TWI346972B - System and method for controlling composition for lithography process in real time using near infrared spectrometer - Google Patents

System and method for controlling composition for lithography process in real time using near infrared spectrometer

Info

Publication number
TWI346972B
TWI346972B TW094107330A TW94107330A TWI346972B TW I346972 B TWI346972 B TW I346972B TW 094107330 A TW094107330 A TW 094107330A TW 94107330 A TW94107330 A TW 94107330A TW I346972 B TWI346972 B TW I346972B
Authority
TW
Taiwan
Prior art keywords
real time
near infrared
lithography process
infrared spectrometer
controlling composition
Prior art date
Application number
TW094107330A
Other languages
English (en)
Other versions
TW200531152A (en
Inventor
Ki-Beom Lee
Jae-Ku Lee
Mi-Sun Park
Jong-Min Kim
Min-Gun Lee
Original Assignee
Dongjin Semichem Co Ltd New
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongjin Semichem Co Ltd New filed Critical Dongjin Semichem Co Ltd New
Publication of TW200531152A publication Critical patent/TW200531152A/zh
Application granted granted Critical
Publication of TWI346972B publication Critical patent/TWI346972B/zh

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/35Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
    • G01N21/359Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light using near infrared light
    • GPHYSICS
    • G04HOROLOGY
    • G04BMECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B47/00Time-pieces combined with other articles which do not interfere with the running or the time-keeping of the time-piece
    • G04B47/06Time-pieces combined with other articles which do not interfere with the running or the time-keeping of the time-piece with attached measuring instruments, e.g. pedometer, barometer, thermometer or compass
    • G04B47/063Time-pieces combined with other articles which do not interfere with the running or the time-keeping of the time-piece with attached measuring instruments, e.g. pedometer, barometer, thermometer or compass measuring physiological quantities, e.g. pedometers, heart-rate sensors, blood pressure gauges and the like
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C22/00Measuring distance traversed on the ground by vehicles, persons, animals or other moving solid bodies, e.g. using odometers, using pedometers
    • G01C22/006Pedometers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • GPHYSICS
    • G04HOROLOGY
    • G04BMECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B19/00Indicating the time by visual means
    • G04B19/06Dials
    • G04B19/18Graduations on the crystal or glass, on the bezel, or on the rim
    • GPHYSICS
    • G04HOROLOGY
    • G04BMECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B37/00Cases
    • G04B37/0008Cases for pocket watches and wrist watches
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67075Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00Sampling; Preparing specimens for investigation
    • G01N1/02Devices for withdrawing samples
    • G01N1/10Devices for withdrawing samples in the liquid or fluent state
    • G01N1/20Devices for withdrawing samples in the liquid or fluent state for flowing or falling materials
    • G01N1/2035Devices for withdrawing samples in the liquid or fluent state for flowing or falling materials by deviating part of a fluid stream, e.g. by drawing-off or tapping
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01Arrangements or apparatus for facilitating the optical investigation
    • G01N21/03Cuvette constructions
    • G01N21/05Flow-through cuvettes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T436/00Chemistry: analytical and immunological testing
    • Y10T436/12Condition responsive control

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Biochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Biophysics (AREA)
  • Cardiology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Physiology (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW094107330A 2004-03-11 2005-03-10 System and method for controlling composition for lithography process in real time using near infrared spectrometer TWI346972B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20040016638A KR100909184B1 (ko) 2004-03-11 2004-03-11 근적외선 분광기를 이용한 리쏘그래피 공정용 조성물의실시간 제어 시스템 및 제어 방법

Publications (2)

Publication Number Publication Date
TW200531152A TW200531152A (en) 2005-09-16
TWI346972B true TWI346972B (en) 2011-08-11

Family

ID=34836818

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094107330A TWI346972B (en) 2004-03-11 2005-03-10 System and method for controlling composition for lithography process in real time using near infrared spectrometer

Country Status (7)

Country Link
US (1) US7307259B2 (zh)
EP (1) EP1577662B1 (zh)
JP (1) JP4775937B2 (zh)
KR (1) KR100909184B1 (zh)
CN (1) CN100510969C (zh)
DE (1) DE602005014302D1 (zh)
TW (1) TWI346972B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100428183C (zh) * 2006-01-17 2008-10-22 奇奕国际股份有限公司 自动化蚀刻控制系统、装置与方法
JP4850769B2 (ja) * 2007-03-30 2012-01-11 東京エレクトロン株式会社 レジスト濃度測定方法及びレジスト濃度測定装置
CN101896640B (zh) 2007-12-12 2012-02-01 朗姆研究公司 用于电镀液分析和控制的方法和设备
KR101023429B1 (ko) * 2008-12-23 2011-03-25 송원산업 주식회사 푸리에 변환 근적외선 분광학을 이용한 감광성 수지 공중합체의 조성 분석방법
AT13262U1 (de) * 2012-05-16 2013-09-15 Koerner Chemieanlagen Analysevorrichtung
US10018555B2 (en) * 2014-03-12 2018-07-10 Shenzhen China Star Optoelectronics Technology Co., Ltd. Device and method for measuring concentration of etchant
CN103868866B (zh) * 2014-03-12 2016-03-23 深圳市华星光电技术有限公司 蚀刻液浓度测量装置及方法
CN109690292A (zh) * 2016-09-15 2019-04-26 株式会社堀场Stec 吸光光度计和使用该吸光光度计的半导体制造装置
CN106444304B (zh) * 2016-11-18 2019-08-23 昆山国显光电有限公司 显影装置以及显影液活性度的补偿方法
JP6736087B2 (ja) * 2017-01-23 2020-08-05 株式会社平間理化研究所 現像液の濃度監視装置、及び現像液管理装置
JP7491126B2 (ja) 2020-07-29 2024-05-28 東京エレクトロン株式会社 基板処理装置、及び基板処理方法。
CN115420862B (zh) * 2022-10-17 2023-02-03 江苏龙东新材料有限公司 一种用于剥离液生产的原料多点取样抽检设备

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4778532A (en) * 1985-06-24 1988-10-18 Cfm Technologies Limited Partnership Process and apparatus for treating wafers with process fluids
DE4216628A1 (de) * 1992-05-20 1993-11-25 Harald Michael Entwässerungsanlage
JPH08278635A (ja) * 1995-04-07 1996-10-22 Tokyo Ohka Kogyo Co Ltd 現像液の調整方法及び調整装置
JPH11133619A (ja) * 1997-05-01 1999-05-21 Shipley Co Llc フォトレジストのリサイクリング方法
JP2000147785A (ja) * 1998-11-12 2000-05-26 Tokyo Ohka Kogyo Co Ltd 現像装置
JP3212958B2 (ja) * 1998-12-11 2001-09-25 九州日本電気株式会社 薬液濃度制御装置
US6203659B1 (en) * 1999-03-30 2001-03-20 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for controlling the quality of a photoresist stripper bath
JP2001217185A (ja) * 2000-02-04 2001-08-10 Sigma Meltec Ltd 端面薄膜除去装置
KR100390553B1 (ko) * 2000-12-30 2003-07-07 주식회사 동진쎄미켐 근적외선 분광기를 이용한 금속막 에칭 공정 제어방법 및에쳔트 조성물의 재생방법
KR100390567B1 (ko) * 2000-12-30 2003-07-07 주식회사 동진쎄미켐 근적외선 분광기를 이용한 포토레지스트 박리공정제어방법 및 포토레지스트 박리액 조성물의 재생방법
EP1283546A1 (en) * 2001-08-08 2003-02-12 Infineon Technologies AG Method for detecting removal of organic material from a semiconductor device in a manufacturing process
KR100414550B1 (ko) * 2001-09-20 2004-01-13 주식회사 아큐텍반도체기술 다성분 용액의 농도 분석 시스템 및 방법
US7344991B2 (en) * 2002-12-23 2008-03-18 Tokyo Electron Limited Method and apparatus for multilayer photoresist dry development
US7127358B2 (en) * 2004-03-30 2006-10-24 Tokyo Electron Limited Method and system for run-to-run control

Also Published As

Publication number Publication date
KR20050091288A (ko) 2005-09-15
JP2005260238A (ja) 2005-09-22
DE602005014302D1 (de) 2009-06-18
TW200531152A (en) 2005-09-16
CN1667514A (zh) 2005-09-14
US20050202564A1 (en) 2005-09-15
EP1577662A3 (en) 2006-10-11
EP1577662A2 (en) 2005-09-21
US7307259B2 (en) 2007-12-11
KR100909184B1 (ko) 2009-07-23
EP1577662B1 (en) 2009-05-06
JP4775937B2 (ja) 2011-09-21
CN100510969C (zh) 2009-07-08

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MM4A Annulment or lapse of patent due to non-payment of fees