1323144 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種導電載板’尤關於一種高導熱導電 載板。 【先前技術】 一般電子元件使用PCB載板來組裝並於其上規劃線路 與電子元件之間的電連接關係。但由於pCB載板本身之導 • 熱性不良，導致使用產熱量較高的電子元件，或是使用於 諸如筆記型電腦内部等不易散熱的環境時，電子元件所產 的熱:g未能被適當的加以散熱，進而引起故障或當機等運 作上的嚴重問題，甚至會導致電子元件本身或週邊設備的 損壞。 前述產熱量較高的電子元件之中，尤以高能（High power)發光二極體（Light — emitting Di〇de，LED)為甚。 隨著近年發光二極體相關科技的發展，發光二極體不 •但在發光顏色方面發展出紅光、黃光、綠光、藍光甚至白 光之發光—極體供業者或使用者搭配使用，更在光強度方 面有長足進步，頗有取代傳統燈泡'日光燈或其他發光器 材的趨勢。 為得到所需的照明效果，常將數個相互搭配的發光二 極體設置於-PCB載板上’使其在發光時能合作發揮更強 的光照效果或調配出所需的發光顏色。 ^ ⑴述相互搭配的發光二極體所產生的熱量不但 未能得到適當 率大為提高， 的散熱，反而互相影響而使故障或損壞的機 疋一有待改善之問題。 【發明内容】 、=#於月.ji4既有技術上待改善的缺·點本發明之目的 :提供同導熱導電載板以在供電子元件設置的同時， 可發揮良好的散熱效果以排除電子元件產出的熱量，以 降低故障或損壞的機率，提高產品的良率。 為達到上述目的，本發明所採取的技術手段係令該高 導熱導電載板包括有： 鋁板，其上形成有複數埋孔，以供電子元件插設； 邑緣物質，覆蓋於該鋁板表面及其埋孔的内周壁 藉、·邑緣物質可達到絕緣的效果，其中該絕缘物質可採 用陽極處理的方式達成覆蓋鋁板表面與埋孔内周壁之目 的； 一導電物質，係塞合於前述埋孔之中，使埋孔構成一 導通接點；該導電物質可採用如鋼膏或銅條等金屬材料， 作為來達成導電的效果； 一線路層，其係形成於前述鋁板表面的絕緣物質上 層，並連結既定之導通接點，其表面並經蝕刻而形成凹凸 不平的粗糙形狀； 一石墨層，其係形成於該線路層的表面上，發揮保護 月1J述線路層的功用。 使用本實施例之高導熱導電載板時，係將電子元件以 丄 表面黏著技術（surface m〇unt technology，SMT)之方式 依規劃設置於適當的導通接點上，並藉由前述線路層在該 等電子元件之間建立電連接關係。 前述電子元件在運作中所散發的熱量則經由該鋁板的 表面積散逸。由於鋁板本身即具有高導熱性，且該鋁板的 表面積相對於個別電子元件而言極為廣大，因此可以非常 有效率的散熱而排除熱量，確可達成本發明提供一高導熱 導電載板以在供電子元件設置的同時進行有效散熱，降低 鲁故障或損壞的機率，並提高良率的目的。 【實施方式】 請參閱第一圖，揭露有本發明第一實施例高導熱導電 載板之銘板鑽孔之側視剖面圖β 本發明第一實施例高導熱導電載板係使用一铭板（1 ◦)來進行製作，首先於該鋁板（10)上預先設定電子 元件（圖中未示）設置的位置，並規劃其間的電連接關係 修與所需之線路佈局。接著在欲設置電子元件處鑽孔以形成 對應於電子元件表面黏著腳位之埋孔（1 i 。 請配合參閱第二圖，揭露有本發明第一實施例高導熱 導電載板進行陽極處理之側視剖面圖。 將該鋁板（1 〇 )進行陽極處理，使其表面及其埋孔 (1 1)的内周壁上皆彼覆有一層絕緣物質（2〇)而達 到絕緣的效果。 請配合參閱第三圖，揭露有本發明第—實施例高導熱 6 1323144 導電載板之埋孔灌入銅膏之側視剖面圖。 其次，在前述埋孔（1 1 )中灌入銅f* ( 3 〇 )或銅 條（圖中未示）以構成導通接點；在本實施例中，係採用 銅膏（30) ’使之塞合於埋孔（11)之中作為導電物 質，並將突出埋孔（i i )的銅膏（3 〇 )修整使之不 復突出而保持平整外觀》 請配合參閱第四圖，揭露有本發明第一實施例高導熱 導電載板上形成線路之側視剖面圖。 依照前述線路佈局，以可蝕刻金屬粉加上環氧樹脂 (EP〇Xy)混合成液態之後，印刷於前述紹板（丄〇 )上以 形成-線路層（4 0 )’以便在預定的導通孔之間建立電 連接關係。 請配合參閱第五圖’揭露有本發明第一實―施例高導熱 導電載板經蝕刻後電鍍石墨之側視剖面圖。 在如前述於既定導通接點間以線路層（4〇)構成電 連接後，再對該線路層（40)進行钱刻，使該線路層（4 〇)表面形成凹凸不平的粗韃形狀。在本實施例中實施該 钱刻處理時’係對本實施例之高導料线板全體進行餘 刻處理，利用線路層（4Q)比㈣過陽極處理的高導孰 導電載板更容易受到姓刻的特性，使該線路層（40)受 钱刻而讓其表面形成所需的態樣。 接著，以電鍍+ υ)的方式在該線路層（40)的 表面上形成一石墨層 全贗、b〇)，刖述線路層（40)表面 之粗輪形狀有助錢石墨層（50)結合於線路層（4〇) 7 1323144 的表面，以讓該石墨層（5 Ο )發揮保護該線路層（4 〇 ) 的功用》 在使用本實施例之高導熱導電載板時，係將電子元件 依表面黏著技術之方式依規劃設置於預定之導通接點上， 並透過線路層（4 〇 )構成電連接。 同時，該等電子元件在運作中所散發的熱量則經由高 導熱性的銘板（1 0 )排散’並藉著該銘i 〇 )的表 積放逸。由於該銘板（1 〇) #表面積相對於個別電子 元件而言極為廣大’因此可以非常有效率的散熱而排除電 子元件所產出的熱量。1323144 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a conductive carrier plate </ RTI> particularly to a highly thermally conductive conductive carrier. [Prior Art] A general electronic component is assembled using a PCB carrier board and an electrical connection relationship between a line and an electronic component is planned thereon. However, due to the poor thermal conductivity of the pCB carrier board, the use of electronic components with high heat generation, or the use of an environment such as a notebook computer that does not easily dissipate heat, the heat generated by the electronic components is not properly The heat is dissipated, causing serious problems such as malfunction or malfunction, and even damage to the electronic components themselves or peripheral devices. Among the above-mentioned electronic components having high heat generation, a high-power LED (Light-emitting Diode) (LED) is particularly preferred. With the development of related technologies in light-emitting diodes in recent years, the light-emitting diodes do not, but develop red, yellow, green, blue and even white light in the color of the light--for use by polar operators or users, There has been a lot of progress in terms of light intensity, and there is a tendency to replace the traditional bulb 'fluorescent lamp or other illuminating equipment. In order to obtain the desired illumination effect, a plurality of mutually matching light-emitting diodes are often disposed on the -PCB carrier board to enable a stronger illumination effect or a desired illumination color when illuminating. ^ (1) The heat generated by the light-emitting diodes that are matched with each other not only fails to obtain a high rate of heat dissipation, but also affects each other and causes problems in the fault or damage. SUMMARY OF THE INVENTION, =#于月.ji4 has technically improved defects. The purpose of the present invention is to provide a heat-conducting conductive carrier to provide a good heat-dissipating effect while excluding electrons while providing electronic components. The heat generated by the component to reduce the chance of failure or damage and improve the yield of the product. In order to achieve the above object, the technical means adopted by the present invention is such that the high thermal conductive conductive carrier comprises: an aluminum plate having a plurality of buried holes formed therein for inserting electronic components; and a rim material covering the surface of the aluminum plate and The inner peripheral wall of the buried hole can achieve the effect of insulation by using the material of the rim, wherein the insulating material can be anodized to achieve the purpose of covering the surface of the aluminum plate and the inner peripheral wall of the buried hole; a conductive material is plugged in the above buried In the hole, the buried hole constitutes a conduction contact; the conductive material may use a metal material such as steel paste or copper strip as a conductive effect; a circuit layer formed on the upper surface of the insulating material on the surface of the aluminum plate And connecting a predetermined conduction contact, the surface of which is etched to form a rough and uneven shape; a graphite layer formed on the surface of the circuit layer to serve the function of protecting the circuit layer of the month. When the high thermal conductive conductive carrier of the embodiment is used, the electronic component is disposed on the appropriate conductive contact in a manner of surface m〇unt technology (SMT), and the circuit layer is An electrical connection relationship is established between the electronic components. The heat radiated by the aforementioned electronic components during operation is dissipated via the surface area of the aluminum plate. Since the aluminum plate itself has high thermal conductivity, and the surface area of the aluminum plate is extremely large with respect to individual electronic components, heat can be dissipated very efficiently and heat can be removed, and it is possible to provide a high thermal conductive conductive carrier for the invention. The electronic components are set to effectively dissipate heat at the same time, reducing the probability of failure or damage, and improving the yield. [Embodiment] Referring to the first drawing, a side cross-sectional view of a drilled hole of a nameplate having a highly thermally conductive conductive carrier according to a first embodiment of the present invention is disclosed. The first embodiment of the present invention uses a nameplate for the high thermal conductivity conductive carrier. 1 ◦) To make the production, first set the position of the electronic component (not shown) on the aluminum plate (10), and plan the electrical connection relationship between them to repair the required circuit layout. Then, a hole is drilled at the electronic component to be formed to form a buried hole corresponding to the surface of the electronic component (1 i. Referring to the second figure, the high thermal conductive conductive carrier of the first embodiment of the present invention is disclosed for anodizing. Side view of the aluminum plate (1 〇) is anodized so that the surface and the inner peripheral wall of the buried hole (1 1) are covered with a layer of insulating material (2〇) to achieve the insulation effect. Referring to the third figure, a side cross-sectional view of a buried hole copper paste having a high thermal conductivity 6 1323144 conductive carrier plate according to the first embodiment of the present invention is disclosed. Next, a copper f* is poured into the buried hole (1 1 ). 3 〇) or copper strip (not shown) to constitute a conductive contact; in this embodiment, a copper paste (30) is used to plug it into the buried hole (11) as a conductive material, and The copper paste (3 〇) protruding from the buried hole (ii) is trimmed so as not to protrude and maintain a flat appearance. Please refer to the fourth figure to disclose the side view of the line formed on the high thermal conductive conductive carrier of the first embodiment of the present invention. Sectional view. According to the above line layout, etchable metal powder plus After the oxygen resin (EP〇Xy) is mixed into a liquid state, it is printed on the aforementioned substrate to form a wiring layer (40) to establish an electrical connection relationship between predetermined via holes. Figure 2 is a side cross-sectional view showing the electroplated graphite after etching of the highly thermally conductive conductive carrier of the first embodiment of the present invention. After the electrical connection is formed by the wiring layer (4〇) between the predetermined conduction contacts as described above, The circuit layer (40) is engraved so that the surface of the circuit layer (4 〇) is formed into a rugged and rough shape. In the embodiment, when the money processing is performed, the high-conductivity wire plate of the embodiment is used. The entire process is carried out, and the high conductivity conductive carrier plate which is processed by the circuit layer (4Q) than the (4) anode is more susceptible to the characteristics of the surname, so that the circuit layer (40) is engraved and the surface is formed. Next, a graphite layer is formed on the surface of the circuit layer (40) by electroplating + υ), and the shape of the thick wheel on the surface of the circuit layer (40) is helpful for the graphite layer. (50) Bonding to the surface of the wiring layer (4〇) 7 1323144 to allow the graphite layer (5 Ο) to protect the function of the circuit layer (4 〇). When using the high thermal conductivity conductive carrier of the embodiment, the electronic component is arranged on the predetermined conduction contact according to the surface adhesion technology. The electrical connection is made through the circuit layer (4 〇). At the same time, the heat dissipated in the operation of these electronic components is dissipated through the high thermal conductivity nameplate (10) and is released by the surface of the inscription. Since the nameplate (1 〇) # surface area is extremely large with respect to individual electronic components, it is possible to dissipate heat generated by the electronic components with very efficient heat dissipation.
考慮本發明之高導熱導電載板有效散熱之特性，可知 其f用於諸如大尺寸液晶電視（TFT_LCDTV)的背光模組， 或是應用於諸如密集排列之發光二極體照明設借，又或是 應用於諸如筆記型電腦内部等不易散熱的環境時，可以發 2效散熱的效果’而快速散發熱量，或配合後續的熱力 千叹什’使熱量可以有效的受到導引而散出，離開不易散 由上述可知，本發明確可提供一高導熱導電載板以在 雪電子π件設置的同時’另可發揮良好的散熱效果以排除 子π件產出的熱量，以降低故障或損壞的機率，提高產 【圖式簡單說明】 第一圖：係本發明第一實施例高導熱導電載板之銘板 8 U23144 • 鑽孔之側視剖面圖。 . 第二圖：係本發明第一實施例高導熱導電載板進行陽 極處理之側視剖面圖。 第三圖：係本發明第一實施例高導熱導電載板灌入銅 膏之側視剖面圖。 第四圖：係本發明第一實施例高導熱導電載板上形成 線路之側視剖面圖。 _ __ ^導電載板經· 刻 第五圖：係本發明第一實施例尚導，，，、 _ 後電錄石墨之側視剖面圖。 【主要元件符號說明】 (1 0)鋁板 （1 1 )埋孔 (2 〇 )絕緣物質 （3 0 )銅管 (40)線路層 （50)石墨廣 9Considering the characteristics of the effective heat dissipation of the highly thermally conductive conductive carrier of the present invention, it can be seen that it is used for a backlight module such as a large-size liquid crystal television (TFT_LCDTV), or for applications such as densely arranged light-emitting diode lighting, or It is applied to environments such as notebook computers that are not easy to dissipate heat, and can emit 2 effects of heat dissipation, and quickly dissipate heat, or cooperate with subsequent heats to make the heat effectively guided and dissipated. It is not easy to disperse from the above. The present invention can provide a highly thermally conductive conductive carrier to provide a good heat dissipation effect while removing the heat generated by the sub-π pieces while the snow electrons are disposed to reduce malfunction or damage. Probability, increase production [Simplified description of the drawing] First figure: the nameplate 8 U23144 of the high thermal conductivity conductive carrier of the first embodiment of the present invention. • Side view of the borehole. Fig. 2 is a side cross-sectional view showing the anode treatment of the highly thermally conductive conductive carrier of the first embodiment of the present invention. Fig. 3 is a side cross-sectional view showing the high thermal conductive conductive carrier of the first embodiment of the present invention filled with a copper paste. Figure 4 is a side cross-sectional view showing a line formed on a highly thermally conductive conductive carrier of the first embodiment of the present invention. _ __ ^ Conductive carrier plate engraved. Fig. 5 is a side cross-sectional view of the first embodiment of the present invention, followed by _ post-electric recording graphite. [Description of main component symbols] (1 0) Aluminum plate (1 1 ) Buried hole (2 〇 ) Insulating material (3 0 ) Copper tube (40) Circuit layer (50) Graphite wide 9