TWI328832B - Apparatus and processing element for processing electronic components mounted on a carrier, and method for product related adjustment of such apparatus - Google Patents

Apparatus and processing element for processing electronic components mounted on a carrier, and method for product related adjustment of such apparatus Download PDF

Info

Publication number
TWI328832B
TWI328832B TW093135060A TW93135060A TWI328832B TW I328832 B TWI328832 B TW I328832B TW 093135060 A TW093135060 A TW 093135060A TW 93135060 A TW93135060 A TW 93135060A TW I328832 B TWI328832 B TW I328832B
Authority
TW
Taiwan
Prior art keywords
processing
item
carrier
scope
frame
Prior art date
Application number
TW093135060A
Other languages
English (en)
Other versions
TW200520044A (en
Inventor
Wilhelmus Hendrikus Johannes Harmsen
Original Assignee
Fico Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv filed Critical Fico Bv
Publication of TW200520044A publication Critical patent/TW200520044A/zh
Application granted granted Critical
Publication of TWI328832B publication Critical patent/TWI328832B/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/51Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5136Separate tool stations for selective or successive operation on work
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/51Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5136Separate tool stations for selective or successive operation on work
    • Y10T29/5137Separate tool stations for selective or successive operation on work including assembling or disassembling station
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/51Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5136Separate tool stations for selective or successive operation on work
    • Y10T29/5137Separate tool stations for selective or successive operation on work including assembling or disassembling station
    • Y10T29/5142Separate tool stations for selective or successive operation on work including assembling or disassembling station and means to sever work from supply
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/53039Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y10T29/53048Multiple station assembly or disassembly apparatus
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/53039Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y10T29/53048Multiple station assembly or disassembly apparatus
    • Y10T29/53052Multiple station assembly or disassembly apparatus including position sensor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53174Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178Chip component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53174Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183Multilead component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53261Means to align and advance work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Packaging Frangible Articles (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Framework For Endless Conveyors (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Description

1328832 九、發明說明: 【發明所屬之技術領域】 本發明相關於一種用於加工裝設在一個載具上的電子 零件之裝[該裝置包含有至少二個嚙合元件,當該等元 件嚙合在-載具上時係共同作用。本發明亦相關於一種用 於加工裝設在載具上之電子零件的加工元件,該加工元件 可相互交換地耦接於一個依據本發明之裝置。本發明更相 關於-種用於此類U之產品相關調㈣方法。 【先前技術】 开疋帑有被運接";-丹上您像; 晶片(ICs)之半導體零件的裁 ' 卞幻戰具)之上的電子零件之加二 糸以工業的規模被廣泛地應用。 ^ ^ B , /、在製造晶片期間 一載八(亦被稱作、導框架"或、、板,,)係在 造完成)產品儲存、(半萝诰6 " 、卞戒梃凡成)產品運送及勃一 列製程的期間被嚙合,例 f . 像疋建立電連接(、連線煜本 (wi re bounding )")、封入帝 : .^ v ;封入零件(、'模製")、產品3 件的分離和變形(、修剪和成型,。及 , 於加工裝載在一載具上的電子零 ’、°等專。月 用於加工特定尺寸之載具,或者 =置通常僅3 刀修改,以便加工不同尺寸 規刃戈 寸來移除1 ,、(尤其是,根據產品, 水移除或放置可相互交換之零件)。 【發明内容】 本發明之目的在於提供— 電子零# ;加工裝載在載具上# 令仵之裝置及方法,利用本 置和方法,各式各樣¥ 5 1328832 產品可被連續地加工 作業及轉換機構。 而不需要用於此目的之 可觀的轉換 為了此目的,本發明提供一種用於加工裝載在載 ::子零件之裝置,其係包含有至少二個共同作用以用於 嚙a於-載具上的嚙合元件,根據用於嚙合之载具的尺 寸,該等响合元件係以可以調整的方式被定位在一個 定向中…,該等唾合元件具有至少一個參考位置相: =藉著界定出相収位的參考機構而共同作用。為了要固 定住喷合元件之—個設^的相對方位,該等喃合元件較佳 地具有固定機構《該等可位移的嗜合元件能夠設定該裳 置,使得其適用於加工特定尺寸的產品(帶有裝載於其: 子零件的載具)。畢竟,二個或多於二個的喷合機構 當嚙合在單一載體上時將共同作用)必須在它們相互的 共同作用期間被修改成適用於嚙合產品的尺寸。此處之參 考機構係界定出用於在一已定產品之情況下所需要之調整 的尺寸。除了該等嚙合機構具有簡單、快速且可靠之產品 相關調整的優點之外,此更可造成所需要之產品相關之; 相互交換零件的數目可以顯著地減少,而此減少亦可能會 造成裝置之成本優勢、簡化補給及/或操作成本的降低。 在—特別較佳的實施例中’該裝置亦具有一用於加工 帶有電子零件之可相互交換的加工元件,而該加工元件係 具有—體的參考機構。此種加工元件可例如是由一模製模 組、一切削模組、一切削平板、一衝壓平板、一變形模組 或—產品保持器所構成的。必須能夠加工各式各樣產品之 1328832 裝置通常也具有能夠針對此目的而可以與裝置相互交換使 用的加工元件。因為在正常情況下加工元件在裝置的轉換 期間必須已經被交換,當該等加工元件同時界定出用於該 裝置其他零件之調整的尺寸(亦即,形成參考機構)、而 s玄等其他零件具有一產品相關的尺寸時,其係額外有利。 藉著產品相關之加工元件的定位(無論如何已經為必要 者),該等嚙合元件因此必須同時被帶入相關的相對定向。 除了工作負荷減少之外,此更具有設定的錯誤組合之機會 將會減少的優點。該裝置一般將包含有一框架,該等嗜: 元件及加工元件係可相對於該框架而位移。但是,此處應 注意的是’另—方面’也可能選擇使用分離的參考機構Γ ▲在該裝置的另-較佳變型中,該等喊合元件被輕接至 "玄框架’使# -第__嗜合元件相對於該框架的位移會產生 至少-個第二嚙合元件的一個強制性位移。此係可以例如 是藉著經由一桿系'统(桿組件)來組裝複數個喷合元件而 被實現。此較佳實施例的優點為:在沒有為了該雨 要之另外㈣別注意或是對於第二唾合元件之調整(決$ 方位)所需要之參考機構的情況下,一 一 干一、乐―)嗜入 元件的位移將產生與其同步之—個或多個(第二)嗜人: 件的位移。 σ 70 該等唾合元件可由-輸送器的零件形成,例如 -導引通道的相對側邊…卜—可能性為:該等 : 係籍著-供應容器的零件而形成,例#,像是一 的二個或多個壁部部份》 〜B幵 1328832 :參考位置可以由例如是一阻擋表面、一參考銷釘、 减:考開:或此等元件之組合而形成。對於唾合元件的精 人疋:來心所需要的是:可以實現在參考機構與該等嚙 二=的一個精密(可再製造)接觸。為了增加準確 二=、但非必要的是:為此目的而在該等唾合元件 …考機構之間應用一個形狀配合的共同作用。 件的ΓΓΤ供一種用於加工裝載在-載具上之電子零 如上文所述的裝置,互:換地被耗合於-個 機槿。v……’、中該加工疋件係具有-體的參考 #攄太路杈具、切割工具或變形元件的優點已經參照 根據本發明之梦署、+<1 情、/ 特別注意的是:根據 ::疋’然而也可能選擇使用分離的參考機構,例如, 像疋參考平板及參考銷釘等等。 :外,本發明提供了一種用於一個裝置之產品相關調 叙的方法,該裝置係用於加工被裝設於一如上所述之載具 上的電子零件,該方法包含有以下步驟:A)選取對於該裝 置之—個決定調整所需要的一個參考機構;及B)位移一個 用於:產品的嚙合元件,直到該嚙合元件的位置被參考機 定為止。一個用於加工產品之裝置的意義為:產品可 錯者該裝置而例如被輸送、變形、模製'切割,但是產品 也可:藉著該裝置而被保持在庫存中。與之前用於轉換裝 置所需者相較,由於根據本發明的方法,此種裝置的產品 相關調整係變得非常簡單、更快速並所需要的技巧較少。 與習知方法相比較,這種方法能夠減少成本並產生更少的 例,本發明的特色、優點及細節 圖 八π疋吧攸喏解。 中 二顯不出依據本發明之裝置之一部分的立體圖直 /、已經部份地從該裝置被取出; ^ 圖2係顯示圖!所示之穿置 圖3 # m 、 、田邛的立體圖;以及 係、顯不用於引導框@ 導樞架的容納空間可Λ 供應容器的立體圖,該引 _ 日〗了精者一種類似把— 而被調整。 厅示之參考平板的作用 【主要元件符號說明】 裝置 工具 3 W導件 4、 r»y 5 ' 6輸送輪 7、 8 參考銷釘 9、 10輪载具 11 21、 開口 2 2側壁 23 參考平板. 24 接觸表面 25 開口

Claims (1)

  1. mn 月: 拉if.(烫S)正替換頁 十、申請專利範圍: L —種用於加工裝設在載具上之電子零件的裝置 (1) ’其係包含有至少二個用於嚙合於一載具上之共同^ 的响合元件,依據用於鳴合之載具的尺寸,該等嗜合元件 可用可調整的方式和被定位在一個相對的定向中,其 I’該等喷合元件被提供有至少一個用於與界定出該相對 定向之參考機構共同作用的參考位置。 2.如申請專利範圍第丨項所述之裝置(1),其中,誃 嚙。件具有用於固定嚙合元件之—個 定機構^ ^ ^ ^ gj ,如申請專利範圍帛1項或第2項所述之裝置⑴ 中,遠裝置⑴耗提供有—可相互交換的加工元件二 加工帶有電子零件的載具,該加工元件灰 考機構。 的,體的參 4·如申請專利範圍第i項或第2項所 中,該裝置⑴亦包含有一框架,該等响 該框架位移。 1千T以相對於 5·如申請㈣㈣第4項所述之裝置⑴ 唾合元件係㈣合到該框架,使得一第一唾合元件相= 框架的位移會產生至少一個第二嚙合 ’於 6.如宇請專利範圍第〗項或第 、,性位移。 a 4乐Z項所述之裝晋(η, 該等0*合元件係藉著-輸送”件形成。 '、 中.7:等圍第1項或第2項所述之“⑴ r 孩等嘴合π件係藉菩一 精者供應容器零件(20)形成。 12 •J •J 中 .如申。月專利範圍第1項或第2項 該參考位置係藉著m 〈裝置⑴’其 棺考阻擋表面形成。 中 9·如申咕專利範圍第1項或第2項所述之裝置⑴ 該參考位置#莊戈A ^ 衣置U),其 係措耆一參考銷釘(7)形成。 1〇·如申請專利範圍第丨項 其中,該參考位置传藉菩Λ 边之裝置⑴, 置係糟者一參考開口形成。 U.—種用於加工裝設在— 元件,該加工元件可以相 ,: 子零件的加工 交換地被麵接於如申請鼻刺γ 圍第1項至第〗η招甘七, 甲"月寻利範 項八中任—項所述的裝置(1)中,並且, 該加工元件係具有-體的參考機構。 12· —種用於一個梦署女 該裝置# « ^ ^ i⑴之產品相關之調整的方法, /装罝係用於加工如申枝轰4|丨贫m » 範圍第1項至第10項其中任 項所述之裝設在—且 載/、上的電子零件,該方法係包含有 以下的加工步驟: 乃 A)選擇用於該裳置门、 參考機構;以&置⑴之-已決定調整所需要的一個 的位Hi一個用於該產品的喷合元件,直到該唾合元件 置破參考機構決定為止。 如申請專利範圍第12項所述之方法,其令, 口工步驟A)的參考機構之選擇係、藉 相 加工元件而發生,!^ 來‘ μ加工70件係用於藉著一體的參考機構 I加工帶有電子零件的載具。 中,Π·如申請專利範圍第12項或第㈣所述之方法其 。 >一個共同作用之嚙合元件的相對位置係在加工 13 年月·曰修(¾)正替換頁 步驟B)期間被調整。 ,其 該被 被固 15.如申請專利範圍第12項或第13項所述之方法 中,在根據加工步驟B)位移至少一個嚙合元件之後, 位移之嚙合元件的位置係在一後續的加工步驟C)中 定0 Η—、圖式: 如次頁 14
TW093135060A 2003-11-20 2004-11-16 Apparatus and processing element for processing electronic components mounted on a carrier, and method for product related adjustment of such apparatus TWI328832B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL1024819A NL1024819C2 (nl) 2003-11-20 2003-11-20 Inrichting en werkwijze voor het productafhankelijk instellen van een inrichting voor het verwerken van een drager met elektronische componenten.

Publications (2)

Publication Number Publication Date
TW200520044A TW200520044A (en) 2005-06-16
TWI328832B true TWI328832B (en) 2010-08-11

Family

ID=34699145

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093135060A TWI328832B (en) 2003-11-20 2004-11-16 Apparatus and processing element for processing electronic components mounted on a carrier, and method for product related adjustment of such apparatus

Country Status (10)

Country Link
US (1) US7676900B2 (zh)
EP (1) EP1688026B1 (zh)
JP (1) JP4989972B2 (zh)
KR (1) KR100922451B1 (zh)
CN (2) CN1883244B (zh)
HK (1) HK1148424A1 (zh)
MY (1) MY138114A (zh)
NL (1) NL1024819C2 (zh)
TW (1) TWI328832B (zh)
WO (1) WO2005060327A2 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4989715B2 (ja) * 2009-12-23 2012-08-01 株式会社日立ハイテクインスツルメンツ 電子部品の装着方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4362786A (en) * 1979-02-02 1982-12-07 Industrial Electronic Rubber Company Apparatus and product useful in manufacture and handling of cable seals
DE58909457D1 (de) * 1988-02-26 1995-11-09 Esec Sa Verfahren und Einrichtung zum Bestücken von metallenen Systemträgern mit elektronischen Komponenten.
JPH0280625U (zh) * 1988-12-10 1990-06-21
BE1007866A3 (nl) * 1993-12-10 1995-11-07 Koninkl Philips Electronics Nv Werkwijze voor het plaatsen van een onderdeel op een strookvormige drager alsmede inrichting voor het plaatsen van een onderdeel op een strookvormige drager.
JP3339230B2 (ja) * 1995-01-17 2002-10-28 松下電器産業株式会社 プリント基板の支持装置および方法および実装装置
US5823316A (en) * 1995-10-04 1998-10-20 Motorola, Inc. Method for automatic conveyor width adjustment
IL125471A0 (en) * 1998-07-23 1999-03-12 Orbotech Ltd Conveying method and device for loading/unloading articles
JP4429465B2 (ja) * 1999-12-07 2010-03-10 パナソニック株式会社 部品供給部一括交換用カート
JP3829050B2 (ja) * 2000-08-29 2006-10-04 松下電器産業株式会社 一体型電子部品
US6984974B2 (en) * 2003-11-17 2006-01-10 Venturedyne, Ltd. Independently-adjustable circuit board carrier

Also Published As

Publication number Publication date
CN101951753B (zh) 2012-03-28
TW200520044A (en) 2005-06-16
CN1883244A (zh) 2006-12-20
CN1883244B (zh) 2010-12-08
KR100922451B1 (ko) 2009-10-21
HK1148424A1 (en) 2011-09-02
EP1688026A2 (en) 2006-08-09
US7676900B2 (en) 2010-03-16
WO2005060327A3 (en) 2005-11-03
WO2005060327A2 (en) 2005-06-30
MY138114A (en) 2009-04-30
NL1024819C2 (nl) 2005-05-23
JP4989972B2 (ja) 2012-08-01
CN101951753A (zh) 2011-01-19
JP2007512206A (ja) 2007-05-17
US20070251084A1 (en) 2007-11-01
EP1688026B1 (en) 2015-08-05
KR20060097733A (ko) 2006-09-14

Similar Documents

Publication Publication Date Title
US10293589B2 (en) System and method for additive fabrication using laminated sheets
US7458793B2 (en) Mold for in-mold decoration
TW200811487A (en) Systems and methods for manufacturing wire grid polarizers
JP4143621B2 (ja) プラズマディスプレイ装置及びプラズマディスプレイ装置用シャーシベースの製造方法
WO2005005136A1 (en) Nanoimprinting apparatus and method
TWI328832B (en) Apparatus and processing element for processing electronic components mounted on a carrier, and method for product related adjustment of such apparatus
US20040109913A1 (en) Shaping Tool for Plastic Housing Parts
TW202042999A (zh) 成形模具、樹脂成形裝置及樹脂成形品的製造方法
JP2007266271A (ja) コア装着方法及び装置
WO2011101701A1 (en) Method of and apparatus for personalising a portable object
CN107566694A (zh) Ccm模组底座贴合方法及ccm模组
TW200539998A (en) A perforation apparatus
JP4477768B2 (ja) リードフレーム搬送装置
JP2007512206A5 (zh)
JP2021028115A (ja) 樹脂成形装置及び樹脂成形品の製造方法
CN212667897U (zh) 一种麦拉片重复使用的固定工装
CN218662558U (zh) 一种改进型贴膜装置
TW201013334A (en) Coating-developing apparatus, coating-developing method and storage medium
JP2957759B2 (ja) リードフレーム搬送装置
JP2009045706A (ja) オンデマンド型製造装置
JP2001114208A (ja) エンボステープの製造装置
JP2628501B2 (ja) ユニットタイルの製造方法
JP6373405B2 (ja) 小型製造装置
TW459329B (en) Adjustment tool of wafer transferring device with two supporting arms
JP2001219322A (ja) 組立装置