KR20160002022A - Bonding head and die bonding apparatus having the same - Google Patents

Abstract

Provided is a bonding head to bond a die on the substrate and a die boding apparatus having the same. The bonding head comprises: a main body mounted on a driving unit to transfer the die; a plate-shaped heater mounted on the bottom surface of the main body; a collet mounted on the bottom surface of the heater to grip the die using vacuum pressure; and a cooling module connected to the main body, and supplying refrigerant to cool the heater to the top surface of the heater through the main body.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a bonding head and a die bonding apparatus including the bonding head,

Embodiments of the present invention relate to a bonding head and a die bonding apparatus including the bonding head. And more particularly, to a bonding head for picking up a die from a wafer and bonding the substrate to a substrate, and a die bonding apparatus including the bonding head.

Generally, in the die bonding process, a bonding head for picking up the dies from the wafer and bonding the individual dies on the substrate in order to bond the dies on a substrate such as a printed circuit board, a lead frame and the like through a soaking process can be used. The bonding head may include a collet for picking up a die using vacuum pressure and a body to which the collet is mounted, and may be mounted on a driving unit for moving the die.

On the other hand, the bonding head may heat the die to bond the die onto the substrate, and may include a heater for this purpose. As an example, Korean Patent Laid-Open Publication No. 10-2013-0007657 discloses an electronic component mounting apparatus having a ceramic heater assembly and a bonding tool.

In particular, the bonding tool is mounted on the ceramic heater assembly, and the ceramic heater assembly includes a heater base having a ceramic heater incorporated therein. The heater base and the bonding tool are provided with a first cooling channel for cooling the heater base and a second cooling channel for cooling the bonding tool. Air can be supplied as a coolant to the first and second cooling passages, and the air is discharged to the outside from the first and second cooling passages.

However, in the related art, since the heater base and the bonding tool are entirely cooled by using only air, a considerable time may be required to cool the heater base and the bonding tool, so that the productivity of the die bonding process is deteriorated .

Embodiments of the present invention provide a bonding head capable of shortening the time required for temperature control and a die bonding apparatus including the bonding head.

According to an aspect of the present invention, there is provided a bonding head for bonding a die to a substrate, the bonding head including a body mounted to a driving unit for feeding the die, A collet for mounting the die on the lower surface of the heater and for holding the die by using vacuum pressure; a cooler connected to the main body for supplying a coolant for cooling the heater to the upper surface of the heater through the main body; Modules. At this time, the refrigerant may include air and water.

According to embodiments of the present invention, the cooling module includes: a compressed air source for supplying the air; an ultrasonic generator connected to the cooling pipe connecting between the compressed air source and the main body, And may include a vibrating unit.

According to embodiments of the present invention, the ultrasonic vibration unit may include a water tank for containing the water, an ultrasonic vibrator disposed in the water tank for granulating the water using ultrasonic waves, And a valve for regulating the supply amount of the water.

According to embodiments of the present invention, the lower surface of the main body may be provided with a cooling channel provided with the coolant, and the cooling channel may extend to the side of the main body to discharge the coolant to the outside of the main body. have.

According to embodiments of the present invention, the main body may include a fixing block mounted on the driving unit and a heat insulating block mounted on a lower portion of the fixing block, wherein the cooling channel is provided on the lower surface of the heat insulating block .

According to the embodiments of the present invention, the heater and the collet may be respectively provided with through holes connected to each other, and the main body may be provided with a vacuum flow path connected to the through hole of the heater.

According to embodiments of the present invention, the lower surface of the heater may be provided with a vacuum channel for vacuum adsorption of the collet, and the main body may be provided with a vacuum flow path connected to the vacuum channel, And a through hole connecting the vacuum channel and the vacuum channel may be provided.

According to another aspect of the present invention, there is provided a die bonding apparatus including a bonding head for bonding a die onto a substrate, the bonding head including: a main body mounted to a driving unit for transferring the die; , A plate heater mounted on a lower surface of the main body, a collet mounted on a lower surface of the heater for holding the die using a vacuum pressure, and a collet connected to the main body, And a cooling module for supplying a coolant for cooling the heater. At this time, the refrigerant may include air and water.

According to embodiments of the present invention as described above, the bonding head may include a body mounted on a body, a heater mounted on a lower portion of the body, and a collet mounted on a lower portion of the heater. Particularly, the heater can be cooled by the air supplied through the body and the water in the particle state. Particularly, the water in the particle state can be vaporized at a position adjacent to the heater, whereby the cooling efficiency of the heater can be greatly improved.

The main body may include a fixing block and a heat insulating block, and the heater may be mounted under the heat insulating block. Therefore, unlike the prior art, only the heater is cooled by using the air and the particulate water, so that the cooling rate of the heater can be further improved.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a schematic block diagram illustrating a die bonding apparatus according to embodiments of the present invention. FIG.
2 is a schematic bottom view for explaining the bonding head shown in Fig.
Figs. 3 and 4 are schematic sectional views for explaining the bonding head shown in Fig. 2. Fig.
Fig. 5 is a schematic bottom view for explaining the heater shown in Fig. 2. Fig.
FIG. 6 is a schematic diagram for explaining the cooling module shown in FIG. 1. FIG.
Fig. 7 is a schematic bottom view for explaining the heat insulating block shown in Fig. 2. Fig.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

In the embodiments of the present invention, when one element is described as being placed on or connected to another element, the element may be disposed or connected directly to the other element, . Alternatively, if one element is described as being placed directly on another element or connected, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used in the embodiments of the present invention is used for the purpose of describing specific embodiments only, and is not intended to be limiting of the present invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Thus, changes from the shapes of the illustrations, e.g., changes in manufacturing methods and / or tolerances, are those that can be reasonably expected. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the regions described in the drawings, but include deviations in the shapes, and the elements described in the drawings are entirely schematic and their shapes Is not intended to describe the exact shape of the elements and is not intended to limit the scope of the invention.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a schematic diagram for explaining a die bonding apparatus according to embodiments of the present invention; FIG. 2 is a schematic bottom view for explaining a bonding head shown in FIG. 1;

Referring to FIGS. 1 and 2, a die bonding apparatus 10 according to an embodiment of the present invention picks up the dies 30 from a wafer 20 made of individualized dies through a soaking process, For example, on a substrate 40 such as a substrate, a lead frame, or the like. Although not shown, the dies 30 may be provided attached to a dicing film (not shown) and the dicing film may be mounted to a mount frame (not shown) in the form of a generally circular ring .

Also, though not shown, the dies 30 can be selectively separated from the dicing film by a die ejecting unit (not shown) and picked up by the bonding head 100. Particularly, the die bonding apparatus 10 may include a driving unit (driving unit) to which the bonding head 100 is mounted. The driving unit picks up the die 30 using the bonding head 100, The bonding head 100 may be moved to bond the picked-up die 30 onto the substrate 40. As an example, the driving unit may have a rectangular coordinate robot shape.

According to an embodiment of the present invention, the bonding head 100 includes a main body 110 mounted on the driving unit, a plate-like heater 130 mounted on a lower surface of the main body 110, And a heater 130 connected to the upper surface of the heater 130 through the main body 110. The heater 130 is connected to the main body 110, And a cooling module 150 for supplying a refrigerant for cooling the refrigerant.

The main body 110 may include a fixing block 112 mounted on the driving unit and a heat insulating block 114 mounted on a lower portion of the fixing block 112. The heat insulating block 114 may be used to prevent heat transfer from the heater 130 to the fixing block 112. Although not shown, the heat insulating block 114 may be formed using a fastening member such as a bolt And can be mounted on the fixed block 112.

For example, the heat insulating block 114 may be made of aluminum oxide (Al ₂ O ₃ ), and the heat insulating block 114 may heat the heater 140 thermally from the fixing block 112 and the driving part. Can be isolated.

As the heater 130, a ceramic heater including an electric resistance heating wire may be used. The heater 130 may be mounted on the lower surface of the main body 110, that is, the lower surface of the heat insulating member 114, using a fastening member such as a bolt, The die 30 may be heated to bond the substrate 40 onto the substrate 40.

For example, the bonding head 100 may thermally press the die 30 onto the substrate 40 by heating. The collet 140 may grip the die 30 for picking up and transporting the die 30 and may function as a bonding tool. As an example, the collet 140 may vacuum adsorb the die 30 using vacuum pressure and may be bonded to the substrate 40 by pressing the die 30.

Figs. 3 and 4 are schematic cross-sectional views for explaining the bonding head shown in Fig. 2, and Fig. 5 is a schematic bottom view for explaining the heater shown in Fig.

3 through 5, the heater 130 and the collet 140 may be provided with through holes 132 and 142, respectively, which are connected to each other. 110 may include a first vacuum passage 116 connected to the through hole of the heater 130. As shown in the figure, the central portions of the heater 130 and the collet 140 may be provided with through holes 132 and 142 connected to each other, The fixing block 112 and the heat insulating block 114 may be formed through the central portion of the main body 110, that is, the central portion of the fixing block 112 and the heat insulating block 114.

Although not shown in detail, the first vacuum passage 116 may be connected to a vacuum module 160 (see FIG. 1) including a vacuum pump and a valve, and the bonding head 100 may be connected to the vacuum module 160, The die 30 can be gripped using a vacuum provided from the die 30.

Also, according to one embodiment of the present invention, the collet 140 may be mounted on the lower surface of the heater 130 using a vacuum pressure. For example, a vacuum channel for vacuum adsorption of the collet 140 may be provided on the lower surface of the heater 130, and a second vacuum channel connected to the vacuum channel may be provided in the main body 110 .

5, an inner vacuum channel 134 surrounding the central portion of the heater 130 and an outer vacuum channel 134 surrounding the inner vacuum channel 134 are formed on the lower surface of the heater 130, (136) may be provided. In one example, the inner and outer vacuum channels 134 and 136 have a substantially rectangular ring shape, but the shapes of the inner and outer vacuum channels 134 and 136 may vary widely, The scope is not limited.

As shown in the figure, the main body 110 may include an inner vacuum channel 118 connected to the inner vacuum channel 134 and an outer vacuum channel 120 connected to the outer vacuum channel 136 . Although not shown in detail, the inner and outer vacuum passages 118 and 120 may be connected to the vacuum module 160. The heater 130 may include the inner and outer vacuum passages 118 and 120, The through holes 138, 139 connecting the inner and outer vacuum channels 134, 136 may be provided. 3, the inner and outer vacuum passages 118 and 120 are formed on both sides of the central portion of the heater 130 in order to uniformly apply the vacuum pressure to the heater 130, .

According to another embodiment of the present invention, a vacuum channel (not shown) having a substantially ring shape may be provided on the lower surface of the heater 130, and a vacuum channel (not shown) .

Meanwhile, the cooling module 150 may provide a coolant to the upper surface of the heater 130 to cool the heater 130. According to an embodiment of the present invention, the main body 110 may be provided with a cooling channel connected to the cooling module 150. For example, the main body 110 may include a first cooling channel 122 and a second cooling channel 124, and the first and second cooling channels 122 and 124 may be formed in the fixed block 112 extending from the side of the heat insulating block 114 to the upper surface of the heater 130. However, the number and shape of the cooling channel may be variously changed, so that the scope of the present invention is not limited thereto.

Fig. 6 is a schematic structural view for explaining the cooling module shown in Fig. 1, and Fig. 7 is a schematic bottom view for explaining the heat insulating block shown in Fig.

Referring to FIGS. 6 and 7, according to an embodiment of the present invention, the cooling module 150 may supply water together with air as a refrigerant to improve the cooling efficiency of the heater 130. The water supplied together with the air can be vaporized at a position adjacent to the heater 130 so that the cooling of the heater 130 can be performed more quickly.

The cooling module 150 may be connected to the first and second cooling flow paths 122 and 124 of the main body 110 through a cooling pipe. As an example, the cooling module 150 may include a compressed air source 152 for supplying the air and an ultrasonic vibration unit 154 for supplying the water together with the air in a fine particle state .

Although not shown in detail, the compressed air source 152 includes a container for storing compressed air, an air pump for providing compressed air, a valve for controlling the flow rate of the air, Filters, and the like.

The ultrasonic vibration unit 154 may be connected to a cooling pipe connecting between the main body 110 and the compressed air source 152 as shown, Can supply. The ultrasonic vibration unit 154 is connected to the cooling pipe and includes a water tank 156 for receiving the water, an ultrasonic wave generator 156 disposed in the water tank 156, A vibrator 158, and a valve 159 for regulating the supply amount of water granulated by the ultrasonic vibrator 158. On the other hand, deionized water may be used as the water.

The water in the form of particles as described above may be supplied to the upper surface of the heater 130 attached to the lower surface of the heat insulating block 114 together with the air. At this time, a cooling channel 126 functioning as a passage between air and water may be provided on the lower surface of the heat insulating block 114. Particularly, the cooling channel 126 may extend to the side of the body 110, that is, the side of the heat insulating block 114, in order to discharge the air and water out of the body 110.

The water supplied in the particle state as described above can be vaporized in the cooling channel 126 of the heat insulating block 114, whereby the cooling efficiency of the heater 130 can be greatly improved. Although the cooling channel 126 in the form of a square ring is shown, the shape of the cooling channel 126 may be variously changed, so that the scope of the present invention is not limited thereto.

The die bonding apparatus 10 may include a controller (not shown) for controlling a flow rate of the air and a flow rate of water supplied in a fine particle state. Particularly, it is preferable that the supply amount of the water is adjusted within a range that does not cause condensation in the die bonding apparatus 10.

Although not shown, the bonding head 100 may include a temperature sensor (not shown) for measuring the temperature of the heater 130. The controller 130 may control the temperature of the heater 130, The operation of the cooling module 150, for example, the flow rate of the refrigerant can be controlled according to the temperature of the refrigerant. As an example, a thermocouple may be used as the temperature sensor.

The bonding head 100 includes a body 110 and a collet 140 mounted on a lower portion of the body 130. The collet 140 is mounted on a lower portion of the body 130. The collet 140 is mounted on the lower portion of the body 110, . ≪ / RTI > Particularly, the heater 130 may be cooled by the air supplied through the main body 110 and water in the form of particles. Particularly, the water in the particulate state can be vaporized in a cooling channel 126 formed at a position adjacent to the heater 130, for example, at a lower surface of the heat insulating block 114, whereby the cooling efficiency of the heater 130 Can be greatly improved.

In addition, since the heater 130 is mounted under the heat insulating block 114, it is possible to cool only the heater 130 using the air and the particulate water, unlike the prior art, Can be further improved.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.

10: substrate 20: wafer
30: die 40: substrate
10: die bonding apparatus 100: bonding head
110: main body 112: fixed block
114: adiabatic block 116: first vacuum channel
118: Inner vacuum channel 120: Outside vacuum channel
122: first cooling flow passage 124: second cooling flow passage
126: cooling channel 130: heater
140: Collet 150: Cooling module
152: Compressed air source 154: Ultrasonic vibration unit
156: Water tank 158: Ultrasonic vibrator
159: Valve 160: Vacuum module

Claims (8)

A bonding head for bonding a die onto a substrate,
A main body mounted on a driving unit for transferring the die;
A plate-shaped heater mounted on a lower surface of the main body;
A collet mounted on a lower surface of the heater for holding the die using vacuum pressure; And
And a cooling module connected to the main body and supplying coolant for cooling the heater to the upper surface of the heater through the main body, wherein the coolant includes air and water. The cooling system according to claim 1,
A compressed air source for supplying the air; And
And an ultrasonic vibration unit connected to a cooling pipe connecting between the compressed air source and the main body and supplying the water in a granular form. The ultrasonic diagnostic apparatus according to claim 2,
A water tank for containing the water;
An ultrasonic vibrator disposed in the water tank for granulating the water using ultrasonic waves; And
And a valve for controlling the supply amount of the water granulated by the ultrasonic vibrator. The refrigerator according to claim 1, wherein a cooling channel is provided on a lower surface of the main body,
And the cooling channel extends to the side of the main body to discharge the refrigerant to the outside of the main body. 5. The apparatus according to claim 4,
A fixed block mounted on the driving unit; And
And a heat insulating block mounted on a lower portion of the fixing block,
And the cooling channel is provided on a lower surface of the heat insulating block. [3] The apparatus of claim 1, wherein the heater and the collet are provided with through holes,
Wherein the main body is provided with a vacuum flow path connected to the through hole of the heater. [2] The apparatus according to claim 1, wherein a vacuum channel is provided on a lower surface of the heater for vacuum adsorption of the collet,
Wherein the main body is provided with a vacuum channel connected to the vacuum channel,
Wherein the heater is provided with a through hole connecting the vacuum channel and the vacuum channel. A die bonding apparatus comprising a bonding head for bonding a die onto a substrate, the bonding head comprising:
A main body mounted on a driving unit for transferring the die;
A plate-shaped heater mounted on a lower surface of the main body;
A collet mounted on a lower surface of the heater for holding the die using vacuum pressure; And
And a cooling module connected to the main body and supplying coolant for cooling the heater to the upper surface of the heater through the main body, wherein the coolant includes air and water.

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