TWI334366B - - Google Patents
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- Publication number
- TWI334366B TWI334366B TW094106915A TW94106915A TWI334366B TW I334366 B TWI334366 B TW I334366B TW 094106915 A TW094106915 A TW 094106915A TW 94106915 A TW94106915 A TW 94106915A TW I334366 B TWI334366 B TW I334366B
- Authority
- TW
- Taiwan
- Prior art keywords
- solder
- bga
- ball
- bumps
- free
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 claims description 66
- 229910020935 Sn-Sb Inorganic materials 0.000 claims description 4
- 229910008757 Sn—Sb Inorganic materials 0.000 claims description 4
- 229910017944 Ag—Cu Inorganic materials 0.000 claims description 3
- 229910020836 Sn-Ag Inorganic materials 0.000 claims description 3
- 229910020888 Sn-Cu Inorganic materials 0.000 claims description 3
- 229910020988 Sn—Ag Inorganic materials 0.000 claims description 3
- 229910019204 Sn—Cu Inorganic materials 0.000 claims description 3
- 230000008018 melting Effects 0.000 description 9
- 238000002844 melting Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 238000005476 soldering Methods 0.000 description 7
- 238000007792 addition Methods 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 3
- 229910052732 germanium Inorganic materials 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000003916 acid precipitation Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 244000025254 Cannabis sativa Species 0.000 description 1
- 235000012766 Cannabis sativa ssp. sativa var. sativa Nutrition 0.000 description 1
- 235000012765 Cannabis sativa ssp. sativa var. spontanea Nutrition 0.000 description 1
- 208000003251 Pruritus Diseases 0.000 description 1
- 241000245165 Rhododendron ponticum Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 235000009120 camo Nutrition 0.000 description 1
- 235000005607 chanvre indien Nutrition 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000003673 groundwater Substances 0.000 description 1
- 239000011487 hemp Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 244000144972 livestock Species 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 210000002445 nipple Anatomy 0.000 description 1
- 231100000572 poisoning Toxicity 0.000 description 1
- 230000000607 poisoning effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004079348 | 2004-03-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200603932A TW200603932A (en) | 2006-02-01 |
| TWI334366B true TWI334366B (enrdf_load_stackoverflow) | 2010-12-11 |
Family
ID=34993512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094106915A TW200603932A (en) | 2004-03-19 | 2005-03-08 | Lead free solder fall |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4392020B2 (enrdf_load_stackoverflow) |
| TW (1) | TW200603932A (enrdf_load_stackoverflow) |
| WO (1) | WO2005089999A1 (enrdf_load_stackoverflow) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5071802B2 (ja) * | 2008-04-08 | 2012-11-14 | 日立金属株式会社 | はんだボール、はんだ層及びはんだバンプ |
| JP2011031253A (ja) * | 2009-07-30 | 2011-02-17 | Eishin Kogyo Kk | 無鉛ハンダ合金 |
| KR101283580B1 (ko) | 2011-12-14 | 2013-07-05 | 엠케이전자 주식회사 | 주석계 솔더 볼 및 이를 포함하는 반도체 패키지 |
| US8865062B2 (en) * | 2012-08-08 | 2014-10-21 | Senju Metal Industry Co., Ltd. | High-temperature lead-free solder alloy |
| JP6713106B2 (ja) * | 2014-02-24 | 2020-06-24 | 株式会社弘輝 | 鉛フリーはんだ合金、はんだ材料及び接合構造体 |
| JP6579253B1 (ja) | 2018-11-09 | 2019-09-25 | 千住金属工業株式会社 | ハンダボール、ハンダ継手および接合方法 |
| CN115464299A (zh) * | 2021-10-21 | 2022-12-13 | 上海华庆焊材技术股份有限公司 | 一种降低焊接空洞的预成型无铅焊片及其制备方法和应用 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3684811B2 (ja) * | 1998-01-28 | 2005-08-17 | 株式会社村田製作所 | 半田および半田付け物品 |
| JP3753168B2 (ja) * | 1999-08-20 | 2006-03-08 | 千住金属工業株式会社 | 微小チップ部品接合用ソルダペースト |
-
2005
- 2005-03-08 TW TW094106915A patent/TW200603932A/zh not_active IP Right Cessation
- 2005-03-14 JP JP2006511176A patent/JP4392020B2/ja not_active Expired - Lifetime
- 2005-03-14 WO PCT/JP2005/004427 patent/WO2005089999A1/ja active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2005089999A1 (ja) | 2005-09-29 |
| JPWO2005089999A1 (ja) | 2008-01-31 |
| TW200603932A (en) | 2006-02-01 |
| JP4392020B2 (ja) | 2009-12-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |