JP2016061673A - Electronic component transportation device and electronic component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component transportation device capable of quickly reducing a temperature of an electronic component when the temperature of the electronic component is higher than a preset temperature in control for maintaining the temperature of the electronic component at the preset temperature, and further to provide an electronic component inspection device.SOLUTION: An electronic component transportation device comprises: a holding section holding an electronic component; a heating section; a heat radiation section; a fluid injection section injecting fluid to the heat radiation section; and a flow rate adjustment section adjusting a flow rate of the fluid injected from the fluid injection section. The flow rate adjustment section can adjust an average flow rate of the fluid injected from the fluid injection section to a first average flow rate and a second average flow rate greater than the first average flow rate. The average flow rate is set to the first average flow rate before the electronic component is inspected, and the average flow rate includes the second average flow rate while the electronic component is being inspected.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects the electrical characteristics of an electronic component such as an IC device is known. This electronic component inspection apparatus includes an electronic component for transporting an IC device to a holding unit of an inspection unit. A transport device is incorporated. When inspecting the IC device, the IC device is disposed in the holding unit, and a plurality of probe pins provided in the holding unit are brought into contact with the terminals of the IC device. Such an IC device inspection may be performed by heating or cooling the IC device to a predetermined temperature. In this case, control is performed to keep the temperature of the electronic component at a set temperature (target temperature).

  In Patent Document 1, as a method of adjusting the temperature at the time of inspection of an electronic component, a method of increasing the temperature of the electronic component by utilizing the self-heating of the electronic component while insulating the electronic component by contacting the heat insulating material Is disclosed.

JP 2007-315906 A

  However, the method described in Patent Document 1 has a problem that when the temperature of the electronic component becomes higher than a set temperature during the inspection of the electronic component, the temperature cannot be lowered. In the inspection of electronic components, if the temperature of the electronic component exceeds the allowable temperature, the electronic component may be damaged and become defective.If the temperature of the electronic component is higher than the set temperature, a large current May cause a product that is originally a good product to be judged as a defective product, and it is difficult to inspect correctly.

  An object of the present invention is to control an electronic component so that the temperature of the electronic component can be quickly lowered when the temperature of the electronic component is higher than the set temperature in the control for keeping the temperature of the electronic component at the set temperature. It is to provide an inspection device.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application Example 1]
An electronic component transport apparatus according to the present invention includes a gripping unit that grips an electronic component,
A heating unit;
A heat dissipating part;
A fluid ejecting unit that ejects fluid to the heat radiating unit;
A flow rate adjusting unit for adjusting the flow rate of the fluid ejected from the fluid ejecting unit,
The flow rate adjustment unit is capable of adjusting the average flow rate of the fluid ejected from the fluid ejection unit to a first average flow rate and a second average flow rate that is greater than the first average flow rate,
Before inspecting the electronic component, the average flow rate is the first average flow rate,
The average flow rate during the inspection of the electronic component includes the second average flow rate.

  As a result, when electronic components are cooled, the responsiveness of cooling (cooling responsiveness) can be improved, and in the control for maintaining the temperature of the electronic components at the set temperature (target temperature), the temperature of the electronic components is higher than the set temperature. If it is too high, the temperature of the electronic component can be quickly reduced.

  Specifically, for example, before inspecting an electronic component, while heating the electronic component, the fluid is sprayed toward the heat radiating portion to cool the electronic component, and the balance between them is set, and the temperature of the electronic component is set to a set temperature. Adjust to. In this case, the average flow rate of the fluid is the first average flow rate.

  During the inspection of the electronic component, when the temperature of the electronic component is higher than the set temperature, the average flow rate of the fluid sprayed toward the heat radiating unit is changed to the second average flow rate. Thereby, the temperature of an electronic component falls. In addition, since the fluid is sprayed toward the heat radiating part before the temperature of the electronic component becomes higher than the set temperature, the cooling response is improved and the electronic component is heated when the temperature of the electronic component is higher than the set temperature. The temperature can be quickly reduced.

[Application Example 2]
In the electronic component transport apparatus according to the aspect of the invention, it is preferable that the heating unit is disposed between the heat dissipation unit and the gripping unit.

  The temperature of the gripping part in contact with the electronic component should be the set temperature in the inspection, and the temperature of the heat dissipation part should be as low as possible. In other words, the larger the temperature gradient between the gripping part and the heat radiating part, the better the cooling response, so by arranging the heating part between the heat radiating part and the gripping part, Increase the temperature gradient. Thereby, an electronic component can be rapidly cooled via a thermal radiation part. Moreover, an electronic component can be easily heated via a holding part.

[Application Example 3]
In the electronic component conveying apparatus of the present invention, it is preferable to have a temperature sensor that detects the temperature of the electronic component.

  Thereby, the temperature of an electronic component can be adjusted based on the detection result of a temperature sensor.

[Application Example 4]
In the electronic component transport device of the present invention, the flow rate adjusting unit adjusts the average flow rate to the second flow rate when the temperature detected by the temperature sensor is higher than a threshold while the electronic component is being inspected. An average flow rate is preferred.

  Thereby, when the temperature of an electronic component is higher than preset temperature, the temperature of an electronic component can be reduced.

[Application Example 5]
In the electronic component transport apparatus according to the aspect of the invention, it is preferable to include a fluid supply unit that supplies the fluid to the fluid ejecting unit.
Thereby, the fluid can be ejected from the fluid ejecting section to the heat radiating section.

[Application Example 6]
In the electronic component conveying apparatus of the present invention, it is preferable that the flow rate adjusting unit is a flow rate adjusting valve capable of adjusting a flow rate.

  Thereby, it is possible to adjust the flow rate of the fluid ejected from the fluid ejecting unit with a simple configuration.

[Application Example 7]
In the electronic component conveying apparatus of the present invention, it is preferable that at least one of the opening degree and the opening / closing period of the flow rate adjusting valve is adjustable.

  Thereby, it is possible to adjust the flow rate of the fluid ejected from the fluid ejecting unit with a simple configuration.

[Application Example 8]
In the electronic component transport device of the present invention, the flow rate adjustment unit includes a first flow path through which the fluid flows,
A valve for opening and closing the first flow path;
It is preferable that the fluid flow and a second flow path that bypasses the valve.

  Thereby, the flow volume of the fluid ejected from the fluid ejecting unit can be adjusted with simple control.

[Application Example 9]
In the electronic component transport device of the present invention, one end of the second flow path communicates with a portion of the first flow path upstream of the valve, and the other end of the second flow path. It is preferable that the end portion communicates with a portion of the first flow path downstream of the valve.
Thereby, the structure of a flow volume adjustment part can be simplified.

[Application Example 10]
In the electronic component transport device of the present invention, a cross-sectional area in a direction orthogonal to the central axis of the first flow path is larger than a cross-sectional area in a direction orthogonal to the central axis of the second flow path. preferable.

  Thereby, the second average flow rate can be sufficiently increased with respect to the first average flow rate.

[Application Example 11]
In the electronic component transport device according to the aspect of the invention, it is preferable to include a second flow rate adjusting unit that adjusts the flow rate of the fluid flowing through the second flow channel.
Thereby, the temperature of the electronic component can be easily adjusted.

[Application Example 12]
In the electronic component conveying apparatus of the present invention, it is preferable that the average flow rate is the first average flow rate after the inspection of the electronic component is completed.
Thereby, it can prepare for the test | inspection of the following electronic component.

[Application Example 13]
In the electronic component transport device of the present invention, the period after the completion of the inspection of the electronic component includes a period in which the average flow rate is smaller than the first average flow rate or a period in which the fluid is not ejected to the heat radiating unit. Is preferred.

  After the inspection of the electronic component, since the energization to the electronic component is stopped, the temperature of the electronic component is lowered. As a result, the average flow rate of the fluid sprayed to the heat radiating portion after the inspection of the electronic component is reduced to the first average flow rate. Compared with the case where it is said, temperature can be raised rapidly and it can prepare quickly for the test | inspection of the next electronic component.

[Application Example 14]
The electronic component inspection apparatus of the present invention includes a gripping unit that grips an electronic component,
A heating unit;
A heat dissipating part;
A fluid ejecting unit that ejects fluid to the heat radiating unit;
A flow rate adjusting unit for adjusting a flow rate of fluid ejected from the fluid ejecting unit;
An inspection unit for inspecting the electronic component,
The flow rate adjustment unit is capable of adjusting the average flow rate of the fluid ejected from the fluid ejection unit to a first average flow rate and a second average flow rate that is greater than the first average flow rate,
Before inspecting the electronic component, the average flow rate is the first average flow rate,
The average flow rate during the inspection of the electronic component includes the second average flow rate.

  As a result, when electronic components are cooled, the responsiveness of cooling (cooling responsiveness) can be improved, and in the control for maintaining the temperature of the electronic components at the set temperature (target temperature), the temperature of the electronic components is higher than the set temperature. If it is too high, the temperature of the electronic component can be quickly reduced.

  Specifically, for example, before inspecting an electronic component, while heating the electronic component, the fluid is sprayed toward the heat radiating portion to cool the electronic component, and the balance between them is set, and the temperature of the electronic component is set to a set temperature. Adjust to. In this case, the average flow rate of the fluid is the first average flow rate.

  During the inspection of the electronic component, when the temperature of the electronic component is higher than the set temperature, the average flow rate of the fluid sprayed toward the heat radiating unit is changed to the second average flow rate. Thereby, the temperature of an electronic component falls. In addition, since the fluid is sprayed toward the heat radiating part before the temperature of the electronic component becomes higher than the set temperature, the cooling response is improved and the electronic component is heated when the temperature of the electronic component is higher than the set temperature. The temperature can be quickly reduced.

1 is a schematic view showing a first embodiment of an electronic component inspection apparatus of the present invention. It is a figure which shows the conveyance part and inspection part of the electronic component inspection apparatus shown in FIG. It is sectional drawing which shows the hand unit of the conveyance part of the electronic component inspection apparatus shown in FIG. It is a block diagram which shows the principal part of the electronic component inspection apparatus shown in FIG. It is a flowchart which shows the control operation of the electronic component inspection apparatus shown in FIG. It is a block diagram which shows the principal part of 2nd Embodiment of the electronic component inspection apparatus of this invention. It is a block diagram which shows the principal part of 3rd Embodiment of the electronic component inspection apparatus of this invention.

  DESCRIPTION OF EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device of the present invention will be described in detail based on embodiments shown in the accompanying drawings.

<First Embodiment>
FIG. 1 is a schematic view showing a first embodiment of the electronic component inspection apparatus of the present invention. FIG. 2 is a diagram illustrating a conveyance unit and an inspection unit of the electronic component inspection apparatus illustrated in FIG. 1. FIG. 3 is a cross-sectional view showing a hand unit of the transport unit of the electronic component inspection apparatus shown in FIG. FIG. 4 is a block diagram showing a main part of the electronic component inspection apparatus shown in FIG. FIG. 5 is a flowchart showing a control operation of the electronic component inspection apparatus shown in FIG.

  In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction”, a direction parallel to the Y axis is also referred to as “Y direction”, and a direction parallel to the Z axis is also referred to as “Z direction”. Further, the upstream side in the conveying direction of the electronic component is also simply referred to as “upstream side”, and the downstream side is also simply referred to as “downstream side”. In addition, “horizontal” as used in the specification of the present application is not limited to complete horizontal, and includes a state where the electronic component is slightly inclined (for example, less than about 5 °) as long as transportation of electronic components is not hindered.

  Further, the upper side in FIG. 3 is referred to as “upper” or “upper”, and the lower side is referred to as “lower” or “lower”, and in FIG. 3, one of a plurality of hand units of the transport unit is illustrated. Yes.

  An inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 includes, for example, an IC device such as a BGA (Ball Grid Array) package and an LGA (Land Grid Array) package, an LCD (Liquid Crystal Display), and an OLED (Organic Electroluminescence Display). , Including display devices such as electronic paper, CIS (CMOS Image Sensor), CCD (Charge Coupled Device), accelerometer, gyro sensor, pressure sensor, etc. This is a device for inspecting and testing electrical characteristics of electronic components (hereinafter simply referred to as “inspection”). In the following, for convenience of explanation, a case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 9”.

  As shown in FIG. 1, the inspection apparatus 1 includes a supply unit 2, a supply side arrangement unit 3, a transport unit 4, an inspection unit 5, a collection side arrangement unit 6, a collection unit 7, and control of these units. And a control unit 8 for performing The inspection apparatus 1 includes a supply unit 2, a supply side arrangement unit 3, a conveyance unit 4, an inspection unit 5, a base 11 on which a collection side arrangement unit 6 and a collection unit 7 are arranged, a supply side arrangement unit 3, and a conveyance unit 4. And a cover 12 that covers the base 11 so as to accommodate the inspection unit 5 and the collection side arrangement unit 6. The base surface 111 which is the upper surface of the base 11 is substantially horizontal, and the constituent members of the supply side array unit 3, the transport unit 4, the inspection unit 5, and the collection side array unit 6 are arranged on the base surface 111. ing. In addition, the inspection apparatus 1 may have a heater, a chamber, or the like for heating the IC device 9 as necessary.

  In such an inspection apparatus 1, the supply unit 2 supplies the IC device 9 to the supply side arrangement unit 3, the supply side arrangement unit 3 arranges the supplied IC device 9, and the arranged IC device 9 is transferred to the conveyance unit 4. Is transported to the inspection unit 5, the inspection unit 5 inspects the IC device 9 that has been transported, and the transport unit 4 transports / arranges the IC device 9 that has been inspected to the collection side array unit 6. The collection unit 7 collects the arranged IC devices 9. According to such an inspection apparatus 1, supply, inspection, and collection of the IC device 9 can be automatically performed. The inspection apparatus 1 is transported by a configuration excluding the inspection unit 5, that is, by a part of the supply unit 2, the supply side arrangement unit 3, the conveyance unit 4, the collection side arrangement unit 6, the collection unit 7, and the control unit 8. An apparatus (electronic component conveying apparatus) 10 is configured. The transport device 10 transports the IC device 9 and the like.

Hereinafter, configurations of the transport unit 4 and the inspection unit will be described.
≪Transport section≫
As shown in FIG. 2, the transport unit 4 transports the IC device 9 disposed on the mounting stage 341 of the supply side array unit 3 to the inspection unit 5 and finishes the inspection in the inspection unit 5. 9 is a unit that transports 9 to the collection side arrangement unit 6. Such a transport unit 4 includes a shuttle 41, a supply robot 42, an inspection robot 43, and a collection robot 44.

-Shuttle-
The shuttle 41 transports the IC device 9 on the mounting stage 341 to the vicinity of the inspection unit 5, and further transports the inspected IC device 9 inspected by the inspection unit 5 to the vicinity of the collection side array unit 6. It is a shuttle to do. In such a shuttle 41, four pockets 411 for accommodating the IC device 9 are formed side by side in the X direction. The shuttle 41 is guided by a linear motion guide and can be reciprocated in the X direction by a drive source such as a linear motor.

-Supply robot-
The supply robot 42 is a robot that conveys the IC device 9 disposed on the placement stage 341 to the shuttle 41. Such a supply robot 42 is supported by the base 11, a support frame 421 supported by the support frame 421, a movable frame 422 that can reciprocate in the Y direction with respect to the support frame 421, and a movable frame 422. And four hand units (gripping robots) 423. Each hand unit 423 includes an elevating mechanism and a suction nozzle, and can grip the IC device 9 by suction.

-Inspection robot-
The inspection robot 43 is a robot that transports the IC device 9 accommodated in the shuttle 41 to the inspection unit 5 and also transports the IC device 9 that has been inspected from the inspection unit 5 to the shuttle 41. Further, the inspection robot 43 can also press the IC device 9 against the inspection unit 5 and apply a predetermined inspection pressure to the IC device 9 during the inspection. Such an inspection robot 43 is supported by the support frame 431 supported by the base 11, the movable frame 432 supported by the support frame 431 and reciprocally movable in the Y direction with respect to the support frame 431, and the movable frame 432. And four hand units (gripping robots) 433. The arrangement of each hand unit 433 is not particularly limited, and the arrangement shown is an example.

  Each hand unit 433 includes an elevating mechanism, a suction tube 260 and a suction pad 270 (see FIG. 3), which will be described later, and can grip (suction grip) the IC device 9 by suction. Since each hand unit 433 is the same, one of them will be described below.

  The hand unit 433 is detachably fixed to the moving frame 432 by, for example, screwing or the like.

  As shown in FIG. 3, the hand unit 433 includes an air cylinder 210 fixed to the moving frame 432, and a device chuck 220 connected to the tip of the air cylinder 210.

  The air cylinder 210 has a cylinder tube 211 fixed to the moving frame 432. The cylinder tube 211 has a bottomed cylindrical tube main body 212 and a front plate 213 that closes the opening of the tube main body 212. A piston 214 is formed in the Z direction in a cylinder chamber formed by the tube main body 212 and the front plate 213. It is arranged to be movable. The cylinder chamber is partitioned by the piston 214 into a first chamber D1 located on the upper side and a second chamber D2 located on the lower side.

  The piston 214 is lifted upward by a coil spring 151, which will be described later. When the air cylinder 210 is not in operation, the position where the surface of the piston 214 on the first chamber D1 side comes into contact with the bottom surface of the tube body 212 (hereinafter referred to as this). It is located at the top end position).

  An air introduction port 215 is formed at the end of the tube body 212 on the first chamber D1 side, and a connection port P1 is attached to the air introduction port 215. The connection port P1 is connected to an electropneumatic regulator (not shown). When air is supplied from the electropneumatic regulator to the first chamber D1, the piston 214 is moved from the uppermost position by the pressure of the air to the coil spring 151. It moves downward against the elastic force. By setting the pressure in the first chamber D1 to a predetermined pressure, the IC device 9 arranged in the holding unit 51 can be pressed with a suitable pressure. Therefore, the conduction between the IC device 9 and the holding unit 51 can be reliably achieved, and the breakage of the IC device 9 can be suppressed. The driving of the electropneumatic regulator is controlled by the control unit 8.

  The device chuck 220 disposed on the lower side of the air cylinder 210 as described above includes a connection block 230 fixed to the lower end portion of the piston 214, a member 293 disposed on the lower side of the connection block 230, and a heat sink (heat radiation portion). ) 291, a heater block 240 disposed below the member 293 and the heat sink 291, and a contact pusher 250 disposed below the heater block 240. The heat sink 291 is provided with an injection nozzle (fluid injection unit) 292 that injects air (fluid) G as a cooling gas. The injection nozzle 292 and the heat sink 291 constitute a cooling unit 290 that cools the IC device 9.

  The connection block 230 is connected to the moving frame 432 via a coil spring 151. That is, the connecting block 230 is elastically suspended from the moving frame 432 via the coil spring 151. As described above, the coil spring 151 pushes the piston 214 up to the uppermost end position via the connecting block 230. Further, the connecting block 230 is formed with a through hole that opens to the center and the side surface of the lower surface, and this through hole functions as the vacuum guide path 231. A connection port P <b> 2 is attached to one end of the vacuum guide path 231. Further, the connection port P2 is connected to a pump for sucking air and a pump for ejecting air (both not shown). The driving of the pump is controlled by the control unit 8.

  Further, the upper ends of a plurality of columnar members 293 having excellent heat insulation are connected and fixed to the lower surface of the connecting block 230, and the heater block 240 is connected and fixed to the lower ends of the plurality of columnar members 293. A contact pusher 250 is detachably connected and fixed to the lower surface. The contact pusher 250 is a part that contacts the IC device 9 and presses the IC device 9 when the hand unit 433 presses the IC device 9 when the IC device 9 is inspected. Note that the hand unit 433 can press the IC device 9 when the IC device 9 is inspected, either in a state where the IC device 9 is gripped or in a state where the IC device 9 is not gripped. The setting of whether to hold or not to hold can be performed as appropriate.

  A heat sink 291 is disposed in a space formed by the member 293 (a space between the heater block 240 and the connection block 230). The heat sink 291 is fixed to the heater block 240 using a brazing material such as solder, and is thermally connected. Further, the heat sink 291 is provided in contact with the connecting block 230. In other words, a gap is formed between the heat sink 291 and the connection block 230. Thereby, the heat exchange between the heat sink 291 and the connection block 230 is suppressed, and the heat dissipation effect of the heat sink 291 is improved. The size of the gap can be easily controlled by adjusting the height of the member 293.

  The injection nozzle 292 is provided alongside the heat sink 291 and is configured to inject the air G toward the heat sink 291. That is, the later-described pump 133 that ejects air (compressed air) is connected to the injection nozzle 292. The driving of the pump 133 is controlled by the control unit 8. By blowing the air G onto the heat sink 291, the IC device 9 can be cooled via the heater block 240 and the contact pusher 250. In addition, since the injection nozzle 292 is fixed to the connection block 230 via a fixing tool, the relative position with the heat sink 291 is kept constant. Therefore, the air G is stably jetted to the heat sink 291 and the heat sink 291 can be cooled stably. In addition, although the injection of the air G from the injection nozzle 292 is controlled by the control part 8, the description is mentioned later.

  Moreover, it is preferable that the injection nozzle 292 is comprised so that the air G may be diffusively injected (radially injected). Thus, the air G can be blown over a wider range of the heat sink 291 while reducing the size of the injection nozzle 292. Moreover, it is preferable that the injection cross-sectional shape of the air G injected from the injection nozzle 292 has a shape in which the spread in the Z direction is suppressed more than the spread in the XY plane direction. Thereby, the air G can be efficiently supplied to the heat sink 291.

  Further, by using air as the fluid to be ejected from the ejection nozzle 292, the handling can be simplified and the cost can be reduced. For example, the cooling performance of the IC device 9 can be improved by using a refrigeration cooler or the like and using cooled air. However, the fluid ejected from the ejection nozzle 292 is not limited to air, and for example, gases such as various insulating gases such as nitrogen, argon, carbon dioxide, fluorine-based gas, and mixed gas containing these are applicable. It is. Moreover, you may provide the temperature adjustment part which adjusts the temperature of the air (fluid) injected from the injection nozzle 292. FIG.

  A housing hole is formed in the central portion of the heat sink 291, the heater block 240, and the contact pusher 250 so as to penetrate the vacuum guide path 231. A suction pipe 260 is disposed in the housing hole. A suction pad (suction hole) 270 is connected and fixed to the tip of the suction pipe 260. Then, the IC device 9 can be gripped (sucked and gripped) by the suction pad 270 by driving the pump and sucking air to bring the suction pipe 260 into a negative pressure state. Further, by driving the pump to supply air and releasing the negative pressure state in the suction pipe 260, the IC device 9 held by the suction pad 270 can be released. The suction pad 270 and the contact pusher 250 constitute a grip portion that grips the IC device 9. The heater block 240 and the heater 241 are disposed between the heat sink 291 and the grip portion, that is, between the heat sink 291, the suction pad 270 and the contact pusher 250.

  The heat sink 291, the heater block 240, and the contact pusher 250 are each made of a material that is hard and has high thermal conductivity. The material that is hard and has high thermal conductivity is not particularly limited. For example, various metals such as iron, nickel, cobalt, gold, platinum, silver, copper, aluminum, magnesium, titanium, and tungsten, or of these metals Alloys or intermetallic compounds containing at least one kind, and oxides, nitrides, carbides, and the like of these metals can be given.

  Two rod-shaped heaters (heating units) 241 are embedded in the heater block 240. The driving of the heater 241 is controlled by the control unit 8. When the heater 241 generates heat, the heat is transmitted to the IC device 9 through the heater block 240 and the contact pusher 250, and the temperature of the IC device 9 rises. Thereby, the electrical characteristics of the IC device 9 in a high temperature environment can be inspected.

  The two heaters 241 extend in the Y direction, and are disposed at both ends in the X direction so as to avoid the suction pipe 260 in the center of the heater block 240. Such a heater 241 is not particularly limited as long as the IC device 9 can be heated. For example, various heaters such as an alumina heater, an aluminum nitride heater, a silicon nitride heater, a silicon carbide heater, and a boron nitride heater, nichrome Various cartridge heaters using a heating wire such as a wire can be used. Moreover, the heater 241 is not limited to a rod-shaped heater, and for example, a planar heater can be used. In addition, as a heating part, it is not limited to the heater 241, In addition, for example, a Peltier device etc. are mentioned.

  A temperature sensor 243 is embedded in the heater block 240. The temperature sensor 243 detects (detects) the temperature of the heater block 240 to indirectly detect the temperature of the IC device 9. The detection result of the temperature sensor 243, that is, the signal output from the temperature sensor 243 is input to the control unit 8, and the control unit 8 grasps the temperature detected by the temperature sensor 243. As described above, since the heater block 240 and the contact pusher 250 are made of a material having high thermal conductivity, the temperature difference between the IC device 9 and the heater block 240 is small, and the temperature sensor embedded in the heater block 240. Also by 243, the temperature of the IC device 9 can be detected sufficiently accurately.

  In this embodiment, since the detection part which is a part which actually detects (detects) temperature of the temperature sensor 243 is located in the center part of the heater block 240, the separation distance with an IC device becomes small. Therefore, the temperature of the IC device 9 can be detected more accurately. Further, the heater 241 and the temperature sensor 243 can be separated as much as possible by arranging the two heaters 241 in a rod shape and disposing them at both ends of the heater block 240 in the X direction. Therefore, the temperature sensor 243 is hardly affected by the heat from the heater 241.

  The temperature sensor 243 is not particularly limited as long as the temperature of the IC device 9 can be detected. For example, a Pt sensor such as a platinum sensor, a thermocouple, a thermistor, or the like can be used. When the IC device 9 includes a thermal diode or the like, the temperature sensor 243 may be omitted and the temperature of the IC device 9 may be detected by the thermal diode.

  The temperature sensor 243 of the present embodiment is arranged so as to indirectly detect the temperature of the IC device 9, but the arrangement is not particularly limited as long as the temperature of the IC device 9 can be detected. For example, the temperature of the IC device 9 may be directly detected. Specifically, the temperature sensor 243 may be disposed so as to be exposed on the lower surface of the device chuck 220 and come into contact with the IC device 9 when pressed. In the inspection apparatus 1, the temperature of the IC device 9 may be a temperature obtained by adding a predetermined correction to the temperature detected by the temperature sensor 243 in consideration of the thermal resistance of the heater block 240 and the contact pusher 250.

  In the present embodiment, the temperature sensor 243 is embedded in the heater block 240. However, the temperature sensor 243 may be embedded in the contact pusher 250, which is closer to the IC device 9, and the temperature detection accuracy is improved. It is thought to improve. However, since the contact pusher 250 is a member that is appropriately selected depending on the type and size of the IC device 9, if the temperature sensor 243 is disposed in the contact pusher 250, the temperature sensor 243 is provided in all the replacement contact pushers 250. It must be placed, which increases costs. Therefore, if the purpose is to reduce the cost, the temperature sensor 243 is preferably arranged in the heater block 240 as in the present embodiment.

  According to such a hand unit 433, the temperature of the IC device 9 is maintained within a predetermined temperature range (for example, about a set temperature ± 2 ° C.) by heating the IC device 9 with the heater 241 and cooling with the air G. be able to. In particular, the temperature rise due to self-heating of the IC device 9 can be quickly canceled by the air G, the temperature of the IC device 9 being inspected can be kept substantially constant, and the inspection of the IC device 9 is more accurate. Can be done well.

-Recovery robot-
The collection robot 44 is a robot that conveys the IC device 9 that has been inspected by the inspection unit 5 to the collection side arrangement unit 6. Such a collection robot 44 is supported by the support frame 441 supported by the base 11, the moving frame 442 supported by the support frame 441 and reciprocally movable in the Y direction with respect to the support frame 441, and the moving frame 442. And four hand units (gripping robots) 443. Each hand unit 443 includes an elevating mechanism and a suction nozzle, and can grip the IC device 9 by suction.

  Such a transport unit 4 transports the IC device 9 as follows. First, the shuttle 41 moves to the left in the figure, and the supply robot 42 transports the IC device 9 on the placement stage 341 to the shuttle 41 (STEP 1). Next, the shuttle 41 moves to the center, and the inspection robot 43 transports the IC device 9 on the shuttle 41 to the inspection unit 5 (STEP 2). Next, the inspection robot 43 transports the IC device 9 that has been inspected by the inspection unit 5 to the shuttle 41 (STEP 3). Next, the shuttle 41 moves to the right side in the drawing, and the collection robot 44 conveys the inspected IC device 9 on the shuttle 41 to the collection side arrangement unit 6. (STEP 4) By repeating such STEP 1 to STEP 4, the IC device 9 can be transported to the collection side arrangement unit 6 via the inspection unit 5.

  The configuration of the transport unit 4 has been described above. As the configuration of the transport unit 4, the IC device 9 on the mounting stage 341 is transported to the inspection unit 5, and the IC device 9 that has been inspected is collected on the collection side array unit 6. If it can be conveyed to, it will not be specifically limited. For example, the shuttle 41 is omitted, and any one of the supply robot 42, the inspection robot 43, and the collection robot 44 is used to transport the placement stage 341 to the inspection unit 5, and from the inspection unit 5 to the collection side arrangement unit 6. You may carry to.

≪Inspection Department≫
The inspection unit 5 is a unit that inspects and tests the electrical characteristics of the IC device 9. As shown in FIG. 2, the inspection unit 5 includes four holding units 51 in which the IC devices 9 are arranged. Each of the holding portions 51 is provided with a plurality of probe pins (not shown) that are electrically connected to the terminals of the IC device 9. Each probe pin is electrically connected to the control unit 8. When the IC device 9 is inspected, one IC device 9 is arranged (held) in one holding unit 51. Each terminal of the IC device 9 disposed in the holding unit 51 is pressed against each probe pin with a predetermined inspection pressure by pressing of the hand unit 433 of the inspection robot 43. Thereby, each terminal of the IC device 9 and each probe pin are electrically connected (contacted), and the IC device 9 is inspected via the probe pin. The inspection of the IC device 9 is performed based on a program stored in the control unit 8.

≪Control part≫
The control unit 8 includes, for example, an inspection control unit and a drive control unit. The inspection control unit, for example, inspects the electrical characteristics of the IC device 9 disposed in the inspection unit 5 based on a program stored in a memory (not shown). The drive control unit controls the driving of each of the supply unit 2, the supply side arrangement unit 3, the conveyance unit 4, the inspection unit 5, the collection side arrangement unit 6, and the collection unit 7, for example, conveyance of the IC device 9 and the like. I do.

  Next, a mechanism for injecting the air G to the heat sink 291 will be described, but a mechanism for one injection nozzle 292 will be described as a representative.

  As shown in FIG. 4, the inspection apparatus 1 includes a pump (fluid supply unit) 133 that ejects air G and supplies the air G to the ejection nozzle 292, and a tube body 14 that connects the pump 133 and the ejection nozzle 292. And a flow meter (flow rate sensor) 242 as a flow rate detection unit for detecting (measuring) the flow rate of the air G injected from the injection nozzle 292. The lumen of the tube body 14 is a flow path through which the air G flows.

  Moreover, the flowmeter 242 is installed in the tube body 14, for example. A signal indicating the flow rate of the air G detected by the flow meter 242 is input to the control unit 8, and the control unit 8 grasps the flow rate of the air G detected by the flow meter 242. The flow meter 242 may be preset in the tube body 14 or may be retrofitted as long as it can detect the flow rate of the air G injected from the injection nozzle 292.

  As another method for detecting the flow rate of the air G by the flow meter 242, for example, a heat ray flow meter is used as the flow meter 242, and the flow meter 242 is disposed in the vicinity of the injection nozzle 292 to detect the flow rate of the air G. . The vicinity of the injection nozzle 292 includes an internal space of the injection nozzle 292, an opening of the injection nozzle 292, a position separated from the opening of the injection nozzle 292 by a predetermined distance, and the like.

  Further, the tube body 14 is branched into the first tube body 141 and the second tube body 142 in the middle of the tube body 14 and merges again. That is, the first tube body 141 and the second tube body 142 are connected in parallel. The lumen of the first tube 141 is a first channel through which the air G flows, and the lumen of the second tube 142 is a second channel through which the air G flows. The cross-sectional area in the direction orthogonal to the central axis of the lumen (first flow path) of the first tubular body 141 is the central axis of the lumen (second flow path) of the second tubular body 142. It is larger than the cross-sectional area in the direction orthogonal to.

  An electromagnetic valve (valve) 131 that opens and closes the flow path (first flow path) is provided in the middle of the first tubular body 141. Further, a throttle valve (second flow rate adjusting unit) 132 that adjusts the opening degree and adjusts the flow rate of the air G flowing through the second tubular body 142 is provided in the middle of the second tubular body 142. ing. As described above, one end portion of the second tubular body 142 communicates with a portion (end portion in the present embodiment) on the upstream side of the electromagnetic valve 131 of the first tubular body 141, and the second tubular body The other end portion of 142 communicates with a portion (end portion in the present embodiment) on the downstream side of the electromagnetic valve 131 of the first tubular body 141. That is, the second tubular body 142 bypasses the electromagnetic valve 131. The driving of the electromagnetic valve 131 and the throttle valve 132 is controlled by the control unit 8. The first tube body 141, the second tube body 142, the electromagnetic valve 131, the throttle valve 132, and the like constitute the flow rate adjusting unit 100 that adjusts the flow rate of the air G injected from the injection nozzle 292.

  The flow rate adjustment unit 100 can adjust the average flow rate of the air G injected from the injection nozzle 292 to a first average flow rate and a second average flow rate larger than the first average flow rate under the control of the control unit 8. It is configured. The average flow rate when the solenoid valve 131 is closed and the throttle valve 132 is opened and the opening degree is set to a predetermined opening degree is the first average flow rate. The electromagnetic valve 131 is opened and the throttle valve 132 is opened and opened. The average flow rate when the degree is set to a predetermined opening is the second average flow rate. The “average flow rate” is an average value of the flow rate of the air G injected from the injection nozzle 292 in a predetermined unit time. In addition, since the flow rate of the air G may increase or decrease with time, in this embodiment, the flow rate of the air G is managed using the average flow rate instead of the instantaneous value of the flow rate of the air G.

  The flow rate adjusting unit 100 sets the average flow rate to the first average flow rate before inspecting the IC device 9. On the other hand, the second average flow rate is included in the average flow rate during the inspection of the IC device 9. Details will be described below.

  First, in the inspection apparatus 1, the temperature sensor 243 detects the temperature of the IC device 9, and based on the detection result, the temperature of the IC device 9 becomes a predetermined set temperature (target temperature) suitable for the inspection. Temperature control.

  Before the inspection of the IC device 9, the electromagnetic valve 131 is closed and the throttle valve 132 is open. The opening of the throttle valve 132 is adjusted to a predetermined opening. Then, while driving the heater 241 to heat the IC device 9, the pump 133 is driven to inject the air G from the injection nozzle 292 toward the heat sink 291, cool the IC device 9, balance these, The temperature of the IC device 9 is adjusted to the set temperature. In this case, since the electromagnetic valve 131 is closed, the average flow rate of the air G injected from the injection nozzle 292 is the first average flow rate.

  During the inspection of the IC device 9, the IC device 9 may self-heat due to energization of the IC device 9 and may become higher than the set temperature. For this reason, when the temperature of the IC device 9 detected by the temperature sensor 243 is higher than the threshold value Tmax which is the upper limit value of the set temperature allowable range, the output of the heater 241 is reduced or stopped, and the electromagnetic valve 131 is opened. The average flow rate of the air G injected from the injection nozzle 292 is set to the second average flow rate. As a result, the amount of heat radiated from the heat sink 291 increases, and the IC device 9 is further cooled. Further, since the air G is blown onto the heat sink 291 before the temperature of the IC device 9 becomes higher than the threshold value Tmax, the cooling responsiveness (cooling responsiveness) is improved, and the temperature of the IC device 9 is rapidly reduced. Can be made. In this way, the temperature of the IC device 9 is controlled to be the set temperature.

  In addition, after completion of the inspection of the IC device 9, the electromagnetic valve 131 is closed, and the average flow rate of the air G injected from the injection nozzle 292 is set to the first average flow rate to prepare for the next inspection of the IC device 9.

  Here, the first average flow rate a is not particularly limited, and is appropriately set according to various conditions, but is preferably 1 mL / second or more and 500 mL / second or less, preferably 10 mL / second or more, More preferably, it is 100 mL / second or less.

  If the first average flow rate a is larger than the upper limit value, although depending on other conditions, it is necessary to increase the output of the heater 241 and the energy consumption increases.

  If the first average flow rate a is smaller than the lower limit value, the cooling responsiveness when the IC device 9 is cooled is lowered depending on other conditions.

  The second average flow rate b is not particularly limited and is appropriately set according to various conditions, but is preferably 2 mL / second or more and 1000 mL / second or less, and is preferably 20 mL / second or more and 200 mL. / Second or less is more preferable.

  When the second average flow rate b is larger than the upper limit value, energy consumption increases although it depends on other conditions.

  In addition, when the second average flow rate b is smaller than the lower limit value, the cooling response in cooling the IC device 9 is deteriorated depending on other conditions.

  Further, the ratio (b / a) between the first average flow rate a and the second average flow rate b is not particularly limited and is appropriately set according to various conditions, but is 1.5 or more. It is preferably 2 or more and 10 or less.

  If b / a is larger than the upper limit, energy consumption increases although it depends on other conditions.

  Moreover, if b / a is smaller than the lower limit value, the cooling response in cooling the IC device 9 is lowered although it depends on other conditions.

  Next, the control operation of the control unit 8 in controlling the average flow rate of the air G ejected from the ejection nozzle 292 will be described.

  First, as shown in FIG. 5, before the inspection of the IC device 9, the average flow rate of the air G ejected from the ejection nozzle 292 is set to the first average flow rate (step S101). Then, as described above, the temperature sensor 243 detects the temperature of the IC device 9, and based on the detection result, temperature control is performed so that the temperature of the IC device 9 becomes the set temperature.

  Next, it is determined whether or not the inspection of the IC device 9 is started (step S102). When the inspection is started, the temperature T of the IC device 9 is detected by the temperature sensor 243 (step S103) and detected. It is determined whether or not the temperature T is higher than a threshold value Tmax that is an upper limit value of the allowable range of the set temperature (step S104).

  If it is determined in step S104 that the detected temperature T is equal to or lower than the threshold value Tmax, the average flow rate is set to the first average flow rate (step S105). That is, when the current average flow rate is the first average flow rate, it is maintained, and when the current average flow rate is the second average flow rate, the average flow rate is changed to the first average flow rate.

  If it is determined in step S104 that the detected temperature T is greater than the threshold value Tmax, the average flow rate is set to the second average flow rate (step S106). That is, when the current average flow rate is the second average flow rate, it is maintained, and when the current average flow rate is the first average flow rate, the average flow rate is changed to the second average flow rate. In this case, as described above, the output of the heater 241 is reduced or stopped.

  Next, it is determined whether or not the inspection of the IC device 9 has been completed (step S107). If the inspection has not been completed, the process returns to step S103, and step S103 and subsequent steps are executed again. When the inspection of the IC device 9 is completed, the average flow rate is set to the first average flow rate in preparation for the next inspection of the IC device 9 (step S108). That is, when the current average flow rate is the first average flow rate, it is maintained, and when the current average flow rate is the second average flow rate, the average flow rate is changed to the first average flow rate. This is the end of this program.

  As described above, according to the inspection apparatus 1, when the IC device 9 is cooled, the cooling responsiveness can be improved. Thus, in the control for keeping the temperature of the IC device 9 at the set temperature for the inspection, when the temperature of the IC device 9 is higher than the set temperature, the temperature of the IC device 9 can be quickly reduced.

  Further, the temperature of the suction pad 270 and the contact pusher 250 that are in contact with the IC device 9 should be set to the inspection set temperature, and the temperature of the heat sink 291 should be as low as possible. That is, the larger the temperature gradient between the suction pad 270 and the contact pusher 250 and the heat sink 291, the better the cooling responsiveness. The temperature gradient between the suction pad 270 and the contact pusher 250 and the heat sink 291 is increased. Thereby, the IC device 9 can be quickly cooled via the heat sink 291. Further, the IC device 9 can be easily heated via the suction pad 270 and the contact pusher 250.

Second Embodiment
FIG. 6 is a block diagram showing the main part of a second embodiment of the electronic component inspection apparatus of the present invention.

Hereinafter, although the second embodiment will be described, the description will focus on the differences from the first embodiment described above, and the description of the same matters will be omitted.
As shown in FIG. 6, in the inspection apparatus 1 of the second embodiment, an electromagnetic valve (valve) 134 that opens and closes the flow path (second flow path) is provided in the middle of the second tubular body 142. Yes. The first tubular body 141, the second tubular body 142, the electromagnetic valves 131 and 134, the throttle valve 132, and the like constitute the flow rate adjusting unit 100 that adjusts the flow rate of the air G ejected from the ejection nozzle 292.

  In the second embodiment, after completion of the inspection of the IC device 9, a period in which the average flow rate of the air G injected from the injection nozzle 292 is set to a flow rate smaller than the first average flow rate or a temperature increase period in which the air G is not injected into the heat sink 291 is set. Provide. This temperature increase period starts when the inspection of the IC device 9 is completed. When the average flow rate is smaller than the first average flow rate, the opening degree of the throttle valve 132 is adjusted. When the average flow rate is set to “0”, that is, when the air G is not injected into the heat sink 291, the electromagnetic valve 134 is closed. When the temperature increase period ends, the average flow rate of the air G injected from the injection nozzle 292 is set to the first average flow rate.

  After the inspection of the IC device 9, the energization to the IC device 9 is stopped, so that the temperature of the IC device 9 is decreased. By providing the temperature increase period, the IC device 9 is sprayed onto the heat sink 291 after the inspection of the IC device 9 is completed. Compared with the case where the average flow rate of the air G is set to the first average flow rate, the temperatures of the suction pad 270 and the contact pusher 250 can be rapidly increased, and the next IC device 9 can be quickly prepared for inspection. .

  Further, the length of the temperature rise period is not particularly limited, and is appropriately set according to various conditions, but is preferably 10 seconds or longer and 10 minutes or shorter, and is preferably 30 seconds or longer and 5 minutes or shorter. More preferably.

  If the temperature rise period is longer than the upper limit value, the temperature of the suction pad 270 and the contact pusher 250 may become too high, depending on other conditions.

  Further, if the temperature increase period is shorter than the lower limit value, the temperature of the suction pad 270 and the contact pusher 250 may not be sufficiently increased although it depends on other conditions.

  According to the second embodiment as described above, the same effect as that of the first embodiment described above can be exhibited.

  In the present embodiment, the start time of the temperature rise period is when the inspection of the IC device 9 is completed, but is not limited thereto, and may be after the inspection of the IC device 9 is completed.

<Third Embodiment>
FIG. 7 is a block diagram showing a main part of a third embodiment of the electronic component inspection apparatus of the present invention.

  In the following, the third embodiment will be described. The description will focus on the differences from the first embodiment described above, and the description of the same matters will be omitted.

  As shown in FIG. 7, in the inspection apparatus 1 according to the third embodiment, the tube body 14 is not branched. Further, an electromagnetic valve 131 that opens and closes the flow path and a throttle valve 135 that adjusts the opening degree and adjusts the flow rate of the air G flowing through the pipe body 14 are provided in the middle of the pipe body 14. The electromagnetic valve 131, the throttle valve 135, and the like constitute a flow rate adjusting unit 100 that adjusts the flow rate of the air G injected from the injection nozzle 292. The electromagnetic valve 131 and the throttle valve 135 constitute a flow rate adjustment valve 136.

  The flow rate adjustment valve 136 only needs to adjust at least one of the opening degree and the opening / closing period, but in the present embodiment, the opening degree and the opening / closing period can be adjusted.

  The flow rate adjusting valve 136 can adjust the average flow rate of the air G injected from the injection nozzle 292 to the first average flow rate and the second average flow rate by adjusting the opening degree of the throttle valve 135.

  Further, the flow rate adjusting valve 136 adjusts the opening / closing period of the electromagnetic valve 131, that is, the average flow rate of the air G injected from the injection nozzle 292 by PWM control, the first average flow rate and the second average flow rate. Can be adjusted.

According to the third embodiment as described above, the same effects as those of the first embodiment described above can be exhibited.
The third embodiment can also be applied to the second embodiment.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated based on embodiment of illustration, this invention is not limited to this, The structure of each part has the same function. Any configuration can be substituted. In addition, any other component may be added to the present invention.

  Further, the present invention may be a combination of any two or more configurations (features) of the above embodiments.

DESCRIPTION OF SYMBOLS 1 ... Inspection apparatus 10 ... Conveyance apparatus 100 ... Flow volume adjustment part 11 ... Base 111 ... Base surface 12 ... Cover 2 ... Supply part 3 ... Supply side arrangement | positioning part 341 ... Mounting stage 4 ... Conveying section 41 …… Shuttle 411 …… Pocket 42 …… Supply robot 421 …… Support frame 422 …… Moving frame 423 …… Hand unit 43 …… Inspection robot 431 …… Support frame 432 …… Moving frame 433 …… Hand unit 44 …… Recovery robot 441 …… Support frame 442 …… Moving frame 443 …… Hand unit 5 …… Inspection part 51 …… Holding part 6 …… Recovery side array part 7 …… Recovery part 8 …… Control part 9 …… IC device 131, 134 ... Solenoid valve 132, 135 ... Throttle valve 133 ... Pump 136 ... Flow control valve 14 ... Tube 141 …… First tube 142 · Second tube 151 ··· Coil spring 210 ··· Air cylinder 211 ··· Cylinder tube 212 ··· Tube body 213 ··· Front plate 214 ··· Piston 215 ··· Air inlet 220 …… Device chuck 230 …… Connection block 231 …… Vacuum guide path 240 …… Heater block 241 …… Heater 242 …… Flow meter 243 …… Temperature sensor 250 …… Contact pusher 260 …… Suction tube 270 …… Suction pad 290 ... Cooling unit 291 ... Heat sink 292 ... Injection nozzle 293 ... Member D1 ... First chamber D2 ... Second chamber P1, P2 ... Connection port G ... Air S101 to S108 ... Step

Claims (14)

A gripper for gripping electronic components;
A heating unit;
A heat dissipating part;
A fluid ejecting unit that ejects fluid to the heat radiating unit;
A flow rate adjusting unit for adjusting the flow rate of the fluid ejected from the fluid ejecting unit,
The flow rate adjustment unit is capable of adjusting the average flow rate of the fluid ejected from the fluid ejection unit to a first average flow rate and a second average flow rate that is greater than the first average flow rate,
Before inspecting the electronic component, the average flow rate is the first average flow rate,
The electronic component transport apparatus according to claim 1, wherein the second average flow rate is included in the average flow rate during the inspection of the electronic component.   The electronic component conveying apparatus according to claim 1, wherein the heating unit is disposed between the heat radiating unit and the gripping unit.   The electronic component transport apparatus according to claim 1, further comprising a temperature sensor that detects a temperature of the electronic component.   The said flow volume adjustment part makes the said average flow volume the said 2nd average flow volume, when the temperature detected by the said temperature sensor is higher than a threshold value while inspecting the said electronic component. Electronic component transport device.   The electronic component conveying apparatus according to claim 1, further comprising a fluid supply unit that supplies the fluid to the fluid ejecting unit.   The electronic component conveying apparatus according to claim 1, wherein the flow rate adjusting unit is a flow rate adjusting valve capable of adjusting a flow rate.   The electronic component conveying apparatus according to claim 6, wherein the flow rate adjusting valve is capable of adjusting at least one of an opening degree and an opening / closing period. The flow rate adjustment unit includes a first flow path through which the fluid flows,
A valve for opening and closing the first flow path;
The electronic component transport apparatus according to claim 1, further comprising: a second flow path through which the fluid flows and bypasses the valve.   One end of the second flow path communicates with a portion of the first flow path upstream of the valve, and the other end of the second flow path is the first flow path. The electronic component conveying apparatus according to claim 8, wherein the electronic component conveying apparatus is in communication with a portion of the path downstream of the valve.   The electronic component conveyance according to claim 8 or 9, wherein a cross-sectional area in a direction orthogonal to the central axis of the first flow path is larger than a cross-sectional area in a direction orthogonal to the central axis of the second flow path. apparatus.   11. The electronic component conveying apparatus according to claim 8, further comprising a second channel flow rate adjusting unit that adjusts a flow rate of the fluid flowing through the second channel.   The electronic component transport apparatus according to claim 1, wherein after the inspection of the electronic component is finished, the average flow rate is set to the first average flow rate.   12. The period after the completion of the inspection of the electronic component includes a period in which the average flow rate is smaller than the first average flow rate or a period in which the fluid is not injected into the heat radiating unit. The electronic component conveying apparatus described in 1. A gripper for gripping electronic components;
A heating unit;
A heat dissipating part;
A fluid ejecting unit that ejects fluid to the heat radiating unit;
A flow rate adjusting unit for adjusting a flow rate of fluid ejected from the fluid ejecting unit;
An inspection unit for inspecting the electronic component,
The flow rate adjustment unit is capable of adjusting the average flow rate of the fluid ejected from the fluid ejection unit to a first average flow rate and a second average flow rate that is greater than the first average flow rate,
Before inspecting the electronic component, the average flow rate is the first average flow rate,
The electronic component inspection apparatus, wherein the second average flow rate is included in the average flow rate during the inspection of the electronic component.

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