TWI328992B - - Google Patents

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Publication number
TWI328992B
TWI328992B TW95110045A TW95110045A TWI328992B TW I328992 B TWI328992 B TW I328992B TW 95110045 A TW95110045 A TW 95110045A TW 95110045 A TW95110045 A TW 95110045A TW I328992 B TWI328992 B TW I328992B
Authority
TW
Taiwan
Prior art keywords
conductor layer
via hole
layer
lower conductor
multilayer printed
Prior art date
Application number
TW95110045A
Other languages
English (en)
Chinese (zh)
Other versions
TW200704327A (en
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Publication of TW200704327A publication Critical patent/TW200704327A/zh
Application granted granted Critical
Publication of TWI328992B publication Critical patent/TWI328992B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW095110045A 2005-03-24 2006-03-23 Multi-layer printed circuit board TW200704327A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005085454 2005-03-24

Publications (2)

Publication Number Publication Date
TW200704327A TW200704327A (en) 2007-01-16
TWI328992B true TWI328992B (enExample) 2010-08-11

Family

ID=37023794

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095110045A TW200704327A (en) 2005-03-24 2006-03-23 Multi-layer printed circuit board

Country Status (3)

Country Link
JP (1) JP4973494B2 (enExample)
TW (1) TW200704327A (enExample)
WO (1) WO2006101134A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI468093B (zh) * 2008-10-31 2015-01-01 Princo Corp 多層基板之導孔結構及其製造方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5005416B2 (ja) * 2007-04-20 2012-08-22 新光電気工業株式会社 多層配線基板及びその製造方法
JP5125531B2 (ja) * 2008-01-16 2013-01-23 富士通セミコンダクター株式会社 配線基板及び半導体装置
JP5060998B2 (ja) * 2008-03-18 2012-10-31 日本特殊陶業株式会社 多層樹脂配線基板
JP2015038909A (ja) * 2012-07-13 2015-02-26 イビデン株式会社 配線板及びその製造方法
JP6287149B2 (ja) * 2013-12-10 2018-03-07 イビデン株式会社 電子部品内蔵基板及び電子部品内蔵基板の製造方法
JP5797309B1 (ja) * 2014-07-22 2015-10-21 株式会社フジクラ プリント配線板
JP2016072285A (ja) * 2014-09-26 2016-05-09 京セラ株式会社 回路基板およびプローブカード
CN105430876A (zh) * 2015-12-29 2016-03-23 景旺电子科技(龙川)有限公司 一种增加金属基板绝缘槽孔孔壁结合力的方法
TWI613942B (zh) * 2016-07-05 2018-02-01 元太科技工業股份有限公司 電連接結構
US10103201B2 (en) 2016-07-05 2018-10-16 E Ink Holdings Inc. Flexible display device
US10607932B2 (en) 2016-07-05 2020-03-31 E Ink Holdings Inc. Circuit structure
CN107580410B (zh) * 2016-07-05 2019-12-13 元太科技工业股份有限公司 电连接结构
KR20220110919A (ko) * 2021-02-01 2022-08-09 엘지이노텍 주식회사 회로기판 및 이를 포함하는 패키지 기판
JP7872707B2 (ja) * 2022-07-20 2026-06-10 イビデン株式会社 プリント配線板
TWI894943B (zh) * 2024-05-03 2025-08-21 大陸商宏啟勝精密電子（秦皇島）有限公司 電路板及其製造方法
WO2025258471A1 (ja) * 2024-06-12 2025-12-18 Ｔｏｐｐａｎホールディングス株式会社 多層配線基板、半導体装置及び多層配線基板の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4468528B2 (ja) * 1999-11-26 2010-05-26 イビデン株式会社 多層プリント配線板およびその製造方法。
JP2003069233A (ja) * 2001-08-30 2003-03-07 Kyocera Corp 多層配線基板
JP3854160B2 (ja) * 2002-01-23 2006-12-06 京セラ株式会社 多層配線基板
JP4160765B2 (ja) * 2002-03-25 2008-10-08 京セラ株式会社 配線基板の製造方法
JP2004158703A (ja) * 2002-11-07 2004-06-03 Internatl Business Mach Corp <Ibm> プリント配線板とその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI468093B (zh) * 2008-10-31 2015-01-01 Princo Corp 多層基板之導孔結構及其製造方法
US9107315B2 (en) 2008-10-31 2015-08-11 Princo Middle East Fze Via structure in multi-layer substrate

Also Published As

Publication number Publication date
JP4973494B2 (ja) 2012-07-11
WO2006101134A1 (ja) 2006-09-28
JPWO2006101134A1 (ja) 2008-09-04
TW200704327A (en) 2007-01-16

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