TWI328685B - - Google Patents

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Publication number
TWI328685B
TWI328685B TW96113702A TW96113702A TWI328685B TW I328685 B TWI328685 B TW I328685B TW 96113702 A TW96113702 A TW 96113702A TW 96113702 A TW96113702 A TW 96113702A TW I328685 B TWI328685 B TW I328685B
Authority
TW
Taiwan
Prior art keywords
glass substrate
mold
hole
opening
guide hole
Prior art date
Application number
TW96113702A
Other languages
English (en)
Chinese (zh)
Other versions
TW200809209A (en
Inventor
Kiyoshi Takekoshi
Shinjiro Watanabe
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200809209A publication Critical patent/TW200809209A/zh
Application granted granted Critical
Publication of TWI328685B publication Critical patent/TWI328685B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW96113702A 2006-04-18 2007-04-18 Probe card and glass substrate drilling method TW200809209A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006114160 2006-04-18
JP2006315044 2006-11-22

Publications (2)

Publication Number Publication Date
TW200809209A TW200809209A (en) 2008-02-16
TWI328685B true TWI328685B (ja) 2010-08-11

Family

ID=38625050

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96113702A TW200809209A (en) 2006-04-18 2007-04-18 Probe card and glass substrate drilling method

Country Status (2)

Country Link
TW (1) TW200809209A (ja)
WO (1) WO2007123150A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI684011B (zh) * 2016-07-28 2020-02-01 義大利商探針科技公司 電子裝置用探針卡

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2008133089A1 (ja) * 2007-04-20 2010-07-22 日本発條株式会社 導電性接触子ユニット
WO2009130737A1 (ja) 2008-04-21 2009-10-29 富士通株式会社 検査用基板、検査用基板の製造方法、及びその検査用基板を用いた検査方法
JP5372706B2 (ja) * 2009-11-04 2013-12-18 株式会社日本マイクロニクス プローブ針ガイド部材及びこれを備えたプローブカード並びにそれを用いる半導体装置の試験方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6343940B1 (en) * 2000-06-19 2002-02-05 Advantest Corp Contact structure and assembly mechanism thereof
JP2002365308A (ja) * 2001-06-08 2002-12-18 Japan Electronic Materials Corp 垂直ブレード型プローブ、垂直ブレード型プローブユニット及びそれを用いた垂直ブレード型プローブカード
JP3991682B2 (ja) * 2001-12-28 2007-10-17 松下電器産業株式会社 ガラスの精密孔あけ方法、光ファイバーコネクタ用フェルールの製造方法および磁気ディスクガラス基板の製造方法
EP1496366A4 (en) * 2002-04-16 2005-09-14 Nhk Spring Co Ltd HOLDER FOR CONDUCTIVE CONTACT
JP4905872B2 (ja) * 2005-02-18 2012-03-28 日本発條株式会社 導電性接触子ユニット
US20090205372A1 (en) * 2005-07-13 2009-08-20 Toyko Electron Limited Method and device for forming hole in glass substrate
JP5005195B2 (ja) * 2005-07-13 2012-08-22 東京エレクトロン株式会社 プローブカード製造方法
JP4884753B2 (ja) * 2005-11-22 2012-02-29 日本発條株式会社 導電性接触子ユニットおよび導電性接触子

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI684011B (zh) * 2016-07-28 2020-02-01 義大利商探針科技公司 電子裝置用探針卡

Also Published As

Publication number Publication date
WO2007123150A1 (ja) 2007-11-01
TW200809209A (en) 2008-02-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees