TWI339098B - - Google Patents
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- Publication number
- TWI339098B TWI339098B TW96131726A TW96131726A TWI339098B TW I339098 B TWI339098 B TW I339098B TW 96131726 A TW96131726 A TW 96131726A TW 96131726 A TW96131726 A TW 96131726A TW I339098 B TWI339098 B TW I339098B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- layer
- double
- flexible board
- heat dissipation
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 230000000694 effects Effects 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 238000013021 overheating Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96131726A TW200911098A (en) | 2007-08-27 | 2007-08-27 | Double-faced soft board with heat conductive design |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96131726A TW200911098A (en) | 2007-08-27 | 2007-08-27 | Double-faced soft board with heat conductive design |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200911098A TW200911098A (en) | 2009-03-01 |
| TWI339098B true TWI339098B (https=) | 2011-03-11 |
Family
ID=44724582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96131726A TW200911098A (en) | 2007-08-27 | 2007-08-27 | Double-faced soft board with heat conductive design |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200911098A (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI407847B (zh) * | 2010-06-01 | 2013-09-01 | Azotek Co Ltd | 散熱基板 |
-
2007
- 2007-08-27 TW TW96131726A patent/TW200911098A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200911098A (en) | 2009-03-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |