TWI348167B - - Google Patents

Info

Publication number
TWI348167B
TWI348167B TW096137860A TW96137860A TWI348167B TW I348167 B TWI348167 B TW I348167B TW 096137860 A TW096137860 A TW 096137860A TW 96137860 A TW96137860 A TW 96137860A TW I348167 B TWI348167 B TW I348167B
Authority
TW
Taiwan
Application number
TW096137860A
Other versions
TW200839793A (en
Inventor
Kenji Takai
Nobuaki Takane
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200839793A publication Critical patent/TW200839793A/zh
Application granted granted Critical
Publication of TWI348167B publication Critical patent/TWI348167B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/16—Metallic particles coated with a non-metal
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H01R13/035—Plated dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/08—Ingredients agglomerated by treatment with a binding agent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Powder Metallurgy (AREA)
TW096137860A 2006-10-17 2007-10-09 Coated particle and method for producing the same, anisotropic conductive adhesive composition using coated particle, and anisotropic conductive adhesive film TW200839793A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006282617 2006-10-17
JP2007160533 2007-06-18

Publications (2)

Publication Number Publication Date
TW200839793A TW200839793A (en) 2008-10-01
TWI348167B true TWI348167B (zh) 2011-09-01

Family

ID=39313841

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096137860A TW200839793A (en) 2006-10-17 2007-10-09 Coated particle and method for producing the same, anisotropic conductive adhesive composition using coated particle, and anisotropic conductive adhesive film

Country Status (7)

Country Link
US (1) US20100133486A1 (zh)
EP (1) EP2079084A4 (zh)
JP (2) JP4780197B2 (zh)
KR (1) KR101024467B1 (zh)
CN (1) CN101523513B (zh)
TW (1) TW200839793A (zh)
WO (1) WO2008047600A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI547304B (zh) * 2010-12-30 2016-09-01 奇異電器公司 用於製造分離器總成之方法及裝置

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EP2073316A4 (en) * 2006-09-26 2010-07-21 Hitachi Chemical Co Ltd ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, CIRCUIT ELEMENT CONNECTION STRUCTURE, AND METHOD OF MANUFACTURING COATED PARTICLES
JP2008120990A (ja) * 2006-10-17 2008-05-29 Hitachi Chem Co Ltd 異方導電性接着剤組成物、異方導電性フィルム、回路部材の接続構造、及び、被覆粒子の製造方法
JP5272368B2 (ja) * 2007-03-05 2013-08-28 日立化成株式会社 被覆導電性粒子、被覆導電性粒子の製造方法、異方性導電接着剤及び導電性接着剤
JP5151920B2 (ja) * 2008-02-05 2013-02-27 日立化成工業株式会社 導電粒子及び導電粒子の製造方法
JP5644067B2 (ja) * 2008-07-23 2014-12-24 日立化成株式会社 絶縁被覆導電粒子
US20120104333A1 (en) * 2009-07-01 2012-05-03 Hitachi Chemical Company, Ltd. Coated conductive particles and method for producing same
WO2011030715A1 (ja) * 2009-09-08 2011-03-17 積水化学工業株式会社 絶縁粒子付き導電性粒子、絶縁粒子付き導電性粒子の製造方法、異方性導電材料及び接続構造体
WO2011041507A1 (en) * 2009-10-01 2011-04-07 Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College Apparatus and method for nanocomposite sensors
JP5320523B1 (ja) * 2012-02-21 2013-10-23 積水化学工業株式会社 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
JP6251978B2 (ja) * 2013-01-25 2017-12-27 日立化成株式会社 カラム用コアシェル型粒子及びその製造方法
JP5673895B1 (ja) * 2013-03-13 2015-02-18 Dic株式会社 コア−シェル型ナノ粒子及びその製造方法
JP6180159B2 (ja) * 2013-04-04 2017-08-16 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
US9376595B2 (en) 2013-06-21 2016-06-28 General Electric Company Method and apparatus for fabricating separator assembly
JP2015135878A (ja) * 2014-01-16 2015-07-27 デクセリアルズ株式会社 接続体、接続体の製造方法、接続方法、異方性導電接着剤
KR20160125344A (ko) * 2014-02-24 2016-10-31 세키스이가가쿠 고교가부시키가이샤 도전 페이스트, 접속 구조체 및 접속 구조체의 제조 방법
WO2016080515A1 (ja) * 2014-11-20 2016-05-26 積水化学工業株式会社 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
JP6588843B2 (ja) * 2015-02-19 2019-10-09 積水化学工業株式会社 接続構造体の製造方法
CN107077914B (zh) * 2015-02-19 2019-05-31 积水化学工业株式会社 导电糊剂及连接结构体
JP6973076B2 (ja) * 2015-07-31 2021-11-24 住友金属鉱山株式会社 導電性基板
JP6737293B2 (ja) * 2016-02-10 2020-08-05 日立化成株式会社 導電粒子、絶縁被覆導電粒子、異方導電性接着剤、接続構造体及び導電粒子の製造方法
CN109072010B (zh) 2016-06-02 2022-09-23 M技术株式会社 透明材料用紫外线和/或近红外线遮断剂组合物
JP7046351B2 (ja) 2018-01-31 2022-04-04 三国電子有限会社 接続構造体の作製方法
JP7160302B2 (ja) * 2018-01-31 2022-10-25 三国電子有限会社 接続構造体および接続構造体の作製方法
JP7185252B2 (ja) 2018-01-31 2022-12-07 三国電子有限会社 接続構造体の作製方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI547304B (zh) * 2010-12-30 2016-09-01 奇異電器公司 用於製造分離器總成之方法及裝置

Also Published As

Publication number Publication date
TW200839793A (en) 2008-10-01
KR101024467B1 (ko) 2011-03-23
CN101523513B (zh) 2012-01-11
WO2008047600A1 (fr) 2008-04-24
JP4780197B2 (ja) 2011-09-28
CN101523513A (zh) 2009-09-02
EP2079084A1 (en) 2009-07-15
JP4784713B1 (ja) 2011-10-05
KR20090076974A (ko) 2009-07-13
US20100133486A1 (en) 2010-06-03
JP2011219869A (ja) 2011-11-04
JPWO2008047600A1 (ja) 2010-02-25
EP2079084A4 (en) 2010-09-08

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MM4A Annulment or lapse of patent due to non-payment of fees