TWI330388B - Formulation of a silicon germanium-on-insulator structure by oxidation of a buried porous silicon layer - Google Patents
Formulation of a silicon germanium-on-insulator structure by oxidation of a buried porous silicon layer Download PDFInfo
- Publication number
- TWI330388B TWI330388B TW093126414A TW93126414A TWI330388B TW I330388 B TWI330388 B TW I330388B TW 093126414 A TW093126414 A TW 093126414A TW 93126414 A TW93126414 A TW 93126414A TW I330388 B TWI330388 B TW I330388B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- germanium
- substrate
- region
- annealing step
- Prior art date
Links
- 239000012212 insulator Substances 0.000 title claims abstract description 33
- 239000000203 mixture Substances 0.000 title claims description 13
- 230000003647 oxidation Effects 0.000 title abstract description 12
- 238000007254 oxidation reaction Methods 0.000 title abstract description 12
- 229910021426 porous silicon Inorganic materials 0.000 title abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title 1
- 238000009472 formulation Methods 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
- 238000000034 method Methods 0.000 claims abstract description 81
- 239000000758 substrate Substances 0.000 claims abstract description 66
- 238000000137 annealing Methods 0.000 claims abstract description 49
- 239000000463 material Substances 0.000 claims abstract description 40
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 67
- 229910052732 germanium Inorganic materials 0.000 claims description 65
- 239000013078 crystal Substances 0.000 claims description 26
- 229910052715 tantalum Inorganic materials 0.000 claims description 23
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 23
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 22
- 229910052707 ruthenium Inorganic materials 0.000 claims description 22
- 239000002019 doping agent Substances 0.000 claims description 19
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 15
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- 239000011261 inert gas Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000007743 anodising Methods 0.000 claims description 8
- 239000007789 gas Substances 0.000 claims description 8
- 238000004151 rapid thermal annealing Methods 0.000 claims description 8
- 229910052734 helium Inorganic materials 0.000 claims description 5
- 239000001307 helium Substances 0.000 claims description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 150000002500 ions Chemical class 0.000 claims description 3
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- 230000004913 activation Effects 0.000 claims 9
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- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims 1
- 229910001347 Stellite Inorganic materials 0.000 claims 1
- AHICWQREWHDHHF-UHFFFAOYSA-N chromium;cobalt;iron;manganese;methane;molybdenum;nickel;silicon;tungsten Chemical compound C.[Si].[Cr].[Mn].[Fe].[Co].[Ni].[Mo].[W] AHICWQREWHDHHF-UHFFFAOYSA-N 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 229910052727 yttrium Inorganic materials 0.000 claims 1
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- 238000010438 heat treatment Methods 0.000 description 14
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- 229910000577 Silicon-germanium Inorganic materials 0.000 description 8
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- 238000002513 implantation Methods 0.000 description 5
- 238000005468 ion implantation Methods 0.000 description 5
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- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 4
- 238000000038 ultrahigh vacuum chemical vapour deposition Methods 0.000 description 4
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- 239000000956 alloy Substances 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
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- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 3
- 238000001289 rapid thermal chemical vapour deposition Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910001257 Nb alloy Inorganic materials 0.000 description 2
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 2
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 2
- 235000011613 Pinus brutia Nutrition 0.000 description 2
- 241000018646 Pinus brutia Species 0.000 description 2
- 238000001505 atmospheric-pressure chemical vapour deposition Methods 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 210000003298 dental enamel Anatomy 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001152 Bi alloy Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 206010019468 Hemiplegia Diseases 0.000 description 1
- 241000238631 Hexapoda Species 0.000 description 1
- 206010029412 Nightmare Diseases 0.000 description 1
- KZNMRPQBBZBTSW-UHFFFAOYSA-N [Au]=O Chemical compound [Au]=O KZNMRPQBBZBTSW-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 229910001922 gold oxide Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001272 nitrous oxide Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 201000004409 schistosomiasis Diseases 0.000 description 1
- 229910021647 smectite Inorganic materials 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
- H01L21/76227—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials the dielectric materials being obtained by full chemical transformation of non-dielectric materials, such as polycristalline silicon, metals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/10—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of nickel or cobalt or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76245—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using full isolation by porous oxide silicon, i.e. FIPOS techniques
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6758—Thin-film transistors [TFT] characterised by the insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02378—Silicon carbide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02441—Group 14 semiconducting materials
- H01L21/0245—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Recrystallisation Techniques (AREA)
- Element Separation (AREA)
- Local Oxidation Of Silicon (AREA)
- Silicates, Zeolites, And Molecular Sieves (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/662,028 US7125458B2 (en) | 2003-09-12 | 2003-09-12 | Formation of a silicon germanium-on-insulator structure by oxidation of a buried porous silicon layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200516666A TW200516666A (en) | 2005-05-16 |
| TWI330388B true TWI330388B (en) | 2010-09-11 |
Family
ID=34274005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093126414A TWI330388B (en) | 2003-09-12 | 2004-09-01 | Formulation of a silicon germanium-on-insulator structure by oxidation of a buried porous silicon layer |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US7125458B2 (enExample) |
| EP (1) | EP1665340B1 (enExample) |
| JP (1) | JP4856544B2 (enExample) |
| KR (1) | KR100856988B1 (enExample) |
| CN (1) | CN100429761C (enExample) |
| AT (1) | ATE368939T1 (enExample) |
| DE (1) | DE602004007940T2 (enExample) |
| TW (1) | TWI330388B (enExample) |
| WO (1) | WO2005031810A2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10777366B2 (en) | 2011-09-30 | 2020-09-15 | Intel Corporation | Method of increasing an energy density and an achievable power output of an energy storage device |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7566482B2 (en) * | 2003-09-30 | 2009-07-28 | International Business Machines Corporation | SOI by oxidation of porous silicon |
| US7172930B2 (en) * | 2004-07-02 | 2007-02-06 | International Business Machines Corporation | Strained silicon-on-insulator by anodization of a buried p+ silicon germanium layer |
| US7767541B2 (en) * | 2005-10-26 | 2010-08-03 | International Business Machines Corporation | Methods for forming germanium-on-insulator semiconductor structures using a porous layer and semiconductor structures formed by these methods |
| US7833884B2 (en) * | 2007-11-02 | 2010-11-16 | International Business Machines Corporation | Strained semiconductor-on-insulator by Si:C combined with porous process |
| US7772096B2 (en) * | 2008-07-10 | 2010-08-10 | International Machines Corporation | Formation of SOI by oxidation of silicon with engineered porosity gradient |
| FR2935194B1 (fr) * | 2008-08-22 | 2010-10-08 | Commissariat Energie Atomique | Procede de realisation de structures geoi localisees, obtenues par enrichissement en germanium |
| US8618554B2 (en) * | 2010-11-08 | 2013-12-31 | International Business Machines Corporation | Method to reduce ground-plane poisoning of extremely-thin SOI (ETSOI) layer with thin buried oxide |
| US8518807B1 (en) * | 2012-06-22 | 2013-08-27 | International Business Machines Corporation | Radiation hardened SOI structure and method of making same |
| US9087716B2 (en) * | 2013-07-15 | 2015-07-21 | Globalfoundries Inc. | Channel semiconductor alloy layer growth adjusted by impurity ion implantation |
| US9343303B2 (en) | 2014-03-20 | 2016-05-17 | Samsung Electronics Co., Ltd. | Methods of forming low-defect strain-relaxed layers on lattice-mismatched substrates and related semiconductor structures and devices |
| US10032870B2 (en) | 2015-03-12 | 2018-07-24 | Globalfoundries Inc. | Low defect III-V semiconductor template on porous silicon |
| US9899274B2 (en) | 2015-03-16 | 2018-02-20 | International Business Machines Corporation | Low-cost SOI FinFET technology |
| US10833175B2 (en) * | 2015-06-04 | 2020-11-10 | International Business Machines Corporation | Formation of dislocation-free SiGe finFET using porous silicon |
| US20190131454A1 (en) * | 2017-11-01 | 2019-05-02 | Qualcomm Incorporated | Semiconductor device with strained silicon layers on porous silicon |
| CN112908849A (zh) * | 2021-01-28 | 2021-06-04 | 上海华力集成电路制造有限公司 | 一种形成SiGe沟道的热处理方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4104090A (en) | 1977-02-24 | 1978-08-01 | International Business Machines Corporation | Total dielectric isolation utilizing a combination of reactive ion etching, anodic etching, and thermal oxidation |
| JPS5831730B2 (ja) * | 1979-10-15 | 1983-07-08 | 松下電器産業株式会社 | 半導体装置の製造方法 |
| JPS592185B2 (ja) * | 1980-02-04 | 1984-01-17 | 日本電信電話株式会社 | 半導体基体内への絶縁領域の形成法 |
| KR960002765B1 (ko) | 1992-12-22 | 1996-02-26 | 금성일렉트론주식회사 | 절연체 위에 단결정 반도체 제조방법 |
| US6376859B1 (en) * | 1998-07-29 | 2002-04-23 | Texas Instruments Incorporated | Variable porosity porous silicon isolation |
| US5950094A (en) * | 1999-02-18 | 1999-09-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for fabricating fully dielectric isolated silicon (FDIS) |
| JP4212228B2 (ja) * | 1999-09-09 | 2009-01-21 | 株式会社東芝 | 半導体装置の製造方法 |
| JP2002305293A (ja) * | 2001-04-06 | 2002-10-18 | Canon Inc | 半導体部材の製造方法及び半導体装置の製造方法 |
| US6812116B2 (en) * | 2002-12-13 | 2004-11-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of fabricating a wafer with strained channel layers for increased electron and hole mobility for improving device performance |
-
2003
- 2003-09-12 US US10/662,028 patent/US7125458B2/en not_active Expired - Fee Related
-
2004
- 2004-09-01 TW TW093126414A patent/TWI330388B/zh not_active IP Right Cessation
- 2004-09-10 JP JP2006526273A patent/JP4856544B2/ja not_active Expired - Fee Related
- 2004-09-10 KR KR1020067003316A patent/KR100856988B1/ko not_active Expired - Fee Related
- 2004-09-10 WO PCT/US2004/029378 patent/WO2005031810A2/en not_active Ceased
- 2004-09-10 EP EP04809708A patent/EP1665340B1/en not_active Expired - Lifetime
- 2004-09-10 AT AT04809708T patent/ATE368939T1/de not_active IP Right Cessation
- 2004-09-10 CN CNB2004800263800A patent/CN100429761C/zh not_active Expired - Fee Related
- 2004-09-10 DE DE602004007940T patent/DE602004007940T2/de not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10777366B2 (en) | 2011-09-30 | 2020-09-15 | Intel Corporation | Method of increasing an energy density and an achievable power output of an energy storage device |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1665340B1 (en) | 2007-08-01 |
| DE602004007940T2 (de) | 2008-04-24 |
| EP1665340A2 (en) | 2006-06-07 |
| WO2005031810A2 (en) | 2005-04-07 |
| CN1957458A (zh) | 2007-05-02 |
| US20050056352A1 (en) | 2005-03-17 |
| JP2007505502A (ja) | 2007-03-08 |
| JP4856544B2 (ja) | 2012-01-18 |
| KR20060061839A (ko) | 2006-06-08 |
| KR100856988B1 (ko) | 2008-09-04 |
| TW200516666A (en) | 2005-05-16 |
| CN100429761C (zh) | 2008-10-29 |
| ATE368939T1 (de) | 2007-08-15 |
| US7125458B2 (en) | 2006-10-24 |
| WO2005031810A3 (en) | 2005-06-23 |
| DE602004007940D1 (de) | 2007-09-13 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |