TWI336778B - Image defect inspection apparatus, image defect inspection system, and image defect inspection method - Google Patents

Image defect inspection apparatus, image defect inspection system, and image defect inspection method Download PDF

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Publication number
TWI336778B
TWI336778B TW095131901A TW95131901A TWI336778B TW I336778 B TWI336778 B TW I336778B TW 095131901 A TW095131901 A TW 095131901A TW 95131901 A TW95131901 A TW 95131901A TW I336778 B TWI336778 B TW I336778B
Authority
TW
Taiwan
Prior art keywords
image
defect
inspection
value
determined
Prior art date
Application number
TW095131901A
Other languages
English (en)
Chinese (zh)
Other versions
TW200722740A (en
Inventor
Masayuki Kuwabara
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of TW200722740A publication Critical patent/TW200722740A/zh
Application granted granted Critical
Publication of TWI336778B publication Critical patent/TWI336778B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
TW095131901A 2005-11-25 2006-08-30 Image defect inspection apparatus, image defect inspection system, and image defect inspection method TWI336778B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005340248A JP2007149837A (ja) 2005-11-25 2005-11-25 画像欠陥検査装置、画像欠陥検査システム及び画像欠陥検査方法

Publications (2)

Publication Number Publication Date
TW200722740A TW200722740A (en) 2007-06-16
TWI336778B true TWI336778B (en) 2011-02-01

Family

ID=38210904

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095131901A TWI336778B (en) 2005-11-25 2006-08-30 Image defect inspection apparatus, image defect inspection system, and image defect inspection method

Country Status (3)

Country Link
JP (1) JP2007149837A (enExample)
KR (2) KR20070055406A (enExample)
TW (1) TWI336778B (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI627405B (zh) * 2015-10-08 2018-06-21 Hitachi Power Solutions Co Ltd 缺陷檢查方法及其裝置
TWI746320B (zh) * 2020-12-18 2021-11-11 財團法人工業技術研究院 產生及更新定位分布圖的方法及其系統
TWI755460B (zh) * 2017-02-10 2022-02-21 日商東麗工程股份有限公司 外觀檢查方法
TWI840374B (zh) * 2019-06-17 2024-05-01 日月光半導體製造股份有限公司 用於檢測半導體裝置之缺陷之系統及方法
TWI880217B (zh) * 2022-06-13 2025-04-11 日商日立全球先端科技股份有限公司 缺陷檢查裝置

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG164292A1 (en) * 2009-01-13 2010-09-29 Semiconductor Technologies & Instruments Pte System and method for inspecting a wafer
US9601393B2 (en) 2009-02-06 2017-03-21 Kla-Tencor Corp. Selecting one or more parameters for inspection of a wafer
TWI413021B (zh) * 2009-04-10 2013-10-21 Hon Hai Prec Ind Co Ltd 圖像比較系統及方法
US8754972B2 (en) * 2012-02-01 2014-06-17 Kla-Tencor Corporation Integrated multi-channel analog front end and digitizer for high speed imaging applications
JP2013250225A (ja) * 2012-06-04 2013-12-12 Toray Eng Co Ltd 外観検査装置及び外観検査方法
JP5717711B2 (ja) * 2012-12-07 2015-05-13 東京エレクトロン株式会社 基板の基準画像作成方法、基板の欠陥検査方法、基板の基準画像作成装置、基板の欠陥検査ユニット、プログラム及びコンピュータ記憶媒体
JP6329397B2 (ja) * 2014-03-07 2018-05-23 株式会社ダイヘン 画像検査装置及び画像検査方法
KR101702752B1 (ko) * 2015-05-29 2017-02-03 세메스 주식회사 전자 부품 검사 방법
KR102576277B1 (ko) * 2018-05-02 2023-09-08 삼성디스플레이 주식회사 불량 검출 장치 및 방법
US11410292B2 (en) * 2019-09-27 2022-08-09 Kla Corporation Equi-probability defect detection
KR102196396B1 (ko) * 2019-10-21 2020-12-30 (주)에스비네트워크 유동적인 디스플레이 패널 글래스의 표면 결함 검사 방법
JP7087221B2 (ja) * 2019-10-30 2022-06-21 Ａｌｉｔｅｃｓ株式会社 検査装置、方法、及び、プログラム
WO2022091380A1 (ja) * 2020-10-30 2022-05-05 株式会社日立ハイテク 欠陥検査装置
TWI891951B (zh) * 2021-01-06 2025-08-01 日商發那科股份有限公司 圖像處理裝置
TWI790591B (zh) * 2021-04-12 2023-01-21 環球晶圓股份有限公司 晶圓加工系統及其重工方法
CN113592853A (zh) * 2021-08-16 2021-11-02 南京耘瞳科技有限公司 一种基于深度学习的原丝纤维表面缺陷检测方法
CN114171375A (zh) * 2021-11-16 2022-03-11 长江存储科技有限责任公司 一种晶圆光刻方法
CN114266773B (zh) * 2022-03-02 2022-05-20 成都数联云算科技有限公司 显示面板缺陷定位方法、装置、设备及存储介质
CN115690670A (zh) * 2022-09-23 2023-02-03 盛吉盛(宁波)半导体科技有限公司 一种晶圆瑕疵智能识别方法和系统
JP7750823B2 (ja) * 2022-12-27 2025-10-07 株式会社ニューフレアテクノロジー 検査装置及び検査画像の生成方法
CN119540149B (zh) * 2024-10-24 2025-08-19 苏州市东拓新能源有限公司 凹坑缺陷检测方法、系统、设备、存储介质及产品
CN119228795A (zh) * 2024-11-29 2024-12-31 陕西华威科技股份有限公司 一种主轴类零件表面无损检测方法及系统

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3566589B2 (ja) * 1998-07-28 2004-09-15 株式会社日立製作所 欠陥検査装置およびその方法
JP4233397B2 (ja) * 2002-10-01 2009-03-04 株式会社東京精密 画像欠陥検査方法、画像欠陥検査装置及び外観検査装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI627405B (zh) * 2015-10-08 2018-06-21 Hitachi Power Solutions Co Ltd 缺陷檢查方法及其裝置
TWI755460B (zh) * 2017-02-10 2022-02-21 日商東麗工程股份有限公司 外觀檢查方法
TWI840374B (zh) * 2019-06-17 2024-05-01 日月光半導體製造股份有限公司 用於檢測半導體裝置之缺陷之系統及方法
TWI746320B (zh) * 2020-12-18 2021-11-11 財團法人工業技術研究院 產生及更新定位分布圖的方法及其系統
US11687065B2 (en) 2020-12-18 2023-06-27 Industrial Technology Research Institute Method and system for generating and updating position distribution graph
TWI880217B (zh) * 2022-06-13 2025-04-11 日商日立全球先端科技股份有限公司 缺陷檢查裝置

Also Published As

Publication number Publication date
JP2007149837A (ja) 2007-06-14
KR20070055406A (ko) 2007-05-30
TW200722740A (en) 2007-06-16
KR20080073281A (ko) 2008-08-08

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