15 Thallner Erich Vorrichtung und Verfahren zum Aufbringen und/oder Ablösen eines Wafers auf einen/von einem Träger
US8460067B2 (en) 2009-05-14 2013-06-11 Applied Materials, Inc. Polishing head zone boundary smoothing
JP5648954B2 (ja) * 2010-08-31 2015-01-07 不二越機械工業株式会社 研磨装置
KR101801264B1 (ko) * 2011-06-13 2017-11-27 삼성전자주식회사 반도체 제조 장치 및 이를 이용한 반도체 패키지 방법
WO2014034299A1 (ja) * 2012-08-28 2014-03-06 日産自動車株式会社 オイルシールの圧入装置
US8998677B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Bellows driven floatation-type abrading workholder
US9199354B2 (en) 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
US8845394B2 (en) 2012-10-29 2014-09-30 Wayne O. Duescher Bellows driven air floatation abrading workholder
US8998678B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
US9011207B2 (en) 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
US9604339B2 (en) 2012-10-29 2017-03-28 Wayne O. Duescher Vacuum-grooved membrane wafer polishing workholder
US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
US9039488B2 (en) 2012-10-29 2015-05-26 Wayne O. Duescher Pin driven flexible chamber abrading workholder
WO2014145456A1 (en) * 2013-03-15 2014-09-18 Rudolph Technologies, Inc. Flexible handling system for semiconductor substrates
CN111584354B (zh) * 2014-04-18 2021-09-03 株式会社荏原制作所 蚀刻方法
EP3234986B1 (en) * 2014-12-19 2023-03-08 Applied Materials, Inc. Components for a chemical mechanical polishing tool
KR102346786B1 (ko) * 2015-07-03 2022-01-04 주식회사 케이씨텍 화학 기계적 연마 시스템의 웨이퍼 로딩 장치
KR102461598B1 (ko) * 2015-12-18 2022-11-01 주식회사 케이씨텍 화학 기계적 연마 시스템의 기판 로딩 장치
US10510563B2 (en) * 2016-04-15 2019-12-17 Taiwan Semiconductor Manufacturing Company Ltd. Wafer carrier assembly
JP6650345B2 (ja) * 2016-05-26 2020-02-19 日本特殊陶業株式会社 基板保持装置及びその製造方法
US10618447B2 (en) * 2016-10-17 2020-04-14 Walmart Apollo, Llc Delivery vehicle and systems or parts thereof
KR102330274B1 (ko) * 2017-05-31 2021-11-24 주식회사 케이씨텍 기판 거치대 및 이를 구비한 기판 처리 장치
US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
CN110142689B (zh) * 2019-04-17 2021-09-14 杭州众硅电子科技有限公司 一种晶圆装载支架、晶圆装载系统及晶圆装片方法
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
US11945073B2 (en) * 2019-08-22 2024-04-02 Applied Materials, Inc. Dual membrane carrier head for chemical mechanical polishing
US11484987B2 (en) 2020-03-09 2022-11-01 Applied Materials, Inc. Maintenance methods for polishing systems and articles related thereto
US12550688B2 (en) * 2021-12-29 2026-02-10 Canon Kabushiki Kaisha Planarization process, apparatus and method of manufacturing an article
US20240363371A1 (en) * 2023-04-28 2024-10-31 Applied Materials, Inc. Substrate cleaning improvement

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US6398621B1 (en) * 1997-05-23 2002-06-04 Applied Materials, Inc. Carrier head with a substrate sensor
US5964653A (en) * 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6080050A (en) * 1997-12-31 2000-06-27 Applied Materials, Inc. Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus
US5993302A (en) * 1997-12-31 1999-11-30 Applied Materials, Inc. Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
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US6159079A (en) * 1998-09-08 2000-12-12 Applied Materials, Inc. Carrier head for chemical mechanical polishing a substrate
US6165058A (en) * 1998-12-09 2000-12-26 Applied Materials, Inc. Carrier head for chemical mechanical polishing
US6162116A (en) * 1999-01-23 2000-12-19 Applied Materials, Inc. Carrier head for chemical mechanical polishing
US6156124A (en) * 1999-06-18 2000-12-05 Applied Materials, Inc. Wafer transfer station for a chemical mechanical polisher
JP3816297B2 (ja) * 2000-04-25 2006-08-30 株式会社荏原製作所 研磨装置
US6722965B2 (en) * 2000-07-11 2004-04-20 Applied Materials Inc. Carrier head with flexible membranes to provide controllable pressure and loading area
US6857945B1 (en) * 2000-07-25 2005-02-22 Applied Materials, Inc. Multi-chamber carrier head with a flexible membrane
EP1177859B1 (en) * 2000-07-31 2009-04-15 Ebara Corporation Substrate holding apparatus and substrate polishing apparatus
US6848980B2 (en) * 2001-10-10 2005-02-01 Applied Materials, Inc. Vibration damping in a carrier head
US6652362B2 (en) * 2000-11-23 2003-11-25 Samsung Electronics Co., Ltd. Apparatus for polishing a semiconductor wafer and method therefor
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US7255771B2 (en) * 2004-03-26 2007-08-14 Applied Materials, Inc. Multiple zone carrier head with flexible membrane
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Also Published As

Publication number Publication date
JP2009539626A (ja) 2009-11-19
WO2007143566A3 (en) 2008-09-18
US20070289124A1 (en) 2007-12-20
TW200807615A (en) 2008-02-01
WO2007143566A2 (en) 2007-12-13
US7527271B2 (en) 2009-05-05

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