TWI333269B - - Google Patents
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- Publication number
- TWI333269B TWI333269B TW96117534A TW96117534A TWI333269B TW I333269 B TWI333269 B TW I333269B TW 96117534 A TW96117534 A TW 96117534A TW 96117534 A TW96117534 A TW 96117534A TW I333269 B TWI333269 B TW I333269B
- Authority
- TW
- Taiwan
- Prior art keywords
- insulating material
- exclusion
- terminal
- electrode
- wafer type
- Prior art date
Links
- 230000007717 exclusion Effects 0.000 claims description 51
- 239000011810 insulating material Substances 0.000 claims description 44
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 14
- 238000004544 sputter deposition Methods 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims 2
- 238000005516 engineering process Methods 0.000 claims 1
- 239000012774 insulation material Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 10
- 229910052709 silver Inorganic materials 0.000 description 10
- 239000004332 silver Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 2
- 241000257303 Hymenoptera Species 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96117534A TW200847358A (en) | 2007-05-17 | 2007-05-17 | A manufacturing method for terminal electrodes of chip resistor array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96117534A TW200847358A (en) | 2007-05-17 | 2007-05-17 | A manufacturing method for terminal electrodes of chip resistor array |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200847358A TW200847358A (en) | 2008-12-01 |
| TWI333269B true TWI333269B (https=) | 2010-11-11 |
Family
ID=44823494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96117534A TW200847358A (en) | 2007-05-17 | 2007-05-17 | A manufacturing method for terminal electrodes of chip resistor array |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200847358A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI606468B (zh) * | 2017-06-03 | 2017-11-21 | 可調式雙面排阻電阻器裝置及其製造方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI620318B (zh) * | 2016-08-10 | 2018-04-01 | Wafer resistor device and method of manufacturing same |
-
2007
- 2007-05-17 TW TW96117534A patent/TW200847358A/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI606468B (zh) * | 2017-06-03 | 2017-11-21 | 可調式雙面排阻電阻器裝置及其製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200847358A (en) | 2008-12-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |