1329608 九、發明說明： 【發明所屬之技術領域】 士 發明係提供—種可同時移載及測試複數個記憶體I c，而 測二二能’並有效提升各裝置使用效能之記憶體1 °檢 【先前技術】 翻’半導體元狀1 〇概分為邏輯1 c、記憶體I C、 拿她此及微70件1 ^等不同類型’以邏輯1 C為例，係應用於1329608 IX. Description of the invention: [Technical field of invention] The invention provides a memory that can simultaneously transfer and test a plurality of memory I c, and measure the energy of each device and effectively improve the performance of each device. [Previous technique] Turning over 'semiconductor element 1 〇 is divided into logic 1 c, memory IC, taking her and micro 70 pieces 1 ^ and other different types' with logic 1 C as an example, applied
處理^俾以負責中央處理11與其他周邊^件之 訊雜換或傳遞’以及運算作業，其魏性 = 2則單純用以儲存資料，並裝設於模組電路&，該模^ς板 再裝配於域板上，其魏錄為單純，财論類 保=『[均須經過一檢測作業，以淘汰出不良品，而確 板上進行檢測作業，基於邏輯I C 1 C於實體 ，故料辨纪木心士 檢測作業較為複雜及多樣化 ，t 供執行單—邏輯1⑽測作業 研參閱第1、2圖’係為坊間應用於檢測 =機’包含於機台之前端設有供料£i 移1係可承置待 二移料穿置1;3係用以測之邏輯1 c用以收料，而第 則設有複數個測試裝置i 4及第二移料#置而=== 14係設有具單一測試套座142之實體板Ί」 ^ 壓待測邏輯IC之壓接機構143，Α中，t4丨1 ’以及用ϊΐ 供置入單-制之邏輯ί C G 3而第!移=座1 4 2: 矛—移枓裝置15則用以移 5 1329608 载待/完測之邏輯I ς，另設有一Processing ^ 俾 to be responsible for the central processing 11 and other peripherals of the information exchange or transmission 'and operation, its superiority = 2 is simply used to store data, and installed in the module circuit & The board is reassembled on the domain board, and its Wei recorded as simple, and the financial category guarantees = "[all must go through a test operation to eliminate the defective products, and the detection operation on the board, based on the logic IC 1 C in the entity, Therefore, it is more complicated and diversified to detect the work of the Muscles. For the execution of the single-logic 1 (10) test operation, refer to the first and second figures, which are used in the workshop for testing = machine included in the front end of the machine. The i shift 1 system can hold the second transfer material 1; the 3 system is used to measure the logic 1 c for receiving, and the first is to have a plurality of test devices i 4 and the second transfer material # set == = 14 is a solid board with a single test socket 142" ^ Pressing the crimping mechanism 143 of the logic IC to be tested, Α中, t4丨1 ' and ϊΐ for the single-system logic ί CG 3 The first shift = the seat 1 4 2: The spear-moving device 15 is used to move 5 1329608 to be checked/completed logic I ς, another one
轉運襄置16 ’該轉運裝置i 6係」，台前、後端往復位移之 ，進而該第一移料裝置1 3可於供料待/完測之邏輯I C I C 1 7，並置放於轉運裝置1 6 11處取出待測之邏輯 台之後端’第二移料裝置1 5即將轉、裝置16載送至機 I C17取出’並移載至測試置16上待測之邏輯 141之測試套座142中，以勃并仏，，且置入於其實體板 該第二移料裝置1 5即將完測之邏輯’於檢測完畢後， 運裝置16上’由轉運裝置丨6載 ^7取出，並置放於轉 置1 3則將轉運裝置1 6上完測之邏輯’第一移料裝 收料匣12，且依檢測結果而分d王：取出，並移載至 檢測、分類作業。 置，以元成邏輯I C17之 單純反資料，其功能性較為 ，C檢測分類機來執行記ct:業;= 借=時巧載及測試多個制之記憶體I C，且經由“運二二 僅載送單一待測之記憶體I c，將使整個 “置-人 J為具複數個測試裝置之大型記憶體I c檢測機機貝 作 產^等=間將更為繁$貞及耗時’亦A幅降低記憶體I ^之檢測 ^月^ ’故此一 I C檢測分類機不適用於執行記憶體〗〇之檢測作 因此’在講求快速之檢測使用效率及提升產能之需求下，如 何設計一種適用於檢測記憶體丨C，而大幅提升檢測產能之記情 體IC檢測分類機’即為業者設計之標的。 w 【發明内容】 本發明之目的一 ’係提供一種記憶體I c檢測分類機（四） ，其包含設於機台前端之供料匣、至少一個收料匣及載送裝置， 設於機台後端之至少一個測試裝置，以及設於供、收料匣及測試 農置間之移料裝置；該供、收料匣係分別用以承置待/完測之記 6 ’顺裝置係設有具她_試套座之測試電路板，移 ’番U可於供繼同時移载複數個待測之記憶體J 〇至載送裝 Hi送裝置係可預熱承置之待測記憶體1 C，使尚未進_ 剌記麵1 C雜餅高溫魏T，並有X-Y方向 钟移動以供測試裝置於不同位置取料，於測試裝置之各測 巧憶體1 c完畢後，移料裝置可依測試結果再將完測 ΐΐϋ =移載至收料11以分類收置；藉此，可同時移載及測 紐1 C，社幅增加檢啦能，並有效提升載送裝 罝之使用效能。 明之目的二’係提供—種記舰I C檢測分麵（四） 」其^3设於機台前端之供料匣、至少一個收料匣及載送裝置， 設if台後端，至少-個職裝置及搬移式收料Ε，以及設於供 署測試裝置間之移料裝置；該供、收料11係分別用以承 :0丨^凡測之§己憶體1 C，測試裝置係設有具複數個測試套座之 二r2裝置係可於供料四時移載複數個待測之記憶 = 载綠置，賴送裝置係將制之記賴I C載送至測 试裝置以供取料’於測試震置之各測試套座測試記憶體工 後’移料裝置可依測試結果再將完測之記憶體丨 收料II之料盤，該搬移式收_具有一可作x —J = 移載器’用以將盛m】記憶體][c之料盤賴至機自下方之收 ，容器中收置’並可視測試結果’而將收納容器中用以盛裝不同 等級完測記憶體Ic之料盤取出移載至機台上收料· 時移載及測試複數個記憶體！ C，而大幅增加產日 ^ 中作更多獨料之分類㈣，™ 本發明之目的三’係提供—種記憶體！ c檢測分賴（四） ，其包含設於機台前端之供料匣、至少一個收料匣 置，設於機台後端之至少一個測試裝置、第二載 了 於供、收料1E及測試裝置間之移料裝置；該供、收^係分別^ 1329608 . 以承置待/完測之記憶體Ic，測試裝置係設有具複數個測試套 座之測試電路板’移料裝置係可於供料匣移載複數個記憶體I C 至第一載送裝置，該第一載送裝置可將待測之記憶體I C載送至 • 測試裝置以供取料，於測試裝置之各測試套座測試記憶體I C完 畢後’第二載送裝置係載送出完測之記憶體I C，移料裝置則將 - 第二載送裝置上完測之記憶體I C取出，並依測試結果移載至收 料匣分類收置；藉此，可同時移載及測試複數個記憶體I c，而 大幅增加檢測產能，並以第一、二載送裝置分別載送待/完測之 s己憶體I C ’而有效提升载送記憶體I c之使用效能。 •本發明之目的四，係提供一種記憶體I C檢測分類機（四） . ，其包含設於機台前端之供料匣、至少一個收料匣及載送裝置， 设於機台後端之至少一個測試裝置，以及設於供、收料匣及測試 裝置間之移料裝置；該供、收料匣係分別用以承置待/完測之記 隐體I C ’測武裝置係设有具複數個測試套座之測試電路板，移 料裝置係可於供料匣移載複數個記憶體I C至載送裝置，載送裝 置可將待測之記憶體I c載送至測試裝置以供取料，於測試裝置 之各測試套座測試記憶體I c完畢後，載送裝置係以複數個 C CD先逐一檢查測試裝置之各測試套座中是否殘留記憶體J c ，而後供承置完測之記憶體I C，移料裝置再將載送裝置上完測 Φ 之§己憶體I c取出，並依測試結果移載至收料匣分類收置；藉此 ’可同時移載及測試複數個記憶體I c，而大幅增加檢測產食1， 並以載送襄置檢查測試套座是否殘留記憶體I c，以確保測試裝 置順利作動之使用效益。 1 本發明之目的五’係提供一種記憶體I c檢測分類機（四） ，其包含設於機台前端之供料匣、至少一個收料匣及載送裝置， 設於機台後端之至少一個測試裝置，以及設於供、收料s及測試 裝置間之移料裝置；該供、收料匣係分別用以承置待/完測之記 隐體I C ’測試裝置係设有具複數個測試套座之測試電路板，移 料裝置係可於供料匣移載複數個記憶體Ic至載送裝置之載台上 8 1329608 ’載送裝置係以疊層移載機構逐層凸伸出數 送載台至測試裝置中，以供職裝絲 ，，台承載完測之記憶體！ c，移料裝置則將載送裝is D上元測之記憶體I C取出’並依測試結果 置严，可同時移載及測試複數個記憶體!=== 測產能，並可縮減載送裝置佔用之空間。 穴恼a加檢 【實施方式】 為使貴審查委員對本發明作更進一步之瞭解， 實施例並配合圖式，詳述如后： 牛平乂1主 二9ί參ΐ第3Ϊ所示，本發明之記憶體1 C檢測分類機係於機 1 2 0 ^刖端設有供· 2 i、处2 2，設 端之複數個臟2 3 A、2 3 B、2 3 C、2 3 D及一“蒋ί ’設於機台2◦後端之測試裝置25，設於測=^ 25刖端及側端之第一載送裝置26及第二 =刪i简2及第一載送裝置^: 裝置28，及移動於第二載送裝置27、收料E23A、23b 、2 3C、2 30及搬移式收料1£24間之第二移料裝置 巧1 承置待測之記憶體1 C，空以2係可接收 斗匣2 1使用完之空料盤，並可依需要將收置 =㈣ 3Α、23Β、2κ、23_/= 固收· 2 m 3 Β、2 3 C、2 3 D及搬移式收 2二 糸可細分不同等級，肋儲放完測之不同等級記憶體〗c， j搬移式收料ϋ 2 4係設有可作X — z方向位移之移&器 1，並於機台2〇之下方設有可收納複數個不同等級料 ，納容器2 4 2，該移載ϋ 2 41可視測試結果而將收納容器 】^中不同等級之料盤搬移至機台2 〇上以供分類收料，測“ 襄置2 5係設有具複數個測試套座2 51 (例如3 2個）之 電路板2 5 2，測試電路板2 5 2並連結至機台2 〇下方之㈣ 9 1329608 ί裝置作動，以執行自動化作業之中=至用以控制及整合 2 51之上方係設有壓接機構2 5 q 、处益，而測s式套座 並可下壓記憶體I c與測試套座2 取、放記憶體I C， 記憶體I C會應用於高溫之環境中實相互接觸，由於部份 實際使用之高溫環境下執行檢測作1使=^裝置2 5可於模擬 2 5 1之外部裝設一熱測室機乍業而於複數個測試套座 以外罩罩覆於複數個測試套座51；^熱測室機構2 5 4係 具高溫環境之埶測室，@^之外邛，使得内部可形成一 向錯位移載τ置26係設有可假^方 I c (例如i 2 8個複數個待測之記憶體 ㈣输謝，第二載送裝 第二截么971 〇271用以承置複數個完測之記憶體j c 檢查ί C D 2 7 2之視覺 移，第-舰層移载機構2 7 3用以帶動作X方向位 取放写？ ^ Ϊ係設有複數個可作X — Y — Z方向位移之 至===料=:載複數個待測 ? q ΐ ίΓ糸設有複數個可作χ—γ—ζ方向位移之取放器 97 1 放器2 91則可於第二載送裝置2 7之第二載台 你袓「Ο Q魏個完測之記憶體1 C ’並依測試結果移載至各 類收置。A、23B、23C、2 3D或搬移式收料昆2 4分 请參閱第4圖所示’該第-移料裝置2 8之取放H2 81係 於供料H 2 1上取岐數個制之記紐〗c，並將 =移載至第一載送裝置2 6之第一載台2 6丄上，H 〇2|1承置128個待測之記憶體Ic。 清參閱第5、6圖所示，該第-载送農置2 6之第-載台 2 61係作γ方向位移將各待測之記憶體i c載送至測試裝置 2 5中，該測試裝置2 5之壓接機構2 5 3係具有複數個取^器 2 5 3 1 ’由於各取放器2 5 31之位置固定，該第一载送梦^ 2 6為便利壓接機構2 5 3於第一載台2 61上取出待測之^憶 體1C ’係使第一載台2 61可作X方向左、右位差—個待測記 憶體I C之錯位移動，以及作γ方向前、後位差一個待測記憶^ I C之錯位移動，以形成有4個取料區域，並使第一载台°2 g工 之其一取料區域對位於壓接機構2 5 3之各取放器2 5 g1位置 ’以供各取放器2 5 31取出相對應待測之記憶體ϊ c，而第一 載台2 61並可預熱尚未被取出之各待測記憶體〗c，使待測之 s己憶體Ic仍保持位於高溫環境下以待測試；請參閱第3、7圖 所示，該壓接機構2 5 3之複數個取放器2 5 31於取出待測之 記憶體IC後，係將各待測之記憶體j u入於相對應之測試套 座2 51中，並下壓各待測之記憶體丨c與測試套座2 5丄之接 點確實相互接觸，而後測試裝置2 5可利用熱測室機構2 5 4使 f數個測試套座2 51於高溫環境之熱測室中執行測試作業；請 $ = 8騎^於各測試套座2 5 i測試完畢後，該壓接麵 f=之複數個取放器2 5 3 1係向上位移而將完測之記憶體 C由各測試套座2 51中取出，以待出料。 f參閱第3、911所示’該第二載送裝置27係位於測試裝 之側方’其第二載台2 7工係用以承置複數個完測之記憶 測設魏數紙⑶2 7 2，用以先行掃猫檢查 而楚I25之各測试套座251中是否有殘留有記憶體1c， 7 3 2 係⑦有第—皮帶輪組2 7 3 1及第二皮帶輪组 方之笛-—皮帶輪組2 7 3 1係以上皮帶段部驅動位於上 連3 2的皮帶輪，並於下找段部設有第一 7 3 3用以連結第二皮帶輪組2 7 3 2，而可帶動第二 ^29608 = 3 2作又方向往復位移，而第二皮帶輪έ 2 7 ζ广1，而可帶動苐—邈么 硬…第—載台 皮帶輪組2 7 3 !第口;位移，由於第- 採疊層式設計，而可於小*門虚:2f f第—载台2 71係 载送第二裁台27、jf逐層凸伸出數倍X方向位移量以 佔用空間。 〜又較長之載送元件’而可有效縮減 請參閱第3、1 〇圖所示，兮楚__鲁”，壯逆^ 皮帶輪組2 7 3 1以m、金二第一载达裝置2 7係控制第— 2 7 3 2作ϋ；1 件2 7 3 3帶動第二皮帶輪組 帶輪作動，使第：皮第：皮帶輪組2 7 3 2之皮 向凸伸位移至測試裝置2 5，該第二载台 之各測續以CCD2 72逐一"^查測試裝置2 5 測之:二髀5 5上中是否有殘留記憶體1 C ’以便順利承置完 懒C，請參閲第1 151所示，當第二載台2 7 1位於 5之驗機構2 5 3下方後，該壓接機構2 5 3可帶 器2 5 3 1下降位移，並將各完測之記憶體I C置入於 ^二載台2 71以便載出收料；請參閱第丄2圖所示，當第二載 口 2 71承置完測之記憶體Ic後，第二載送裝置2 7係控制第 一皮帶輪組2 7 3 1以第-連結件2 7 3 3帶動第二皮帶輪組 2 7 3 2作X方向反向復位，並驅動第二皮帶輪組2 7 3 2之皮 帶輪反向作動，使第二皮帶輪組2 7 3 2以第二連結件2 7 3 4 帶動第二載台2 71作X方向反向復位而退出測試裝置2 5。The transfer device 16 'the transfer device i 6 series", the front and rear stages are reciprocally displaced, and the first transfer device 13 can be placed on the logic ICIC 17 for feeding/finishing and placed on the transfer device 1 6 11 Take out the logic station to be tested and the end of the second transfer device 1 5 is about to turn, the device 16 is carried to the machine I C17 to take out 'and transfer to the test set 16 on the test 141 of the logic 141 to be tested 142, in the 142, and placed on its physical board, the second transfer device 15 is about to complete the logic 'after the detection is completed, the transport device 16' is taken out by the transfer device 丨6, The symmetry is placed on the transfer device 13 to complete the logic of the transfer device 16. The first moving material is loaded and received 匣12, and according to the detection result, the d king: take out and transfer to the detection and classification operation. Set, to the simple logic of the logic I C17, its functionality is relatively, C detection classifier to perform the record ct: industry; = borrowing = time to load and test multiple memory IC, and through the "two 2. Only carrying a single memory I c to be tested will make the whole "set-person J a large memory Ic with multiple test devices, and the production will be more complicated." Time-consuming 'also A-level reduction of memory I ^ detection ^ month ^ 'Therefore, an IC detection classifier is not suitable for the implementation of memory test 作 因此 因此 因此 因此 讲 讲 讲 讲 讲 讲 讲 讲 讲 讲 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此How to design a kind of IC IC detection classifier that is suitable for detecting memory 丨C and greatly improving the detection capacity is the standard designed by the industry. [ OBJECT OF THE INVENTION] The object of the present invention is to provide a memory I c detection sorting machine (4), which comprises a feeding magazine provided at the front end of the machine, at least one receiving magazine and a carrying device, which are arranged on the machine At least one test device at the back end of the station, and a material transfer device disposed between the supply and receiving hoppers and the test farmhouse; the supply and receiving rafts are respectively used to hold the pending/completed test 6' shun system A test circuit board with her _ test socket is provided, and the memory can be pre-heated and stored in the memory device J 〇 to the carrier device. Body 1 C, so that it has not yet entered the _ 剌 面 1 C cake high temperature Wei T, and has the XY direction clock to move the test device at different positions, after the test device's various test memory 1 c is completed, move According to the test results, the equipment can be transferred to the receiving material 11 for sorting and collecting; thereby, the loading and measuring 1 C can be simultaneously transferred, the social width can be increased, and the loading and unloading can be effectively improved. Performance. The purpose of the second is to provide a type of ship IC detection facet (4). The ^3 is located at the front end of the machine, the supply hopper, at least one receiving hopper and the carrying device, and the back end of the if station, at least one Service equipment and moving receipts, as well as the transfer device installed between the test equipments of the Department; the supply and receipt of the 11 series are used to undertake: 0丨^ 凡 忆 体 体 1 C, test equipment The second r2 device with a plurality of test sockets can transfer a plurality of memories to be tested at the time of feeding 4 = green, and the device is carried by the IC to the test device. Retrieving the test memory of each test socket after the test is shocked. The material transfer device can re-measure the memory of the test material according to the test result. The transport type _ has one for x —J = The transferer is used to hold the m-memory][c's tray to the bottom of the machine, and the container is filled with 'visible test results' and the storage container is used to hold different grades. The tray of the memory Ic is taken out and transferred to the machine for receiving and discharging. When transferring and testing a plurality of memories! C, and significantly increase the production day ^ in the classification of more unique materials (four), TM The purpose of the invention is to provide a kind of memory! c detection depends on (4), which comprises a feed port disposed at the front end of the machine, at least one receiving device, at least one test device disposed at the rear end of the machine, and a second load on the supply and receiving 1E and The feeding device between the testing devices; the supply and receiving system respectively ^ 1329608. To hold the memory Ic to be tested/completed, the testing device is provided with a test circuit board with a plurality of test sockets. A plurality of memory ICs can be transferred to the first carrier device at the supply port, and the first carrier device can carry the memory IC to be tested to the test device for retrieving, and testing the test device After the socket test memory IC is completed, the second carrier device sends out the memory IC that has been tested, and the material transfer device removes the memory IC that is completed on the second carrier device and transfers it according to the test result. The collection and collection of the receipts; thereby, the plurality of memory I c can be simultaneously transferred and tested, and the detection capacity is greatly increased, and the first and second carrier devices respectively carry the pending/completed measurements. The body IC' effectively improves the performance of the carrier memory Ic. The fourth object of the present invention is to provide a memory IC detection sorting machine (4). The utility model comprises a feeding magazine provided at a front end of the machine, at least one receiving magazine and a carrying device, which are arranged at the rear end of the machine. At least one test device, and a transfer device disposed between the supply and the receiving device and the test device; the supply and the receiving device are respectively used for holding the IC to be tested/completed. A test circuit board having a plurality of test sockets, wherein the loading device can transfer a plurality of memory ICs to the carrier device in the feeding device, and the carrier device can carry the memory Ic to be tested to the testing device. For the retrieving, after the test socket I c of each test socket of the test device is completed, the carrier device checks whether the memory J c remains in each test socket of the test device by using a plurality of C CDs one by one, and then the donor After the memory IC of the test is completed, the loading device takes out the § 己I Ic of the Φ on the carrying device, and transfers it to the receiving 匣 according to the test result; thereby, it can be simultaneously transferred. And testing a plurality of memory I c, and substantially increasing the detection of food production 1, and carrying Check whether the seat cover facing the test remaining memory I c, to ensure that the test actuating means of smooth utilization. 1 The object of the present invention is to provide a memory Ic detection sorting machine (4), which comprises a feeding magazine provided at the front end of the machine, at least one receiving magazine and a carrying device, which are arranged at the rear end of the machine. At least one test device, and a transfer device disposed between the supply and the receiving device and the test device; the supply and receiving device are respectively used for holding the IC to be tested/tested A test circuit board of a plurality of test sockets, wherein the material transfer device can transfer a plurality of memory Ic to the carrier of the carrier device in the supply port 8 1329608 'The carrier device is layer-by-layer convex with a stacked transfer mechanism Extend the number of loading stations to the test device to serve the wire, and the station carries the tested memory! c. The material transfer device will take out the memory IC of the device loaded with the is D and check it according to the test result. It can transfer and test multiple memories at the same time! === Measuring the capacity and reducing the load The space occupied by the device. In order to make the reviewer further understand the present invention, the embodiment and the drawings are described in detail as follows: Niu Pingyi 1 main 2 9 ΐ ΐ ΐ 3rd, the present invention The memory 1 C detection sorting system is provided at the end of the machine 1 2 0 ^ 供 end for the supply of 2 i, at 2 2, the end of the plurality of dirty 2 3 A, 2 3 B, 2 3 C, 2 3 D and A "Jiang ί" test device 25 disposed at the rear end of the machine 2, a first carrier device 26 and a second = simplification 2 and a first carrier device disposed at the end of the measurement ^: The device 28, and the second transfer device moving between the second carrier device 27, the receiving materials E23A, 23b, 2 3C, 2 30 and the moving receiving material 1 £ 24 are placed on the memory to be tested. 1 C, empty 2 series can receive the empty tray used by the bucket 2 1 and can be stored as needed = (4) 3Α, 23Β, 2κ, 23_/= 固收· 2 m 3 Β, 2 3 C, 2 3 D and moving type 2 2 糸 can be subdivided into different grades, rib storage and measurement of different levels of memory 〗 〖c, j moving type ϋ 2 4 series with shifts that can be used for X-z direction shift & 1, and can be stored under the machine 2 Level material, nano container 2 4 2, the transfer ϋ 2 41 visual test results and the storage container 】 ^ different grades of trays moved to the machine 2 〇 for classification and receipt, measured " 2 2 5 series A circuit board 2 5 2 having a plurality of test sockets 2 51 (for example, 32) is provided, and the test circuit board 2 5 2 is connected to the (4) 9 1329608 ί device under the machine 2 to perform an automated operation. Medium = to control and integrate 2 51 is provided with crimping mechanism 2 5 q, benefit, while measuring s-type socket and can press memory I c and test socket 2 to take and put memory IC The memory ICs will be used in real-time contact with high-temperature environments. For some of the actual high-temperature environments, the test is performed as 1 to make the device 2 5 to install a thermal chamber outside the analog 2 5 1 In addition, a plurality of test covers are covered by a plurality of test covers 51; the thermal chamber mechanism 2 5 4 is equipped with a high temperature environment, and the outer chamber can form a dislocation displacement. The τ set 26 is provided with a false square I c (for example, i 2 8 pieces of memory to be tested (4), and the second load is 2nd. 971 〇 271 is used to install a plurality of completed memory jc check ί CD 2 7 2 visual shift, the first-ship transfer mechanism 2 7 3 is used to take the action X direction bit to read and write? ^ Ϊ There are a plurality of X-Y-Z-direction displacements to ===Material =: Load a plurality of loads to be tested? q ΐ Γ糸 Γ糸 There are a plurality of pick-and-place devices that can be used as χ-γ-ζ displacements. The device 2 91 can be transferred to the various collections according to the test result in the second stage of the second carrier device 27, "Ο Q Wei finished memory 1 C". A, 23B, 23C, 2 3D or moving type receiving material Kun 4 4 points, please refer to Figure 4, 'The first-feeding device 2 8 pick and place H2 81 is on the feeding H 2 1 The system is calculated as c, and is transferred to the first stage 206 of the first carrier device 26, and H 〇 2|1 holds 128 memory Ic to be tested. As shown in Figures 5 and 6, the first-stage 2 61 of the first-loading farm 2 is γ-direction displacement, and the memory ic to be tested is carried to the test device 25, the test The crimping mechanism 2 5 3 of the device 25 has a plurality of devices 2 5 3 1 ' because the positions of the pick-and-placers 2 5 31 are fixed, the first carrying dream 26 is a convenient crimping mechanism 2 5 3, on the first stage 2 61, take out the memory 1C' to be tested, so that the first stage 2 61 can be left and right in the X direction - the misalignment of the memory IC to be tested, and the gamma direction The front and back positions are one memory to be tested. The misalignment of the IC moves to form four reclaiming areas, and one of the first loading stations is located in the crimping mechanism. The pick-up device 2 5 g1 position 'for each pick-and-placer 2 5 31 to take out the corresponding memory ϊ c to be tested, and the first stage 2 61 can preheat the memory to be tested that has not been taken out. , so that the sufficiency Ic to be tested remains in a high temperature environment for testing; please refer to Figures 3 and 7, the plurality of pick and place devices 2 5 3 of the crimping mechanism 2 5 3 are taken out for testing After the memory IC, the system will wait The measured memory is inserted into the corresponding test socket 2 51, and the contacts of the memory 丨c to be tested and the test socket 25 are pressed into contact with each other, and then the test device 25 can utilize heat. The chamber mechanism 2 5 4 enables f test suites 2 51 to perform test operations in a thermal chamber of a high temperature environment; please $=8 ride on each test socket 2 5 i after the test is completed, the crimp surface f The plurality of pick and place devices 2 5 3 1 are upwardly displaced and the tested memory C is taken out from each test socket 2 51 to be discharged. f Refer to the third and 911's 'the second carrier 27 is located on the side of the test fixture'. The second stage 27 is used to carry a plurality of completed memory measurements. (3) 2 7 2, used to scan the cat first and whether there is any memory 1c remaining in each test socket 251 of the I25, 7 3 2 system 7 has the first - pulley set 2 7 3 1 and the second pulley set square flute - - Pulley set 2 7 3 1 The above belt section drives the pulley located on the upper link 3 2, and the first 7 3 3 is provided in the lower section to connect the second pulley set 2 7 3 2, which can drive the first 2^29608 = 3 2 for reciprocating displacement in the direction, and the second pulley έ 2 7 ζ 广1, and can drive 苐 邈 邈 硬 ... 第 第 第 载 载 载 载 载 载 载 载 载 载 载 载 载 载 载 载 载 载 载 载 载 载 载 载 载 载 载 载 载The cascading design is adopted, and the small * door imaginary: 2f f - the stage 2 71 is carried by the second cutting table 27, and the jf is protruded by a plurality of times in the X direction to occupy a space. ~ Longer carrier component 'can be effectively reduced. Please refer to the 3rd and 1st drawings, 兮 __鲁", Zhuang inverse ^ pulley set 2 7 3 1 in m, Jin 2 first carrier 2 7 series control - 2 7 3 2 for ϋ; 1 piece 2 7 3 3 to drive the second pulley set pulley to make the first: leather: pulley set 2 7 3 2 skin convex displacement to the test device 2 5, each of the second stage of the test is CCD2 72 one by one ^ check the test device 2 5 measured: whether there is residual memory 1 C ' on the second 5 5 in order to successfully complete the lazy C, please participate Referring to FIG. 1151, when the second stage 2 7 1 is located under the inspection mechanism 2 5 3 of 5, the crimping mechanism 2 5 3 can be displaced by the belt 2 5 3 1 and the memory of each test is completed. The body IC is placed in the second stage 2 71 to carry out the receiving; as shown in Fig. 2, when the second carrier 2 71 carries the tested memory Ic, the second carrying device 27 Controlling the first pulley set 2 7 3 1 to drive the second pulley set 2 7 3 2 to reverse the X direction in the first link 2 7 3 3, and drive the pulley of the second pulley set 2 7 3 2 to reverse the action , so that the second pulley set 2 7 3 2 Coupling member 2734 to drive the second stage counter 271 for resetting the X-direction to exit the test apparatus 25.
請參閱第13、14、15圖所示，當第二載台2 71載出 完測之記憶體I C後，該第二移料裝置2 g係驅動各取放器 2 91位移至第二載台2 71之上方，並以各取放器2 91取出 第二載台2 71内完測之記憶體IC ’而後依據測試結果，將完 測之記憶體IC移載於收料匣23A、23B、23C、23D 12 1329608 或搬移式士料n 2 4内收置，當第二移料裝置2 9之取放器 2fI將元測之記憶體1C移載至搬移式收料匣2 4時，由於收 納容器三4 2係收置不同等級之料盤，進而可視測試結果，係驅 動移載器2 41作X- z方向位移將所需等級之料盤搬移至機台 2 〇上，以供取放器2 91將完測之記憶體Ic置入於料盤中， 而後再使移細2 4 1作X - z方向位移將盛裝完測記憶體i c „搬移至收納容器2 4 2收置，而完成分類收置完測記憶體 IC之作業。 據此Referring to Figures 13, 14, and 15, after the second stage 2 71 carries out the tested memory IC, the second transfer device 2 g drives the respective pick and place units 2 91 to the second load. Above the table 2 71, the memory IC ICs in the second stage 2 71 are taken out by the respective pickers 2 91 and then the tested memory ICs are transferred to the receiving cassettes 23A, 23B according to the test results. , 23C, 23D 12 1329608 or the moving material n 2 4 is housed, when the pick-up device 2fI of the second moving device 29 transfers the memory 1C of the meta-test to the moving receiving device 2 4 Since the storage container 3 4 sets the trays of different grades, and thus visually tests the results, the shifter 2 41 is driven to shift in the X-z direction, and the tray of the required grade is moved to the machine 2 for the purpose of The pick-up device 2 91 puts the tested memory Ic into the tray, and then shifts the moving film 2 4 1 into the X-z direction to move the finished memory ic „ to the storage container 2 4 2 And complete the classification and storage of the memory IC operation.
------丰發明可同時移載及測試複數個記憶能，並有效提升各裝置之使用效能，實為二二 ϋϋ之設計，絲見有侧之產品及刊物公開，從而允符 發明專利申請要件，爰依法提出申請。 【圖式簡單說明】 習式IC檢測分類機之配置圖。 習式IC檢測分類機之測試裝置示意圖。 本發明5己憶體I c檢測分類機之配置示意圖。 ^發明第-移料裝置移料至第—載送裝^之示意圖。 本發明第-載送裝置送料至測試裝置之示意圖。 本發明測試裝置之壓接機構作動示意圖（一 本發明測試裝置之壓接機構作動示意圖（二）。 .本發明測試裝置之壓接機構作動示意圖（三）。 第9圖：本發明第二载送裝置之示意圖。 第10圖：本發明第二載台位移至測試裝置之示。 本發明第二載台承置完測記憶體IC之示意圖。 本發明第二载台離開測試裝置之示意圖广 亡2:置於第二觸置取料之示意圖。 ^發月第—移料裝置移料至搬移式收料Ε收料之示竟 圖。 〜 第15圖：本發明搬移式收料匣收置料盤之示意圖。 第1圖 第2圖 第3圖 第4圖 第5圖 第6圖 第7圖 第8圖 第1 1圖 第1 2圖 第1 3圖 第1 4圖 13 1329608 【主要元件符號說明】 " 〔習式〕 供料匣：11 第一移料裝置：13 實體板：141 壓接機構：14 3 轉運裝置16 〔本發明〕 機台：2 0 • 空匣：2 2 •收料匣：2 3A、2 3 B、 搬移式收料匣：2 4 收納容器：2 4 2 測試裝置：2 5 測試電路板：2 5 2 取放器：2 5 31 第一載送裝置：2 6 第二載送裝置：2 7 CCD：272 • 第一皮帶輪組：2 7 31 第一連結件：2 7 3 3 第一移料裝置：2 8 第二移料裝置：2 9 收料匣：12 測試裝置：14 測試套座：14 2 第二移料裝置：15 I C ： 1 7 供料匣：21 2 3 C、2 3D 移載器：241 測試套座：2 51 壓接機構：2 5 3 熱測室機構：2 5 4 第一載台：2 61 第二載台：2 71 疊層移载機構：2 7 3 第二皮帶輪組：2 7 3 2 第二連結件：2 7 3 4 取放器：2 81 取放器：2 91------Feng invention can transfer and test a plurality of memory energy at the same time, and effectively improve the performance of each device. It is actually the design of the second and second, and the products and publications of the side are disclosed, thus allowing the invention. Patent application requirements, 提出 apply in accordance with the law. [Simple diagram of the diagram] Configuration diagram of the IC detection classifier. Schematic diagram of the test device of the conventional IC detection classifier. A schematic diagram of the configuration of the 5th memory Ic detection classifier of the present invention. ^Inventive-transfer device transfer to the first-loading device schematic. A schematic view of the first carrier device of the present invention feeding the test device. Schematic diagram of the operation of the crimping mechanism of the testing device of the present invention (a schematic diagram of the actuating mechanism of the crimping mechanism of the testing device of the present invention (2). Schematic diagram of the actuating mechanism of the crimping mechanism of the testing device of the present invention (3). FIG. 9: Second carrying of the present invention Schematic diagram of the sending device. Figure 10: The second stage of the present invention is displaced to the test device. The second stage of the present invention is provided with a schematic diagram of the test memory IC. Death 2: A schematic diagram of placing the second touch and take the material. ^Feiyue No.—Transfer of the moving material to the moving receipt and receipt of the material. ~ Figure 15: The moving receipt of the present invention Schematic diagram of the storage tray. Fig. 1 Fig. 2 Fig. 3 Fig. 4 Fig. 5 Fig. 6 Fig. 7 Fig. 8 Fig. 1 1 Fig. 1 2 Fig. 1 3 Fig. 1 4 Fig. 13 1329608 [Main Component symbol description] " [Literature] Feeding equipment: 11 First moving device: 13 Solid board: 141 Crimp mechanism: 14 3 Transfer device 16 [Invention] Machine: 2 0 • Empty: 2 2 • Receipt: 2 3A, 2 3 B, Removable Receipt: 2 4 Storage Container: 2 4 2 Test Set 2 5 Test circuit board: 2 5 2 Pick and place: 2 5 31 First carrier: 2 6 Second carrier: 2 7 CCD: 272 • First pulley set: 2 7 31 First link: 2 7 3 3 First transfer unit: 2 8 Second transfer unit: 2 9 Receipt: 12 Test unit: 14 Test set: 14 2 Second transfer unit: 15 IC : 1 7 Feed: 21 2 3 C, 2 3D Transfer: 241 Test Seat: 2 51 Crimp Mechanism: 2 5 3 Thermal Chamber Mechanism: 2 5 4 First Stage: 2 61 Second Stage: 2 71 Stack Transfer Mechanism: 2 7 3 Second pulley set: 2 7 3 2 Second link: 2 7 3 4 Pick and place: 2 81 Pick and place: 2 91