TWI339401B - - Google Patents
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- Publication number
- TWI339401B TWI339401B TW95140119A TW95140119A TWI339401B TW I339401 B TWI339401 B TW I339401B TW 95140119 A TW95140119 A TW 95140119A TW 95140119 A TW95140119 A TW 95140119A TW I339401 B TWI339401 B TW I339401B
- Authority
- TW
- Taiwan
- Prior art keywords
- anode
- type capacitor
- capacitor
- chip
- cathode
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 claims description 47
- 239000000758 substrate Substances 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 229920001940 conductive polymer Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- 208000032544 Cicatrix Diseases 0.000 claims 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims 1
- 206010039580 Scar Diseases 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 238000005488 sandblasting Methods 0.000 claims 1
- 208000014745 severe cutaneous adverse reaction Diseases 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
- 239000002023 wood Substances 0.000 claims 1
- 238000013461 design Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 244000025254 Cannabis sativa Species 0.000 description 1
- 241001247287 Pentalinon luteum Species 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- OGFYIDCVDSATDC-UHFFFAOYSA-N silver silver Chemical compound [Ag].[Ag] OGFYIDCVDSATDC-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95140119A TW200820285A (en) | 2006-10-31 | 2006-10-31 | Chip type electrolytic capacitor and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95140119A TW200820285A (en) | 2006-10-31 | 2006-10-31 | Chip type electrolytic capacitor and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200820285A TW200820285A (en) | 2008-05-01 |
| TWI339401B true TWI339401B (https=) | 2011-03-21 |
Family
ID=44770118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95140119A TW200820285A (en) | 2006-10-31 | 2006-10-31 | Chip type electrolytic capacitor and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200820285A (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201030785A (en) * | 2009-02-02 | 2010-08-16 | Apaq Technology Co Ltd | Stress absorption structure for anode of solid state electrolyte capacitor |
| TWI690957B (zh) * | 2018-09-21 | 2020-04-11 | 鈺冠科技股份有限公司 | 不需要使用碳膠層的堆疊型電容器封裝結構及其堆疊型電容器、以及高分子複合層 |
-
2006
- 2006-10-31 TW TW95140119A patent/TW200820285A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200820285A (en) | 2008-05-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |