TW200834293A - Heat-dissipating case - Google Patents
Heat-dissipating caseInfo
- Publication number
- TW200834293A TW200834293A TW96105657A TW96105657A TW200834293A TW 200834293 A TW200834293 A TW 200834293A TW 96105657 A TW96105657 A TW 96105657A TW 96105657 A TW96105657 A TW 96105657A TW 200834293 A TW200834293 A TW 200834293A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- water tanks
- cooling device
- conducting fluid
- present
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention discloses a heat-dissipating case. The present invention comprises at least two surroundingly-formed heat dissipation modules. Each heat dissipation module has two water tanks, a plurality of circulation pipes bent and connected to the water tanks, and a plurality of fins are disposed, in parallel and at intervals, to the circulation pipes. The water tanks and the circulation pipes are filled with heat-conducting fluid. The present invention further comprises a pressurization device capable of pressurizing to the heat-conducting fluid, and a cooling device. The cooling device and the water tanks are connected to each other. A hollow room is formed inside the cooling device, and is connected to the water tanks. Further, the cooling device has a cooling surface made of heat-conductive metal. By means of the circulation of the heat-conducting fluid, the cooling surface can be attached to the surface of an electronic component, so as to rapidly absorb heat generated by the electronic component, and to transfer the heat to the fins, thereby performing a high-efficient heat dissipation process.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW96105657A TW200834293A (en) | 2007-02-15 | 2007-02-15 | Heat-dissipating case |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW96105657A TW200834293A (en) | 2007-02-15 | 2007-02-15 | Heat-dissipating case |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200834293A true TW200834293A (en) | 2008-08-16 |
TWI323403B TWI323403B (en) | 2010-04-11 |
Family
ID=44819422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW96105657A TW200834293A (en) | 2007-02-15 | 2007-02-15 | Heat-dissipating case |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200834293A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112776003A (en) * | 2019-11-07 | 2021-05-11 | 台达电子工业股份有限公司 | Heat abstractor and robot that is suitable for thereof |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM441311U (en) | 2012-06-08 | 2012-11-11 | Leng-Hong Zhang | Casing formed with heat sink combination |
-
2007
- 2007-02-15 TW TW96105657A patent/TW200834293A/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112776003A (en) * | 2019-11-07 | 2021-05-11 | 台达电子工业股份有限公司 | Heat abstractor and robot that is suitable for thereof |
US11504863B2 (en) | 2019-11-07 | 2022-11-22 | Delta Electronics, Inc. | Heat dissipation device and robot using same |
Also Published As
Publication number | Publication date |
---|---|
TWI323403B (en) | 2010-04-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |