TWI324361B - - Google Patents
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- Publication number
- TWI324361B TWI324361B TW092123978A TW92123978A TWI324361B TW I324361 B TWI324361 B TW I324361B TW 092123978 A TW092123978 A TW 092123978A TW 92123978 A TW92123978 A TW 92123978A TW I324361 B TWI324361 B TW I324361B
- Authority
- TW
- Taiwan
- Prior art keywords
- plasma
- substrate
- processed
- processing method
- electrostatic chuck
- Prior art date
Links
- 238000012545 processing Methods 0.000 claims description 59
- 239000000758 substrate Substances 0.000 claims description 58
- 238000003672 processing method Methods 0.000 claims description 53
- 238000005530 etching Methods 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 30
- 238000009832 plasma treatment Methods 0.000 claims description 28
- 239000004020 conductor Substances 0.000 claims description 8
- 230000005611 electricity Effects 0.000 claims description 8
- 230000003068 static effect Effects 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000002002 slurry Substances 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 89
- 239000007789 gas Substances 0.000 description 34
- 239000002245 particle Substances 0.000 description 17
- 230000008569 process Effects 0.000 description 10
- 230000007246 mechanism Effects 0.000 description 7
- 230000002159 abnormal effect Effects 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 239000010949 copper Substances 0.000 description 3
- 230000008030 elimination Effects 0.000 description 3
- 238000003379 elimination reaction Methods 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- RWRIWBAIICGTTQ-UHFFFAOYSA-N difluoromethane Chemical compound FCF RWRIWBAIICGTTQ-UHFFFAOYSA-N 0.000 description 1
- 238000005108 dry cleaning Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium oxide Inorganic materials O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- PVADDRMAFCOOPC-UHFFFAOYSA-N oxogermanium Chemical compound [Ge]=O PVADDRMAFCOOPC-UHFFFAOYSA-N 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/004—Charge control of objects or beams
- H01J2237/0041—Neutralising arrangements
- H01J2237/0044—Neutralising arrangements of objects being observed or treated
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002256096A JP4322484B2 (ja) | 2002-08-30 | 2002-08-30 | プラズマ処理方法及びプラズマ処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200410332A TW200410332A (en) | 2004-06-16 |
TWI324361B true TWI324361B (ja) | 2010-05-01 |
Family
ID=31972935
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092123978A TW200410332A (en) | 2002-08-30 | 2003-08-29 | Method and device for plasma treatment |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP4322484B2 (ja) |
KR (1) | KR100782621B1 (ja) |
CN (1) | CN100414672C (ja) |
AU (1) | AU2003261790A1 (ja) |
TW (1) | TW200410332A (ja) |
WO (1) | WO2004021427A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI506668B (zh) * | 2010-09-16 | 2015-11-01 | Tokyo Electron Ltd | Plasma processing device and plasma processing method |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7205250B2 (en) * | 2003-03-18 | 2007-04-17 | Matsushita Electric Industrial Co., Ltd. | Plasma processing method and apparatus |
US7316785B2 (en) * | 2004-06-30 | 2008-01-08 | Lam Research Corporation | Methods and apparatus for the optimization of etch resistance in a plasma processing system |
JP4704087B2 (ja) * | 2005-03-31 | 2011-06-15 | 東京エレクトロン株式会社 | プラズマ処理装置およびプラズマ処理方法 |
CN100416758C (zh) * | 2005-12-09 | 2008-09-03 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种在晶片刻蚀设备中彻底释放静电卡盘静电的方法 |
CN101740340B (zh) * | 2008-11-25 | 2011-12-21 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 反应腔室及半导体加工设备 |
JP2010199310A (ja) * | 2009-02-25 | 2010-09-09 | Sharp Corp | プラズマエッチング方法 |
US20120154974A1 (en) * | 2010-12-16 | 2012-06-21 | Applied Materials, Inc. | High efficiency electrostatic chuck assembly for semiconductor wafer processing |
WO2014049915A1 (ja) * | 2012-09-26 | 2014-04-03 | シャープ株式会社 | 基板処理装置および基板処理方法、半導体装置の製造方法 |
WO2015129719A1 (ja) * | 2014-02-28 | 2015-09-03 | 株式会社 アルバック | プラズマエッチング方法、プラズマエッチング装置、プラズマ処理方法、およびプラズマ処理装置 |
JP6558901B2 (ja) | 2015-01-06 | 2019-08-14 | 東京エレクトロン株式会社 | プラズマ処理方法 |
JP6595334B2 (ja) * | 2015-12-28 | 2019-10-23 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置及びプラズマ処理方法 |
TWI697940B (zh) * | 2016-02-26 | 2020-07-01 | 美商得昇科技股份有限公司 | 使用icp剝離劑的分層植入型光阻剝離製程 |
US10535505B2 (en) * | 2016-11-11 | 2020-01-14 | Lam Research Corporation | Plasma light up suppression |
US20190119815A1 (en) * | 2017-10-24 | 2019-04-25 | Applied Materials, Inc. | Systems and processes for plasma filtering |
US20230173557A1 (en) * | 2020-03-17 | 2023-06-08 | Tokyo Electron Limited | Cleaning method and method of manufacturing semiconductor device |
CN113154610A (zh) * | 2021-05-31 | 2021-07-23 | 北京十三和科技发展有限公司 | 一种具有温度调节功能的空气净化器 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06318552A (ja) * | 1993-05-10 | 1994-11-15 | Nissin Electric Co Ltd | プラズマ処理方法及び装置 |
JPH1027780A (ja) * | 1996-07-10 | 1998-01-27 | Nec Corp | プラズマ処理方法 |
JP3907256B2 (ja) * | 1997-01-10 | 2007-04-18 | 芝浦メカトロニクス株式会社 | 真空処理装置の静電チャック装置 |
TW484187B (en) * | 2000-02-14 | 2002-04-21 | Tokyo Electron Ltd | Apparatus and method for plasma treatment |
-
2002
- 2002-08-30 JP JP2002256096A patent/JP4322484B2/ja not_active Expired - Fee Related
-
2003
- 2003-08-28 WO PCT/JP2003/010937 patent/WO2004021427A1/ja active Application Filing
- 2003-08-28 CN CNB038206455A patent/CN100414672C/zh not_active Expired - Lifetime
- 2003-08-28 AU AU2003261790A patent/AU2003261790A1/en not_active Abandoned
- 2003-08-28 KR KR1020057003051A patent/KR100782621B1/ko active IP Right Grant
- 2003-08-29 TW TW092123978A patent/TW200410332A/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI506668B (zh) * | 2010-09-16 | 2015-11-01 | Tokyo Electron Ltd | Plasma processing device and plasma processing method |
Also Published As
Publication number | Publication date |
---|---|
CN1679148A (zh) | 2005-10-05 |
KR100782621B1 (ko) | 2007-12-06 |
KR20050058464A (ko) | 2005-06-16 |
JP4322484B2 (ja) | 2009-09-02 |
WO2004021427A1 (ja) | 2004-03-11 |
CN100414672C (zh) | 2008-08-27 |
JP2004095909A (ja) | 2004-03-25 |
AU2003261790A1 (en) | 2004-03-19 |
TW200410332A (en) | 2004-06-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |