TWI350577B - Semiconductor testing apparatus and method for controlling the same - Google Patents

Semiconductor testing apparatus and method for controlling the same

Info

Publication number
TWI350577B
TWI350577B TW097100477A TW97100477A TWI350577B TW I350577 B TWI350577 B TW I350577B TW 097100477 A TW097100477 A TW 097100477A TW 97100477 A TW97100477 A TW 97100477A TW I350577 B TWI350577 B TW I350577B
Authority
TW
Taiwan
Prior art keywords
controlling
same
testing apparatus
semiconductor testing
semiconductor
Prior art date
Application number
TW097100477A
Other languages
Chinese (zh)
Other versions
TW200849456A (en
Inventor
Moon Seok Kim
Jun Ho Lee
Sung Joon Park
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of TW200849456A publication Critical patent/TW200849456A/en
Application granted granted Critical
Publication of TWI350577B publication Critical patent/TWI350577B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
TW097100477A 2007-06-05 2008-01-04 Semiconductor testing apparatus and method for controlling the same TWI350577B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070054986A KR100889819B1 (en) 2007-06-05 2007-06-05 Semiconductor inspecting apparatus and control method thereof

Publications (2)

Publication Number Publication Date
TW200849456A TW200849456A (en) 2008-12-16
TWI350577B true TWI350577B (en) 2011-10-11

Family

ID=40233286

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097100477A TWI350577B (en) 2007-06-05 2008-01-04 Semiconductor testing apparatus and method for controlling the same

Country Status (3)

Country Link
JP (1) JP4980870B2 (en)
KR (1) KR100889819B1 (en)
TW (1) TWI350577B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5187188B2 (en) * 2008-12-26 2013-04-24 富士通株式会社 Method for installing semiconductor integrated circuit package and method for manufacturing electronic component
KR102000950B1 (en) * 2012-02-29 2019-07-17 (주)제이티 Semiconductor device inspection apparatus
JP7239474B2 (en) * 2017-01-13 2023-03-14 ベックマン コールター， インコーポレイテッド Motion system for tip loading
CN111771120B (en) 2018-02-22 2023-09-05 国立大学法人大阪大学 Chip for evaluating substrate and substrate evaluating device
KR102190485B1 (en) * 2019-05-14 2020-12-15 주식회사 탑 엔지니어링 Array Tester

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3407192B2 (en) * 1998-12-31 2003-05-19 株式会社ダイトー Test hand control method and measurement control system
JP4327335B2 (en) * 2000-06-23 2009-09-09 株式会社アドバンテスト Contact arm and electronic component testing apparatus using the same
JP2002011684A (en) * 2000-06-26 2002-01-15 Daito:Kk Heat radiation mechanism of ic suction hand
JP2002257899A (en) * 2001-02-27 2002-09-11 Ando Electric Co Ltd Automatic handler
JP4510679B2 (en) * 2005-03-30 2010-07-28 株式会社テセック Teaching method of contact head working position

Also Published As

Publication number Publication date
TW200849456A (en) 2008-12-16
KR20080107098A (en) 2008-12-10
JP4980870B2 (en) 2012-07-18
JP2008304447A (en) 2008-12-18
KR100889819B1 (en) 2009-03-20

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees