TWI337168B - Testing and classifying machine for use in memory ics - Google Patents
Testing and classifying machine for use in memory ics Download PDFInfo
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- TWI337168B TWI337168B TW96134593A TW96134593A TWI337168B TW I337168 B TWI337168 B TW I337168B TW 96134593 A TW96134593 A TW 96134593A TW 96134593 A TW96134593 A TW 96134593A TW I337168 B TWI337168 B TW I337168B
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Description
1337168 九、發明說明: 【發明所屬之技術領域】 本發明係提供一種可同時移載及測試複數個記憶體丨C, 大幅增加檢測產能,並有效提升載送分類收置記憶體丨 , 能之記憶體I C檢測分類機(五)。 卜系效 【先前技術】 在現今,半導體元件之丨c概分為邏輯〗C、記 類比I C及微元件I c等不同類型,以邏輯J c為例 认1337168 IX. Description of the Invention: [Technical Field of the Invention] The present invention provides a memory 丨C that can simultaneously transfer and test a plurality of memory ,C, greatly increasing the detection throughput, and effectively improving the carrying and sorting storage memory. Memory IC detection classifier (5). Bud Effect [Prior Art] In today's world, the semiconductor device is divided into logic type C, analog class I C and micro device I c, and the like, taking the logic J c as an example.
主機板上之中央處理器’俾以負責中央處理器與其他周ϋ ; 訊號轉,或傳遞’以及運算作*,其魏性較為複雜,而記 I C則單躺哺存資料,並裝設於模組電 ^ 再裝配於主機板上,其功能性較為單純,然不論任何 ’於,作完成後,均須經過-檢測作業,以淘汰出不良品,而確 保產品品質。 由於,1 c搭配之中央處理器係直接裝設於主機板,且 匕月b k為複雜及多樣化,業者為使邏輯I c可於實際環境下進 測杳以提升檢測作業之準確性,遂以日後邏輯1 C實際裝配 之實體板(即主機板)作為測試電路板,使邏輯Ic於實體 板ΐίΐ檢測作業’基於邏輯1c之檢測作業較為複雜及多樣化 ,t該實體板常僅設有一測試套座供執行單一邏輯〗€檢測作業 "月參閱第1、2圖,係為坊間應用於檢測邏輯I ς之I C檢測 分類機,包含於機台之前端設有供料匣i i、複數個收料匣丄2 及第移料裝置1 3 ’該供料£ 1 1係可承置待測之邏輯J c以 供取料’各收料2係可承置完測之邏輯! c用以收料,而第 一移料裝置1 3係用以移餅/完測之邏輯I c,而機台之後端 則設有複數個測試裝置14及第二移料裝置丄5,各測試裝置 王4係設有具單一測試套座142之實體板141,以及用以下 測?輯1 C之壓接機構1 4 3,其中,該職套座1 4 2可 供置入單一待測之邏輯Ic17,而第二移料裝置丄5則用以移 5 完測之邏輯! c ’另設有—可於機 轉運1置16,該轉運裝置16係用以載“ 復位移之 1 c 1 7,並置放於轉運裝置丨6上,由榦、$^出4測之邏輯 t之後端,第二移料裝5即將轉運nn載送至機 】斤1 7取出’並移載至測試裝置1 4處,且置人邏輯 31 i!機套座14 2中,以執行檢測作業,於檢ΐίΐΐ板 3置16上’由轉運裝置16載送至機台之前維,笛轉 置13則將轉運裝置i 6上完測之邏輯! 第移料裝 1 2 ’且依檢測結果而分類收置,以^巧至 檢測、分類作業。 疋攻邏輯I C17之 單轴反!^記憶體1㈢於係純制㈣存資料,其功能性減 般係同時以多個記憶體1 〇進行測試,若業:ί 剛固待測之記憶體1 c,且經由轉3裝ί-; :為具複數個測試裝置之大型記憶體J c檢測機, 2 ,及等待時間將更為繁觀耗時,社贿低記憶體〗 ^能’故此-I C檢測分類機不適用於執行記憶體T k檢測作 呆0 因此,在講求快速之檢測使用效率及提升產能之需求下,如 何設計一種可大幅提升檢測記憶體i C產能及各裝置作業能 記憶體IC檢測分類機’即為業者設計之標的。 【發明内容】 本發明之目的一,係提供一種記憶體〗C檢測分類機(五) ’包含有設於機台前端之供料匣及複數個收料匣’設於機4後端 之測試裝置、第一、二載送裝置、轉送裝置,以及設於供:收 匣及第一、二載送裝置、轉送裝置間之第一、二移料裝置;該供 有用以承置待/完測之記憶體1 c,測試裝置係設 —二複數個測試套座之測試電路板,第—移料裝置係 斗、 複Ϊ個記憶體1 U第—載送裝置,該第:、載送ίϊ可 而=2二載送裝置係載送出完測之記憶體i c, 依^社果一載送裝置上完測之記憶體1 °取出’並 蔣ii、r 77別將良品之記憶體1 c移載至良品收料e,以及 之賴體1 C移載於轉送裝置處,而可使第-載逆F置 =,載完測之記憶體! c,而後第二移料⑤= 離之記憶體1C分類收置於各不良品收料匣;藉2,可 =ί =ΐ;ΐ憶體1 c,而大幅增加檢测產能,並可 ϊ ^測記憶體1 α,再執行分類作業,以 且太=置之等待時間,而有效提升載送分類收置之作業效能。 將轉’係於機台之前端設有第三移料裝置,用以 ΐΐϊίί 記憶體1c分類收置於各不良品收料g, 而可更加有效提升分類收置記憶體J c之作業效能。 之:的L係在於該第—載送裝置可預熱承置之待測 效:預熱待測_! C而節; 右目的四’係於機台之前端設有搬移式收料s,1且 體I C之健’並視檢測結果,而以—可 ς 門收納容器中之料盤而供收料;藉此,可於機台之小* 不同等級之分類收料’而有效提升收料®之使用效‘ 為使責審查委員對本發明作更進一步之瞭解兹舉一較佳 1337168 實施例並配合圖式,詳述如后: △ ,本發明記憶體1 C檢測分類機包含於機 料E21、空£2 2、複數個用以收納良品 =體1 C之收料Μ 3 A、2 3 b ’及複數個用以收納不良品 = 3 C、2 3 D、2 3 E、搬移她 、第後端之測試裝置2 4、第—載送装置2 5 空送裝置2 7,以及移動於供料Ε2 1、 9 «置2 5間之第一移料裝置2 8,及移動於 ^載送裝置2 6、收料!23B間之第二移料裝置 K,以及移動於轉送裝置27、收料E2 3C、2 3【 3 E、2 3 F間之第三移料裝置3 q ;該供龍 ^ ί =二之記憶體1 C ’空£2 2係可接收由供料匿 之第’ :第一移料裝置2 8係設有具複數個吸頭 「%1 Γ至供龍21處,以便—次移載複 之β己憶體I C至第一載送裝置2 5處。 試奎圖:斤示’該測試裝置2 4係設有具複數個測 ;--- ,,數個取放器2 4 3 i之壓接機構2 4 3,用以取、放】j I憶體1 C與測試套座2 4 1確實相、 第載达裝置25係以循環交替之載送機構而依序一次 個待測之記憶體!C,其係於機台上之置料端及測試裝 —ί降機構2 5 1及第二升降機構2 5 2 ’並設有位 於不冋咼度之第一、二平移機構2 5 3、2 5 4,該第—、二 移機構2 5 3、2 5 4係分別具有可移動於置料端及測試裝置 8 2 4間之第一、二滑移5| 2 r q 個待測記憶體!〆(例°如5 3 1、2 5 4 1,用以載送具複數 2 5 6,並使签一 Z 8個)之第—、二料盤2 5 5、 差一個待測記Ϊ體;5 5、2 5 6可作Χ方向左、右位 個待測記憶體『c之錯位=移動:以及作Υ方向前、後位差-一、二料盤2 5 5、2% fi佐’崎成有4個取料區域,且各第 I C,進*第—平移機二預,尚未被,出之各待測記憶體 待測記憶體I CU盤 j —滑移11 2 5 3 1可載送具 測試裝置^構處,由於 便利壓接機構2 4 3可於第^ ° 2 4 3 1 =置固定’為 1 C,係可使第—料盤2 5第4盤2 5 5^取出待測之記憶體 體IC之錯位移動,或γ方向1右位差一個待測記憶 錯位移動,使其一M ’後位差一個待測記憶體I C之 2 4 3 i位置4 3之各取放器 I C,此時,第” 1取出相對應待測之記憶體The central processing unit on the motherboard is responsible for the central processing unit and other peripherals; the signal is transferred, or transmitted, and the operation is *, the Wei is more complicated, and the IC is lying on the feeding data and installed in The module is mounted on the motherboard, and its functionality is relatively simple. However, no matter what is done, it must pass the inspection operation to eliminate the defective products and ensure the product quality. Because the 1 c with the central processor is directly installed on the motherboard, and the monthly bk is complex and diversified, the operator can make the logic I c can be tested in the actual environment to improve the accuracy of the inspection operation. The physical board (ie, the motherboard) actually assembled by the logic 1 C in the future is used as the test board, so that the logic Ic is in the physical board ΐίΐ detection operation. The detection operation based on the logic 1c is complicated and diverse, and the physical board is usually only provided with one The test suite is used to execute a single logic. The inspection operation is described in the first and second figures. It is an IC detection classification machine used for detecting logic I. It is included in the front end of the machine with feed 匣 ii, plural Receiver 及2 and the first transfer device 1 3 'The feed is £1 1 can be used to take the logic J c to be tested for reclaiming 'each receipt 2 can be placed to complete the logic of the test! c is used for receiving, and the first moving device 13 is used to transfer the cake/finish logic I c, and the rear end of the machine is provided with a plurality of testing devices 14 and a second moving device 丄 5, each The test device king 4 series is provided with a solid board 141 having a single test socket 142, and a crimping mechanism 1 4 3 using the following test 1 C, wherein the seat sleeve 1 4 2 can be placed into a single test The logic Ic17, and the second transfer device 丄5 is used to shift the logic of 5! c 'Alternatively - can be transferred to the machine 1 , the transfer device 16 is used to carry the "re-displacement of 1 c 1 7 and placed on the transfer device 丨6, from the logic of the dry, $ ^ 4 test At the rear end of the t, the second transfer device 5 will transfer the nn to the machine. The load 1 is taken out and transferred to the test device 14 and placed in the logic 31 i! machine case 14 2 to perform the test. The operation is carried out on the ΐ ΐΐ 3 3 3 置 置 ' ' ' ' 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由And the classification and collection, to the skill to detect and classify the operation. 疋 逻辑 Logic I C17 uniaxial inverse! ^ Memory 1 (three) in the system of pure (four) stored data, its functional reduction is equivalent to multiple memory 1 〇 Test, if the industry: ί rigidly tested memory 1 c, and via the turn 3 installed ί-;: is a large memory J c detector with multiple test devices, 2, and the waiting time will be more complicated When you look at the consumption, the social bribe is low in memory. ^Can't use this - IC detection classifier is not suitable for performing memory T k detection for staying 0. Therefore, in the fast test Under the demand of increasing capacity and increasing production capacity, how to design a memory IC detection classifier that can greatly improve the detection memory i C capacity and each device operation is the target of the design of the manufacturer. Providing a memory 〗 C detection sorting machine (5) 'containing a supply hopper and a plurality of receiving hoppers provided at the front end of the machine 匣 'test device provided at the rear end of the machine 4, first and second carrier devices, transfer The device and the first and second transfer devices provided between the receiving and the first and second carrying devices and the transfer device; the memory device 1 c for use in the standby/testing, the test device is provided - test circuit board of two test sockets, the first - transfer device is a bucket, and the memory 1 U first - carrier device, the first: carrying: 载 ϊ = = 2 2 carrier device After the memory ic is sent out, the memory of the measured device is taken out at 1 °, and the memory 1 c of the good product is transferred to the good material receipt e, and The body 1 C is transferred to the transfer device, and the first load reverse F can be set to = the memory is loaded. c, then the second material 5 = the memory 1C classification is placed in the receipt of each defective product; by 2, can = ί = ΐ; ΐ 体 1 c, and greatly increase the detection capacity, and ϊ Measure the memory 1 α, and then perform the classification operation, and too = set the waiting time, and effectively improve the performance of the carrier classification and collection. , used to ΐΐϊίί memory 1c classified and placed in each defective product receipt g, and can more effectively improve the performance of the classified storage memory J c. The L system is that the first carrier device can be preheated To be tested: preheating to be tested _! C and section; right purpose four' is located at the front end of the machine with a moving receipt s, 1 and the body IC's health and the results of the test, and The tray in the storage container is used for receiving materials; thereby, the utility model can effectively improve the use of the receiving material in the small-sized and different grades of the machine', so that the reviewing committee can further advance the present invention. It is understood that the preferred embodiment 1337168 embodiment and with the drawings, as detailed below: △, the memory 1 C detection classifier of the present invention is included in Machine E21, empty £2 2, multiple for receiving good goods = body 1 C receiving Μ 3 A, 2 3 b ' and a plurality of used to accommodate defective products = 3 C, 2 3 D, 2 3 E, Moving her, the back end of the test device 2 4, the first carrier device 2 5 air delivery device 2 7, and the first transfer device 2, 8 and the mobile device 2 2, 9 The second transfer device K between the delivery device 26, the receiving material 23B, and the third moving device 3 moving between the transfer device 27, the receiving material E2 3C, and the 3 3 [3 E, 2 3 F q; The supply of dragon ^ ί = two memory 1 C 'empty £ 2 2 system can receive the first by the supply of material ': the first transfer device 2 8 series with a plurality of tips "%1 Γ to The dragon is 21, so that the complex β-replica IC is transferred to the first carrier device 25. Test Quito: Jin showed that 'the test device 24 is equipped with a plurality of tests; ---, a number of pick-and-place devices 2 4 3 i crimping mechanism 2 4 3, used to take, put] j I The memory 1 C and the test socket 2 4 1 are indeed phased, and the first loading device 25 is a memory to be tested one by one in a cyclically alternate carrier mechanism! C, which is attached to the loading end of the machine and the test device - the lowering mechanism 2 5 1 and the second lifting mechanism 2 5 2 ' and is provided with the first and second translation mechanisms 2 5 3 2 5 4, the first and second shifting mechanisms 2 5 3, 2 5 4 respectively have the first and second slips 5 | 2 rq of the memory to be tested which can be moved between the receiving end and the testing device 8 24 ! 〆 (example ° such as 5 3 1 , 2 5 4 1, used to carry a plurality of 2 5 6 and make a sign of Z 8) - the second tray 2 5 5, a difference to be recorded ; 5 5, 2 5 6 can be used as the left and right bits of the memory to be tested in the direction of the "c" position = movement: and the direction of the front and back of the direction of the head - one, two trays 2 5 5, 2% fi Zuo 'Kasei has 4 reclaiming areas, and each IC, into the * first - translation machine two pre-, has not been, out of each memory to be tested memory I CU disk j - slip 11 2 5 3 1 The load-bearing test device can be placed. Since the convenient crimping mechanism 2 4 3 can be fixed at 1 ° 2 4 3 1 = '1 C, the first tray can be the fourth tray 2 5 5 ^Remove the misalignment movement of the memory IC to be tested, or the γ direction 1 right deviation, one memory error to be measured, so that one M' rear position difference is one memory memory IC 2 4 3 i position 4 3 Each pick-and-placer IC, at this time, the first "1" is taken out corresponding to the memory to be tested
-«2 5 lr:T 供第一移料裝置2 8將待測之記賴1 c置入於ί 言^參閱第5圖所示,當第一料盤2 5 5上之部份待 取】ί於該第二升降機構2 5 2係帶動第-“ 降位移’並置放於第二滑移器2 5 4 i上,由於第 中仍盛裝有待測之記憶體IC,該第-料盤2 5 5可於等 1持預熱尚未被取出之各待測記憶體1 c,·請參 ===二平移機構2 5 4之第二滑移器2 5 4 1係帶 動第-枓盤2 5 5離開測試裝置2 4處’並位移至第—升降機構 2 5 1處〕而測試裝置2 4壓接機構2 4 3之複數個取放器 2 4 3 1係將各待測之記憶體I c置入於相對應之測試套座 2 41中,並下壓各待測之記憶體丨c與測試套座2 4丄之接點 1337168 確實相互接觸以執行測試作業。-«2 5 lr:T for the first transfer unit 2 8 Place the record 1 c to be tested in the ί 言 ^ See the picture shown in Figure 5, when the part of the first tray 255 is to be taken The second lifting mechanism 2 5 2 system drives the first "downshift" and is placed on the second slider 2 5 4 i, since the middle still contains the memory IC to be tested, the first material The disk 2 5 5 can be used to hold the first memory to be tested 1 c, which is not yet taken out, and the second sliding device 2 5 4 is driven by the second slider 2 5 4 1 to drive the first-枓The disk 2 5 5 leaves the test device 2 4 'and is displaced to the first lifting mechanism 2 5 1 ' and the testing device 2 4 crimping mechanism 2 4 3 of the plurality of pick and place devices 2 4 3 1 will be tested The memory I c is placed in the corresponding test socket 2 41, and the memory 丨c to be tested and the contact 1337168 of the test socket 24 are pressed into contact with each other to perform a test operation.
一—請參閱第7圖所示,於測試裝置2 4之各測試套座2 4丄 ,完畢後,該壓接機構2 4 3之複數個取放器2 4 3 1係將各^ 试套座2 41中完測之記憶體Ic取出,並上升復位以待出料凋 此時’該第一料盤2 5 5仍可保持預熱尚未被取出之各待測記情 體1 c ;請參閱帛3、8圖所示,第二載送裝置2 6係具有^ X =向位移之第二載台261,用以承載完測之記憶體丨c,卷 測試裝置2 4之壓接機構2 4 3將完測之記憶體Ic取出後,^ 二載送裝置2 6可驅動第二載台2 61位移至測試裝置2 4之 接機構2 4 3下方,以供壓接機構2 4 3置入完測之記憶體j ς ’並載出測試裝置24處以便收料;請參閱第3、9圖^示,於 第二載送裝置2 6之第二載台2 61將完測之記憶體! c載出後 ,第一載送裝置2 5第一平移機構2 5 3之第一滑移器2 5 3工 係將盛裝有待測記憶體丨c之第二料盤2 5 6載送至測試裝 2 4處以供取料,而第—升降機構2 5 i則帶動仍盛裝有部^ 測έ己憶體IC之第-料盤2 5 5由第二平移機構2 5 4上升位移 至第-平移機構2 5 3處,以供第-移料裝置2 8置入補充 之s己憶體I c,以便依序交替循環執行送料作業。 尤门ΐ參閱第1◦圖所示,該收料Ε 2 3 A、2 3 Β係用以儲放 =專級良品之記憶體IC,而轉送裝置27係設有複數個可作 向位移之載台2 71 ’用以載送不良品之記憶體丨c,第二 =裝置29係設有具複數個吸頭之第二取放器291,用以移 山〜則之€憶體I C ’當第二載送裝置2 6之第二載台2 61載 之記憶體I C後,該第二移料裝置2 9係利用第二取放器 罢,2第二載台2 61上完測之記憶體1C取出,並依測試結 良00之§己憶體1 c置入於收料匣2 3 A或收料匣2 3 B收 置,並將不良品之記憶體〗c先行置入於轉送裝置2 7之載台 2 7 1上,由載台2 7 1將不良品之記憶體〗c載送至收舰 1337168 23C、2 3D、2 3E及搬移式收料£23F處,而可使第_ 移料裝置2 9毋須立即將不良品之記憶體丨c——分類移載至::,23c、23D、23E__g2== =第二移料裝置2 9之位移行程及相關裝置之等待咖,而可J 速返回第二載台2 61處移載其他完測之記憶體r c。1—Please refer to Figure 7 for each test socket of the test device 24, and after completion, the multiple pick-up devices of the crimping mechanism 2 4 3 will be tested. The memory Ic completed in the block 2 41 is taken out, and is raised and reset to be discharged. At this time, the first tray 2 5 5 can still maintain the preheating and the undetected condition 1 c; Referring to Figures 3 and 8, the second carrier device 26 is a second stage 261 having a displacement of X X for carrying the measured memory 丨c, and the crimping mechanism of the winding test device 24 2 4 3 After the completed memory Ic is taken out, the second carrier device 26 can drive the second stage 2 61 to be displaced to the lower side of the connecting device 2 4 3 of the testing device 2 for the crimping mechanism 2 4 3 Place the tested memory j ς ' and load the test device 24 for receiving; please refer to Figures 3 and 9, and the second stage 2 61 of the second carrier device 6 will be completed. Memory! After being carried out, the first shifter 2 5 3 of the first transfer device 2 5 3 carries the second tray 2 6 6 containing the memory to be tested 丨c to The test equipment 2 is located for reclaiming, and the first lifting mechanism 2 5 i drives the first tray 2 that is still filled with the measuring unit IC 5 5 5 is moved up to the second by the second translation mechanism 2 5 4 - Translation mechanism 2 5 3 for the first-feed device 28 to be placed in the supplementary suffix I c in order to alternately perform the feeding operation in sequence. Eugene ΐ refers to the first figure, the receiving Ε 2 3 A, 2 3 Β is used to store the memory IC of the special grade, and the transfer device 27 is provided with a plurality of displacements. The stage 2 71 ' is used to carry the defective product memory 丨 c, and the second = the device 29 is provided with a second pick-and-place 291 having a plurality of tips for moving the mountain~ After the second IC 2 of the second carrier device 26 carries the memory IC, the second transfer device 29 utilizes the second pick-and-place device, and the second carrier 2 61 is completed. The memory 1C is taken out and placed in the receiving 匣 2 3 A or the receiving 匣 2 3 B according to the test 00 § 己 体 c , , , , , , , , , , , , , 收 收 收 收 收 收 收 收 收 收 收 收 收 收On the stage 2 71 of the transfer device 27, the memory of the defective product is carried by the stage 27 to the collection ship 1337168 23C, 2 3D, 2 3E and the transfer type charge £23F. The _th transfer device 29 is required to immediately transfer the memory 丨c of the defective product to::, 23c, 23D, 23E__g2 == = the displacement stroke of the second transfer device 2 9 and the waiting of the related device Coffee, but J speed back to the second stage 2 61 transfer After he measured the memory r c.
請參閱第1 1、12圖所示,該收料£2 3 C、2 3 D、 2 3 E及搬移式收料g2 3 F係可細分不同等級,用以儲放完測 f同等級之不良品記憶體j c,其中,該搬移式收料匣2 3 f係 設有可作Y方向位移之移載器2 3丄F,並於機台2 〇之下方1 有可收納複數個不同等級料盤且可作2方向位移之收納容器 2 3 2F,第三移料裝置3 〇係設有具複數個吸頭之第三取放器 3 0 1,用以移載完測之記憶體I c,當轉送裝置2 7之載台 2 71依序將不良品之記憶體丨c載送至收料匣2 3 c2 3 D 二2 3 E及搬移式收料匣2 3 F處,該第三移料裝置3 〇係以第 二取放器3 01將不良品之記憶體j c移載至各收料匣2 3 c、 2 3 D、2 3 E及搬移式收料匣2 3 F處而分類收置,當第三移 料裝置30之第三取放器301將不良品之記憶體Ic移載至搬 移式收料H 2 3 F時,由於收納容器2 3 2 F係收置不同等級之Please refer to Figures 1 and 12, the receipts of £2 3 C, 2 3 D, 2 3 E and the moving receipt g2 3 F can be subdivided into different grades for storage and measurement of the same level. The defective product memory jc, wherein the moving type receiving container 2 3 f is provided with a transfer device 2 3丄F which can be displaced in the Y direction, and can accommodate a plurality of different levels below the machine 2 The tray is a storage container 2 3 2F which can be displaced in two directions, and the third moving device 3 is provided with a third pick-and-placer 3 0 1 with a plurality of tips for transferring the tested memory I c, when the carrier 2 71 of the transfer device 27 sequentially transports the memory 丨c of the defective product to the receiving container 2 3 c2 3 D 2 2 3 E and the moving receiving device 2 3 F, the first The three-feed device 3 transfers the memory jc of the defective product to the respective receiving ports 2 3 c, 2 3 D, 2 3 E and the moving receiving container 2 3 F by the second pick-and-place device 3 01 When the third pick-and-place device 301 of the third transfer device 30 transfers the memory Ic of the defective product to the transportable receipt H 2 3 F, the storage container 2 3 2 F is differently stored. Grade
料盤’進而可視測試結果,使收置該等級記憶體I C之料盤上升 位移至機台2 〇上方,並由移載器2 31F作Y方向位移將料盤 取出’以供第三取放器3 01將不良品之記憶體I C置入於料盤 中’而完成分類收置完測記憶體IC之作業。 據此’本發明可同時移載及測試複數個記憶體I C,而大幅 增加檢測產能,並有效提升載送記憶體I C之作業效能,實為一 深具實用性及進步性之設計,然未見有相同之產品及刊物公開, 從而允符發明專利申請要件,爰依法提出申請。 【圖式簡單說明】 第1圓:習式Ic檢測分類機之配置圖。 1337168 第2圖:習式IC檢測分類機之測試裝置示意圖。 第3圖:本發明記憶體I C檢測分類機之配置示意圖。 第4圖:本發明記憶體I C檢測分類機之使用示意圖(一)。 第5圖:本發明記憶體I C檢測分類機之使用示意圖(二)。 第6圖:本發明記憶體I C檢測分類機之使用示意圖(三)。 第7圖:本發明記憶體I C檢測分類機之使用示意圖(四)。 第8圖:本發明記憶體I C檢測分類機之使用示意圖(五)。 第9圖:本發明記憶體I C檢測分類機之使用示意圖(六)。The tray' can further visualize the test result, so that the tray that receives the level memory IC is up-shifted to the top of the machine 2, and the tray is removed by the shifter 2 31F for the Y direction for the third pick and place. The device 3 01 puts the memory IC of the defective product into the tray, and completes the operation of sorting and collecting the memory IC. According to this, the present invention can simultaneously transfer and test a plurality of memory ICs, thereby greatly increasing the detection throughput and effectively improving the operational efficiency of the memory IC, which is a practical and progressive design. See the same products and publications open to allow for the invention of patent applications, and apply in accordance with the law. [Simple description of the diagram] The first circle: the configuration diagram of the class Ic detection classifier. 1337168 Fig. 2: Schematic diagram of the test device of the conventional IC detection classifier. Fig. 3 is a schematic view showing the configuration of the memory I C detection classifier of the present invention. Fig. 4 is a schematic view showing the use of the memory I C detection sorting machine of the present invention (1). Figure 5: Schematic diagram of the use of the memory I C detection sorter of the present invention (2). Figure 6: Schematic diagram of the use of the memory I C detection classifier of the present invention (3). Figure 7: Schematic diagram of the use of the memory I C detection classifier of the present invention (4). Figure 8: Schematic diagram of the use of the memory I C detection classifier of the present invention (5). Figure 9: Schematic diagram of the use of the memory I C detection classifier of the present invention (6).
第10圖:本發明記憶體I C檢測分類機之使用示意圖(七)。 第1 1圖:本發明記憶體I C檢測分類機之使用示意圖(八)。 第12圖:本發明搬移式收料匣之示意圖。 【主要元件符號說明】 〔習式〕Figure 10: Schematic diagram of the use of the memory I C detection classifier of the present invention (7). Fig. 1 is a schematic view showing the use of the memory I C detection sorting machine of the present invention (8). Fig. 12 is a schematic view showing the moving type receiving magazine of the present invention. [Main component symbol description] [Literature]
供料匣:11 第一移料裝置:13 實體板:141 壓接機構:14 3 轉運裝置16 〔本發明〕 機台:2 0 空匣:2 2 收料匣:2 3 A、2 3 B、 搬移式收料匣:2 3 F 收納容器:2 3 2 F 測試裝置:2 4 測試電路板:2 4 2 取放器·· 2 4 3 1 第一載送裝置:2 5 第二升降機構:252 收料匣:12 測試裝置:14 測試套座:14 2 第二移料裝置:15 I C : 1 7 供料匣:21Feeding 匣: 11 First moving device: 13 Solid board: 141 Crimp mechanism: 14 3 Transfer device 16 [Invention] Machine: 2 0 Air: 2 2 Receipt: 2 3 A, 2 3 B , Transfer type receiving container: 2 3 F Storage container: 2 3 2 F Test device: 2 4 Test circuit board: 2 4 2 Pick and place device · 2 4 3 1 First carrier device: 2 5 Second lifting mechanism :252 Receipt: 12 Test set: 14 Test set: 14 2 Second transfer unit: 15 IC : 1 7 Feed: 21
23C、23D、23E23C, 23D, 23E
移載器:2 31F 測試套座:2 41 壓接機構:2 4 3 第一升降機構:2 51 第一平移機構:2 5 3 12 1337168 第一滑移器:2 5 3 1 第二滑移器:2 5 4 1 第二料盤:2 5 6 第二載送裝置:2 6 轉送裝置:2 7 第一移料裝置:2 8 第二移料裝置:2 9 第三移料裝置:3 0 第二平移機構:2 5 4 第一料盤:2 5 5 第二載台:2 61 載台:2 7 1 第一取放器:2 81 第二取放器:2 91 第三取放器:3 01Transfer: 2 31F Test Seat: 2 41 Crimp Mechanism: 2 4 3 First Lifting Mechanism: 2 51 First Translation Mechanism: 2 5 3 12 1337168 First Slipper: 2 5 3 1 Second Slip Device: 2 5 4 1 Second tray: 2 5 6 Second carrier: 2 6 Transfer device: 2 7 First transfer device: 2 8 Second transfer device: 2 9 Third transfer device: 3 0 Second translation mechanism: 2 5 4 First tray: 2 5 5 Second stage: 2 61 Stage: 2 7 1 First pick-and-place: 2 81 Second pick-and-place: 2 91 Third pick and place : 3 01
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