TWI353211B - - Google Patents

Download PDF

Info

Publication number
TWI353211B
TWI353211B TW093118507A TW93118507A TWI353211B TW I353211 B TWI353211 B TW I353211B TW 093118507 A TW093118507 A TW 093118507A TW 93118507 A TW93118507 A TW 93118507A TW I353211 B TWI353211 B TW I353211B
Authority
TW
Taiwan
Prior art keywords
coolant
gas
heat generating
substrate
test
Prior art date
Application number
TW093118507A
Other languages
English (en)
Chinese (zh)
Other versions
TW200511923A (en
Inventor
Nishiura Koei
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200511923A publication Critical patent/TW200511923A/zh
Application granted granted Critical
Publication of TWI353211B publication Critical patent/TWI353211B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW093118507A 2003-06-30 2004-06-25 Gas collection device, test connector, and testing apparatus for IC device TW200511923A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/008299 WO2005004571A1 (ja) 2003-06-30 2003-06-30 発熱素子冷却用カバー、発熱素子実装装置およびテストヘッド

Publications (2)

Publication Number Publication Date
TW200511923A TW200511923A (en) 2005-03-16
TWI353211B true TWI353211B (online.php) 2011-11-21

Family

ID=33549064

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093118507A TW200511923A (en) 2003-06-30 2004-06-25 Gas collection device, test connector, and testing apparatus for IC device

Country Status (9)

Country Link
US (1) US7072180B2 (online.php)
EP (1) EP1645318A4 (online.php)
JP (1) JP4275668B2 (online.php)
KR (1) KR100813125B1 (online.php)
CN (1) CN100556495C (online.php)
AU (1) AU2003246165A1 (online.php)
MY (1) MY131476A (online.php)
TW (1) TW200511923A (online.php)
WO (1) WO2005004571A1 (online.php)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4889653B2 (ja) 2005-11-17 2012-03-07 株式会社アドバンテスト デバイス実装装置、テストヘッド及び電子部品試験装置
WO2009031415A1 (ja) * 2007-09-06 2009-03-12 Advantest Corporation 電子部品冷却装置、それを備えたテストヘッド及び電子部品試験装置
KR20100040979A (ko) * 2007-09-14 2010-04-21 가부시키가이샤 아드반테스트 기판상의 전자부품을 냉각하기 위한 워터 재킷
JP4703633B2 (ja) * 2007-12-04 2011-06-15 株式会社東芝 冷却プレート構造
JP5683961B2 (ja) * 2008-10-28 2015-03-11 株式会社アドバンテスト 試験装置および回路モジュール
US8289039B2 (en) 2009-03-11 2012-10-16 Teradyne, Inc. Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment
CN103093848B (zh) * 2011-10-28 2015-12-09 原子高科股份有限公司 85Kr源的制备及回收工艺
US20160081220A1 (en) * 2014-09-15 2016-03-17 Cisco Technology, Inc. Reduction of Intake Resistance for Air Flow Enhancement
JP2016188780A (ja) * 2015-03-30 2016-11-04 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
KR20160117082A (ko) 2015-03-31 2016-10-10 최민석 인터넷 검색 시스템
US10309732B2 (en) * 2015-12-11 2019-06-04 Hanon Systems Internal degas feature for plate-fin heat exchangers
JP7412277B2 (ja) * 2020-06-02 2024-01-12 東京エレクトロン株式会社 検査装置及び検査方法
CN112015253A (zh) * 2020-09-14 2020-12-01 深圳比特微电子科技有限公司 一种液冷板散热器和计算设备
CN114705972B (zh) * 2022-05-06 2023-05-09 中国软件评测中心(工业和信息化部软件与集成电路促进中心) 一种集成电路性能测试装置及其测试方法
US20240084821A1 (en) * 2022-09-13 2024-03-14 Us Hybrid Corporation Self-priming cooling jacket
TWI891269B (zh) * 2024-03-05 2025-07-21 英業達股份有限公司 電路板測試系統與電路板測試裝置

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1849196A (en) * 1930-06-27 1932-03-15 Bengt E Meurk Apparatus for separating air from water
US2924438A (en) * 1953-04-14 1960-02-09 Kramer Trenton Co Header construction for heating elements
US2841127A (en) * 1955-02-16 1958-07-01 White Motor Co Cooling system
US3139073A (en) * 1960-04-29 1964-06-30 Ford Motor Co Cooling system
US3132634A (en) * 1962-09-10 1964-05-12 Charles R Butler Cooling system for internal combustion engines
US3601181A (en) * 1970-03-09 1971-08-24 Saf Gard Products Inc Method and apparatus for purging air from internal combustion engine cooling systems
US3989103A (en) * 1973-04-19 1976-11-02 White Motor Corporation Method and apparatus for cooling and deaerating internal combustion engine coolant
US3939901A (en) * 1973-04-19 1976-02-24 White Motor Corporation Method and apparatus for cooling and deaerating internal combustion engine coolant
US4006775A (en) * 1974-03-07 1977-02-08 Avrea Walter C Automatic positive anti-aeration system for engine cooling system
US4047561A (en) * 1974-10-18 1977-09-13 General Electric Company Cooling liquid de-gassing system
US4785874A (en) * 1982-04-29 1988-11-22 Avrea Walter C Method and apparatus for continuously purging gaseous matter from the cooling system of an internal combustion engine
US4712609A (en) * 1984-11-21 1987-12-15 Iversen Arthur H Heat sink structure
JPS61222242A (ja) * 1985-03-28 1986-10-02 Fujitsu Ltd 冷却装置
US4776390A (en) * 1985-09-24 1988-10-11 Cummins Engine Company, Inc. Venting filler cap
EP0257111A1 (de) * 1986-08-14 1988-03-02 AURORA Konrad G. Schulz GmbH & Co Wärmetauscher für den Kühlkreislauf von Brennkraftmaschinen
JPH0534113Y2 (online.php) * 1987-07-29 1993-08-30
US4892140A (en) * 1988-11-21 1990-01-09 Honovich Tito D Condenser vent siphon line
JP2690585B2 (ja) * 1990-02-14 1997-12-10 富士通株式会社 半導体素子の冷却構造
JP2669924B2 (ja) * 1990-05-18 1997-10-29 富士通株式会社 浸漬冷却装置
JPH04243175A (ja) * 1991-01-17 1992-08-31 Nippon Denki Laser Kiki Eng Kk 冷却装置
JP2995590B2 (ja) * 1991-06-26 1999-12-27 株式会社日立製作所 半導体冷却装置
US6067712A (en) * 1993-12-15 2000-05-30 Olin Corporation Heat exchange tube with embossed enhancement
US5587880A (en) * 1995-06-28 1996-12-24 Aavid Laboratories, Inc. Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation
MY115676A (en) * 1996-08-06 2003-08-30 Advantest Corp Printed circuit board with electronic devices mounted thereon
JP3424717B2 (ja) 1996-08-06 2003-07-07 株式会社アドバンテスト 発熱素子実装半導体装置
US5810074A (en) * 1996-09-13 1998-09-22 American Standard Inc. Serial heat exchanger and cascade circuitry
US5920457A (en) * 1996-09-25 1999-07-06 International Business Machines Corporation Apparatus for cooling electronic devices using a flexible coolant conduit
US6079481A (en) * 1997-01-23 2000-06-27 Ail Research, Inc Thermal storage system
US6078187A (en) * 1997-05-23 2000-06-20 Credence Systems Corporation Hemispherical test head for integrated circuit tester employing radially distributed circuit cards
US6135067A (en) * 1998-08-21 2000-10-24 Uview Ultraviolet Systems, Inc. System removing entrapped gas from an engine cooling system
US6019171A (en) * 1998-11-18 2000-02-01 General Motors Corporation Down flow, two pass radiator with automatic air venting means
US6568466B2 (en) * 2000-06-23 2003-05-27 Andrew Lowenstein Heat exchange assembly
JP2002280507A (ja) * 2001-03-19 2002-09-27 Advantest Corp 発熱素子冷却装置および発熱素子実装装置
US6708653B2 (en) * 2001-04-27 2004-03-23 Bombardier Recreational Products Inc. Fluid reservoir
US6421240B1 (en) * 2001-04-30 2002-07-16 Hewlett-Packard Company Cooling arrangement for high performance electronic components
US6587343B2 (en) * 2001-08-29 2003-07-01 Sun Microsystems, Inc. Water-cooled system and method for cooling electronic components

Also Published As

Publication number Publication date
US7072180B2 (en) 2006-07-04
WO2005002294A2 (ja) 2005-01-06
MY131476A (en) 2007-08-30
JP4275668B2 (ja) 2009-06-10
AU2003246165A1 (en) 2005-01-21
KR20060023569A (ko) 2006-03-14
WO2005002294A3 (ja) 2005-03-03
TW200511923A (en) 2005-03-16
WO2005004571A1 (ja) 2005-01-13
JPWO2005002294A1 (ja) 2006-08-10
KR100813125B1 (ko) 2008-03-17
EP1645318A2 (en) 2006-04-12
CN100556495C (zh) 2009-11-04
EP1645318A4 (en) 2009-05-13
CN1812826A (zh) 2006-08-02
US20050056102A1 (en) 2005-03-17

Similar Documents

Publication Publication Date Title
JP4275668B2 (ja) 気体回収装置、テストヘッドおよびｉｃデバイス試験装置
US4378139A (en) Integrated circuit carrier connector
JP7681019B2 (ja) 電子デバイスを冷却するためのコールドプレートおよびシステム
JP3601778B2 (ja) 電子機器
TWI264549B (en) Pusher with heater, electronic component handling device, and method of controlling temperature of the electronic component
TWI314679B (en) Liquid cooling system including hot-wsappable components
JPH079956B2 (ja) 集積回路基板用ヒート・シンク
WO2005081947A3 (en) Miniature fluid-cooled heat sink with integral heater
TW579366B (en) Microcomponent
CN101785375A (zh) 水套
JP4116933B2 (ja) モジュールｉｃのテストハンドラ用発熱補償装置
Joiner et al. Measurement and simulation of junction to board thermal resistance and its application in thermal modeling
CN116321931A (zh) 冷却板、浸泡箱及服务器系统
JP2002280507A (ja) 発熱素子冷却装置および発熱素子実装装置
JPH0715160A (ja) 電子装置の冷却機構
JP2504059B2 (ja) 電子回路パッケ−ジの冷却構造
CN216930671U (zh) 液冷模块和液冷设备
JP3139816B2 (ja) 小型電子機器
Brunschwiler et al. Thermal power plane enabling dual-side electrical interconnects for high-performance chip stacks: Implementation
TENG et al. Thermal model of a component package for system level applications
JP2605785B2 (ja) 多層配線基板の冷却構造
Sage Multichip Modules—The Hybrid for Wafer‐scale Integration
CN101051724A (zh) 减热插座
McBride et al. Flexible Flip Chip Connection
TWI335990B (en) Test module

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees