TWI342967B - Coordinates detection apparatus and subject inspection apparatus - Google Patents

Coordinates detection apparatus and subject inspection apparatus Download PDF

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Publication number
TWI342967B
TWI342967B TW095100331A TW95100331A TWI342967B TW I342967 B TWI342967 B TW I342967B TW 095100331 A TW095100331 A TW 095100331A TW 95100331 A TW95100331 A TW 95100331A TW I342967 B TWI342967 B TW I342967B
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TW
Taiwan
Prior art keywords
subject
coordinates detection
guiding member
subject inspection
inspection apparatus
Prior art date
Application number
TW095100331A
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English (en)
Other versions
TW200628902A (en
Inventor
Hiroshi Kato
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of TW200628902A publication Critical patent/TW200628902A/zh
Application granted granted Critical
Publication of TWI342967B publication Critical patent/TWI342967B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8861—Determining coordinates of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/061—Sources
    • G01N2201/06113—Coherent sources; lasers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/40—Imaging
    • G01N2223/417—Imaging recording with co-ordinate markings

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Description

丄 / 第 95100331 ΜΙΕ» 2〇ι?ί^ 持部上者； 引導構件，係可於前述被檢體表面上移動，而與前 述被檢體之表面對向且成非接觸者； .聚光源，係設置成可朝與前述引導構件之移動方向 垂直之方向移動’且將聚光斜向照射於前述被檢體之表 面者； 操作部’係在藉由前述搖動機構將前述保持部傾斜 刖述預疋角度的狀態下，使前述引導構件與聚光源各自 移動’並藉前述聚光之照射位置指定前述被檢體上的缺 陷位置者；及 座払檢測邻’係可由前述引導構件及前述聚光源的 各移動位置之位置資訊，求得前述聚光所指定的前述缺 陷位置之座標資料者。 、 10·種被檢體檢查裝置，係可對被檢體的特定部位進行顯 微觀察者，其特徵在於包含有： 觀’、、、明。卩’係用以對前述被檢體照射巨觀照明光 者； 保持部，係可保持前述被檢禮者； 搖動機構’係使前述保持部朝預定角度旋轉者； 對導軌’係挾持前述被檢體而對向配置於前述保 持部上者； ' 引導構件’係、係、可於前述—對導軌上移動，且與前 述被檢體之表面對向而成非接觸者； 聚光源’係②置成可朝與前述引導構件之移動方向 27 1342967 第95100331號專利申請案 更正替換 2012.5.18 垂直之方向移動，且聚光斜向照射於前述被檢體之表面 者； 操作部，係在藉由前述搖動機構將前述保持部傾斜 前述預定角度的狀態下，使前述引導構件與前述聚光源 分別移動，而可藉由前述聚光之照射位置來指定前述被 檢體上之缺陷位置者；
座標檢測部，係可由前述引導構件與前述聚光源之 各移動位置的位置資訊，求得由前述聚光所指定之前述 缺陷位置之座標資料者；及 10 顯微觀察部，係設置成可對前述被檢體作相對移 動，並且根據前述座標檢測部所求得之前述座標資料而 移動到前述缺陷位置，以進行顯微鏡觀察。 15 11.如申請專利範圍第10項之被檢體檢查裝置，其中前述保 持部具有可使前述引導構件退避以防止與前述顯微觀 察部互相干涉之退避範圍。
28
TW095100331A 2005-01-18 2006-01-04 Coordinates detection apparatus and subject inspection apparatus TWI342967B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005010239A JP4653500B2 (ja) 2005-01-18 2005-01-18 座標検出装置及び被検体検査装置

Publications (2)

Publication Number Publication Date
TW200628902A TW200628902A (en) 2006-08-16
TWI342967B true TWI342967B (en) 2011-06-01

Family

ID=36840076

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095100331A TWI342967B (en) 2005-01-18 2006-01-04 Coordinates detection apparatus and subject inspection apparatus

Country Status (4)

Country Link
JP (1) JP4653500B2 (zh)
KR (1) KR100827342B1 (zh)
CN (1) CN100516771C (zh)
TW (1) TWI342967B (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4517354B2 (ja) * 2004-11-08 2010-08-04 株式会社ニコン 露光装置及びデバイス製造方法
CN101446699B (zh) * 2008-12-30 2010-06-02 友达光电股份有限公司 检测装置与用于此检测装置的检测方法
TWI474068B (zh) * 2010-05-05 2015-02-21 Hon Hai Prec Ind Co Ltd 位移量測裝置
CN102253506B (zh) * 2010-05-21 2019-05-14 京东方科技集团股份有限公司 液晶显示基板的制造方法及检测修补设备
CN102393576A (zh) * 2011-08-03 2012-03-28 深圳市华星光电技术有限公司 液晶显示器中玻璃基板的目视检查机及检查方法
US8854616B2 (en) 2011-08-03 2014-10-07 Shenzhen China Star Optoelectronics Technology Co., Ltd. Visual inspection apparatus for glass substrate of liquid crystal display and inspection method thereof
CN102927928B (zh) * 2012-10-30 2016-08-17 三峡大学 固形物上端面扫描仪及扫描方法
CN103075970B (zh) * 2012-12-27 2015-07-01 深圳市华星光电技术有限公司 测长装置直交度补偿方法及使用该方法的测长装置
US9080865B2 (en) 2012-12-27 2015-07-14 Shenzhen China Star Optoelectronics Technology Co., Ltd Orthogonality compensation method for length measurement device and length measurement device using same
KR101751801B1 (ko) * 2016-05-18 2017-06-29 한국기계연구원 기판 결함 검사 장치 및 이를 이용한 검사 방법
JP2018059830A (ja) * 2016-10-06 2018-04-12 川崎重工業株式会社 外観検査方法
CN106770355A (zh) * 2016-12-09 2017-05-31 武汉华星光电技术有限公司 一种cf涂布机的异物检测装置及方法、cf涂布机
CN106773189A (zh) * 2017-03-27 2017-05-31 武汉华星光电技术有限公司 宏观自动检查机及提升显示异常区域量测效率的方法
CN107014826A (zh) * 2017-04-12 2017-08-04 武汉华星光电技术有限公司 Cf基板微观检查机
CN108613990A (zh) * 2018-07-13 2018-10-02 江苏东旭亿泰智能装备有限公司 一种微观和宏观复合检查机
CN109141303B (zh) * 2018-08-14 2020-06-19 哈尔滨工业大学 一种构件几何缺陷检测系统及检测方法
CN116448371B (zh) * 2023-06-16 2023-08-25 苗疆(武汉)机器人科技有限公司 一种工业机器人多角度检测装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01201144A (ja) * 1988-02-05 1989-08-14 Nikon Corp 散乱光検出装置
JP3190406B2 (ja) * 1992-02-18 2001-07-23 オリンパス光学工業株式会社 欠陥検査装置
JPH10206121A (ja) 1997-01-23 1998-08-07 Laser Tec Kk Ｘｙステージの回動検出装置
JPH1134299A (ja) * 1997-07-18 1999-02-09 Shinohara Tekkosho:Kk 見当マークの検出方法
JP2000266511A (ja) * 1999-03-19 2000-09-29 Olympus Optical Co Ltd 検査装置
JP2002082067A (ja) * 2000-09-05 2002-03-22 Olympus Optical Co Ltd 基板検査装置
JP2002267620A (ja) * 2001-03-09 2002-09-18 Hitachi Kokusai Electric Inc 板状物体目視検査装置
JP4690584B2 (ja) * 2001-06-06 2011-06-01 有限会社ユナテック 表面評価装置及び表面評価方法
JP2003002934A (ja) * 2001-06-25 2003-01-08 Toagosei Co Ltd 水性樹脂分散体及びその製造方法並びに用途
JP4347028B2 (ja) * 2003-12-01 2009-10-21 株式会社日立国際電気 目視検査装置

Also Published As

Publication number Publication date
CN1808055A (zh) 2006-07-26
JP4653500B2 (ja) 2011-03-16
CN100516771C (zh) 2009-07-22
KR20060083890A (ko) 2006-07-21
KR100827342B1 (ko) 2008-05-06
TW200628902A (en) 2006-08-16
JP2006200917A (ja) 2006-08-03

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