TWI346357B - Apparatus and method for treating substrate, and injection head used in the apparatus - Google Patents

Apparatus and method for treating substrate, and injection head used in the apparatus

Info

Publication number
TWI346357B
TWI346357B TW096118845A TW96118845A TWI346357B TW I346357 B TWI346357 B TW I346357B TW 096118845 A TW096118845 A TW 096118845A TW 96118845 A TW96118845 A TW 96118845A TW I346357 B TWI346357 B TW I346357B
Authority
TW
Taiwan
Prior art keywords
injection head
head used
treating substrate
treating
substrate
Prior art date
Application number
TW096118845A
Other languages
English (en)
Other versions
TW200744128A (en
Inventor
Hyun-Jong Kim
Young-Ki Ahn
Original Assignee
Semes Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semes Co Ltd filed Critical Semes Co Ltd
Publication of TW200744128A publication Critical patent/TW200744128A/zh
Application granted granted Critical
Publication of TWI346357B publication Critical patent/TWI346357B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3063—Electrolytic etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW096118845A 2006-05-25 2007-05-25 Apparatus and method for treating substrate, and injection head used in the apparatus TWI346357B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060047217A KR100706666B1 (ko) 2006-05-25 2006-05-25 기판을 처리하는 장치 및 방법, 그리고 이에 사용되는분사헤드

Publications (2)

Publication Number Publication Date
TW200744128A TW200744128A (en) 2007-12-01
TWI346357B true TWI346357B (en) 2011-08-01

Family

ID=38161648

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096118845A TWI346357B (en) 2006-05-25 2007-05-25 Apparatus and method for treating substrate, and injection head used in the apparatus

Country Status (5)

Country Link
US (1) US8747611B2 (zh)
JP (1) JP4474438B2 (zh)
KR (1) KR100706666B1 (zh)
CN (1) CN100530534C (zh)
TW (1) TWI346357B (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4912916B2 (ja) * 2006-10-10 2012-04-11 大日本スクリーン製造株式会社 基板処理装置
KR100790726B1 (ko) 2006-12-21 2008-01-02 동부일렉트로닉스 주식회사 반도체 노광장비
JP5671261B2 (ja) * 2010-06-04 2015-02-18 東京応化工業株式会社 被処理体の処理方法
JP5743853B2 (ja) * 2010-12-28 2015-07-01 東京エレクトロン株式会社 液処理装置および液処理方法
JP5762925B2 (ja) * 2010-12-28 2015-08-12 東京エレクトロン株式会社 液処理装置および液処理方法
JP5646354B2 (ja) * 2011-01-25 2014-12-24 東京エレクトロン株式会社 液処理装置および液処理方法
JP5474840B2 (ja) * 2011-01-25 2014-04-16 東京エレクトロン株式会社 液処理装置および液処理方法
JP5642574B2 (ja) * 2011-01-25 2014-12-17 東京エレクトロン株式会社 液処理装置および液処理方法
JP5467583B2 (ja) * 2011-02-17 2014-04-09 東京エレクトロン株式会社 基板洗浄装置
CN103177934B (zh) * 2011-12-26 2016-06-15 北京七星华创电子股份有限公司 薄片盘状物清洗甩干器
CN102779772A (zh) * 2012-07-16 2012-11-14 北京七星华创电子股份有限公司 晶片背面清洗装置
US9460944B2 (en) * 2014-07-02 2016-10-04 SCREEN Holdings Co., Ltd. Substrate treating apparatus and method of treating substrate
KR102283587B1 (ko) * 2014-08-01 2021-08-02 세메스 주식회사 기판 처리 장치 및 방법
JP2016111302A (ja) * 2014-12-10 2016-06-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN105762098B (zh) * 2014-12-17 2020-03-31 北京北方华创微电子装备有限公司 传片系统及半导体加工设备
KR101880232B1 (ko) * 2015-07-13 2018-07-19 주식회사 제우스 기판 액처리 장치 및 방법
CN105470177B (zh) * 2016-01-05 2018-09-07 清华大学 晶圆清洗干燥装置
KR102030470B1 (ko) * 2016-07-01 2019-10-11 세메스 주식회사 기판 처리 장치 및 방법
JP6804325B2 (ja) * 2017-02-09 2020-12-23 東京エレクトロン株式会社 液処理装置
KR102176209B1 (ko) * 2018-12-13 2020-11-09 주식회사 제우스 이물질 제거용 기판처리장치

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3953276A (en) * 1972-10-26 1976-04-27 Zenith Radio Corporation Etching apparatus with plural nozzle arrangements
KR0122507Y1 (ko) * 1996-06-14 1998-08-17 배순훈 식기세척기의 세척수분사장치
JPH1064831A (ja) 1996-08-20 1998-03-06 Fujitsu Ltd 気相成長装置
JP3563605B2 (ja) 1998-03-16 2004-09-08 東京エレクトロン株式会社 処理装置
DE19832982C2 (de) * 1998-07-22 2000-08-03 Premark Feg Llc Spülvorrichtung für eine Geschirrspülmaschine
KR20010055816A (ko) * 1999-12-13 2001-07-04 박종섭 화학증착 헤드의 가스 균일분사장치
KR100427996B1 (ko) * 2001-07-19 2004-04-28 주식회사 아이피에스 박막증착용 반응용기 및 그를 이용한 박막증착방법
KR100457053B1 (ko) * 2002-07-30 2004-11-10 삼성전자주식회사 웨이퍼 세정 장치
KR20050026766A (ko) * 2003-09-09 2005-03-16 삼성전자주식회사 반도체 제조설비에서의 세정장치
JP2006013107A (ja) * 2004-06-25 2006-01-12 Dainippon Screen Mfg Co Ltd 基板処理装置

Also Published As

Publication number Publication date
US20070275562A1 (en) 2007-11-29
US8747611B2 (en) 2014-06-10
TW200744128A (en) 2007-12-01
JP2007318140A (ja) 2007-12-06
CN100530534C (zh) 2009-08-19
KR100706666B1 (ko) 2007-04-13
CN101079373A (zh) 2007-11-28
JP4474438B2 (ja) 2010-06-02

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