TWI319221B - Substrate alignment apparatus and method for aligning substrate using the same - Google Patents

Substrate alignment apparatus and method for aligning substrate using the same

Info

Publication number
TWI319221B
TWI319221B TW095137619A TW95137619A TWI319221B TW I319221 B TWI319221 B TW I319221B TW 095137619 A TW095137619 A TW 095137619A TW 95137619 A TW95137619 A TW 95137619A TW I319221 B TWI319221 B TW I319221B
Authority
TW
Taiwan
Prior art keywords
substrate
same
alignment apparatus
aligning
substrate alignment
Prior art date
Application number
TW095137619A
Other languages
Chinese (zh)
Other versions
TW200802755A (en
Inventor
Dae-Soo Lee
Chae-Woong Kim
Kyoung-Ook Lee
Sim-Man Yuk
Jin-Hyeong Kim
Original Assignee
Doosan Mecatec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Doosan Mecatec Co Ltd filed Critical Doosan Mecatec Co Ltd
Publication of TW200802755A publication Critical patent/TW200802755A/en
Application granted granted Critical
Publication of TWI319221B publication Critical patent/TWI319221B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/191—Deposition of organic active material characterised by provisions for the orientation or alignment of the layer to be deposited

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
TW095137619A 2006-06-16 2006-10-13 Substrate alignment apparatus and method for aligning substrate using the same TWI319221B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060054396A KR100712953B1 (en) 2006-06-16 2006-06-16 Substrate align device and align method using the same

Publications (2)

Publication Number Publication Date
TW200802755A TW200802755A (en) 2008-01-01
TWI319221B true TWI319221B (en) 2010-01-01

Family

ID=38269293

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095137619A TWI319221B (en) 2006-06-16 2006-10-13 Substrate alignment apparatus and method for aligning substrate using the same

Country Status (4)

Country Link
KR (1) KR100712953B1 (en)
CN (1) CN101461284A (en)
TW (1) TWI319221B (en)
WO (1) WO2007145402A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI581057B (en) * 2012-05-31 2017-05-01 三星顯示器有限公司 Mask tensioning apparatus, mask sheet, and mask manufacturing system including the same

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5297046B2 (en) * 2008-01-16 2013-09-25 キヤノントッキ株式会社 Deposition equipment
TWI423187B (en) * 2009-09-30 2014-01-11 Innolux Corp Self-emission flat panel display and alignment system for assembling the same
US9325007B2 (en) 2009-10-27 2016-04-26 Applied Materials, Inc. Shadow mask alignment and management system
KR101203171B1 (en) 2012-05-22 2012-11-21 주식회사 아이.엠.텍 Align the device for glass substrate bonding
KR101289050B1 (en) * 2012-10-23 2013-07-22 유진디스컴 주식회사 Alignment apparatus for vaccum chamber
KR101310336B1 (en) 2013-03-28 2013-09-23 주식회사 아이.엠.텍 Largest space glass aligner of driving apparatus
KR102141855B1 (en) * 2014-03-31 2020-08-07 주식회사 선익시스템 Mask align apparatus
TWM526177U (en) * 2014-11-03 2016-07-21 應用材料股份有限公司 Visualization system and process chamber having the same
KR101599205B1 (en) * 2015-01-30 2016-03-03 주식회사 테스 Tray assembly and thin-film deposition apparatus having the same
KR101629462B1 (en) * 2015-02-17 2016-06-13 주식회사 에스에프에이 Apparatus and Method for aligning substrate
KR101979149B1 (en) * 2018-04-27 2019-05-15 캐논 톡키 가부시키가이샤 Alignment method, deposition method using the same and electronic device
KR102591646B1 (en) * 2018-06-29 2023-10-20 삼성디스플레이 주식회사 Deposition apparatus and method of aligning magnet plate of deposition apparatus
WO2020091413A1 (en) * 2018-10-30 2020-05-07 어플라이드 머티어리얼스, 인코포레이티드 Substrate treatment device
CN112117230A (en) * 2020-10-19 2020-12-22 北京航空航天大学杭州创新研究院 Substrate-mask plate in-situ holding device for high-density patterning

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100422487B1 (en) * 2001-12-10 2004-03-11 에이엔 에스 주식회사 Evaporation Apparatus for Manufacturing Organic Electro-Luminescent Display Device using Electromagnet and Evaporation Method using the same
KR100647577B1 (en) * 2002-06-12 2006-11-17 삼성에스디아이 주식회사 Apparatus and method for aligning a substrate
JP4184771B2 (en) * 2002-11-27 2008-11-19 株式会社アルバック Alignment equipment, film deposition equipment
JP2004183044A (en) * 2002-12-03 2004-07-02 Seiko Epson Corp Mask vapor deposition method and apparatus, mask and mask manufacturing method, display panel manufacturing apparatus, display panel and electronic equipment
KR20040083653A (en) * 2003-03-24 2004-10-06 (주)네스디스플레이 Substrate holder and Apparatus for clipping substrate using the same
KR20050022749A (en) * 2003-08-29 2005-03-08 이충화 Method and apparatus for contacting between a mask and a substrate, method for sputtering and sputter using the same
KR100863902B1 (en) * 2003-12-02 2008-10-16 삼성에스디아이 주식회사 Mask frame assembly and method for aligning a substrate and a mask with the mask frame assembly
JP4596794B2 (en) * 2004-02-27 2010-12-15 日立造船株式会社 Alignment equipment for vacuum deposition
KR100672971B1 (en) 2004-12-28 2007-01-22 두산디앤디 주식회사 Substrate align device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI581057B (en) * 2012-05-31 2017-05-01 三星顯示器有限公司 Mask tensioning apparatus, mask sheet, and mask manufacturing system including the same

Also Published As

Publication number Publication date
KR100712953B1 (en) 2007-05-02
CN101461284A (en) 2009-06-17
TW200802755A (en) 2008-01-01
WO2007145402A1 (en) 2007-12-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees