TWI334401B - Substrate transport apparatus - Google Patents
Substrate transport apparatus Download PDFInfo
- Publication number
- TWI334401B TWI334401B TW094102869A TW94102869A TWI334401B TW I334401 B TWI334401 B TW I334401B TW 094102869 A TW094102869 A TW 094102869A TW 94102869 A TW94102869 A TW 94102869A TW I334401 B TWI334401 B TW I334401B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- magnet
- carrier
- magnet row
- transport
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims description 108
- 230000032258 transport Effects 0.000 claims description 37
- 238000012546 transfer Methods 0.000 claims description 23
- 238000012545 processing Methods 0.000 claims description 14
- 239000013589 supplement Substances 0.000 claims description 14
- 230000007246 mechanism Effects 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 8
- 230000005415 magnetization Effects 0.000 claims description 6
- 230000007723 transport mechanism Effects 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 14
- 239000011521 glass Substances 0.000 description 8
- 238000005469 granulation Methods 0.000 description 7
- 230000003179 granulation Effects 0.000 description 7
- 229910052742 iron Inorganic materials 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 229910052761 rare earth metal Inorganic materials 0.000 description 3
- 238000009835 boiling Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002910 rare earth metals Chemical class 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- -1 lanthanide rare earth Chemical class 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/04—Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members
- E04F15/041—Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members with a top layer of wood in combination with a lower layer of other material
- E04F15/043—Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members with a top layer of wood in combination with a lower layer of other material the lower layer being of organic plastic with or without reinforcements or filling materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
- B32B21/02—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board the layer being formed of fibres, chips, or particles, e.g. MDF, HDF, OSB, chipboard, particle board, hardboard
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/10—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials
- E04F15/102—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials of fibrous or chipped materials, e.g. bonded with synthetic resins
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Non-Mechanical Conveyors (AREA)
- Framework For Endless Conveyors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004105072A JP4471708B2 (ja) | 2004-03-31 | 2004-03-31 | 基板搬送装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200533582A TW200533582A (en) | 2005-10-16 |
| TWI334401B true TWI334401B (en) | 2010-12-11 |
Family
ID=35049218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094102869A TWI334401B (en) | 2004-03-31 | 2005-01-31 | Substrate transport apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4471708B2 (enrdf_load_stackoverflow) |
| KR (1) | KR101088665B1 (enrdf_load_stackoverflow) |
| CN (1) | CN1676445B (enrdf_load_stackoverflow) |
| TW (1) | TWI334401B (enrdf_load_stackoverflow) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1840242B1 (de) * | 2006-03-29 | 2011-06-29 | Applied Materials GmbH & Co. KG | Vakuumtransportvorrichtung mit beweglicher Führungsschiene |
| JP2007269071A (ja) * | 2006-03-30 | 2007-10-18 | Asyst Shinko Inc | 無人搬送装置 |
| KR101409524B1 (ko) * | 2007-05-28 | 2014-06-20 | 엘지디스플레이 주식회사 | 기판 이송 장치 |
| KR101288599B1 (ko) * | 2007-05-29 | 2013-07-22 | 엘지디스플레이 주식회사 | 기판 이송 장치 |
| JP4505002B2 (ja) * | 2007-08-27 | 2010-07-14 | キヤノンアネルバ株式会社 | 搬送装置 |
| US7770714B2 (en) | 2007-08-27 | 2010-08-10 | Canon Anelva Corporation | Transfer apparatus |
| DE102008015982B3 (de) * | 2008-03-27 | 2009-07-30 | Grenzebach Maschinenbau Gmbh | Verfahren und Vorrichtung zur Fixierung und den Weitertransport stoßempfindlicher Platten in Sputter-Beschichtungsanlagen, Computerprogramm zur Durchführung des Verfahrens und maschinenlesbarer Träger hierzu |
| US8226795B2 (en) * | 2009-02-03 | 2012-07-24 | Nordson Corporation | Magnetic clips and substrate holders for use in a plasma processing system |
| JP5603333B2 (ja) * | 2009-07-14 | 2014-10-08 | キヤノンアネルバ株式会社 | 基板処理装置 |
| CN101989005B (zh) * | 2009-07-30 | 2013-08-14 | 北京京东方光电科技有限公司 | 结构基板、传送装置和对盒装置 |
| JP4745447B2 (ja) * | 2010-02-04 | 2011-08-10 | キヤノンアネルバ株式会社 | 基板搬送装置及び真空処理装置 |
| CN102190156B (zh) * | 2010-02-10 | 2014-06-25 | 佳能安内华股份有限公司 | 托盘式基板输送系统、成膜方法和电子装置的制造方法 |
| JP5731838B2 (ja) * | 2010-02-10 | 2015-06-10 | キヤノンアネルバ株式会社 | トレイ式基板搬送システム、成膜方法及び電子装置の製造方法 |
| US9922854B2 (en) * | 2010-04-30 | 2018-03-20 | Applied Materials, Inc. | Vertical inline CVD system |
| CN101954625A (zh) * | 2010-10-21 | 2011-01-26 | 湖南玉丰真空科学技术有限公司 | 一种工件夹具 |
| TWI476139B (zh) * | 2011-06-30 | 2015-03-11 | Sfa Engineering Corp | 用於傳送基板的裝置 |
| JP2013021036A (ja) * | 2011-07-08 | 2013-01-31 | Canon Anelva Corp | 搬送装置 |
| KR101319785B1 (ko) * | 2013-03-18 | 2013-10-18 | 주식회사 야스 | 정전기 부상을 이용한 기판이송장치 |
| CN103420165B (zh) * | 2013-08-06 | 2015-09-02 | 中国电子科技集团公司第四十八研究所 | 一种基片传输装置 |
| JP6092349B2 (ja) * | 2014-11-27 | 2017-03-08 | アルバック コリア リミテッドＵｌｖａｃ Ｋｏｒｅａ，Ｌｔｄ． | 基板搬送装置 |
| KR20160063969A (ko) * | 2014-11-27 | 2016-06-07 | 한국알박(주) | 기판 이송 장치 |
| DE102015004582B4 (de) * | 2015-04-09 | 2017-02-09 | Mecatronix Ag | Vorrichtung zum Halten, Positionieren und Bewegen eines Objekts |
| CN104820306B (zh) * | 2015-05-27 | 2018-01-26 | 京东方科技集团股份有限公司 | 一种基板的剥离方法及层叠结构、显示面板和显示装置 |
| CN106044243B (zh) * | 2016-07-08 | 2019-06-04 | 佛山格尼斯磁悬浮技术有限公司 | 面板立式输送装置 |
| KR102232306B1 (ko) * | 2017-03-17 | 2021-03-24 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판의 진공 프로세싱을 위한 장치, 기판의 진공 프로세싱을 위한 시스템, 및 진공 챔버 내에서의 기판 캐리어 및 마스크 캐리어의 이송을 위한 방법 |
| CN108519693B (zh) * | 2018-04-16 | 2021-10-29 | 京东方科技集团股份有限公司 | 一种基板对位装置、基板及基板对位方法 |
| KR102090645B1 (ko) * | 2018-08-27 | 2020-03-18 | 엘지전자 주식회사 | 반송 장치 |
| JP7242414B2 (ja) * | 2019-05-08 | 2023-03-20 | 株式会社アルバック | 真空搬送装置及び成膜装置 |
| CN110453200B (zh) * | 2019-08-16 | 2024-12-24 | 星弧涂层新材料科技（苏州）股份有限公司 | 片材纵置运输小车及气相沉积设备 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4036339C2 (de) * | 1990-11-15 | 1993-10-21 | Leybold Ag | Vorrichtung für den Transport von Substraten |
| JP2687306B2 (ja) * | 1994-05-16 | 1997-12-08 | 株式会社エイコー・エンジニアリング | 真空系内基板搬送装置 |
| CH691680A5 (de) * | 1996-10-15 | 2001-09-14 | Unaxis Deutschland Gmbh | Transportvorrichtung für Werkstücke in einer Vakuumanlage. |
| WO1999017356A1 (en) * | 1997-09-30 | 1999-04-08 | Semitool, Inc. | Semiconductor processing apparatus having linear conveyor system |
| US6206176B1 (en) * | 1998-05-20 | 2001-03-27 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle having a magnetic drive |
| JP2000177842A (ja) * | 1998-12-10 | 2000-06-27 | Mitsubishi Heavy Ind Ltd | 搬送装置及び真空処理システム |
| JP3842935B2 (ja) * | 1999-10-22 | 2006-11-08 | 三菱重工業株式会社 | トレイレス斜め基板搬送装置 |
-
2004
- 2004-03-31 JP JP2004105072A patent/JP4471708B2/ja not_active Expired - Fee Related
-
2005
- 2005-01-31 TW TW094102869A patent/TWI334401B/zh active
- 2005-02-03 KR KR1020050009809A patent/KR101088665B1/ko not_active Expired - Lifetime
- 2005-03-31 CN CN2005100598529A patent/CN1676445B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060041618A (ko) | 2006-05-12 |
| TW200533582A (en) | 2005-10-16 |
| KR101088665B1 (ko) | 2011-12-01 |
| CN1676445A (zh) | 2005-10-05 |
| JP2005289556A (ja) | 2005-10-20 |
| JP4471708B2 (ja) | 2010-06-02 |
| CN1676445B (zh) | 2011-06-08 |
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