200837026 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種玻璃基板之開孔方法及開孔裝置。 【先前技術】 例如以派熱司（康寧（corning)公司之註冊商標）玻璃為代 表之硼矽酸玻璃基板，係應用於例如壓力感测器、速度感 測器等之電子裝置，或塗佈黏著劑之噴嘴等。該情形，需 要在玻璃基板上開微細之孔。先前，係採用以下方法作為 該玻璃基板之開孔方法，即：對於例如光纖連接器用套圈 或磁盤用玻璃基板，將成形用模具所具備之突起插入軟化 之玻璃基板’此後固化玻璃基板拔出前述突起，藉此在玻 璃基板上形成孔（專利文獻1) [專利文獻1]日本特開2003-201 147號公報 【發明内容】 [發明欲解決之問題] 然而，由於使用玻璃基板之壓力感測器等產品之高性能 化及小型化’要求對玻璃基板開數千個左右之微米等級之 微細孔，並且對其各孔要求高位置精度及尺寸精度。此 外，對於孔之形狀亦要求以多樣形狀形成1 mm以上之深 孔。在前述孔之形成方法中，因為極細長之多數突起就此 直接插入玻璃基板，故有以下情形，即··該插入時突起變 形’此後形成之孔之位置產生錯位’或者孔之形狀精产 差。因此，不能以高位置精度及尺寸精度、且以〇·5 mm以 上之深度穩定地形成如此之微米等級之微細多數孔。 125579.doc 200837026 本發明係寥於該點所完成者，其目的在於在玻璃基板上 以馬位置精度及尺寸精度形成所希望深度之多數微細孔。 [解決問題之技術手段] 為了達成前述目的，依照本發明提供一種玻璃基板之開 孔方法’其特徵在於其係具有：在上面有開口之容器内收 納玻璃基板之步驟；將形成有多數之貫通孔之多孔導引板 叹置於θ述玻璃基板上，在該多孔導引板之孔内插入銷之 步驟，加熱前述容器内之玻璃基板，軟化該玻璃基板之步 驟；使與前述多孔導引板對向配置之昇降自如的推壓構件 下降，將前述銷插入前述玻璃基板内之步驟；在前述銷插 入前述玻璃基板之狀態下，冷卻前述容器内之玻璃基板， 固化該玻璃基板之步驟；及除去插入前述玻璃基板之前述 銷’在前述玻璃基板上形成孔之步驟。 依照本發明，因為首先在基板上設置多孔導引板，在該 多孔導引板之孔内插入銷，此後軟化玻璃基板，使推壓構 件下降將前述銷插入軟化之玻璃基板内，故可以正確地將 多數之銷同時插入玻璃基板之特定位置。且在隨後固化玻 璃基板除去前述銷，藉此可以在插入前述銷之位置上形成 孔。其結果，可在玻璃板之特定位置上正確地同時形成多 數孔。 並且亦可在玻璃基板固化後，從容器内取出玻璃基板進 行後續之處理。該情形，使用於銷之導引之多孔導引板， 既可在玻璃基板固化後，從容器内取出玻璃基板前先取 出’亦可與玻璃基板一起原樣不動地從容器内取出，隨後 125579.doc 200837026 從玻璃基板上取下多孔導引板。 又，藉由適宜變更銷之形狀，可在玻璃基板上形成所希 望形狀之孔。 亦可進步具有研磨已除去前述銷之前述玻璃基板之下 面’使前述玻璃基板之孔貫通之步驟。銷插入玻璃基板 時’有在未到達玻璃基板之下面之狀態下玻璃基板固化之 f月形。忒h形，可以藉由研磨玻璃基板之下面使玻璃基板 之孔貫通。 前述多孔導引板之孔亦可相對於垂直方向傾斜形成。藉 =可以形成相對於玻璃基板傾斜之孔。該情形，前述推 壓構件亦可沿水平方向移動自如。亦即，使推壓構件一面 下降一面亦沿水平方向移動，使推壓構件沿與銷之傾斜方 向相同之方向移動，藉此可以相對於玻璃基板傾斜地插入 銷。 前述多孔導引板’既可由具有與前述玻璃基板相同熱膨 脹率、或前述多孔導引板之熱膨脹率與前述玻璃基板之熱 膨脹率之差異在lxl0-6以内之熱膨脹率之材質所形成，亦 可例如由碳、氮切、氮化紹、切等所形成。加熱收納 於容器内之玻璃基板時，雖然多孔導引板亦同時被加熱而 熱膨脹，但由於玻璃基板與多孔導引板之熱膨脹率相同、 或該熱膨脹率之誤差在lxl0-6以内，多孔導引板之孔相對 於玻璃基板之相對位置不變，故銷由多孔導引板之孔導 引’正確地插入玻璃基板之特定位置。 别述容器之材質亦可由碳所形成。碳使用熱傳導性優異 125579.doc 200837026 脹率與卿酸破璃同等或其以下者。㈣，加執日士 可以將容器之熱有效率地傳遞於玻璃基板，此外碳在U ,粒子間有間隱:’玻璃基板内之氣泡容易通過。再者因為 奴不黏著於玻璃基板，故可以容易地從容器内取出破璃基200837026 IX. Description of the Invention: [Technical Field] The present invention relates to a method for opening a glass substrate and a hole opening device. [Prior Art] For example, a borosilicate glass substrate typified by a glass of a heat exchanger (registered trademark of Corning Co., Ltd.) is applied to an electronic device such as a pressure sensor, a speed sensor, or the like. Adhesive nozzle, etc. In this case, it is necessary to open fine holes in the glass substrate. In the prior art, the following method is used as a method of opening a glass substrate, that is, for example, a ferrule for a fiber connector or a glass substrate for a magnetic disk, a projection of a molding die is inserted into a softened glass substrate, and the cured glass substrate is pulled out. The above-mentioned protrusions are used to form a hole in a glass substrate (Patent Document 1). [Patent Document 1] Japanese Laid-Open Patent Publication No. 2003-201147 (Summary of the Invention) [Problems to be Solved by the Invention] However, the pressure feeling using a glass substrate The high performance and miniaturization of products such as detectors require thousands of micron-sized micropores to be placed on the glass substrate, and high precision and dimensional accuracy are required for each hole. Further, it is also required to form a deep hole of 1 mm or more in various shapes for the shape of the hole. In the method of forming the above-mentioned hole, since a very elongated plurality of protrusions are directly inserted into the glass substrate, there is a case where the protrusion is deformed at the time of insertion, and the position of the hole formed thereafter is misaligned or the shape of the hole is poorly produced. . Therefore, such a micron-sized fine majority hole cannot be stably formed with high positional accuracy and dimensional accuracy and with a depth of 〇·5 mm or more. 125579.doc 200837026 The present invention has been completed at this point, and its object is to form a plurality of fine pores of a desired depth on a glass substrate with horse positional accuracy and dimensional accuracy. [Means for Solving the Problems] In order to achieve the above object, a method for opening a glass substrate according to the present invention is characterized in that it has a step of accommodating a glass substrate in a container having an opening thereon; a porous guide plate of the hole is placed on the θ glass substrate, a step of inserting a pin into the hole of the porous guide plate, heating the glass substrate in the container, and softening the glass substrate; and the porous guide a step of inserting the pin into the glass substrate, the step of inserting the pin into the glass substrate, and cooling the glass substrate in the container to solidify the glass substrate; And removing the aforementioned pin 'inserted into the glass substrate to form a hole on the glass substrate. According to the present invention, since a porous guide plate is first provided on the substrate, a pin is inserted into the hole of the porous guide plate, and thereafter the glass substrate is softened, and the pressing member is lowered to insert the pin into the softened glass substrate, so that it is correct Most of the pins are simultaneously inserted into specific locations on the glass substrate. And the glass substrate is subsequently cured to remove the aforementioned pin, whereby a hole can be formed at a position where the aforementioned pin is inserted. As a result, a plurality of holes can be correctly formed simultaneously at specific positions of the glass sheet. Further, after the glass substrate is cured, the glass substrate can be taken out from the container for subsequent processing. In this case, the porous guiding plate used for the guiding of the pin can be taken out before the glass substrate is taken out from the container after being solidified, or can be taken out from the container together with the glass substrate as it is, and then 125579. Doc 200837026 Remove the porous guide from the glass substrate. Further, by appropriately changing the shape of the pin, a hole of a desired shape can be formed on the glass substrate. It is also possible to advance the step of piercing the hole of the glass substrate with the surface of the glass substrate from which the pin has been removed. When the pin is inserted into the glass substrate, there is a shape in which the glass substrate is solidified without reaching the lower surface of the glass substrate. In the 忒h shape, the pores of the glass substrate can be penetrated by grinding the underside of the glass substrate. The holes of the porous guide sheets may also be formed to be inclined with respect to the vertical direction. Borrow = can form a hole that is inclined with respect to the glass substrate. In this case, the pressing member can also move freely in the horizontal direction. That is, the pressing member is moved in the horizontal direction while being lowered, and the pressing member is moved in the same direction as the inclined direction of the pin, whereby the pin can be inserted obliquely with respect to the glass substrate. The porous guiding plate ′ may be formed of a material having the same thermal expansion coefficient as the glass substrate or a thermal expansion coefficient of the thermal conductivity of the porous guiding plate and the thermal expansion coefficient of the glass substrate within a range of 1×10 −6-6, or For example, it is formed by carbon, nitrogen cutting, nitriding, cutting, and the like. When the glass substrate stored in the container is heated, although the porous guiding plate is simultaneously heated and thermally expanded, since the thermal expansion coefficient of the glass substrate and the porous guiding plate is the same, or the error of the thermal expansion rate is within lx10-6, the porous guide The relative position of the hole of the lead plate relative to the glass substrate is constant, so that the pin is guided by the hole of the perforated guide plate to be correctly inserted into a specific position of the glass substrate. The material of the container may also be formed of carbon. Carbon is excellent in thermal conductivity. 125579.doc 200837026 The expansion ratio is equal to or less than that of sulphuric acid. (4) Adding the Japanese can efficiently transfer the heat of the container to the glass substrate. In addition, the carbon is hidden between U and particles: The bubbles in the glass substrate are easily passed. Furthermore, since the slave does not adhere to the glass substrate, the glass base can be easily taken out from the container.
别=銷亦可由對於前述玻璃基板之加熱溫度具有耐熱性 之材貝所形成。藉此，加熱玻璃基板時，前述銷不會變形 或強度減弱’而正確地插人玻璃基板之特定位置。 ^ 除去前述銷時，例如亦可藉由液體將前述 2玻璃基板除去。該情形，例如亦可由金屬構成前述銷， 月』述液體使用王水。前述銷之材料例如可以使用鶴、不傭 鋼、銷、鎳或鎳合金。 /、 i过鎖時，例如亦可將前述銷燃燒而自前述玻 璃基板除去。該情形，前述銷可錢用碳。 依照其他觀點之本發明’提供—種開孔裝置。其特徵在 於其係用於在玻璃基板上開孔者；其具有：容器，其係可 ，納玻璃基板’上面有開口纟；加熱容器，其係收納前述 容器且加熱前述容器者；推壓構件，其係與設置於前述玻 离，板上且形成有多數貫通孔之多孔導引板對向配置者； 昇降機構纟係用於使前述推壓構件昇降，將插入前述 多孔導引板之銷插入前述容器内之玻璃基板者。 刖述容器之材質亦可包含碳。 [發明之效果] 依照本發明，可、— 1以在玻璃基板上以高位置精度及尺寸精 125579.doc 200837026 度、且以所希望之深度同時形成多數之微細孔。此外亦可 形成多樣形狀之孔。 【實施方式】 以下就本發明之較佳實施形態進行說明。圖丨係顯示本 實施形態之用於實施玻璃基板之開孔方法之開孔裝置丨之 概略構成。 開孔裝置1具備收納玻璃基板10之容器20。容器2〇形成 為上面有開π且縱剖面凹型之箱狀。$器2()内侧之側面形 成為從容器20之底面開始隨著接近開口面，容器2〇之内逕 逐漸增大之錐狀。容器20係藉由以下材料形成，即：與玻 璃基板10相比熱膨脹率同等或其以下之材料，且熱傳導性 良好、與玻璃基板10不融著之材質，例如碳。藉此，可以 防止由於冷卻時之縮小使容器2〇内之玻璃基板1〇破損，或 者防止冷卻後玻璃基板10無法從容器2〇取出。 容器20由支持構件3G所支持，收納於加熱容器仙。加 熱容器31例如形成為上面開口、底面閉口之大致圓筒狀。 加熱容器31例如藉由石英玻璃形成。加熱容器”之上面開 口部係藉由蓋體32所氣密閉鎖。蓋體32例如藉由陶瓷形 在加熱容器31之周圍配置有藉由電力供給而發熱之加熱 器33。加熱器33例如配置於加熱容器31之外側面及下面。 加熱容器31藉由外罩34所覆蓋，該外罩係藉由絕熱材所 形成。前述加熱器33介插於外罩34與加熱容器31之間。 在蓋體32之中央部形成有上下方向貫通之貫通孔32a。 125579.doc 200837026 在貝通孔32a内插通有軸4〇，該軸從蓋體32之上方於上下 方向延伸直至加熱容器31内。軸4〇例如藉由陶瓷形成。 在軸40之下端部例如安裝有大致圓盤形狀之推壓構件 41，與玻璃基板10對向配置。推壓構件41例如藉由陶瓷形 成。 軸40之上端部連接於配置於蓋體32上方之電動機等之昇 降驅動部70。昇降驅動部7〇例如由設置於蓋體“之上面之 支持cr 71所支持。昇降驅動部7〇例如藉由控制部來控制 動作。昇降驅動部70藉由使軸4〇上下移動，可以使推壓構 件41上下移動，相對於容器2〇内之玻璃基板1〇進退。推壓 構件41之昇降速度、昇降位置藉由控制部”所控制。並 且，在本實施形態中，藉由昇降驅動部7〇及控制部Μ構成 昇降機構。 例如在蓋體32與昇降驅動部70之間之軸4〇上安裝有例如 圓盤狀之凸緣80。伸縮自如之波紋管81介插於凸緣8〇與蓋 體32之間。在該波紋管8丨設置有未圖示之冷卻機構，抑制 加熱容器3 1側之熱傳遞到昇降驅動部7〇側。 在開孔裝置1設置有向加熱容器31内供給特定氣體之氣 體供給管85。氣體供給管85例如連接於加熱容器31之側 面。氣體供給管85通往未圖示之氣體供給源。在本實施形 態中’在氣體供給源封人氮氣，& 了使加熱容器31内成為 低氧％ i兄，經由氣體供給管85向加熱容器3丨内供給氮氣。 如此使加熱容器31内成為低氧環境，藉此可以防止藉由碳 所形成之容器20在例如後述之加熱時之溫度、例如1〇〇(rc 125579.doc -10- 200837026 下燃燒’此外可以防止後述之開孔銷90在高溫下氧化、變 形。 本實施形態之開孔裝置1如上構成，下面對使用該開孔 裝置1之玻璃基板10之開孔方法進行說明。在本實施形態 中，以對派熱司玻璃（康寧（corning)公司之註冊商標）等硼 石夕酸玻璃之玻璃基板10形成多數之圓形貫通孔之情形為例 進行說明。 首先，在開孔裝置1之容器20中收納方形且薄平板形狀 之玻璃基板10。隨後，在玻璃基板10上設置方形之多孔導 引板50。 在多孔導引板50之特定位置，例如藉由鑽孔加工等機械 加工或蝕刻等，如圖2所示，貫通多孔導引板5〇形成複數 之圓形孔5 1。於該等之各孔5 1内插入圓柱狀之開孔銷9〇， 開孔銷90之下端接於玻璃基板10。該孔51例如以5〇 ^瓜左 右之直徑、1 〇0 μπι以下之間距形成，具備2 μιη以内之位置 精度及尺寸精度。孔51以較插入之開孔銷90略大之直徑形 成。多孔導引板50之孔51之配置及數量，根據最終形成於 玻璃基板10之孔1〇〇之位置而適宜設定。 多孔導引板50係由具有與玻璃基板1〇相同之熱膨脹率， 例如碳、氮化矽、氮化鋁、或矽等形成。此外開孔銷9〇係 由對例如後述之加熱時之溫度、例如l〇〇〇°C具有耐熱性之 例如鎢、不鏽鋼、鉬、鎳或鎳合金等之金屬形成。開孔銷 9 0係使用例如切斷金屬絲，或以車床等切削加工，或採用 LIGA製程等電鍍技術而形成。開孔銷90形成為例如直經 125579.doc -11 - 200837026 50 μπι左右、1 mm以上之長度。 多孔導引板5 0設置於玻璃基板10上之後’從氣體供給管 85向加熱容器3 1内供給氮氣，加熱容器3 1内維持氮環境。 此時，加熱容器3 1内相對於外部維持正壓，防止外氣流人 加熱容器3 1内。 接著’如圖3(a)所示在推壓構件41與多孔導引板5〇接近 之狀態下，藉由加熱器33之發熱，使加熱容器31内昇溫。 藉此，容器20内之玻璃基板1〇被加熱到約100(rc。此時， 多孔導引板50及開孔銷90亦昇溫到與玻璃基板10相同程度 之溫度。並且，該l〇〇(TC之溫度係可使玻璃基板1〇充分軟 化’將開孔銷90不變形地插入玻璃基板1 〇之温度，且係開 孔銷90不變形，強度不減弱之溫度。 玻璃基板10之溫度到達lOOOt：後，藉由控制部72使昇降 驅動部70動作，如圖3(b)所示推壓構件41以特定速度下降 到特疋位置。此時，推壓構件4丨係一面按壓開孔銷9〇之上 端一面下降。藉此，開孔銷9〇由多孔導引板5〇之孔51所導 引，插入到達玻璃基板1〇内之特定深度。之後，停止藉由 加熱器33之發熱，在開孔銷9〇插入玻璃基板1〇之狀態下， 冷部、固化玻璃基板1 〇。此時之冷卻比加熱時之溫度變動 更緩地進行。又，該冷卻係在多孔導引板5〇設置於玻璃基 板10上之狀態下原樣不動地進行。藉此，從玻璃基板開 、"卩口化，直至到達玻璃基板丨〇之應變點5 1 〇 t完全固 化』間，由於多孔導引板50導引引該開孔銷90，故開孔銷 90不動’開孔銷90之位置固定。 125579.doc -12- 200837026 玻璃基板1 〇冷卻固化後，如圖3(C)所示藉由昇降驅動部 70使推壓構件41上昇，從玻璃基板10退避。此外，多孔導 引板50亦可從玻璃基板10上取除。 接著例如如圖4(a)所示，將玻璃基板1 〇在安裝有開孔銷 90之狀態下從加熱容器31内取出。 從加熱容器3 1内取出玻璃基板1 〇後，接著在例如王水等 藥液中浸潰玻璃基板10，如圖4(b)所示開孔銷90被溶融。 如此從玻璃基板10中除去開孔銷90，在玻璃基板1〇之上面 形成孔100。 之後，例如研磨玻璃基板10之下面，如圖4(c)所示貫通 玻璃基板10之孔100。如此，在玻璃基板1 〇上例如以1 〇〇 μιη以下之間距形成50 μιη之直徑、深度1 mm以上之孔 100。之後，根據需要研磨玻璃基板1〇之上面。 依照以上之實施形態’因為藉由推壓構件41 一面推壓開 孔銷90之上端一面下降，開孔銷9〇由多孔導引板50之微細 孔5 1所導引，插入玻璃基板1 〇内，故開孔銷9〇正確地插入 玻璃基板10之特定位置。接著，從玻璃基板除去開孔銷 90，在玻璃基板1〇上形成孔100。該情形，因為開孔銷9〇 插入玻璃基板10之位置正確，故可以在玻璃基板10上多數 形成微細之具有高位置精度及尺寸精度之微細孔1〇〇。 又，藉由適宜調整開孔銷90之尺寸及推壓構件4 1加工行程 之長度，可以在玻璃基板1〇上形成1 mm以上之所希望深度 之孔100。再者，藉由改變孔51或開孔銷9〇之形狀，可以 在玻璃基板10上簡單地形成多樣形狀之孔丨〇〇。 125579.doc -13- 200837026 因為藉由控制部72所控制夕θ放 ^制之幵降驅動部7〇使推壓構件41 上下移動，故可以將開孔銷9〇 〜 从特疋之速度及特定之深度 插入玻璃基板10内。藉此，可 J Μ在玻璃基板10上形成更高 尺寸精度之孔。 因為從玻璃基板Η)除Μ孔鎖9呵，係藉由王水溶融開 孔銷90,故與例如拔出開孔銷9叫相比，即使係更細之開 孔銷90亦可容易地除去。因&，可以形成更微細之孔 100 〇The pin = pin may be formed of a material having heat resistance to the heating temperature of the glass substrate. Thereby, when the glass substrate is heated, the pin is not deformed or the strength is weakened, and the specific position of the glass substrate is correctly inserted. ^ When the pin is removed, the second glass substrate may be removed by, for example, a liquid. In this case, for example, the pin may be made of a metal, and the liquid may be aqua regia. As the material of the aforementioned pin, for example, a crane, a stainless steel, a pin, a nickel or a nickel alloy can be used. When /, i is overlocked, for example, the pin may be burned and removed from the glass substrate. In this case, the aforementioned pin can be used for carbon. The present invention according to other aspects provides a perforating device. The utility model is characterized in that it is used for opening a hole on a glass substrate; the container has a container, and the nano glass substrate has an opening 上面 thereon; the heating container is for accommodating the container and heating the container; the pressing member And a pair of porous guide plates disposed on the plated, plated surface and having a plurality of through holes; the lifting mechanism is for lifting the pressing member, and inserting the pin into the porous guiding plate The glass substrate inserted into the aforementioned container. The material of the container may also contain carbon. [Effects of the Invention] According to the present invention, it is possible to form a plurality of micropores simultaneously at a desired depth with a high positional accuracy and size on a glass substrate. In addition, holes of various shapes can be formed. [Embodiment] Hereinafter, preferred embodiments of the present invention will be described. The figure shows the schematic configuration of the opening device 用于 for carrying out the opening method of the glass substrate of the embodiment. The hole opening device 1 includes a container 20 that houses the glass substrate 10. The container 2 is formed into a box shape having an open π and a longitudinal section concave. The side surface shape of the inside of the container 2 () is a tapered shape in which the inner diameter of the container 2 is gradually increased from the bottom surface of the container 20 as it approaches the opening surface. The container 20 is formed of a material having a thermal expansion coefficient equal to or lower than that of the glass substrate 10, and a material having good thermal conductivity and not being fused with the glass substrate 10, for example, carbon. Thereby, it is possible to prevent the glass substrate 1 inside the container 2 from being broken due to shrinkage during cooling, or to prevent the glass substrate 10 from being taken out from the container 2 after cooling. The container 20 is supported by the support member 3G and housed in the heating container. The heating container 31 is formed, for example, in a substantially cylindrical shape in which the upper surface is opened and the bottom surface is closed. The heating container 31 is formed, for example, of quartz glass. The upper opening of the heating container is hermetically sealed by the lid body 32. The lid body 32 is provided with a heater 33 that generates heat by electric power supply, for example, by a ceramic shape around the heating container 31. The heater 33 is disposed, for example. The heating container 31 is covered by the outer cover 34. The outer cover is formed by a heat insulating material. The heater 33 is interposed between the outer cover 34 and the heating container 31. A through hole 32a penetrating in the vertical direction is formed in the center portion. 125579.doc 200837026 A shaft 4A is inserted into the beacon hole 32a, and the shaft extends from the upper side of the lid body 32 in the vertical direction up to the inside of the heating container 31. For example, it is formed of ceramics. A pressing member 41 having a substantially disk shape is attached to the lower end portion of the shaft 40, for example, and is disposed to face the glass substrate 10. The pressing member 41 is formed of, for example, ceramic. The upper end of the shaft 40 is connected. The elevation drive unit 70 of the motor or the like disposed above the lid body 32. The elevation drive unit 7 is supported by, for example, a support cru 71 provided on the upper side of the lid body. The elevation drive unit 7 is controlled by, for example, a control unit. The elevation drive unit 70 can move the pressing member 41 up and down by moving the shaft 4〇 up and down, and advances and retreats with respect to the glass substrate 1 in the container 2〇. The raising and lowering speed and the lifting position of the pressing member 41 are controlled by the control unit. Further, in the present embodiment, the lifting and lowering drive unit 7A and the control unit are configured to constitute an elevating mechanism. For example, the cover 32 and the elevating drive unit are provided. For example, a disc-shaped flange 80 is attached to the shaft 4 between the 70. The bellows 81 which is expandable and contractable is interposed between the flange 8A and the lid body 32. The bellows 8 is provided with a not shown The cooling mechanism suppresses heat transfer to the side of the elevation drive unit 7 on the side of the heating container 31. The hole opening device 1 is provided with a gas supply pipe 85 for supplying a specific gas into the heating container 31. The gas supply pipe 85 is connected to, for example, heating. The side of the container 31. The gas supply pipe 85 is connected to a gas supply source (not shown). In the present embodiment, 'the gas supply source is sealed with nitrogen gas, and the inside of the heating container 31 is made low-oxygen. The supply pipe 85 supplies nitrogen gas into the heating vessel 3, thereby making the inside of the heating vessel 31 a low-oxygen environment, whereby the temperature of the vessel 20 formed of carbon, for example, heating as described later, for example, 1 〇〇 (rc) can be prevented. 125579.doc -10- 200837026 In addition, it is possible to prevent the opening pin 90 to be described later from being oxidized and deformed at a high temperature. The opening device 1 of the present embodiment has the above configuration, and a method of opening the glass substrate 10 using the opening device 1 will be described below. In the present embodiment, a case where a plurality of circular through holes are formed in a glass substrate 10 of borosilicate glass such as a Paisley glass (registered trademark of Corning Co., Ltd.) will be described as an example. A rectangular and thin plate-shaped glass substrate 10 is housed in the container 20 of the hole device 1. Subsequently, a square porous guide plate 50 is provided on the glass substrate 10. At a specific position of the porous guide plate 50, for example, by drilling By machining or etching, etc., as shown in Fig. 2, a plurality of circular holes 51 are formed through the perforated guide sheets 5, and cylindrical opening pins 9 are inserted into the holes 5 1 to open the holes. The pin 90 is terminated at the lower end of the glass substrate 10. The hole 51 is formed, for example, at a diameter of about 5 〇 瓜 瓜, and a distance of 1 〇 0 μπι or less, and has a positional accuracy and dimensional accuracy of 2 μm or less. Hole pin 90 is slightly larger The diameter is formed. The arrangement and number of the holes 51 of the porous guiding plate 50 are appropriately set according to the position finally formed in the hole 1 of the glass substrate 10. The porous guiding plate 50 is made to have the same thermal expansion as the glass substrate 1 The rate is, for example, carbon, tantalum nitride, aluminum nitride, or tantalum, etc. Further, the opening pin 9 is made of, for example, tungsten or stainless steel which has heat resistance to, for example, a temperature at the time of heating as described later, for example, 10 ° C. A metal such as molybdenum, nickel or a nickel alloy is formed, and the opening pin 90 is formed by, for example, cutting a wire, cutting by a lathe, or the like by a plating technique such as a LIGA process. The opening pin 90 is formed, for example, straight. 125579.doc -11 - 200837026 50 μπι or so, length of 1 mm or more. After the porous guide plate 50 is placed on the glass substrate 10, nitrogen gas is supplied from the gas supply pipe 85 into the heating container 31, and the nitrogen atmosphere is maintained in the heating container 31. At this time, the inside of the heating container 31 is maintained at a positive pressure with respect to the outside to prevent the outside air person from heating the inside of the container 31. Then, as shown in Fig. 3 (a), in the state where the pressing member 41 and the perforated guide plate 5 are close to each other, the inside of the heating container 31 is heated by the heat generated by the heater 33. Thereby, the glass substrate 1 in the container 20 is heated to about 100 (rc. At this time, the porous guide plate 50 and the opening pin 90 are also heated to the same temperature as the glass substrate 10. And, (The temperature of the TC is such that the glass substrate 1 〇 is sufficiently softened] The opening of the glass substrate 1 is not deformed by the opening pin 90, and the opening pin 90 is not deformed, and the strength is not weakened. The temperature of the glass substrate 10 After reaching 100o:, the control unit 72 operates the elevation drive unit 70, and as shown in Fig. 3(b), the pressing member 41 is lowered to the special position at a specific speed. At this time, the pressing member 4 is pressed one by one. The upper end of the hole pin 9 is lowered on one side. Thereby, the opening pin 9 is guided by the hole 51 of the perforated guide plate 5, and inserted into a specific depth in the glass substrate 1〇. Thereafter, the heater 33 is stopped. When the opening pin 9 is inserted into the glass substrate 1 ,, the cold portion and the cured glass substrate 1 are cooled. The cooling at this time is performed more slowly than the temperature change during heating. Further, the cooling is in the porous guide. The lead plate 5 is placed as it is on the glass substrate 10 as it is. Therefore, from the opening of the glass substrate, "mouthing, until the strain point 5 1 〇t of the glass substrate is completely cured, the opening guide pin 50 guides the opening pin 90, so the opening pin 90 does not move the position of the opening pin 90 is fixed. 125579.doc -12- 200837026 After the glass substrate 1 is cooled and solidified, the pressing member 41 is raised by the elevation driving portion 70 as shown in Fig. 3(C), from the glass substrate Further, the porous guide plate 50 can be removed from the glass substrate 10. Next, as shown in Fig. 4 (a), the glass substrate 1 is raked from the heating container 31 in a state where the opening pin 90 is mounted. After taking out the glass substrate 1 from the heating container 31, the glass substrate 10 is then impregnated in a chemical liquid such as aqua regia, and the opening pin 90 is melted as shown in Fig. 4(b). The hole pin 90 is removed in 10, and the hole 100 is formed on the glass substrate 1A. Thereafter, for example, the lower surface of the glass substrate 10 is polished, and the hole 100 of the glass substrate 10 is penetrated as shown in Fig. 4(c). Thus, the glass substrate is 1 〇, for example, a diameter of 50 μm and a depth of 1 mm at a distance of 1 〇〇μηη The upper hole 100. Thereafter, the upper surface of the glass substrate 1 is ground as needed. According to the above embodiment, since the upper end of the opening pin 90 is pushed down by the pressing member 41, the opening pin 9 is guided by the porous guide. The micropores 51 of the lead plate 50 are guided and inserted into the glass substrate 1 , so that the opening pins 9 are correctly inserted into the specific position of the glass substrate 10. Then, the opening pins 90 are removed from the glass substrate, and the glass substrate 1 is removed. The hole 100 is formed in the crucible. In this case, since the position where the perforation pin 9 is inserted into the glass substrate 10 is correct, a fine micropore having a high positional accuracy and dimensional accuracy can be formed on the glass substrate 10 in many cases. Further, by appropriately adjusting the size of the opening pin 90 and the length of the processing stroke of the pressing member 4 1 , a hole 100 having a desired depth of 1 mm or more can be formed on the glass substrate 1 . Further, by changing the shape of the hole 51 or the opening pin 9 turns, it is possible to easily form the holes of various shapes on the glass substrate 10. 125579.doc -13- 200837026 Since the pressing member 41 is moved up and down by the throttle driving unit 7 controlled by the control unit 72, the opening pin 9〇 can be driven from the speed and A specific depth is inserted into the glass substrate 10. Thereby, a hole of higher dimensional accuracy can be formed on the glass substrate 10. Since the boring lock 9 is removed from the glass substrate, the opening pin 90 is melted by the aqua regia, so that even the thinner opening pin 90 can be easily compared with, for example, the opening of the opening pin 9. Remove. Due to &, a finer hole can be formed 100 〇
又’雖然多孔導引板5G亦係藉由加熱容器31之加熱器33 而被加熱至與玻璃基板10同等之溫度，但因為多孔導引板 5〇與玻璃基板10之熱膨脹率相同，故由熱膨脹之差所引起 之位置偏差被抑制。因此’由於多孔導引板5()之孔51之相 對於玻璃基板ίο之相對位置不變，故開孔銷9〇由孔51所導 引，正確地插入玻璃基板之特定位置。藉此，可以進一步 提高孔100之位置精度。 多孔導引板50與玻璃基板1 〇之熱膨脹率有微小之差異 時，亦可預先考慮该差異而形成多孔導引板5 〇之孔5 1。例 如，基於多孔導引板50之熱膨脹率，修正孔51之形成位置 或尺寸。藉此，可以在玻璃基板10上形成位置精度更高之 孔 100。 在以上之實施形態中，雖然在使加熱容器3丨内加熱之 月il ’向加熱容器3 1内供給氮氣，但亦可不供給氮氣，而將 未圖示之負壓產生裝置連接於加熱容器31來減壓加熱容器 3 1内。藉此亦可使加熱容器3丨内成為低氧環境。 125579.doc -14- 200837026 之孔r J孔銷9〇之形狀雖然係圓柱狀’但亦可根據所要求 ，狀變更開孔鎖9〇之形狀。例如亦可如圖5所示，使 開孔銷9G之形狀成為大致圓柱形狀且下部較上部細之且有 階差部之形狀。該情形亦與前述之實施形態同樣，在炼融 之玻璃基板Π)内插入開孔鎖9〇,隨後在玻璃基…峨固化 後從容H2G取出（圖5(a))e之後，開孔㈣藉由王水所溶 融除去（圖聊。接著’藉由研磨玻璃基板1〇之下面，形 成具有階差部之貫通孔丨1〇(圖5(c))。 又’如圖6⑷所*亦可混合存在有長度或直徑不同之開 孔銷90。該情形亦可藉由與前述之實施形態同樣之方法形 成包含貫通孔及有底孔之孔12〇(圖6(b))。 再者，可以藉由改變開孔銷9〇之形狀，形成前端球狀之 孔130(圖7)、與上端部及下端部相比中央部寬之孔14〇(圖 8)、及中央部窄之孔150(圖9)等。 又，如圖10所示，亦可將多孔導引板5〇之孔51相對於垂 直方向傾斜e又置，插入孔5 1之開孔銷9〇亦傾斜設置，藉此 在玻璃基板10上形成傾斜之孔。該情形，亦可使推壓構件 41沿水平方向移動（圖10(a))。將開孔銷9〇插入玻璃基板1〇 時，使推壓構件41 一面下降一面沿水平方向移動，使推壓 構件41沿與開孔銷90之傾斜方向相同之方向移動（圖 10(b))。藉此，開孔銷90從前端部傾斜地插入玻璃基板 1〇。接著，玻璃基板10冷卻後藉由王水溶解開孔銷9〇，之 後研磨玻璃基板10之下面，藉此在玻璃基板10上形成傾斜 之孔 160(圖 10(c))。 125579.doc -15- 200837026 又’開孔銷90亦可使用碳。開孔銷9〇例如可以藉由切削 而加工成導引孔51之形狀。該情形，可以藉由燃燒碳將開 孔銷90從玻璃基板10上除去。碳之燃燒溫度約為4〇〇c>c# 上，比玻璃基板22之應變點51(rCm，可不使玻璃基板1〇 變形而僅燃燒開孔銷90。 開孔銷90使用碳時，亦可使用圖丨丨所示之開孔裝置17〇 作為玻璃基板之開孔裝置。開孔裝置17〇係在本實施形態 之開孔裝置1上，加上用於燃燒開孔銷9〇之氧供給管86之 表置。氧供給管86係連接於加熱容器3丨之側面。氧供給管 86通往未圖示之氧供給源，經由氧供給管％向加熱容器31 内供給氧。並且，容器20係由碳形成時，由於加熱時容器 2〇燃燒’故每次玻璃基板10之開孔都要更換容器2〇。又， 為使容器20不需更換，容器2〇之材料亦可使用加熱時不燃 燒之例如陶兗。 開孔銷90插入玻璃基板丨〇，玻璃基板丨〇固化後（圖 3(c)) ’使用開孔裝置170除去碳之開孔銷9〇之步驟，例如 如下進行。 從氧供給管86向為了固化玻璃基板10而冷卻到約5〇〇。〇 之加熱容器3 1内供給氧。藉此，碳開孔銷90被燃燒除去。 該情形，由於玻璃基板1 〇應變點為5 1 〇 °C，故不產生變 形’形狀維持原樣不變。 藉此’開孔銷90使用碳時，可以在開孔裝置170之加熱 容器31内除去開孔銷90。 以上’ 一邊參照附圖一邊對本發明之較佳實施形態進行 125579.doc -16 - 200837026 了說明，但本發明並非限定於此例。熟悉本技藝者，當得 月白在°己載於申請專利範圍内之技術思想之範舜内，可想 到各種之變更例或修正例，此等亦理所當然地屬於本發明 之技術範圍。例如前述實施形態所記載之孔100既可係圓 孔，亦可係長方體形狀之方孔、或者尖頭之錐狀。本實施 形態所記載之玻璃基板10雖然係方形，但玻璃基板10之形 狀亦可係圓形等之其他形狀。 [產業上之可利用性] 本發明在以高位置精度及尺寸精度在玻璃基板上形成多 數之微細孔時有用。 【圖式簡單說明】 圖1係顯示本實施形態之開孔裝置之概略構成之縱剖面 圖。 圖2係推壓構件之立體圖。 圖3係顯示玻璃基板之開孔方法之步驟說明圖，（勾係顯 示在玻璃基板上設置有多孔導引板及開孔銷之樣子，（…係 顯不使開孔銷插入軟化之玻璃基板内之樣子，（勾係顯示使 推壓構件退避，取下多孔導引板之樣子。 圖4係顯示接續圖3之玻璃基板之開孔方法之步驟，（句係 顯示從容器内取出玻璃基板之樣子，(b)係顯示除去開二; 之樣子，（c)係顯示研磨玻璃基板之下面，完成孔之樣子 圖5係顯示改變開孔銷之形狀時之孔 一 战芡驟，（a)係 顯示從容器内取出玻璃基板之樣子，（b)係 ’、 氣、、具不除去開孔銷 之樣子’（c)係顯示研磨玻璃基板之下面， 70成孔之樣子。 125579.doc 200837026 圖6係顯示改變開孔蛸之妒狀時 顯示從容器内取出玻璃基板之樣子 子0 孔之形成步驟，（a)係 (b)係顯示完成孔之樣 圖7係顯示改變開孔銷之形狀時 縱剖面圖。 之孔形狀之玻璃基板之 圖8係顯示改變開孔銷之形狀時之孔形狀之玻璃基板之Further, although the porous guide plate 5G is heated to the same temperature as the glass substrate 10 by the heater 33 of the heating container 31, since the thermal expansion coefficient of the porous guide plate 5 and the glass substrate 10 is the same, The positional deviation caused by the difference in thermal expansion is suppressed. Therefore, since the relative position of the hole 51 of the perforated guide plate 5 (with respect to the glass substrate) is constant, the opening pin 9 is guided by the hole 51 and is correctly inserted into a specific position of the glass substrate. Thereby, the positional accuracy of the hole 100 can be further improved. When there is a slight difference in the thermal expansion coefficient between the porous guide plate 50 and the glass substrate 1, the hole 5 1 of the porous guide plate 5 can be formed in consideration of the difference. For example, the formation position or size of the hole 51 is corrected based on the thermal expansion rate of the perforated guide plate 50. Thereby, the hole 100 having higher positional accuracy can be formed on the glass substrate 10. In the above embodiment, the nitrogen gas is supplied into the heating container 31 during the heating of the heating container 3, but the negative pressure generating device (not shown) may be connected to the heating container 31 without supplying nitrogen gas. The inside of the vessel 3 1 was heated under reduced pressure. Thereby, the inside of the heating container 3 can also be made into a low oxygen environment. 125579.doc -14- 200837026 The shape of the hole j J pin 9 is cylindrical, but the shape of the hole lock 9 can be changed according to the requirements. For example, as shown in Fig. 5, the shape of the opening pin 9G may be a substantially cylindrical shape, and the lower portion may be thinner than the upper portion and have a shape of a step portion. In this case as well, in the same manner as in the above embodiment, the opening lock 9 is inserted into the fused glass substrate, and then after the glass substrate is cured, it is taken out from the H2G (Fig. 5(a)) e, and then the opening (4) It is removed by the melting of aqua regia (Fig. Talk. Then, by grinding the underside of the glass substrate, a through-hole 丨1〇 having a step portion is formed (Fig. 5(c)). Also, as shown in Fig. 6(4)* The opening pin 90 having a different length or diameter may be mixed. In this case, the hole 12〇 including the through hole and the bottomed hole may be formed by the same method as the above embodiment (Fig. 6(b)). By changing the shape of the opening pin 9〇, the front end spherical hole 130 (FIG. 7), the hole 14〇 (FIG. 8) which is wider than the upper end portion and the lower end portion, and the center portion are narrow. Hole 150 (Fig. 9), etc. Further, as shown in Fig. 10, the hole 51 of the perforated guide plate 5 can be tilted e with respect to the vertical direction, and the opening pin 9 of the insertion hole 5 1 is also inclined. Thereby, an inclined hole is formed in the glass substrate 10. In this case, the pressing member 41 can also be moved in the horizontal direction (Fig. 10 (a)). The opening pin 9 is inserted into the glass base. At 1 ,, the pressing member 41 is moved in the horizontal direction while being lowered, and the pressing member 41 is moved in the same direction as the inclination direction of the opening pin 90 (Fig. 10 (b)). Thereby, the opening pin 90 The glass substrate 1 is inserted obliquely from the front end portion. Then, after the glass substrate 10 is cooled, the opening pin 9 is dissolved by the aqua regia, and then the underside of the glass substrate 10 is ground, whereby the inclined hole 160 is formed on the glass substrate 10 (Fig. 10(c)). 125579.doc -15- 200837026 The carbon can also be used for the 'opening pin 90. The opening pin 9 can be processed into the shape of the guiding hole 51 by cutting, for example. The burning carbon removes the opening pin 90 from the glass substrate 10. The burning temperature of carbon is about 4 〇〇c>c#, and the strain point 51 (rCm of the glass substrate 22 can be burned without deforming the glass substrate 1〇). Hole pin 90. When the hole pin 90 is made of carbon, the hole opening device 17 shown in Fig. 〇 can also be used as the hole opening device of the glass substrate. The hole opening device 17 is attached to the hole opening device 1 of the present embodiment. And the surface of the oxygen supply pipe 86 for burning the opening pin 9〇. The oxygen supply pipe 86 is attached. The oxygen supply pipe 86 is connected to the side of the heating container 3, and the oxygen supply pipe 86 is supplied to the oxygen supply source (not shown), and oxygen is supplied into the heating container 31 via the oxygen supply pipe %. When the container 20 is formed of carbon, the container is heated. 2〇 Burning' Therefore, the container 2 is replaced every time the opening of the glass substrate 10. Further, in order to make the container 20 unnecessary to be replaced, the material of the container 2 can also be used, for example, ceramics which are not burnt when heated. 90 is inserted into the glass substrate 丨〇, and after the glass substrate is cured (Fig. 3(c)), the step of removing the carbon opening pin 9 by using the opening device 170 is performed, for example, as follows. The oxygen supply tube 86 is cooled to about 5 Torr in order to cure the glass substrate 10. The inside of the heating vessel 31 is supplied with oxygen. Thereby, the carbon opening pin 90 is burned and removed. In this case, since the strain point of the glass substrate 1 is 5 1 〇 ° C, the shape of the deformed shape does not remain unchanged. When the carbon is used for the opening pin 90, the opening pin 90 can be removed in the heating container 31 of the opening device 170. The preferred embodiment of the present invention has been described above with reference to the accompanying drawings. 125579.doc -16 - 200837026, however, the present invention is not limited to this example. Those skilled in the art will be able to devise various modifications and alterations within the scope of the technical idea of the present invention, which is of course within the scope of the present invention. For example, the hole 100 described in the above embodiment may be a circular hole or a square hole having a rectangular parallelepiped shape or a tapered shape of a pointed end. Although the glass substrate 10 described in the present embodiment has a square shape, the shape of the glass substrate 10 may be other shapes such as a circular shape. [Industrial Applicability] The present invention is useful for forming a large number of micropores on a glass substrate with high positional accuracy and dimensional accuracy. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a longitudinal sectional view showing a schematic configuration of a perforating device of the present embodiment. Figure 2 is a perspective view of the pressing member. 3 is a step-by-step view showing a method of opening a glass substrate, (the hook shows a state in which a porous guide plate and an opening pin are provided on a glass substrate, and the opening pin is not inserted into the softened glass substrate; The inside is the same. (The hook shows the state in which the pressing member is retracted and the porous guide plate is removed. Fig. 4 shows the steps of the method of opening the glass substrate of Fig. 3, (the sentence shows that the glass substrate is taken out from the container) In the case of (b), the display shows the removal of the second; (c) shows the underside of the ground glass substrate, and the appearance of the hole is completed. Figure 5 shows the hole in the shape of the hole pin. (a The system displays the appearance of the glass substrate from the container, and (b) shows the appearance of ', gas, and does not remove the opening pin' (c) shows the lower surface of the polished glass substrate, 70 holes. 125579.doc 200837026 Figure 6 shows the steps of forming the hole of the glass substrate from the container when the shape of the opening is changed, (a) the system (b) shows the sample of the completed hole, and the figure 7 shows the change of the hole pin. Longitudinal section of the shape of the shape FIG glass substrate 8 of glass-based display is changed when the shape of the aperture of the pin hole of the shape of the substrate
縱剖面圖。 圖9係顯示改變開孔銷之形狀時 縱剖面圖。 之孔形狀之玻璃基板之 圖10係顯示斜孔之形成步驟，（a)係顯示在玻璃基板上設 置有多孔導引板及開孔銷之樣子’（b)係顯示使開孔銷插入 軟化之玻璃基板内之樣子，（c)係顯示完成孔之樣子。 圖11係顯示其他實施形態之開孔裝置之構成之概略之縱 剖面圖。Longitudinal section. Fig. 9 is a longitudinal sectional view showing the shape of the opening pin. Fig. 10 of the glass substrate of the hole shape shows the step of forming the inclined hole, and (a) shows that the porous guide plate and the opening pin are provided on the glass substrate. (b) shows that the opening pin is inserted and softened. The appearance in the glass substrate, (c) shows the appearance of the completed hole. Fig. 11 is a schematic longitudinal cross-sectional view showing the configuration of a perforating device of another embodiment.
【主要元件符號說明】 1 開孔裝置 10 玻璃基板 20 容器 41 推壓構件 50 多孔導引板 51 孔 90 開孔銷 125579.doc -18 -[Explanation of main component symbols] 1 Opening device 10 Glass substrate 20 Container 41 Pushing member 50 Perforated guide plate 51 Hole 90 Opening pin 125579.doc -18 -