TW200834293A - Heat-dissipating case - Google Patents

Heat-dissipating case

Info

Publication number
TW200834293A
TW200834293A TW96105657A TW96105657A TW200834293A TW 200834293 A TW200834293 A TW 200834293A TW 96105657 A TW96105657 A TW 96105657A TW 96105657 A TW96105657 A TW 96105657A TW 200834293 A TW200834293 A TW 200834293A
Authority
TW
Taiwan
Prior art keywords
heat
water tanks
cooling device
conducting fluid
present
Prior art date
Application number
TW96105657A
Other languages
Chinese (zh)
Other versions
TWI323403B (en
Inventor
zhi-xing Li
Original Assignee
Lea Min Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lea Min Technologies Co Ltd filed Critical Lea Min Technologies Co Ltd
Priority to TW96105657A priority Critical patent/TW200834293A/en
Publication of TW200834293A publication Critical patent/TW200834293A/en
Application granted granted Critical
Publication of TWI323403B publication Critical patent/TWI323403B/zh

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention discloses a heat-dissipating case. The present invention comprises at least two surroundingly-formed heat dissipation modules. Each heat dissipation module has two water tanks, a plurality of circulation pipes bent and connected to the water tanks, and a plurality of fins are disposed, in parallel and at intervals, to the circulation pipes. The water tanks and the circulation pipes are filled with heat-conducting fluid. The present invention further comprises a pressurization device capable of pressurizing to the heat-conducting fluid, and a cooling device. The cooling device and the water tanks are connected to each other. A hollow room is formed inside the cooling device, and is connected to the water tanks. Further, the cooling device has a cooling surface made of heat-conductive metal. By means of the circulation of the heat-conducting fluid, the cooling surface can be attached to the surface of an electronic component, so as to rapidly absorb heat generated by the electronic component, and to transfer the heat to the fins, thereby performing a high-efficient heat dissipation process.
TW96105657A 2007-02-15 2007-02-15 Heat-dissipating case TW200834293A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96105657A TW200834293A (en) 2007-02-15 2007-02-15 Heat-dissipating case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96105657A TW200834293A (en) 2007-02-15 2007-02-15 Heat-dissipating case

Publications (2)

Publication Number Publication Date
TW200834293A true TW200834293A (en) 2008-08-16
TWI323403B TWI323403B (en) 2010-04-11

Family

ID=44819422

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96105657A TW200834293A (en) 2007-02-15 2007-02-15 Heat-dissipating case

Country Status (1)

Country Link
TW (1) TW200834293A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112776003A (en) * 2019-11-07 2021-05-11 台达电子工业股份有限公司 Heat abstractor and robot that is suitable for thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM441311U (en) 2012-06-08 2012-11-11 Leng-Hong Zhang Casing formed with heat sink combination

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112776003A (en) * 2019-11-07 2021-05-11 台达电子工业股份有限公司 Heat abstractor and robot that is suitable for thereof
US11504863B2 (en) 2019-11-07 2022-11-22 Delta Electronics, Inc. Heat dissipation device and robot using same

Also Published As

Publication number Publication date
TWI323403B (en) 2010-04-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees