JP2016075549A - Electronic component conveyance device and electronic component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component conveyance device and an electronic component inspection device that can prevent temperature difference between a plurality of electronic components.SOLUTION: An electronic component conveyance device comprises a first member and an abutment member having a plurality of second members in contact with an electronic component, and at least one coefficient of thermal conductivity between the first member and the plurality of second members is equal to or greater than 16 (W/(mK)). An electronic component inspection device comprises at least a first member, an abutment member having a plurality of second members in contact with the electronic component, and an inspection part for inspecting the electronic component. At least one coefficient of thermal conductivity between the first member and the plurality of second members is equal to or greater than 16 (W/(mK)).SELECTED DRAWING: Figure 3

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects the electrical characteristics of an electronic component such as an IC device has been known. A transport device is incorporated. When inspecting the IC device, the IC device is disposed in the holding unit, and a plurality of probe pins provided in the holding unit are brought into contact with the terminals of the IC device. Such an IC device inspection may be performed by heating or cooling the IC device to a predetermined temperature. In this case, control is performed to keep the temperature of the electronic component at a set temperature (target temperature). In the inspection of IC devices, it is desired to reduce the inspection cost by inspecting a large number of IC devices at once.

  Patent Document 1 discloses an apparatus having a plurality of abutting portions that abut against an electronic component and press the electronic component against a holding portion when inspecting the electronic component. In this apparatus, a plurality of electronic components can be simultaneously pressed against the holding portion by the plurality of contact portions, and a large number of electronic components can be inspected at a time.

JP 2003-28923 A

  However, in the apparatus described in Patent Document 1, a plurality of contact portions are separated from each other, and a member having low thermal conductivity is interposed between the plurality of contact portions. Are different from each other, a temperature difference is generated between the plurality of electronic components, and it is difficult to inspect the plurality of electronic components under the same conditions.

  The objective of this invention is providing the electronic component conveyance apparatus and electronic component inspection apparatus which can suppress that a temperature difference arises between several electronic components.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application Example 1]
The electronic component transport device of the present invention includes a contact member having a first member and a plurality of second members that contact the electronic component,
At least one thermal conductivity of the first member and the plurality of second members is 16 (W / (m · K)) or more.

  Thereby, by sharing a predetermined member with respect to the plurality of second members, the size can be reduced, and the number of parts can be reduced.

  Moreover, by setting the thermal conductivity as described above, it is possible to suppress the occurrence of a temperature difference between a plurality of electronic components. Specifically, for example, when the heat generation amount of the electronic component with which one of the two second members abuts is different from the heat generation amount of the electronic component with which the other member abuts, the electronic component with the larger heat generation amount It is possible to suppress heat from being transmitted to the electronic component having the smaller amount of heat generated by the contact member and causing a temperature difference between the two electronic components.

[Application Example 2]
In the electronic component transport apparatus according to the present invention, the contact member preferably has a thermal conductivity of 16 (W / (m · K)) or more.
Thereby, it can suppress that a temperature difference arises between several electronic components.

[Application Example 3]
In the electronic component transport device of the present invention, the contact member is disposed at least one of the first member and the plurality of second members, and has a thermal conductivity of 16 (W / (m · K). It is preferable to have the above third member.

  Thereby, it can suppress that the 3rd member inhibits transmission of heat, and it can control that a temperature difference arises between a plurality of electronic parts.

[Application Example 4]
In the electronic component transport device of the present invention, it is preferable that the first member and the plurality of second members are integrally formed.

  Thereby, it can suppress that heat transfer is inhibited between the 1st member and the 2nd member, and it can control that a temperature difference arises between a plurality of electronic parts. In addition, a highly accurate configuration such as dimensional accuracy can be realized.

[Application Example 5]
In the electronic component transport device of the present invention, it is preferable that the first member and the plurality of second members each include at least one of aluminum and copper as constituent materials.

  Thereby, the heat conductivity of a 1st member and a 2nd member can be made high, and it can suppress that a temperature difference arises between several electronic components.

[Application Example 6]
In the electronic component transport device of the present invention, it is preferable that a heat radiating portion is disposed on the contact member.
Thereby, an electronic component can be cooled and the temperature of an electronic component can be adjusted.

[Application Example 7]
In the electronic component conveying apparatus of the present invention, it is preferable that a heating unit is disposed on the contact member.
Thereby, an electronic component can be heated and the temperature of an electronic component can be adjusted.

[Application Example 8]
In the electronic component conveying apparatus of the present invention, it is preferable that the heat capacity (J / K) of the contact member is 250 times or more the heat capacity of the electronic component.

  Thereby, the contact member absorbs the heat generated in the electronic component, the temperature rise of the electronic component can be suppressed, and the occurrence of a temperature difference between the plurality of electronic components can be suppressed.

[Application Example 9]
The electronic component inspection apparatus of the present invention includes a first member and a contact member having a plurality of second members that contact the electronic component,
An inspection unit for inspecting the electronic component,
At least one thermal conductivity of the first member and the plurality of second members is 16 (W / (m · K)) or more.

  Thereby, by sharing a predetermined member with respect to the plurality of second members, the size can be reduced, and the number of parts can be reduced.

  Moreover, by setting the thermal conductivity as described above, it is possible to suppress the occurrence of a temperature difference between a plurality of electronic components. Specifically, for example, when the heat generation amount of the electronic component with which one of the two second members abuts is different from the heat generation amount of the electronic component with which the other member abuts, the electronic component with the larger heat generation amount It is possible to suppress heat from being transmitted to the electronic component having the smaller amount of heat generated by the contact member and causing a temperature difference between the two electronic components.

1 is a schematic view showing a first embodiment of an electronic component inspection apparatus of the present invention. It is a figure which shows the conveyance part and inspection part of the electronic component inspection apparatus shown in FIG. It is a perspective view which shows the hand unit of the conveyance part of the electronic component inspection apparatus shown in FIG. It is a side view which shows the hand unit of the conveyance part of the electronic component inspection apparatus shown in FIG. It is sectional drawing which shows the hand unit of the conveyance part of the electronic component inspection apparatus shown in FIG. It is sectional drawing which shows the hand unit of the conveyance part of the electronic component inspection apparatus shown in FIG. It is a block diagram which shows the principal part of the electronic component inspection apparatus shown in FIG. It is a side view which shows the contact block in the modification of the electronic component inspection apparatus shown in FIG. It is a block diagram which shows the principal part of 2nd Embodiment of the electronic component inspection apparatus of this invention. It is a flowchart which shows the control operation of the electronic component inspection apparatus shown in FIG.

  DESCRIPTION OF EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device of the present invention will be described in detail based on embodiments shown in the accompanying drawings.

<First Embodiment>
FIG. 1 is a schematic view showing a first embodiment of the electronic component inspection apparatus of the present invention. FIG. 2 is a diagram illustrating a conveyance unit and an inspection unit of the electronic component inspection apparatus illustrated in FIG. 1. FIG. 3 is a perspective view showing a hand unit of the transport unit of the electronic component inspection apparatus shown in FIG. FIG. 4 is a side view showing the hand unit of the transport unit of the electronic component inspection apparatus shown in FIG. 5 and 6 are cross-sectional views showing the hand unit of the transport section of the electronic component inspection apparatus shown in FIG. FIG. 7 is a block diagram showing a main part of the electronic component inspection apparatus shown in FIG. FIG. 8 is a side view showing a contact block in a modification of the electronic component inspection apparatus shown in FIG.

  In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. Further, the upstream side in the conveying direction of the electronic component is also simply referred to as “upstream side”, and the downstream side is also simply referred to as “downstream side”. In addition, “horizontal” as used in the specification of the present application is not limited to complete horizontal, and includes a state where the electronic component is slightly inclined (for example, less than about 5 °) as long as transportation of electronic components is not hindered.

  3 to 6, the upper side is “upper”, “upper” or “base”, the lower side is “lower”, “lower” or “tip”, the right side is “right”, and the left side is “left”. Say. 3 to 6 illustrate one of a plurality of hand units of the transport unit.

  An inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 includes, for example, an IC device such as a BGA (Ball Grid Array) package and an LGA (Land Grid Array) package, an LCD (Liquid Crystal Display), and an OLED (Organic Electroluminescence Display). , Including display devices such as electronic paper, CIS (CMOS Image Sensor), CCD (Charge Coupled Device), accelerometer, gyro sensor, pressure sensor, etc. This is a device for inspecting and testing electrical characteristics of electronic components (hereinafter simply referred to as “inspection”). In the following, for convenience of explanation, a case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 9”.

  As shown in FIG. 1, the inspection apparatus 1 includes a supply unit 2, a supply side arrangement unit 3, a transport unit 4, an inspection unit 5, a collection side arrangement unit 6, a collection unit 7, and control of these units. And a control unit 8 for performing The inspection apparatus 1 includes a supply unit 2, a supply side arrangement unit 3, a conveyance unit 4, an inspection unit 5, a base 11 on which a collection side arrangement unit 6 and a collection unit 7 are arranged, a supply side arrangement unit 3, and a conveyance unit 4. And a cover 12 that covers the base 11 so as to accommodate the inspection unit 5 and the collection side arrangement unit 6. The base surface 111 which is the upper surface of the base 11 is substantially horizontal, and the constituent members of the supply side array unit 3, the transport unit 4, the inspection unit 5, and the collection side array unit 6 are arranged on the base surface 111. ing. In addition, the inspection apparatus 1 may have a heater, a chamber, or the like for heating the IC device 9 as necessary.

  In such an inspection apparatus 1, the supply unit 2 supplies the IC device 9 to the supply side arrangement unit 3, the supplied IC device 9 is arranged in the supply side arrangement unit 3, and the arranged IC device 9 is transferred to the conveyance unit 4. Is transported to the inspection unit 5, the inspection unit 5 inspects the IC device 9 that has been transported, and the transport unit 4 transports / arranges the IC device 9 that has been inspected to the collection side array unit 6. The collection unit 7 collects the arranged IC devices 9. According to such an inspection apparatus 1, supply, inspection, and collection of the IC device 9 can be automatically performed. The inspection apparatus 1 is transported by a configuration excluding the inspection unit 5, that is, by a part of the supply unit 2, the supply side arrangement unit 3, the conveyance unit 4, the collection side arrangement unit 6, the collection unit 7, and the control unit 8. An apparatus (electronic component conveying apparatus) 10 is configured. The transport device 10 transports the IC device 9 and the like.

Hereinafter, configurations of the transport unit 4 and the inspection unit will be described.
≪Transport section≫
As shown in FIG. 2, the transport unit 4 transports the IC device 9 disposed on the mounting stage 341 of the supply side array unit 3 to the inspection unit 5 and finishes the inspection in the inspection unit 5. 9 is a unit that transports 9 to the collection side arrangement unit 6. Such a transport unit 4 includes a shuttle 41, a supply robot 42, an inspection robot 43, and a collection robot 44.

-Shuttle-
The shuttle 41 transports the IC device 9 on the mounting stage 341 to the vicinity of the inspection unit 5, and further transports the inspected IC device 9 inspected by the inspection unit 5 to the vicinity of the collection side array unit 6. It is a shuttle to do. In such a shuttle 41, four pockets 411 for accommodating the IC device 9 are formed side by side in the X direction. The shuttle 41 is guided by a linear motion guide and can be reciprocated in the X direction by a drive source such as a linear motor.

-Supply robot-
The supply robot 42 is a robot that conveys the IC device 9 disposed on the placement stage 341 to the shuttle 41. Such a supply robot 42 is supported by the base 11, a support frame 421 supported by the support frame 421, a movable frame 422 that can reciprocate in the Y direction with respect to the support frame 421, and a movable frame 422. And four hand units (gripping robots) 423. Each hand unit 423 includes an elevating mechanism and a suction nozzle, and can grip the IC device 9 by suction.

-Inspection robot-
The inspection robot 43 is a robot that transports the IC device 9 accommodated in the shuttle 41 to the inspection unit 5 and also transports the IC device 9 that has been inspected from the inspection unit 5 to the shuttle 41. Further, the inspection robot 43 can also press the IC device 9 against the inspection unit 5 and apply a predetermined inspection pressure to the IC device 9 during the inspection. Such an inspection robot 43 is supported by the support frame 431 supported by the base 11, the movable frame 432 supported by the support frame 431 and reciprocally movable in the Y direction with respect to the support frame 431, and the movable frame 432. Two hand units (gripping robots) 433. The arrangement of each hand unit 433 is not particularly limited, and in the arrangement shown, the hand units 433 are arranged in the X direction.

  Each hand unit 433 includes an elevating mechanism, a contact block 260 (see FIG. 3) described later, and the like, and can grip (suction grip) the IC device 9 by suction. Since each hand unit 433 is the same, one of them will be described below.

  The hand unit 433 is detachably fixed to the moving frame 432 by, for example, screwing or the like.

  As shown in FIGS. 3 to 6, the hand unit 433 includes an air cylinder 210 fixed to the moving frame 432, and a device chuck 220 connected to the tip of the air cylinder 210.

  The air cylinder 210 has a cylinder tube 211 fixed to the moving frame 432. The cylinder tube 211 includes a cylindrical tube main body 212 and a base end portion of the tube main body 212, and has a cylindrical back plate 213. The cylinder tube 211 is formed in a cylinder chamber formed by the tube main body 212 and the back plate 213. A piston 214 is arranged to be movable in the Z direction. The distal end portion 2141 of the piston 214 protrudes further toward the distal end side than the tube main body 212, and the outer peripheral portion of the base end portion 2142 is connected to the base end portion of the tube main body 212 by a thin-walled portion 2121 that can be elastically deformed over the entire circumference. Has been. Further, the base end portion of the cylinder chamber is divided into a first chamber D1 located on the upper side and a second chamber D2 located on the lower side by the base end portion 2142 and the thin portion 2121 of the piston 214.

  The piston 214 is biased upward via the other member by a coil spring (not shown) provided on the other member. That is, the piston 214 is lifted by the coil spring, and in a state where the air cylinder 210 is not operated, the position where the base end portion 2142 (surface on the first chamber D1 side) of the piston 214 abuts the back plate 213 (hereinafter, referred to as the piston 214). This is called the uppermost position).

  In addition, an air introduction port 215 that penetrates the back plate 213 and communicates with the first chamber D1 is formed at the center of the back plate 213. The air inlet 215 communicates with a connection port (not shown). The connection port is connected to an electropneumatic regulator (not shown). When air is supplied from the electropneumatic regulator to the first chamber D1, the piston 214 is elastically moved from the uppermost end position to the elasticity of the coil spring. It moves downward against the force (see FIG. 6). By setting the pressure in the first chamber D1 to a predetermined pressure, the IC device 9 arranged in the holding unit 51 can be pressed with a suitable pressure. Therefore, the conduction between the IC device 9 and the holding unit 51 can be reliably achieved, and the breakage of the IC device 9 can be suppressed. The driving of the electropneumatic regulator is controlled by the control unit 8.

  The device chuck 220 disposed on the lower side of the air cylinder 210 as described above includes a first connection block 231 fixed to the lower surface (front end surface) of the front end portion 2141 of the piston 214, and a lower surface of the first connection block 231. The fixed second connection block 232, four support columns 233 fixed to the lower surface of the second connection block 232 and having excellent heat insulation properties, the heater block 240 fixed to the lower surface of each support column 233, and the heater block A contact block (contact member) 260 detachably fixed to the lower surface of 240, a heat sink (heat radiating portion) disposed between the second connection block 232 and the heater block 240 and fixed to the upper surface of the heater block 240. 291. The heat sink 291 is provided with an injection nozzle (fluid injection unit) 292 that injects air (fluid) G as a cooling gas. The spray nozzle 292 and the heat sink 291 constitute a cooling unit 290 that cools the IC device 9. In addition to the contact block 260, any member can be configured to be detachable.

  The heater block 240 is formed with a through hole that opens to the lower surface and the left side surface. The through hole functions as a vacuum guide path 2401. A connection port P2 is attached to one end of the vacuum guide path 2401. Further, the connection port P2 is connected to a pump for sucking air and a pump for ejecting air (both not shown). Similarly, the heater block 240 is formed with a through hole that opens to the lower surface and the right side surface thereof, and this through hole functions as a vacuum guide path 2402. A connection port P3 is attached to one end of the vacuum guide path 2402. Further, the connection port P3 is connected to a pump that sucks air and a pump that ejects air (both not shown). The driving of each pump is controlled by the control unit 8.

  The contact block 260 includes a plate-like base portion (first member) 263, a first contact portion (second member) 261 that is provided on the lower surface of the base portion 263, and contacts (contacts) the IC device 9. It has the 2nd contact part (2nd member) 262 which contacts the IC device 9 (contact | abut). The first contact portion 261 and the second contact portion 262 each have a cylindrical shape and protrude downward from the lower surface of the base portion 263.

In the present embodiment, the contact block 260, that is, the base portion 263, the first contact portion 261, and the second contact portion 262 are integrally formed. Thereby, between the base 263 and the 1st contact part 261, between the base 263 and the 2nd contact part 262, it can control that transmission of heat is inhibited, respectively. Generation of a temperature difference between the two IC devices 9 can be suppressed. In addition, the contact block 260 can be configured with high accuracy such as dimensional accuracy. The method of integrally forming the contact block 260 is not particularly limited, and examples thereof include a method of forming the contact block 260 by cutting out from an ingot (base material), casting, and the like.
The contact block 260 is not limited to this, and for example, the base portion 263 and the first contact portion 261 may be formed as separate members, and the base portion 263 and the second contact portion 262 are formed as separate members. It may be formed. Further, as shown in FIG. 8, an intermediate member (third member) 271 may be interposed between the base 263 and the first contact portion 261, and similarly, the base 263 and the second contact portion 262. An intermediate member (third member) 272 may be interposed therebetween. Further, one of the intermediate member 271 and the intermediate member 272 may be omitted.

  In addition, the positions of the first contact portion 261 and the second contact portion 262 are not particularly limited and are appropriately set according to various conditions. In the present embodiment, the first contact portion 261 and the second contact portion 262 The two contact portions 262 are arranged point-symmetrically with respect to the center of the base portion 263.

  Further, the distance between the lower surface of the base portion 263 and the lower surface of the first contact portion 261 (the surface on which the IC device 9 abuts) and the distance between the lower surface of the base portion 263 and the lower surface of the second contact portion 262, that is, the first The height H (see FIG. 4) of the first contact portion 261 and the second contact portion 262 is not particularly limited and is appropriately set according to various conditions, but is preferably 5 mm or less. More preferably, it is 4 mm or less. The lower limit of the height H is not particularly limited, but the height H is preferably 1 mm or more, and more preferably 2 mm or more.

  Further, a portion of the contact block 260 where the first contact portion 261 is provided is formed with a through hole that opens to the lower surface (front end surface) and the upper surface (base end surface). It communicates with the guide path 2401. Similarly, a portion of the contact block 260 where the second contact portion 262 is provided is formed with a through hole that opens to the lower surface and the upper surface, and the through hole communicates with the vacuum guide path 2402. Yes.

  With the IC device 9 disposed in the first contact portion 261 of the contact block 260, the predetermined pump is driven to suck air and bring the through hole of the first contact portion 261 into a negative pressure state. The IC device 9 can be held (adsorbed and held) by the first contact portion 261. Further, the IC device 9 held by the first contact portion 261 can be released by driving the predetermined pump to supply air and releasing the negative pressure state of the through hole of the first contact portion 261. it can. The second contact portion 262 can also be held and released by the second contact portion 262 in the same manner as described above. As described above, the two IC devices 9 can be held by one hand unit 433.

  Further, the first contact portion 261 and the second contact portion 262 of the contact block 260 are respectively connected to the IC device when the hand unit 433 presses the IC device 9 toward the holding portion 51 when the IC device 9 is inspected. 9 is a portion that contacts (contacts) 9 and presses the IC device 9. Note that the hand unit 433 can press the IC device 9 when the IC device 9 is inspected, either in a state where the IC device 9 is gripped or in a state where the IC device 9 is not gripped. The setting of whether to hold or not to hold can be performed as appropriate.

  Further, at least one, preferably all, of the base 263, the first contact 261, and the second contact 262 of the contact block 260 has a thermal conductivity of 16 (W / (m · K)) or more. Yes, it is preferably 200 (W / (m · K)) or more, more preferably 300 (W / (m · K)) or more. The upper limit of the thermal conductivity is not particularly limited, but the thermal conductivity is preferably 10000 (W / (m · K)) or less, and 7000 (W / (m · K)) or less. It is more preferable that In addition, as shown in FIG. 8, when the contact block 260 has the intermediate members 271 and 272, the thermal conductivity of the intermediate members 271 and 272 is the same as described above.

  Accordingly, the contact block 260 can function as a heat conduction unit that transfers heat from one of the IC device 9 held by the first contact unit 261 and the IC device 9 held by the second contact unit 262 to the other. it can. That is, in this inspection apparatus 1, as described later, temperature control is performed so that the temperature of the IC device 9 becomes a predetermined set temperature (target temperature) suitable for inspection, but the thermal conductivity is set as described above. Thus, when the IC device 9 is inspected, the amount of heat generated by the IC device 9 gripped by the first contact portion 261 is different from the amount of heat generated by the IC device 9 gripped by the second contact portion 262. The heat of the larger IC device 9 is transmitted to the smaller IC device 9 by the contact block 260 and a temperature difference between the two IC devices 9 can be suppressed.

  However, if the thermal conductivity is smaller than the lower limit value, the contact block 260 cannot sufficiently function as a heat conduction part, and a temperature difference between the two IC devices 9 is suppressed. Is difficult.

  In the present specification, the thermal conductivity of the contact block 260 is an average value of the thermal conductivity of the entire contact block 260. For example, when the contact block 260 is composed of a plurality of members having different thermal conductivities, the thermal conductivity differs depending on the portion of the contact block 260, and therefore the average value of the thermal conductivity of the entire contact block 260 is determined as the contact block 260. The thermal conductivity of

  Further, the heat capacity (J / K) of the contact block 260 is not particularly limited, but is preferably 250 times or more, more preferably 500 times or more, more preferably 500 times or more, 2000 times the heat capacity of the IC device 9. More preferably, it is as follows.

  As a result, the heat generated in the IC device 9 is absorbed by the contact block 260, the temperature rise of the IC device 9 can be suppressed, and the occurrence of a temperature difference between the two IC devices 9 can be suppressed. .

  However, if the heat capacity (J / K) of the contact block 260 is smaller than the lower limit, it is difficult to suppress the temperature difference between the two IC devices 9 depending on other conditions. is there.

  Here, as an example, the following equation (1) representing the amount of heat Q (W) generated per unit time is used, and when the IC device 9 is energized, the temperature rise of the IC device 9 becomes 2K. As a result of obtaining the heat capacity condition, a result that “the heat capacity of the contact block 260 is approximately 261 times the heat capacity of the IC device 9” was obtained. In this calculation, when the IC device 9 is energized, the amount of heat generated from the IC device 9 per unit time is 13.98 (W). From this result, it can be seen that the heat capacity of the contact block 260 is preferably 250 times or more the heat capacity of the IC device 9 as described above.

Q = W × C × (T1-T2) / (h × 3600 × η) (1)
However, in the above formula (1), each parameter is as follows.

W: Mass (kg)
C: Specific heat (J / kg · K)
T1: Temperature when rising (K)
T2: Temperature before rising (K)
h: Rise time (hours)
η: Efficiency (η is 0.7 or more and 1 or less, but in this embodiment, “0.7”)

  Further, the constituent materials of the contact block 260 (base 263, first contact 261, second contact 262, intermediate members 271, 272) are not particularly limited, but are preferably hard, for example, Examples include various metal materials (including alloys and intermetallic compounds) having thermal conductivity. Specifically, for example, silver (412 (W / (m · K))), copper (371 (W / (m · K))), aluminum (195 (W / (m · K))), magnesium (150 (W / (m · K))), chromium (96 (W / (m · K))), iron (79 (W / (m · K))), carbon steel (58 (W / (m · K))), various metals such as titanium (17 (W / (m · K))), alloys or intermetallic compounds containing at least one of these, and oxides of these metals, Examples thereof include nitrides and carbides. In this case, the constituent material of the contact block 260 preferably includes at least one of aluminum and copper. Thereby, the thermal conductivity of the contact block 260 can be increased. Examples of the alloy include stainless steel such as SUS304 (16.7 (W / (m · K))) and SUS316 (16.7 (W / (m · K))). The numerical value in the parentheses is “thermal conductivity”.

  Moreover, although it does not specifically limit as a constituent material of the heater block 240 and the heat sink 291, respectively, The material which has a hard and high heat conductivity is preferable. The material that is hard and has high thermal conductivity is not particularly limited, and a specific example thereof is the same as the constituent material of the contact block 260.

  The heat sink 291 includes a plate-like base portion 2911 and a plurality of fins 2912 that protrude upward from the base portion 2911. The fins 2912 are arranged along the X direction. The heat sink 291 is disposed in a space formed by each column 233 (a space between the heater block 240 and the second connection block 232). The heat sink 291 is thermally connected with the lower surface of the base 2911 fixed to the upper surface of the heater block 240 using a brazing material such as solder, for example. Thus, the heat sink 291 is disposed on the contact block 260 via the heater block 240. Further, the heat sink 291 is provided in contact with the second connection block 232. In other words, a gap is formed between the heat sink 291 and the second connection block 232. Thereby, heat exchange between the heat sink 291 and the second connection block 232 is suppressed, and the heat dissipation effect of the heat sink 291 is improved. The size of the gap can be easily controlled by adjusting the height of each column 233.

  Each column 233 is screwed to the heater block 240 and the second connection block 232 by screws 234, respectively. Further, a heat insulating material 235 is provided between the head of each screw 234 and the heater block 240.

  The ejection nozzle 292 ejects the air G and has a plurality of ejection holes 2921 arranged in one row. This injection nozzle 292 is provided such that each injection hole 1721 is arranged along the arrangement (X direction) of each fin 2912 of the heat sink 291, and the air G is directed from each injection hole 1721 toward each fin 2912. Is configured to inject fuel. That is, the later-described pump 133 that ejects air (compressed air) is connected to the injection nozzle 292. The driving of the pump 133 is controlled by the control unit 8. By blowing air G onto the heat sink 291, the IC device 9 can be cooled via the heat sink 291, the heater block 240, and the contact block 260. Moreover, since the injection nozzle 292 is fixed to the second connection block 232 via a fixture, the relative position with the heat sink 291 is kept constant. Therefore, the air G is stably jetted to the heat sink 291 and the heat sink 291 can be cooled stably.

  Further, by using air as the fluid to be ejected from the ejection nozzle 292, the handling can be simplified and the cost can be reduced. For example, the cooling performance of the IC device 9 can be improved by using a refrigeration cooler or the like and using cooled air. However, the fluid ejected from the ejection nozzle 292 is not limited to air, and for example, gases such as various insulating gases such as nitrogen, argon, carbon dioxide, fluorine-based gas, and mixed gas containing these are applicable. It is. Moreover, you may provide the temperature adjustment part which adjusts the temperature of the air (fluid) injected from the injection nozzle 292. FIG.

  Two rod-shaped heaters (heating units) 241 are embedded in the heater block 240. Each heater 241 extends in the X direction. The heater block 240 in which the heater 241 is embedded is located between the heat sink 291 and the contact block 260 and is disposed on the contact block 260. The driving of the heater 241 is controlled by the control unit 8, and when the heater 241 generates heat, the heat is transmitted to the IC device 9 via the heater block 240 and the contact block 260, and the temperature of the IC device 9 rises. Thereby, the electrical characteristics of the IC device 9 in a high temperature environment can be inspected.

  The heater 241 is not particularly limited as long as the IC device 9 can be heated. For example, various ceramic heaters such as an alumina heater, an aluminum nitride heater, a silicon nitride heater, a silicon carbide heater, and a boron nitride heater, nichrome, etc. Various cartridge heaters using a heating wire such as a wire can be used. Moreover, the heater 241 is not limited to a rod-shaped heater, and for example, a planar heater can be used. In addition, as a heating part, it is not limited to the heater 241, In addition, for example, a Peltier device etc. are mentioned.

  A temperature sensor 243 is embedded in the heater block 240. The temperature sensor 243 detects (detects) the temperature of the heater block 240 to indirectly detect the temperature of the IC device 9. The detection result of the temperature sensor 243, that is, the signal output from the temperature sensor 243 is input to the control unit 8, and the control unit 8 grasps the temperature detected by the temperature sensor 243. As described above, the heater block 240 and the contact block 260 are made of a material having high thermal conductivity, so that the temperature difference between the IC device 9 and the heater block 240 is small, and the temperature sensor 243 embedded in the heater block 240. Thus, the temperature of the IC device 9 can be detected sufficiently accurately.

  The temperature sensor 243 is not particularly limited as long as the temperature of the IC device 9 can be detected. For example, a Pt sensor such as a platinum sensor, a thermocouple, a thermistor, or the like can be used. When the IC device 9 includes a thermal diode or the like, the temperature sensor 243 may be omitted and the temperature of the IC device 9 may be detected by the thermal diode.

  The temperature sensor 243 of the present embodiment is arranged so as to indirectly detect the temperature of the IC device 9, but the arrangement is not particularly limited as long as the temperature of the IC device 9 can be detected. For example, the temperature of the IC device 9 may be directly detected. Specifically, the temperature sensor 243 may be disposed so as to be exposed on the lower surface of the device chuck 220, and may be in contact with any one of the IC devices 9 when pressed. In the inspection apparatus 1, the temperature of the IC device 9 may be a temperature obtained by adding a predetermined correction to the temperature detected by the temperature sensor 243 in consideration of the thermal resistance of the heater block 240 and the contact block 260.

  In the present embodiment, the temperature sensor 243 is embedded in the heater block 240. However, the temperature sensor 243 may be embedded in the contact block 260, which is closer to the IC device 9 and detects temperature. The accuracy is expected to improve. However, since the contact block 260 is a member that is appropriately selected depending on the type and size of the IC device 9, if the temperature sensor 243 is disposed on the contact block 260, the temperature sensor 243 is provided on all the replacement contact blocks 260. It must be placed, which increases costs. Therefore, if the purpose is to reduce the cost, the temperature sensor 243 is preferably arranged in the heater block 240 as in the present embodiment.

  According to such a hand unit 433, the temperature of the IC device 9 is maintained within a predetermined temperature range (for example, about a set temperature ± 2 ° C.) by heating the IC device 9 with the heater 241 and cooling with the air G. be able to. In particular, the temperature rise due to self-heating of the IC device 9 can be quickly canceled by the air G, the temperature of the IC device 9 being inspected can be kept substantially constant, and the inspection of the IC device 9 is more accurate. Can be done well.

-Recovery robot-
The collection robot 44 is a robot that conveys the IC device 9 that has been inspected by the inspection unit 5 to the collection side arrangement unit 6. Such a collection robot 44 is supported by the support frame 441 supported by the base 11, the moving frame 442 supported by the support frame 441 and reciprocally movable in the Y direction with respect to the support frame 441, and the moving frame 442. And four hand units (gripping robots) 443. Each hand unit 443 includes an elevating mechanism and a suction nozzle, and can grip the IC device 9 by suction.

  Such a transport unit 4 transports the IC device 9 as follows. First, the shuttle 41 moves to the left in the figure, and the supply robot 42 transports the IC device 9 on the placement stage 341 to the shuttle 41 (STEP 1). Next, the shuttle 41 moves to the center, and the inspection robot 43 transports the IC device 9 on the shuttle 41 to the inspection unit 5 (STEP 2). Next, the inspection robot 43 transports the IC device 9 that has been inspected by the inspection unit 5 to the shuttle 41 (STEP 3). Next, the shuttle 41 moves to the right side in the figure, and the recovery robot 44 transports the inspected IC device 9 on the shuttle 41 to the recovery side arrangement unit 6 (STEP 4). By repeating such STEP 1 to STEP 4, the IC device 9 can be transported to the collection side array unit 6 via the inspection unit 5.

  The configuration of the transport unit 4 has been described above. As the configuration of the transport unit 4, the IC device 9 on the mounting stage 341 is transported to the inspection unit 5, and the IC device 9 that has been inspected is collected on the collection side array unit 6. If it can be conveyed to, it will not be specifically limited. For example, the shuttle 41 is omitted, and any one of the supply robot 42, the inspection robot 43, and the collection robot 44 is used to transport the placement stage 341 to the inspection unit 5, and from the inspection unit 5 to the collection side arrangement unit 6. You may carry to.

≪Inspection Department≫
The inspection unit 5 is a unit that inspects and tests the electrical characteristics of the IC device 9. As shown in FIG. 2, the inspection unit 5 includes four holding units 51 in which the IC devices 9 are arranged. Each of the holding portions 51 is provided with a plurality of probe pins (not shown) that are electrically connected to the terminals of the IC device 9. Each probe pin is electrically connected to the control unit 8. When the IC device 9 is inspected, one IC device 9 is arranged (held) in one holding unit 51. Each terminal of the IC device 9 disposed in the holding unit 51 is pressed against each probe pin with a predetermined inspection pressure by pressing of the hand unit 433 of the inspection robot 43. Thereby, each terminal of the IC device 9 and each probe pin are electrically connected (contacted), and the IC device 9 is inspected via the probe pin. The inspection of the IC device 9 is performed based on a program stored in the control unit 8.

≪Control part≫
The control unit 8 includes, for example, an inspection control unit and a drive control unit. The inspection control unit, for example, inspects the electrical characteristics of the IC device 9 disposed in the inspection unit 5 based on a program stored in a memory (not shown). The drive control unit controls the driving of each of the supply unit 2, the supply side arrangement unit 3, the conveyance unit 4, the inspection unit 5, the collection side arrangement unit 6, and the collection unit 7, for example, conveyance of the IC device 9 and the like. I do. The control unit 8 also controls the temperature of the IC device 9.

  Next, temperature control of the IC device 9 will be described. Further, a mechanism used to control the temperature and injecting the air G onto the heat sink 291 will be described, but a mechanism regarding one injection nozzle 292 will be described as a representative.

  As shown in FIG. 7, the inspection apparatus 1 includes a pump (fluid supply unit) 133 that ejects air G and supplies the air G to the ejection nozzle 292, and a tubular body 14 that connects the pump 133 and the ejection nozzle 292. have. The lumen of the tube body 14 is a flow path through which the air G flows. Further, an electromagnetic valve (valve) 131 that opens and closes the flow path is provided in the middle of the tube body 14. The driving of the electromagnetic valve 131 is controlled by the control unit 8.

  In this inspection apparatus 1, the temperature sensor 243 detects the temperature of the IC device 9, and based on the detection result, the temperature of the IC device 9 becomes a predetermined set temperature (target temperature) suitable for the inspection. Take control.

  Before the inspection of the IC device 9, the electromagnetic valve 131 is closed. Then, the heater 241 is driven to heat the IC device 9, the output of the heater 241 is adjusted, and the temperature of the IC device 9 is adjusted to the set temperature. When the temperature of the IC device 9 detected by the temperature sensor 243 is higher than the threshold value Tmax that is the upper limit value of the set temperature allowable range, the output of the heater 241 may be reduced or stopped. 133 may be driven, the electromagnetic valve 131 may be opened, and the air G may be injected from the injection nozzle 292. When air G is ejected from the ejection nozzle 292, the air G is blown onto the heat sink 291, and the IC device 9 is cooled via the heat sink 291. In this way, the temperature of the IC device 9 is controlled to be the set temperature.

  During the inspection of the IC device 9, the IC device 9 may self-heat due to energization of the IC device 9 and may become higher than the set temperature. For this reason, when the temperature of the IC device 9 detected by the temperature sensor 243 is higher than the threshold value Tmax that is the upper limit value of the set temperature allowable range, the output of the heater 241 is reduced or stopped, and the pump 133 is driven. Then, the electromagnetic valve 131 is opened, and the air G is injected from the injection nozzle 292.

  By ejecting air G from the ejection nozzle 292, the air G is blown onto the heat sink 291, and the IC device 9 is cooled via the heat sink 291. In this way, the temperature of the IC device 9 is controlled to be the set temperature.

  As described above, according to this inspection apparatus 1, by using other members for the first contact portion 261 and the second contact portion 262, the size can be reduced, and the number of parts can be reduced. Can be reduced. In particular, the interval between the first contact portion 261 and the second contact portion 262 can be reduced, and thereby, when a plurality of hand units 433 are installed side by side, a large number of IC devices 9 are simultaneously grasped, Can be inspected.

  Further, by setting the thermal conductivity as described above, it is possible to suppress the occurrence of a temperature difference between the two IC devices 9.

  Moreover, since the IC device 9 can be cooled while being heated, the temperature of the IC device 9 can be adjusted with high accuracy.

Second Embodiment
FIG. 9 is a block diagram showing a main part of a second embodiment of the electronic component inspection apparatus of the present invention. FIG. 10 is a flowchart showing the control operation of the electronic component inspection apparatus shown in FIG.

  Hereinafter, although the second embodiment will be described, the description will focus on the differences from the first embodiment described above, and the description of the same matters will be omitted. As a mechanism for injecting air G to the heat sink 291, a mechanism for one injection nozzle 292 will be described as a representative.

  As illustrated in FIG. 9, the inspection apparatus 1 according to the second embodiment connects a pump (fluid supply unit) 133 that ejects air G and supplies the air G to the ejection nozzle 292, and the pump 133 and the ejection nozzle 292. And a flow meter (flow rate sensor) 242 as a flow rate detection unit for detecting (measuring) the flow rate of the air G injected from the injection nozzle 292. The lumen of the tube body 14 is a flow path through which the air G flows.

  Moreover, the flowmeter 242 is installed in the tube body 14, for example. A signal indicating the flow rate of the air G detected by the flow meter 242 is input to the control unit 8, and the control unit 8 grasps the flow rate of the air G detected by the flow meter 242. The flow meter 242 may be preset in the tube body 14 or may be retrofitted as long as it can detect the flow rate of the air G injected from the injection nozzle 292.

  As another method for detecting the flow rate of the air G by the flow meter 242, for example, a heat ray flow meter is used as the flow meter 242, and the flow meter 242 is disposed in the vicinity of the injection nozzle 292 to detect the flow rate of the air G. . The vicinity of the injection nozzle 292 includes an internal space of the injection nozzle 292, an opening of the injection nozzle 292, a position separated from the opening of the injection nozzle 292 by a predetermined distance, and the like.

  Further, the tube body 14 is branched into the first tube body 141 and the second tube body 142 in the middle of the tube body 14 and merges again. That is, the first tube body 141 and the second tube body 142 are connected in parallel. The lumen of the first tube 141 is a first channel through which the air G flows, and the lumen of the second tube 142 is a second channel through which the air G flows. The cross-sectional area in the direction orthogonal to the central axis of the lumen (first flow path) of the first tubular body 141 is the central axis of the lumen (second flow path) of the second tubular body 142. It is larger than the cross-sectional area in the direction orthogonal to.

  An electromagnetic valve (valve) 131 that opens and closes the flow path (first flow path) is provided in the middle of the first tubular body 141. Further, a throttle valve (second flow rate adjusting unit) 132 that adjusts the opening degree and adjusts the flow rate of the air G flowing through the second tubular body 142 is provided in the middle of the second tubular body 142. ing. As described above, one end portion of the second tubular body 142 communicates with a portion (end portion in the present embodiment) on the upstream side of the electromagnetic valve 131 of the first tubular body 141, and the second tubular body The other end portion of 142 communicates with a portion (end portion in the present embodiment) on the downstream side of the electromagnetic valve 131 of the first tubular body 141. That is, the second tubular body 142 bypasses the electromagnetic valve 131. The driving of the electromagnetic valve 131 and the throttle valve 132 is controlled by the control unit 8. The first tube body 141, the second tube body 142, the electromagnetic valve 131, the throttle valve 132, and the like constitute the flow rate adjusting unit 100 that adjusts the flow rate of the air G injected from the injection nozzle 292.

  The flow rate adjustment unit 100 can adjust the average flow rate of the air G injected from the injection nozzle 292 to a first average flow rate and a second average flow rate larger than the first average flow rate under the control of the control unit 8. It is configured. The average flow rate when the solenoid valve 131 is closed and the throttle valve 132 is opened and the opening degree is set to a predetermined opening degree is the first average flow rate. The electromagnetic valve 131 is opened and the throttle valve 132 is opened and opened. The average flow rate when the degree is set to a predetermined opening is the second average flow rate. The “average flow rate” is an average value of the flow rate of the air G injected from the injection nozzle 292 in a unit time. In addition, since the flow rate of the air G may increase or decrease with time, in this embodiment, the flow rate of the air G is managed using the average flow rate instead of the instantaneous value of the flow rate of the air G.

  The flow rate adjusting unit 100 sets the average flow rate to the first average flow rate before inspecting the IC device 9. On the other hand, the second average flow rate is included in the average flow rate during the inspection of the IC device 9. Details will be described below.

  First, in the inspection apparatus 1, the temperature sensor 243 detects the temperature of the IC device 9, and based on the detection result, the temperature of the IC device 9 becomes a predetermined set temperature (target temperature) suitable for the inspection. Temperature control.

  Before the inspection of the IC device 9, the electromagnetic valve 131 is closed and the throttle valve 132 is open. The opening of the throttle valve 132 is adjusted to a predetermined opening. Then, while driving the heater 241 to heat the IC device 9, the air G is sprayed from the spray nozzle 292 toward the heat sink 291, the IC device 9 is cooled, the balance between them is taken, and the temperature of the IC device 9 is adjusted. Adjust to the set temperature. In this case, since the electromagnetic valve 131 is closed, the average flow rate of the air G injected from the injection nozzle 292 is the first average flow rate.

  During the inspection of the IC device 9, the IC device 9 may self-heat due to energization of the IC device 9 and may become higher than the set temperature. For this reason, when the temperature of the IC device 9 detected by the temperature sensor 243 is higher than the threshold value Tmax which is the upper limit value of the set temperature allowable range, the output of the heater 241 is reduced or stopped, and the electromagnetic valve 131 is opened. The average flow rate of the air G injected from the injection nozzle 292 is set to the second average flow rate. As a result, the amount of heat radiated from the heat sink 291 increases, and the IC device 9 is further cooled. Further, since the air G is blown onto the heat sink 291 before the temperature of the IC device 9 becomes higher than the threshold value Tmax, the cooling responsiveness (cooling responsiveness) is improved, and the temperature of the IC device 9 is rapidly reduced. Can be made. In this way, the temperature of the IC device 9 is controlled to be the set temperature.

  In addition, after the inspection of the IC device 9 is completed, the solenoid valve 131 is closed, the average flow rate of the air G injected from the injection nozzle 292 is set to the first average flow rate, and the next IC device 9 is prepared for the inspection.

  Here, the first average flow rate a is not particularly limited, and is appropriately set according to various conditions, but is preferably 1 mL / second or more and 500 mL / second or less, preferably 10 mL / second or more, More preferably, it is 100 mL / second or less.

  If the first average flow rate a is larger than the upper limit value, although depending on other conditions, it is necessary to increase the output of the heater 241 and the energy consumption increases.

  If the first average flow rate a is smaller than the lower limit value, the cooling responsiveness when the IC device 9 is cooled is lowered depending on other conditions.

  The second average flow rate b is not particularly limited and is appropriately set according to various conditions, but is preferably 2 mL / second or more and 1000 mL / second or less, and is preferably 20 mL / second or more and 200 mL. / Second or less is more preferable.

  When the second average flow rate b is larger than the upper limit value, energy consumption increases although it depends on other conditions.

  In addition, when the second average flow rate b is smaller than the lower limit value, the cooling response in cooling the IC device 9 is deteriorated depending on other conditions.

  Further, the ratio (b / a) between the first average flow rate a and the second average flow rate b is not particularly limited and is appropriately set according to various conditions, but is 1.5 or more. It is preferably 2 or more and 10 or less.

  If b / a is larger than the upper limit, energy consumption increases although it depends on other conditions.

  Moreover, if b / a is smaller than the lower limit value, the cooling response in cooling the IC device 9 is lowered although it depends on other conditions.

  Next, the control operation of the control unit 8 in controlling the average flow rate of the air G ejected from the ejection nozzle 292 will be described.

  First, as shown in FIG. 10, before the inspection of the IC device 9, the average flow rate of the air G ejected from the ejection nozzle 292 is set to the first average flow rate (step S101). Then, as described above, the temperature sensor 243 detects the temperature of the IC device 9, and based on the detection result, temperature control is performed so that the temperature of the IC device 9 becomes the set temperature.

  Next, it is determined whether or not the inspection of the IC device 9 is started (step S102). When the inspection is started, the temperature T of the IC device 9 is detected by the temperature sensor 243 (step S103) and detected. It is determined whether or not the temperature T is higher than a threshold value Tmax that is an upper limit value of the allowable range of the set temperature (step S104).

  If it is determined in step S104 that the detected temperature T is equal to or lower than the threshold value Tmax, the average flow rate is set to the first average flow rate (step S105). That is, when the current average flow rate is the first average flow rate, it is maintained, and when the current average flow rate is the second average flow rate, the average flow rate is changed to the first average flow rate.

  If it is determined in step S104 that the detected temperature T is greater than the threshold value Tmax, the average flow rate is set to the second average flow rate (step S106). That is, when the current average flow rate is the second average flow rate, it is maintained, and when the current average flow rate is the first average flow rate, the average flow rate is changed to the second average flow rate. In this case, as described above, the output of the heater 241 is reduced or stopped.

  Next, it is determined whether or not the inspection of the IC device 9 has been completed (step S107). If the inspection has not been completed, the process returns to step S103, and step S103 and subsequent steps are executed again. When the inspection of the IC device 9 is completed, the average flow rate is set to the first average flow rate in preparation for the next inspection of the IC device 9 (step S108). That is, when the current average flow rate is the first average flow rate, it is maintained, and when the current average flow rate is the second average flow rate, the average flow rate is changed to the first average flow rate. This is the end of this program.

  As described above, according to the inspection apparatus 1, when the IC device 9 is cooled, the cooling responsiveness can be improved. Thus, in the control for keeping the temperature of the IC device 9 at the set temperature for the inspection, when the temperature of the IC device 9 is higher than the set temperature, the temperature of the IC device 9 can be quickly reduced.

  In addition, the temperature of the contact block 260 that contacts the IC device 9 should be set to the inspection set temperature, and the temperature of the heat sink 291 should be as low as possible. That is, the larger the temperature gradient between the contact block 260 and the heat sink 291, the better the cooling response. Therefore, by arranging the heater 241 between the heat sink 291 and the contact block 260, the contact block 260 and the heat sink 291 Increase the temperature gradient between. Thereby, the IC device 9 can be quickly cooled via the heat sink 291. In addition, the IC device 9 can be easily heated via the contact block 260.

  The same effects as those of the first embodiment described above can also be exhibited by the second embodiment as described above.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated based on embodiment of illustration, this invention is not limited to this, The structure of each part has the same function. Any configuration can be substituted. In addition, any other component may be added to the present invention.

  Further, the present invention may be a combination of any two or more configurations (features) of the above embodiments.

  Moreover, in the said embodiment, although the number of 2nd members is two, in this invention, it is not limited to this, Three or more may be sufficient.

DESCRIPTION OF SYMBOLS 1 ... Inspection apparatus 10 ... Conveyance apparatus 100 ... Flow volume adjustment part 11 ... Base 111 ... Base surface 12 ... Cover 2 ... Supply part 3 ... Supply side arrangement | positioning part 341 ... Mounting stage 4 ... Conveying section 41 …… Shuttle 411 …… Pocket 42 …… Supply robot 421 …… Support frame 422 …… Moving frame 423 …… Hand unit 43 …… Inspection robot 431 …… Support frame 432 …… Moving frame 433 …… Hand unit 44 …… Recovery robot 441 …… Support frame 442 …… Moving frame 443 …… Hand unit 5 …… Inspection part 51 …… Holding part 6 …… Recovery side array part 7 …… Recovery part 8 …… Control part 9 …… IC device 131 ... Solenoid valve 132 ... Throttle valve 133 ... Pump 14 ... Tube 141 ... First tube 142 ... Second tube 210 …… Air cylinder 211 …… Cylinder tube 212 …… Tube body 2121 …… Thin wall portion 213 …… Back plate 214 …… Piston 2141 …… Tip portion 2142 …… Base end portion 215 …… Air introduction port 220 …… Device Chuck 231 ... 1st connecting block 232 ... 2nd connecting block 233 ... support 234 ... screw 235 ... heat insulating material 240 ... heater blocks 2401, 4022 ... vacuum guideway 241 ... heater 242 ... flow meter 243 …… Temperature sensor 260 …… Contact block 261 …… First contact portion 262 …… Second contact portion 263 …… Base portion 271,272 …… Intermediate member 290 …… Cooling portion 291 …… Heat sink 2911 …… Base portion 2912… ... Fin 292 ... Injection nozzle 2921 ... Injection hole D1 ... First chamber D2 ...... second chamber P2, P3 ...... connection port G ...... air S101~S108 ...... step

Claims (9)

A contact member having a plurality of second members that contact the first member and the electronic component;
At least one thermal conductivity of the first member and the plurality of second members is 16 (W / (m · K)) or more.   The electronic component conveying apparatus according to claim 1, wherein the contact member has a thermal conductivity of 16 (W / (m · K)) or more.   The abutting member includes a third member that is disposed in at least one of the first member and the plurality of second members and has a thermal conductivity of 16 (W / (m · K)) or more. Item 3. The electronic component conveying apparatus according to Item 1 or 2.   4. The electronic component conveying apparatus according to claim 1, wherein the first member and the plurality of second members are integrally formed. 5.   5. The electronic component carrying apparatus according to claim 1, wherein each of the first member and the plurality of second members includes at least one of aluminum and copper as a constituent material thereof.   The electronic component carrying device according to claim 1, wherein a heat radiating portion is disposed on the contact member.   The electronic component transport apparatus according to claim 1, wherein a heating unit is disposed on the contact member.   8. The electronic component carrying device according to claim 1, wherein a heat capacity (J / K) of the contact member is 250 times or more of a heat capacity of the electronic component. A contact member having a plurality of second members that contact the first member and the electronic component;
An inspection unit for inspecting the electronic component,
At least one thermal conductivity of the first member and the plurality of second members is 16 (W / (m · K)) or more.

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