TWI347493B - - Google Patents

Info

Publication number
TWI347493B
TWI347493B TW096106195A TW96106195A TWI347493B TW I347493 B TWI347493 B TW I347493B TW 096106195 A TW096106195 A TW 096106195A TW 96106195 A TW96106195 A TW 96106195A TW I347493 B TWI347493 B TW I347493B
Authority
TW
Taiwan
Application number
TW096106195A
Other versions
TW200745749A (en
Inventor
Takashi Kumaki
Masahiro Miyasaka
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200745749A publication Critical patent/TW200745749A/zh
Application granted granted Critical
Publication of TWI347493B publication Critical patent/TWI347493B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Polymerisation Methods In General (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW096106195A 2006-02-21 2007-02-16 Photosensitive resin composition, method for forming resist pattern, method for manufacturing printed wiring board, and method for producing substrate for plasma display panel TW200745749A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006043816 2006-02-21
JP2006167674 2006-06-16

Publications (2)

Publication Number Publication Date
TW200745749A TW200745749A (en) 2007-12-16
TWI347493B true TWI347493B (zh) 2011-08-21

Family

ID=38437346

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096106195A TW200745749A (en) 2006-02-21 2007-02-16 Photosensitive resin composition, method for forming resist pattern, method for manufacturing printed wiring board, and method for producing substrate for plasma display panel

Country Status (6)

Country Link
US (1) US20100233627A1 (zh)
JP (2) JPWO2007097306A1 (zh)
KR (1) KR101013678B1 (zh)
CN (1) CN104808440A (zh)
TW (1) TW200745749A (zh)
WO (1) WO2007097306A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103885292B (zh) 2005-10-25 2017-09-22 日立化成株式会社 感光性树脂组合物、使用其的感光性元件、抗蚀剂图案的形成方法及印刷电路板的制造方法
JP2010085605A (ja) * 2008-09-30 2010-04-15 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2010113349A (ja) * 2008-10-10 2010-05-20 Asahi Kasei E-Materials Corp 感光性樹脂組成物
CN104808444A (zh) * 2009-02-26 2015-07-29 日立化成工业株式会社 感光性树脂组合物、以及感光性元件、抗蚀剂图案的形成方法和印刷线路板的制造方法
CN102549498B (zh) * 2009-09-25 2013-10-30 旭化成电子材料株式会社 抗蚀材料用感光性树脂组合物以及感光性树脂层压体
JP6022749B2 (ja) * 2010-07-30 2016-11-09 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの製造方法、リードフレームの製造方法及びプリント配線板の製造方法
TWI556872B (zh) * 2010-08-30 2016-11-11 鴻海精密工業股份有限公司 噴砂裝置及形成圖案之方法
KR101309812B1 (ko) * 2010-12-01 2013-09-23 제일모직주식회사 옵셋 인쇄용 전극 조성물
CN104081281A (zh) * 2012-02-02 2014-10-01 日立化成株式会社 感光性树脂组合物和使用了该组合物的感光性元件、间隔物的形成方法以及间隔物
JP2015001591A (ja) * 2013-06-14 2015-01-05 日立化成株式会社 感光性樹脂組成物、感光性エレメント、サンドブラスト用マスク材、及び被処理体の表面加工方法
CN111051059A (zh) * 2017-09-01 2020-04-21 富士胶片株式会社 前体薄膜、两面导电性薄膜的制造方法、触摸面板传感器
JP7232685B2 (ja) 2019-03-26 2023-03-03 セイコーインスツル株式会社 時計用文字板及び時計
EP3796105A1 (fr) 2019-09-23 2021-03-24 The Swatch Group Research and Development Ltd Élément d'horlogerie
WO2022182168A1 (ko) * 2021-02-26 2022-09-01 코오롱인더스트리 주식회사 감광성 적층체, 감광성 적층체 제조 방법, 및 회로 기판 제조방법

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* Cited by examiner, † Cited by third party
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DE2914984A1 (de) * 1979-04-12 1980-11-13 Consortium Elektrochem Ind Verfahren zur herstellung von polymerisaten
DE4009700A1 (de) * 1990-03-27 1991-10-02 Hoechst Ag Photopolymerisierbares gemisch und daraus hergestelltes aufzeichnungsmaterial
JP3782134B2 (ja) * 1995-07-20 2006-06-07 旭化成エレクトロニクス株式会社 プリント配線板の製造方法
DE19639761A1 (de) * 1996-09-27 1998-04-02 Du Pont Deutschland Flexographische Druckformen mit verbesserter Beständigkeit gegenüber UV härtbaren Druckfarben
JP3738867B2 (ja) * 1997-04-18 2006-01-25 東京応化工業株式会社 可視露光可能な耐サンドブラスト性感光性樹脂組成物、およびこれを用いたドライフィルム、並びにこれらを用いた被処理体の切削方法
US6322951B1 (en) * 1998-12-11 2001-11-27 Norton International, Inc. Photoimageable compositions having improved flexibility and stripping ability
JP3549015B2 (ja) * 1999-02-12 2004-08-04 旭化成エレクトロニクス株式会社 光重合性組成物
JP4326059B2 (ja) * 1999-02-19 2009-09-02 旭化成イーマテリアルズ株式会社 光重合性組成物
EP1150165A1 (en) * 2000-04-25 2001-10-31 JSR Corporation Radiation sensitive resin composition for forming barrier ribs for an el display element, barrier ribs and el display element
CN1258696C (zh) * 2000-09-11 2006-06-07 日立化成工业株式会社 抗蚀图、其制造方法及其应用
JP3503639B2 (ja) * 2000-09-27 2004-03-08 日立化成工業株式会社 レジストパターン、その製造法およびその利用
KR100630322B1 (ko) * 2002-02-28 2006-09-29 히다치 가세고교 가부시끼가이샤 감광성 수지조성물, 이것을 사용한 감광성 엘리먼트,레지스트패턴의 형성방법 및 프린트배선판의 제조방법
US20030186165A1 (en) * 2002-03-28 2003-10-02 Agfa-Gevaert Photopolymerizable composition sensitized for the wavelength range from 300 to 450 nm
WO2003088495A1 (fr) * 2002-04-17 2003-10-23 Bridgestone Corporation Unite d'affichage d'images
JP4488875B2 (ja) * 2004-03-10 2010-06-23 旭化成イーマテリアルズ株式会社 感光性樹脂組成物および感光性樹脂組成物層含有積層体
JP2005338375A (ja) * 2004-05-26 2005-12-08 Mitsubishi Chemicals Corp 光重合性組成物、感光性画像形成材、感光性画像形成材料、及びその画像形成方法
US20100129752A1 (en) * 2005-05-30 2010-05-27 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element employing the same, method of forming resist pattern, and process for producing printed wiring board
US20090233230A1 (en) * 2005-07-22 2009-09-17 Yosuke Hata Photosensitive Resin Composition and Laminates
CN103885292B (zh) * 2005-10-25 2017-09-22 日立化成株式会社 感光性树脂组合物、使用其的感光性元件、抗蚀剂图案的形成方法及印刷电路板的制造方法

Also Published As

Publication number Publication date
US20100233627A1 (en) 2010-09-16
JP2012003280A (ja) 2012-01-05
JPWO2007097306A1 (ja) 2009-07-16
CN104808440A (zh) 2015-07-29
TW200745749A (en) 2007-12-16
JP5223956B2 (ja) 2013-06-26
KR101013678B1 (ko) 2011-02-10
WO2007097306A1 (ja) 2007-08-30
KR20080085219A (ko) 2008-09-23

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees