KR20070055406A - 화상 결함 검사 장치, 화상 결함 검사 시스템 및 화상 결함검사 방법 - Google Patents

화상 결함 검사 장치, 화상 결함 검사 시스템 및 화상 결함검사 방법 Download PDF

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Publication number
KR20070055406A
KR20070055406A KR1020060117165A KR20060117165A KR20070055406A KR 20070055406 A KR20070055406 A KR 20070055406A KR 1020060117165 A KR1020060117165 A KR 1020060117165A KR 20060117165 A KR20060117165 A KR 20060117165A KR 20070055406 A KR20070055406 A KR 20070055406A
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KR
South Korea
Prior art keywords
image
defect
inspection
value
defect detection
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Ceased
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KR1020060117165A
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English (en)
Korean (ko)
Inventor
마사유키 구와바라
Original Assignee
도쿄 세이미츄 코퍼레이션 리미티드
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Publication of KR20070055406A publication Critical patent/KR20070055406A/ko
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Image Processing (AREA)
KR1020060117165A 2005-11-25 2006-11-24 화상 결함 검사 장치, 화상 결함 검사 시스템 및 화상 결함검사 방법 Ceased KR20070055406A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00340248 2005-11-25
JP2005340248A JP2007149837A (ja) 2005-11-25 2005-11-25 画像欠陥検査装置、画像欠陥検査システム及び画像欠陥検査方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020080072428A Division KR20080073281A (ko) 2005-11-25 2008-07-24 화상 결함 검사 장치, 화상 결함 검사 시스템 및 화상 결함검사 방법

Publications (1)

Publication Number Publication Date
KR20070055406A true KR20070055406A (ko) 2007-05-30

Family

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Family Applications (2)

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KR1020060117165A Ceased KR20070055406A (ko) 2005-11-25 2006-11-24 화상 결함 검사 장치, 화상 결함 검사 시스템 및 화상 결함검사 방법
KR1020080072428A Ceased KR20080073281A (ko) 2005-11-25 2008-07-24 화상 결함 검사 장치, 화상 결함 검사 시스템 및 화상 결함검사 방법

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Application Number Title Priority Date Filing Date
KR1020080072428A Ceased KR20080073281A (ko) 2005-11-25 2008-07-24 화상 결함 검사 장치, 화상 결함 검사 시스템 및 화상 결함검사 방법

Country Status (3)

Country Link
JP (1) JP2007149837A (enExample)
KR (2) KR20070055406A (enExample)
TW (1) TWI336778B (enExample)

Families Citing this family (27)

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SG164292A1 (en) * 2009-01-13 2010-09-29 Semiconductor Technologies & Instruments Pte System and method for inspecting a wafer
US9601393B2 (en) 2009-02-06 2017-03-21 Kla-Tencor Corp. Selecting one or more parameters for inspection of a wafer
TWI413021B (zh) * 2009-04-10 2013-10-21 Hon Hai Prec Ind Co Ltd 圖像比較系統及方法
US8754972B2 (en) * 2012-02-01 2014-06-17 Kla-Tencor Corporation Integrated multi-channel analog front end and digitizer for high speed imaging applications
JP2013250225A (ja) * 2012-06-04 2013-12-12 Toray Eng Co Ltd 外観検査装置及び外観検査方法
JP5717711B2 (ja) * 2012-12-07 2015-05-13 東京エレクトロン株式会社 基板の基準画像作成方法、基板の欠陥検査方法、基板の基準画像作成装置、基板の欠陥検査ユニット、プログラム及びコンピュータ記憶媒体
JP6329397B2 (ja) * 2014-03-07 2018-05-23 株式会社ダイヘン 画像検査装置及び画像検査方法
KR101702752B1 (ko) * 2015-05-29 2017-02-03 세메스 주식회사 전자 부품 검사 방법
JP6546826B2 (ja) * 2015-10-08 2019-07-17 株式会社日立パワーソリューションズ 欠陥検査方法、及びその装置
JP2018128406A (ja) * 2017-02-10 2018-08-16 東レエンジニアリング株式会社 外観検査装置
KR102576277B1 (ko) * 2018-05-02 2023-09-08 삼성디스플레이 주식회사 불량 검출 장치 및 방법
TWI840374B (zh) * 2019-06-17 2024-05-01 日月光半導體製造股份有限公司 用於檢測半導體裝置之缺陷之系統及方法
US11410292B2 (en) * 2019-09-27 2022-08-09 Kla Corporation Equi-probability defect detection
KR102196396B1 (ko) * 2019-10-21 2020-12-30 (주)에스비네트워크 유동적인 디스플레이 패널 글래스의 표면 결함 검사 방법
JP7087221B2 (ja) * 2019-10-30 2022-06-21 Ａｌｉｔｅｃｓ株式会社 検査装置、方法、及び、プログラム
WO2022091380A1 (ja) * 2020-10-30 2022-05-05 株式会社日立ハイテク 欠陥検査装置
TWI746320B (zh) 2020-12-18 2021-11-11 財團法人工業技術研究院 產生及更新定位分布圖的方法及其系統
TWI891951B (zh) * 2021-01-06 2025-08-01 日商發那科股份有限公司 圖像處理裝置
TWI790591B (zh) * 2021-04-12 2023-01-21 環球晶圓股份有限公司 晶圓加工系統及其重工方法
CN113592853A (zh) * 2021-08-16 2021-11-02 南京耘瞳科技有限公司 一种基于深度学习的原丝纤维表面缺陷检测方法
CN114171375A (zh) * 2021-11-16 2022-03-11 长江存储科技有限责任公司 一种晶圆光刻方法
CN114266773B (zh) * 2022-03-02 2022-05-20 成都数联云算科技有限公司 显示面板缺陷定位方法、装置、设备及存储介质
JP2023181587A (ja) * 2022-06-13 2023-12-25 株式会社日立ハイテク 欠陥検査装置
CN115690670A (zh) * 2022-09-23 2023-02-03 盛吉盛(宁波)半导体科技有限公司 一种晶圆瑕疵智能识别方法和系统
JP7750823B2 (ja) * 2022-12-27 2025-10-07 株式会社ニューフレアテクノロジー 検査装置及び検査画像の生成方法
CN119540149B (zh) * 2024-10-24 2025-08-19 苏州市东拓新能源有限公司 凹坑缺陷检测方法、系统、设备、存储介质及产品
CN119228795A (zh) * 2024-11-29 2024-12-31 陕西华威科技股份有限公司 一种主轴类零件表面无损检测方法及系统

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3566589B2 (ja) * 1998-07-28 2004-09-15 株式会社日立製作所 欠陥検査装置およびその方法
JP4233397B2 (ja) * 2002-10-01 2009-03-04 株式会社東京精密 画像欠陥検査方法、画像欠陥検査装置及び外観検査装置

Also Published As

Publication number Publication date
JP2007149837A (ja) 2007-06-14
TW200722740A (en) 2007-06-16
TWI336778B (en) 2011-02-01
KR20080073281A (ko) 2008-08-08

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