TWI344414B - - Google Patents

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Publication number
TWI344414B
TWI344414B TW096146273A TW96146273A TWI344414B TW I344414 B TWI344414 B TW I344414B TW 096146273 A TW096146273 A TW 096146273A TW 96146273 A TW96146273 A TW 96146273A TW I344414 B TWI344414 B TW I344414B
Authority
TW
Taiwan
Prior art keywords
mold
heat
heat insulating
layer
insulating layer
Prior art date
Application number
TW096146273A
Other languages
English (en)
Chinese (zh)
Other versions
TW200824878A (en
Inventor
Toru Hirata
Original Assignee
Sumitomo Heavy Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries filed Critical Sumitomo Heavy Industries
Publication of TW200824878A publication Critical patent/TW200824878A/zh
Application granted granted Critical
Publication of TWI344414B publication Critical patent/TWI344414B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
    • B29C45/2632—Stampers; Mountings thereof
    • B29C2045/2634—Stampers; Mountings thereof mounting layers between stamper and mould or on the rear surface of the stamper
    • B29C2045/2636—Stampers; Mountings thereof mounting layers between stamper and mould or on the rear surface of the stamper insulating layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/001—Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
    • B29L2017/003—Records or discs
    • B29L2017/005—CD''s, DVD''s

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Manufacturing Optical Record Carriers (AREA)
TW096146273A 2006-12-07 2007-12-05 Heat insulating mold, mold component, molding machine, and method for manufacturing the heat insulating mold TW200824878A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006330395A JP4750681B2 (ja) 2006-12-07 2006-12-07 断熱金型、金型部品、成形機及び断熱金型の製造方法

Publications (2)

Publication Number Publication Date
TW200824878A TW200824878A (en) 2008-06-16
TWI344414B true TWI344414B (ja) 2011-07-01

Family

ID=39492118

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096146273A TW200824878A (en) 2006-12-07 2007-12-05 Heat insulating mold, mold component, molding machine, and method for manufacturing the heat insulating mold

Country Status (7)

Country Link
US (1) US20100055225A1 (ja)
EP (1) EP2100710A4 (ja)
JP (1) JP4750681B2 (ja)
KR (1) KR20090085668A (ja)
CN (1) CN101553349A (ja)
TW (1) TW200824878A (ja)
WO (1) WO2008069235A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG186311A1 (en) * 2010-06-14 2013-02-28 Polyplastics Co Method for manufacturing a mold
WO2013035625A1 (ja) * 2011-09-05 2013-03-14 ポリプラスチックス株式会社 金型
CN105517378B (zh) * 2014-09-22 2019-09-20 富泰华工业（深圳）有限公司 壳体及其制备方法，应用其的电子装置
CN109211970B (zh) * 2018-11-09 2021-03-30 中国兵器工业第五九研究所 隔热性能测试装置、隔热性能测试方法及应用

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2485724A (en) * 1945-12-21 1949-10-25 Pittsburgh Corning Corp Method of making lightweight cellular materials
EP0211579B1 (en) * 1985-08-02 1990-03-28 Ngk Insulators, Ltd. Method of making a silicon nitride sintered member
JPS6272583A (ja) * 1985-09-26 1987-04-03 日本碍子株式会社 高温構造部材用炭化珪素焼結部材
JPS63144211U (ja) * 1987-03-16 1988-09-22
US4983247A (en) * 1989-08-07 1991-01-08 General Electric Company Method for producing resin rich surface layer on composite thermoplastic material
US5431367A (en) * 1992-08-28 1995-07-11 General Electric Company Multilayer injection molds having improved surface properties
JPH06246797A (ja) * 1992-12-28 1994-09-06 Nippon Steel Chem Co Ltd 成形品外観へのヒケ防止方法および射出成形用金型
US5458818A (en) * 1993-08-31 1995-10-17 General Electric Co. Insulated mold structure for injection molding of optical disks
JP3183171B2 (ja) * 1996-05-31 2001-07-03 トヨタ自動車株式会社 断熱セラミック層およびその形成方法
TW476958B (en) * 1999-02-09 2002-02-21 Ricoh Kk Optical disk and method of producing the same
JP4594486B2 (ja) * 2000-03-30 2010-12-08 長野県 キャビティ形成金型の製造方法、およびキャビティ形成金型
JP2003014938A (ja) * 2001-04-12 2003-01-15 Mitsubishi Engineering Plastics Corp 透明樹脂製の導光板及びその成形方法、入れ子、金型組立体、並びに、面状光源装置
US6787071B2 (en) * 2001-06-11 2004-09-07 General Electric Company Method and apparatus for producing data storage media
JP4098982B2 (ja) * 2001-07-02 2008-06-11 Ｓｐｓシンテックス株式会社 表面成形用成形型の製造方法
JP2004050825A (ja) * 2002-05-31 2004-02-19 Sumitomo Heavy Ind Ltd 金型
JP4181017B2 (ja) * 2002-11-13 2008-11-12 株式会社東伸精工 成形用金型
AU2003289593A1 (en) * 2002-12-31 2004-07-22 Shinill Kang Molding system for molding micro pattern structure having micro heating element and method for fabricating mold insert for molding micro pattern structure used therein
US7311516B2 (en) * 2003-03-03 2007-12-25 Matsushita Electric Industrial Co., Ltd. Die for molding disk substrate and method of manufacturing disk substrate
JP4016278B2 (ja) * 2003-12-25 2007-12-05 セイコーエプソン株式会社 成形型および成形品の製造方法
EP1666434B1 (en) * 2004-05-20 2012-04-11 Kabushiki Kaisha Toshiba Highly heat conductive silicon nitride sintered body and silicon nitride structural member
CN1715033A (zh) * 2004-06-29 2006-01-04 柯尼卡美能达精密光学株式会社 注射成形用模具和光学元件的成形方法
JP4554330B2 (ja) * 2004-10-21 2010-09-29 株式会社リコー 高耐久性を有する断熱スタンパ構造
KR20080038080A (ko) * 2005-08-18 2008-05-02 코니카 미놀타 옵토 인코포레이티드 광학 소자 성형용 금형 및 그 제조 방법
CN101618578B (zh) * 2006-04-20 2012-07-25 住友重机械工业株式会社 树脂成形装置

Also Published As

Publication number Publication date
EP2100710A4 (en) 2012-11-07
JP4750681B2 (ja) 2011-08-17
TW200824878A (en) 2008-06-16
KR20090085668A (ko) 2009-08-07
CN101553349A (zh) 2009-10-07
US20100055225A1 (en) 2010-03-04
WO2008069235A1 (ja) 2008-06-12
EP2100710A1 (en) 2009-09-16
JP2008142952A (ja) 2008-06-26

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MM4A Annulment or lapse of patent due to non-payment of fees