TWI323403B - - Google Patents
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- Publication number
- TWI323403B TWI323403B TW96105657A TW96105657A TWI323403B TW I323403 B TWI323403 B TW I323403B TW 96105657 A TW96105657 A TW 96105657A TW 96105657 A TW96105657 A TW 96105657A TW I323403 B TWI323403 B TW I323403B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- dissipating
- tube
- heat dissipation
- modules
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 claims description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 24
- 238000001816 cooling Methods 0.000 claims description 20
- 239000012530 fluid Substances 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000010410 dusting Methods 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 claims 1
- 239000013529 heat transfer fluid Substances 0.000 description 10
- 238000012545 processing Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96105657A TW200834293A (en) | 2007-02-15 | 2007-02-15 | Heat-dissipating case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96105657A TW200834293A (en) | 2007-02-15 | 2007-02-15 | Heat-dissipating case |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200834293A TW200834293A (en) | 2008-08-16 |
| TWI323403B true TWI323403B (enExample) | 2010-04-11 |
Family
ID=44819422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96105657A TW200834293A (en) | 2007-02-15 | 2007-02-15 | Heat-dissipating case |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200834293A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2672361A2 (en) | 2012-06-08 | 2013-12-11 | Lerng-Horng Chang | Combinational chassis featuring heat dissipation |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112776003B (zh) * | 2019-11-07 | 2022-05-06 | 台达电子工业股份有限公司 | 散热装置及其适用的机器人 |
| TWI854029B (zh) * | 2020-09-16 | 2024-09-01 | 訊凱國際股份有限公司 | 擴充卡組件及水冷散熱裝置 |
-
2007
- 2007-02-15 TW TW96105657A patent/TW200834293A/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2672361A2 (en) | 2012-06-08 | 2013-12-11 | Lerng-Horng Chang | Combinational chassis featuring heat dissipation |
| US8842437B2 (en) | 2012-06-08 | 2014-09-23 | Lerng-Horng CHANG | Combinational chassis featuring heat dissipation |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200834293A (en) | 2008-08-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |