TWI343676B - Planar connector - Google Patents
Planar connector Download PDFInfo
- Publication number
- TWI343676B TWI343676B TW94107779A TW94107779A TWI343676B TW I343676 B TWI343676 B TW I343676B TW 94107779 A TW94107779 A TW 94107779A TW 94107779 A TW94107779 A TW 94107779A TW I343676 B TWI343676 B TW I343676B
- Authority
- TW
- Taiwan
- Prior art keywords
- less
- planar connector
- connector
- resin composition
- reflow
- Prior art date
Links
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 28
- 239000000203 mixture Substances 0.000 claims description 28
- 239000013589 supplement Substances 0.000 claims description 13
- 239000000805 composite resin Substances 0.000 claims description 12
- 239000012765 fibrous filler Substances 0.000 claims description 11
- 238000002156 mixing Methods 0.000 claims description 6
- 239000000047 product Substances 0.000 claims description 3
- 102100039250 Essential MCU regulator, mitochondrial Human genes 0.000 claims 1
- 101000813097 Homo sapiens Essential MCU regulator, mitochondrial Proteins 0.000 claims 1
- 241001494479 Pecora Species 0.000 claims 1
- 238000000518 rheometry Methods 0.000 claims 1
- 238000010008 shearing Methods 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 22
- 125000003118 aryl group Chemical group 0.000 description 15
- 239000003365 glass fiber Substances 0.000 description 12
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 11
- -1 aromatic hydroxycarboxylic acids Chemical class 0.000 description 10
- 238000004898 kneading Methods 0.000 description 9
- 239000008188 pellet Substances 0.000 description 9
- 229920000728 polyester Polymers 0.000 description 9
- 239000000835 fiber Substances 0.000 description 8
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 2
- KAUQJMHLAFIZDU-UHFFFAOYSA-N 6-Hydroxy-2-naphthoic acid Chemical compound C1=C(O)C=CC2=CC(C(=O)O)=CC=C21 KAUQJMHLAFIZDU-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 150000004984 aromatic diamines Chemical class 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011152 fibreglass Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- XBNGYFFABRKICK-UHFFFAOYSA-N 2,3,4,5,6-pentafluorophenol Chemical compound OC1=C(F)C(F)=C(F)C(F)=C1F XBNGYFFABRKICK-UHFFFAOYSA-N 0.000 description 1
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- NEQFBGHQPUXOFH-UHFFFAOYSA-N 4-(4-carboxyphenyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C=C1 NEQFBGHQPUXOFH-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 125000001118 alkylidene group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000009940 knitting Methods 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 1
- PCILLCXFKWDRMK-UHFFFAOYSA-N naphthalene-1,4-diol Chemical compound C1=CC=C2C(O)=CC=C(O)C2=C1 PCILLCXFKWDRMK-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N para-benzoquinone Natural products O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- IZUPBVBPLAPZRR-UHFFFAOYSA-N pentachloro-phenol Natural products OC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl IZUPBVBPLAPZRR-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000012748 slip agent Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2300/00—Characterised by the use of unspecified polymers
- C08J2300/12—Polymers characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004092020A JP4717366B2 (ja) | 2004-03-26 | 2004-03-26 | 平面状コネクター |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200537757A TW200537757A (en) | 2005-11-16 |
| TWI343676B true TWI343676B (en) | 2011-06-11 |
Family
ID=35056509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW94107779A TWI343676B (en) | 2004-03-26 | 2005-03-15 | Planar connector |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4717366B2 (enExample) |
| CN (1) | CN100539317C (enExample) |
| TW (1) | TWI343676B (enExample) |
| WO (1) | WO2005093909A1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5332188B2 (ja) | 2007-02-26 | 2013-11-06 | 住友化学株式会社 | 樹脂成形体及びその製造方法 |
| JP5165492B2 (ja) * | 2008-05-23 | 2013-03-21 | ポリプラスチックス株式会社 | 平面状コネクター |
| JP2010037364A (ja) * | 2008-07-31 | 2010-02-18 | Polyplastics Co | コネクター |
| TW201132747A (en) | 2009-11-16 | 2011-10-01 | Sumitomo Chemical Co | Liquid crystalline polyester composition for connector and connector using the same |
| JP5485216B2 (ja) | 2011-04-01 | 2014-05-07 | ポリプラスチックス株式会社 | 平面状コネクター |
| KR101947215B1 (ko) * | 2011-11-15 | 2019-02-12 | 티코나 엘엘씨 | 미세 피치 전기 커넥터 및 그에 사용하기 위한 열가소성 조성물 |
| JP5753144B2 (ja) | 2012-09-21 | 2015-07-22 | ポリプラスチックス株式会社 | 全芳香族ポリエステル及びポリエステル樹脂組成物、並びにポリエステル成形品 |
| JP5753143B2 (ja) | 2012-09-21 | 2015-07-22 | ポリプラスチックス株式会社 | 全芳香族ポリエステル及びポリエステル樹脂組成物、並びにポリエステル成形品 |
| WO2014050370A1 (ja) | 2012-09-27 | 2014-04-03 | ポリプラスチックス株式会社 | 複合樹脂組成物及び該複合樹脂組成物から成形される平面状コネクター |
| CN113201229A (zh) * | 2021-05-14 | 2021-08-03 | 金发科技股份有限公司 | 一种液晶聚合物复合材料及其应用 |
| JP7767144B2 (ja) * | 2021-12-27 | 2025-11-11 | 株式会社クラレ | 熱可塑性樹脂組成物及びその製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4540737A (en) * | 1983-02-07 | 1985-09-10 | Celanese Corporation | Method for the formation of composite articles comprised of thermotropic liquid crystalline polymers and articles produced thereby |
| JP2579742B2 (ja) * | 1995-02-20 | 1997-02-12 | ポリプラスチックス株式会社 | 射出成型用組成物 |
| JP3683080B2 (ja) * | 1997-09-25 | 2005-08-17 | 三菱エンジニアリングプラスチックス株式会社 | 樹脂組成物、並びに中空部を有する射出成形品及び射出成形方法 |
| JP2000026743A (ja) * | 1998-07-15 | 2000-01-25 | Toray Ind Inc | 液晶性樹脂組成物 |
| JP4118425B2 (ja) * | 1998-12-18 | 2008-07-16 | ポリプラスチックス株式会社 | コネクター用液晶性ポリマー組成物およびコネクター |
| JP2002194188A (ja) * | 2000-12-26 | 2002-07-10 | Toray Ind Inc | 難燃性液晶ポリエステル樹脂組成物 |
-
2004
- 2004-03-26 JP JP2004092020A patent/JP4717366B2/ja not_active Expired - Lifetime
-
2005
- 2005-03-15 TW TW94107779A patent/TWI343676B/zh not_active IP Right Cessation
- 2005-03-24 CN CNB2005800094012A patent/CN100539317C/zh not_active Expired - Lifetime
- 2005-03-24 WO PCT/JP2005/006220 patent/WO2005093909A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JP4717366B2 (ja) | 2011-07-06 |
| CN1934756A (zh) | 2007-03-21 |
| TW200537757A (en) | 2005-11-16 |
| JP2005276758A (ja) | 2005-10-06 |
| WO2005093909A1 (ja) | 2005-10-06 |
| CN100539317C (zh) | 2009-09-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |