TWI350577B - Semiconductor testing apparatus and method for controlling the same - Google Patents

Semiconductor testing apparatus and method for controlling the same

Info

Publication number
TWI350577B
TWI350577B TW097100477A TW97100477A TWI350577B TW I350577 B TWI350577 B TW I350577B TW 097100477 A TW097100477 A TW 097100477A TW 97100477 A TW97100477 A TW 97100477A TW I350577 B TWI350577 B TW I350577B
Authority
TW
Taiwan
Prior art keywords
controlling
same
testing apparatus
semiconductor testing
semiconductor
Prior art date
Application number
TW097100477A
Other languages
English (en)
Chinese (zh)
Other versions
TW200849456A (en
Inventor
Moon Seok Kim
Jun Ho Lee
Sung Joon Park
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of TW200849456A publication Critical patent/TW200849456A/zh
Application granted granted Critical
Publication of TWI350577B publication Critical patent/TWI350577B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
TW097100477A 2007-06-05 2008-01-04 Semiconductor testing apparatus and method for controlling the same TWI350577B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070054986A KR100889819B1 (ko) 2007-06-05 2007-06-05 반도체 검사 장치 및 그 제어 방법

Publications (2)

Publication Number Publication Date
TW200849456A TW200849456A (en) 2008-12-16
TWI350577B true TWI350577B (en) 2011-10-11

Family

ID=40233286

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097100477A TWI350577B (en) 2007-06-05 2008-01-04 Semiconductor testing apparatus and method for controlling the same

Country Status (3)

Country Link
JP (1) JP4980870B2 (ja)
KR (1) KR100889819B1 (ja)
TW (1) TWI350577B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5187188B2 (ja) * 2008-12-26 2013-04-24 富士通株式会社 半導体集積回路パッケージの設置方法及び電子部品の製造方法
KR102000950B1 (ko) * 2012-02-29 2019-07-17 (주)제이티 소자검사장치
JP7239474B2 (ja) * 2017-01-13 2023-03-14 ベックマン コールター， インコーポレイテッド チップを装填するためのモーションシステム
CN111771120B (zh) 2018-02-22 2023-09-05 国立大学法人大阪大学 基板评价用芯片和基板评价装置
KR102190485B1 (ko) * 2019-05-14 2020-12-15 주식회사 탑 엔지니어링 어레이 테스터

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3407192B2 (ja) * 1998-12-31 2003-05-19 株式会社ダイトー テストハンドの制御方法及び計測制御システム
JP4327335B2 (ja) * 2000-06-23 2009-09-09 株式会社アドバンテスト コンタクトアームおよびこれを用いた電子部品試験装置
JP2002011684A (ja) * 2000-06-26 2002-01-15 Daito:Kk Ｉｃ吸着ハンドの放熱機構
JP2002257899A (ja) * 2001-02-27 2002-09-11 Ando Electric Co Ltd オートハンドラ
JP4510679B2 (ja) * 2005-03-30 2010-07-28 株式会社テセック コンタクトヘッドの作業位置のティーチング方法

Also Published As

Publication number Publication date
TW200849456A (en) 2008-12-16
KR20080107098A (ko) 2008-12-10
JP4980870B2 (ja) 2012-07-18
JP2008304447A (ja) 2008-12-18
KR100889819B1 (ko) 2009-03-20

Similar Documents

Publication Publication Date Title
TWI372445B (en) Semiconductor device and method for making the same
EP2351088A4 (en) SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR
EP2280417A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
EP2030229A4 (en) DEVICE AND METHOD FOR SEMICONDUCTOR BONDING
GB0721336D0 (en) Method and apparatus for the time controlled activation of elements
HK1140091A1 (en) Heating apparatus and method for making the same
TWI348701B (en) Semiconductor memory and method for testing the same
EP2216935A4 (en) METHOD AND DEVICE FOR ADJUSTING RELAY STATUS
TWI371836B (en) Semiconductor device and method for fabricating the same
TWI349982B (en) Semiconductor device and method for making the same
EP2024551A4 (en) APPARATUS RELIEF DEVICE AND OPERATING METHOD THEREFOR
HK1116716A1 (en) Pressurized-training apparatus and control method for the same
EP2064732A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
EP2219215A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
TWI369588B (en) Stage apparatus, method for controlling the same, exposure apparatus, and method for manufacturing device
EP2139160A4 (en) METHOD AND DEVICE FOR CONTROLLING MAIN BACKUP INVERSION
EP2212991A4 (en) ENGINE, AND APPARATUS AND METHOD FOR CONTROLLING THE ENGINE
PT2483700T (pt) Dispositivo para condicionamento de chips semicondutores e processo de teste com emprego do dispositivo
EP2343614A4 (en) MOVING DEVICE AND CONTROL METHOD THEREOF
EP2224470A4 (en) METHOD AND APPARATUS FOR CLEANING SILICON WAFER
TWI371844B (en) Semiconductor device and method for manufacturing the same
HK1154990A1 (en) Semiconductor device and method for manufacturing the same
TWI350577B (en) Semiconductor testing apparatus and method for controlling the same
EP2301070A4 (en) IMPROVED METHOD AND DEVICE FOR WAFERBONDEN
EP2133906A4 (en) SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees