TWM393796U - Metal substrate of non-thermoelectric separation type and light emitting element having metal substrate of non-thermoelectric separation type - Google Patents

Metal substrate of non-thermoelectric separation type and light emitting element having metal substrate of non-thermoelectric separation type Download PDF

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Publication number
TWM393796U
TWM393796U TW99213987U TW99213987U TWM393796U TW M393796 U TWM393796 U TW M393796U TW 99213987 U TW99213987 U TW 99213987U TW 99213987 U TW99213987 U TW 99213987U TW M393796 U TWM393796 U TW M393796U
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Taiwan
Prior art keywords
metal substrate
heat
separation type
layer
thermoelectric separation
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TW99213987U
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Chinese (zh)
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Tzyy-Jang Tseng
Chang-Ming Lee
wen-fang Liu
Cheng-Po Yu
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Unimicron Technology Crop
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Priority to TW99213987U priority Critical patent/TWM393796U/en
Priority to DE201020008793 priority patent/DE202010008793U1/en
Publication of TWM393796U publication Critical patent/TWM393796U/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)

Description

M393796 五、創作說明： 【新型所屬之技術領域】 本創作係關於一種非熱電分離式之金屬基板及發光元 件，特別是一種可加強發熱元件散熱之非熱電分離式之金屬基 板及發光元件。 【先前技術】 金屬基板(Metal Core PCB，MCPCB)因成本便宜，故常被 使用做為發熱元件的散熱基板’然而金屬基板之熱傳導路徑皆 須通過介電層，對於需高散熱性之發熱元件無法符合散熱所 需。在先前技術中，一種解決方法為改用散熱性高的介電層， 以加速傳導熱至金屬板，但其成本將大幅提高，且散熱效果仍 比不上銅、紹或合金的散熱性。 隨著技術發展的日益進步’發光二極體(Light_Emitting Diode，LED)的亮度與發光效率已大幅躍進，尤其是高亮度發 光二極體(High-brightness Light-Emitting Diode，HBLED)亦已 應用於各領域中。然而，其功率消耗量與發熱量亦隨之提高， 倘若無法迅速地將發熱排除掉時，則將會引發發光二極體的亮 度下降以及加速元件的劣化’因此散熱基板的散熱效能是發光 二極體的重要課題。 因此，有必要提供一種非熱電分離式之金屬基板及發光 元件，以改善先前技術所存在的問題。 3 【新型内容】 本匐作之主要目的係在提供一種增加散熱性之非熱電分 離式之金屬基板及發光元件，制是—種具有盲孔之非熱電分 離式之金屬基板及發光元件。 為達成上述之目的，本創作之非熱電分離式之金屬基板 包括線路層、介電層、_化金屬板及至少-導熱孔崎電層 係設置在線路層之下方；_化金屬板係設置在介電層之下 方’圖案化金屬層之下方係、設有絕緣層；且至少_導熱孔係穿 設線路層及介電層並與圖案化金屬板相連接，至少一導熱孔係 設置導熱物質，且導熱物㈣細案化金屬板接I藉此，當 熱元件置赠蘭之上树，發航賊產生之熱可經由導熱 物質傳導至圖案化金屬板，透過圖案化金屬板進行散熱，以達 到降低發熱元件之溫度之效果。 在本創作之一實施例中，導熱物質包括電鍍填孔或金屬 膏。 為達成上述之目的，本創作之發光元件包括發熱元件、 導熱墊及諸電錄式之金屬基板。魏元件係設置於導熱塾 之上方。非熱電分離式之金屬基板包括線路層、介電層、圖案 化金屬板及至少一導熱孔。導熱墊係設置於線路層之上方；介 電層係設置在線路層之下方；圖案化金屬板係設置在介電層之 下方，圖案化金屬層之下方係設有絕緣層；且至少一導熱孔係 穿設線路層及介電層並與圖案化金屬板相連接，至少一導熱孔 係設置導熱物質，且導熱物質係與圖案化金屬板接觸。藉此， 當發熱元件置於線路層之上方時，發熱元件所產生之熱可經由 導熱物質傳導至圖案化金屬板，透過圖案化金屬板進行散熱， 以達到降低發光元件之溫度之效果。 M393796 在本創作之一實施例中，導熱物質包括電鑛填孔或金屬 膏。 【實施方式】 為讓本創作之上述和其他目的、特徵和優點能更明 顯易懂，下文特舉出較佳實施例，並配合所附圖式，作 詳細說明如下° 以下請^併參考圖1關於本創作之非熱電分離式之 金屬基板的製造方法之一實施例之步驟流程圖以及圖2 至圖5關於本創作之非熱電分離式之金屬基板的製造方法 之一實施例之示意圖。須注意的是，本創作之實施例之 示意圖均為簡化後之示意圖，僅以示意方式說明本創作 之非熱電分離式之金屬基板的製造方法，其所顯示之元 件非為實際實施時之態樣，其實際實施時之元件數目、 形狀及尺寸比例為一選擇性之設計，且其元件佈局型態 可更為複雜。 在本創作之一實施例中，非熱電分離式之金屬基板係 金屬基印刷電路板(Metal Core PCB，MCPCB)。 如圖1所示，本創作首先進行步驟S71 :提供金屬 板0 如圖2所示，在本創作之一實施例中，金屬板13 之材質係金屬銅，但本創作不以此為限；舉例來說，金 屬板13之材質亦可為金屬鋁或其他導熱性佳之金屬。 在本創作之一實施例中，金屬板13之一面係貼覆 介電層12，介電層12之一面係貼覆銅層11。 接著進行步驟S72:形成至少一導熱孔以連接銅層 5 M393796 及金屬板。 如圖3所示，在本創作之—實施例中，本創作之非 熱電分離式之金屬基板的製造方法係製作至少一導熱孔14 穿過銅層11及介電層12。在本創作之一實施例中，導熱孔 14係盲孔，但本創作不以此為限。在本創作之一實施例中， 導熱孔14之製作方式可為光罩搭配雷射鑽孔、直接雷鑽 (Direct Laser Drilling，DLD)或機械鑽孔，但本創作不以此為限。 接著進行步驟S73 :於導熱孔内形成導熱物質。 如圖4所示，在本創作之一實施例中，本創作之非 熱電分離式之金屬基板的製造方法係在導熱孔14内填入導 熱物質141 ’導熱物質141係金屬膏，藉此，導熱物質141係 與銅層11及金屬板13相連接，但本創作不以此為限。舉 例來說，本創作之非熱電分離式之金屬基板的製造方法亦 可以電鐘填孔、電鍍填孔搭配金屬膏、通孔安裝方式(pin Through Hole，PTH)搭配金屬銅或通孔安裝方式搭配金屬膏 等以形成導熱物質141。 最後進行步驟S74 :進行圖案化線路化製程。 如圖5所示，在本創作之一實施例中，本創作之非 熱電分離式之金屬基板的製造方法係分別對銅層11及金 屬板13進行圖案化線路化製程，以形成線路層m及圖 案化金屬板13卜在本創作之一實施例中，線路層lu包 括正極1111及負極1112，具有導熱孔14之線路層⑴區域 係供發熱元件的主要導熱區域，但本創作不以此為限。在本創 作之一實施例中，圖案化金屬板131可以蝕刻或衝壓之方式來 絕緣正極1111及負極1112，但本創作不以此為限。在本創作 之一實施例中，圖案化金屬板131包括絕緣層1311 ^ 6 M393796 如圖5所示，藉由上述之製造方法，本創作之非熱電分 離式之金屬基板1包括線路層m、介電層12、圖案化金屬板 131及至少一導熱孔η。介電層12係設置在線路層丨丨丨之下 方；圖案化金屬板131係設置在介電層12之下方，案化金屬 層131之下方係設有絕緣層1311 ;且至少一導熱孔14係穿設 線路層111及介電層12並與圖案化金屬板131相連接，至少 一導熱孔14係設置導熱物質14，且導熱物質141係與圖案^ 金屬板131接觸。藉此’當發熱元件(圖5未示，請參考圖 置於線路層111之上方時’發熱元件所產生之熱可經由導熱物 質14傳導至圖案化金屬板131，以達到降低發熱元件之溫度 之效果。 接下來請參考圖6，關於本創作之發光元件一實施 例之示意圖。 如圖6所示，在本創作之一實施例中，發光元件2 包括發熱元件21、導熱墊3及非熱電分離式之金屬基板丨。發 熱元件21係設置於導熱墊3之上方。非熱電分離式之金屬基 板1包括線路層111、介電層12、圖案化金屬板131及至少一 導熱孔14。導熱墊3係設置於線路層m之上方，在本創作 之一實施例中，導熱墊3係提供發熱元件21與線路層1U連 接。介電層12係設置在線路層111之下方。圖案化金屬板ι31 係設置在介電層12之下方，圖案化金屬層131之下方係設有 絕緣層131卜至少一導熱孔14係穿設線路層1U及介電層u 並與圖案化金屬板131相連接。至少一導熱孔14係設置導熱 物質141 ’且導熱物質141係與圖案化金屬板131接觸。 藉此，當發熱元件21置於線路層in之上方時，發熱元 件21所產生之熱可經由導熱物質141傳導至圖案化金屬板 7 M393796 131，透過圖案化金屬板131進行散熱，以達到降低發光元件 之溫度之效果。 在本創作之一實施例中，發熱元件21係發光二極體， 但本創作不以此為限。 综上所陳，本創作無論就目的、手段及功效，在在均顯示 其迥異於習知技術之特徵，懇請貴審查委員明察，早日賜准 專利，俾嘉惠社會，實感德便。惟應注意的是，上述諸多實施 例僅係為了便於說明而舉例而已，本創作所主張之權利範圍自 應以申請專利範圍所述為準，而非僅限於上述實施例。 【圖式簡單說明】 圖1係關於本創作之非熱電分離式之金屬基板的製造方法之 一實施例之步驟流程圖。 圖2至圖5係關於本創作之非熱電分離式之金屬基板的製造方 法之一實施例之示意圖。 圖6係關於本創作之發光元件之一實施例之示意圖。 【主要元件符號說明】 非熱電分離式之金屬基板1 銅層11 線路層111 正極1111 負極1112 介電層12 金屬板13 圖案化金屬板131 8 M393796 絕緣層1311 導熱孔14 導熱物質141 發光元件2 發熱元件21 導熱墊3M393796 V. Creation Description: [New Technology Field] This creation is about a non-thermoelectric separation type metal substrate and illuminating element, in particular, a non-thermoelectric separation type metal substrate and illuminating element which can enhance the heat dissipation of the heating element. [Prior Art] Metallic PCBs (MCPCBs) are often used as heat-dissipating substrates for heating elements because of their low cost. However, the heat conduction path of the metal substrate must pass through the dielectric layer, which cannot be used for heating elements requiring high heat dissipation. Meets the need for heat dissipation. In the prior art, one solution is to use a dielectric layer with high heat dissipation to accelerate conduction of heat to the metal plate, but the cost thereof is greatly improved, and the heat dissipation effect is still inferior to that of copper, smelting or alloy. With the development of technology, the brightness and luminous efficiency of Light_Emitting Diode (LED) have leapt greatly, especially the High-brightness Light-Emitting Diode (HBLED) has been applied. In all fields. However, its power consumption and heat generation are also increased. If the heat cannot be quickly removed, the brightness of the light-emitting diode will be lowered and the acceleration component will be deteriorated. Therefore, the heat dissipation performance of the heat-dissipating substrate is two. An important subject of the polar body. Therefore, it is necessary to provide a non-thermoelectric separation type metal substrate and light-emitting element to improve the problems of the prior art. 3 [New content] The main purpose of this work is to provide a non-thermoelectric separation type metal substrate and a light-emitting element which have improved heat dissipation properties, and are a non-thermoelectric separation type metal substrate and a light-emitting element having blind holes. In order to achieve the above object, the non-thermoelectric separation type metal substrate of the present invention comprises a circuit layer, a dielectric layer, a _ metal plate and at least a heat conduction aperture layer disposed under the circuit layer; _ metal plate system setting An underlying layer of the patterned metal layer is disposed under the dielectric layer, and an insulating layer is disposed; and at least the heat conducting hole is disposed through the circuit layer and the dielectric layer and is connected to the patterned metal plate, and at least one of the heat conducting holes is provided with heat conduction Substance, and the heat conductive material (4) The thin metal plate is connected to the I. When the thermal element is provided with the tree above the tree, the heat generated by the thief can be transmitted to the patterned metal plate through the heat conductive material, and the heat is radiated through the patterned metal plate. In order to achieve the effect of reducing the temperature of the heating element. In one embodiment of the present invention, the thermally conductive material comprises a plated fill hole or a metal paste. In order to achieve the above object, the light-emitting element of the present invention includes a heat-generating component, a thermal pad, and a metal substrate of an electro-recording type. The Wei component is placed above the thermal conductivity. The non-thermoelectric separation type metal substrate includes a wiring layer, a dielectric layer, a patterned metal plate, and at least one heat conduction hole. The thermal pad is disposed above the circuit layer; the dielectric layer is disposed under the circuit layer; the patterned metal plate is disposed under the dielectric layer, and the insulating layer is disposed under the patterned metal layer; and at least one heat conduction The hole is connected to the circuit layer and the dielectric layer and connected to the patterned metal plate. At least one of the heat conduction holes is provided with a heat conductive material, and the heat conductive material is in contact with the patterned metal plate. Thereby, when the heating element is placed above the circuit layer, the heat generated by the heating element can be conducted to the patterned metal plate via the heat conductive material, and the heat is dissipated through the patterned metal plate to achieve the effect of lowering the temperature of the light emitting element. M393796 In one embodiment of the present invention, the thermally conductive material comprises an electrical ore filler or a metal paste. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will become more apparent and understood. 1 is a flow chart showing a step of an embodiment of a method for producing a non-thermoelectric separation type metal substrate of the present invention, and FIG. 2 to FIG. 5 is a schematic view showing an embodiment of a method for producing a non-thermoelectric separation type metal substrate of the present invention. It should be noted that the schematic diagrams of the embodiments of the present invention are simplified schematic diagrams, and only the manufacturing method of the non-thermoelectric separation type metal substrate of the present invention is illustrated in a schematic manner, and the components displayed are not actual implementation states. In this way, the number, shape and size ratio of components in actual implementation are a selective design, and the component layout type can be more complicated. In one embodiment of the present invention, the non-thermoelectric separation type metal substrate is a metal core printed circuit board (MCPCB). As shown in FIG. 1 , the present invention first performs step S71 : providing a metal plate 0 as shown in FIG. 2 . In an embodiment of the present invention, the material of the metal plate 13 is metallic copper, but the present invention is not limited thereto; For example, the metal plate 13 may be made of metal aluminum or other metal with good thermal conductivity. In one embodiment of the present invention, one of the metal plates 13 is coated with a dielectric layer 12, and one of the dielectric layers 12 is coated with a copper layer 11. Then proceeding to step S72: forming at least one thermal via to connect the copper layer 5 M393796 and the metal plate. As shown in FIG. 3, in the present embodiment, the non-thermoelectric separation type metal substrate manufacturing method of the present invention is such that at least one heat conduction hole 14 is formed through the copper layer 11 and the dielectric layer 12. In one embodiment of the present invention, the heat conducting holes 14 are blind holes, but the present invention is not limited thereto. In one embodiment of the present invention, the heat-conducting holes 14 can be formed by using a reticle with laser drilling, direct laser drilling (DLD) or mechanical drilling, but the creation is not limited thereto. Next, step S73 is performed to form a heat conductive material in the heat conductive hole. As shown in FIG. 4, in one embodiment of the present invention, the non-thermoelectric separation type metal substrate of the present invention is manufactured by filling a heat conductive material 141 with a heat conductive material 141 as a metal paste. The heat conductive material 141 is connected to the copper layer 11 and the metal plate 13, but the present invention is not limited thereto. For example, the manufacturing method of the non-thermoelectric separation type metal substrate of the present invention can also be an electric clock filling hole, a plating hole filling metal paste, a through hole mounting method (PTH), a metal copper or a through hole mounting method. A metal paste or the like is used to form the heat conductive material 141. Finally, step S74 is performed: performing a patterned circuitization process. As shown in FIG. 5, in one embodiment of the present invention, the non-thermoelectric separation type metal substrate manufacturing method of the present invention performs a patterning and line-forming process on the copper layer 11 and the metal plate 13 to form a circuit layer m. And a patterned metal plate 13 In one embodiment of the present invention, the circuit layer lu includes a positive electrode 1111 and a negative electrode 1112, and the circuit layer (1) region having the heat conductive holes 14 is a main heat conduction region for the heat generating component, but the present invention does not Limited. In one embodiment of the present invention, the patterned metal plate 131 may be etched or stamped to insulate the positive electrode 1111 and the negative electrode 1112, but the present invention is not limited thereto. In one embodiment of the present invention, the patterned metal plate 131 includes an insulating layer 1311^6 M393796. As shown in FIG. 5, the non-thermoelectric separation type metal substrate 1 of the present invention includes a circuit layer m, The dielectric layer 12, the patterned metal plate 131 and the at least one heat conducting hole η. The dielectric layer 12 is disposed under the circuit layer ;; the patterned metal plate 131 is disposed under the dielectric layer 12, and the insulating layer 1311 is disposed under the cased metal layer 131; and at least one heat conduction hole 14 The circuit layer 111 and the dielectric layer 12 are connected to the patterned metal plate 131, and at least one of the heat conduction holes 14 is provided with the heat conductive material 14, and the heat conductive material 141 is in contact with the pattern metal plate 131. Therefore, when the heating element (not shown in FIG. 5, please refer to the figure above the circuit layer 111), the heat generated by the heating element can be conducted to the patterned metal plate 131 via the heat conductive material 14 to reduce the temperature of the heating element. Next, please refer to Fig. 6, which is a schematic diagram of an embodiment of the light-emitting element of the present invention. As shown in Fig. 6, in one embodiment of the present invention, the light-emitting element 2 includes a heat-generating component 21, a thermal pad 3 and a non- The thermoelectric separation type metal substrate 丨 is provided above the thermal pad 3. The non-thermoelectric separation type metal substrate 1 includes a wiring layer 111, a dielectric layer 12, a patterned metal plate 131, and at least one heat conduction hole 14. The thermal pad 3 is disposed above the circuit layer m. In one embodiment of the present invention, the thermal pad 3 is provided with a heating element 21 connected to the wiring layer 1U. The dielectric layer 12 is disposed under the wiring layer 111. The metal plate ι31 is disposed under the dielectric layer 12, and the insulating layer 131 is disposed under the patterned metal layer 131. The at least one heat conducting hole 14 is disposed through the circuit layer 1U and the dielectric layer u and the patterned metal plate 131. Connected. To A heat conducting hole 14 is provided with a heat conductive material 141' and the heat conductive material 141 is in contact with the patterned metal plate 131. Thereby, when the heat generating component 21 is placed above the circuit layer in, the heat generated by the heat generating component 21 can pass through the heat conductive material. 141 is conducted to the patterned metal plate 7 M393796 131, and is radiated through the patterned metal plate 131 to achieve the effect of lowering the temperature of the light-emitting element. In one embodiment of the present invention, the heating element 21 is a light-emitting diode, but The creation is not limited to this. In summary, this creation, regardless of its purpose, means and efficacy, is showing its characteristics that are different from the conventional technology. You are requested to review the examination and express the patent as soon as possible. However, it should be noted that the above-described embodiments are merely examples for the convenience of the description, and the scope of the claims should be based on the scope of the patent application, and is not limited to the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart showing the steps of an embodiment of a method for manufacturing a non-thermoelectric separation type metal substrate of the present invention. FIG. 2 to FIG. Fig. 6 is a schematic view showing an embodiment of a light-emitting element of the present invention. Fig. 6 is a schematic view showing an embodiment of a light-emitting element of the present invention. [Description of main component symbols] Non-thermoelectric separation type metal substrate 1 Copper Layer 11 Circuit layer 111 Positive electrode 1111 Negative electrode 1112 Dielectric layer 12 Metal plate 13 Patterned metal plate 131 8 M393796 Insulation layer 1311 Thermal via 14 Thermally conductive material 141 Light-emitting element 2 Heating element 21 Thermal pad 3

Claims (1)

M393796 六、申請專利範圍： 1. 種非熱電为離式之金屬基板’用於降低·一發熱元件之溫度， 該非熱電分離式之金屬基板包括： 一線路層； 一介電層’係設置在該線路層之下方； 一圖案化金屬板，係設置在該介電屠之下方；以及 至少一導熱孔’係穿設該線路層及該介電層並與該圖案化金屬 板相連接，該至少一導熱孔係設置一導熱物質，且該導熱物 質係與該圖案化金屬板接觸。 · 2. 如申請專利範圍第1項所述之非熱電分離式之金屬基板，其中· 該至少一導熱孔係以通孔安裝方式穿設該線路層及該介電層。 3. 如申請專利範圍第丨或2項所述之非熱電分離式之金屬基板， 其中該導熱物質包括一電鍍填孔或一金屬膏。 4. 如申請專利範圍第i項所述之非熱電分離式之金屬基板，其中 該圖案化金屬板之下方係設有一絕緣層。 5. 如申請專利範圍第！項所述之非熱電分離式之金屬基板，其中 該發熱元件包括-積體電路元件或一發光二極體。 6·如申請專利範圍帛1項所述之非熱電分離式之金屬基板，其中· 該非熱電分喊之金祕板包括—金聽印刷電路板。 ‘ 7. —種發光元件，包括： 一發熱元件； -導熱签’其巾該發熱元件係設置於料熱墊之上方； 一非熱電分離式之金屬基板，包括： -線路層’其中該導熱墊係設置於 一介電層，係設置在該線路層之下方；9万 -圖案化金屬板，係設置在該介電層之下方；以及 10M393796 VI. Scope of Application: 1. A non-thermoelectric type of metal substrate is used to reduce the temperature of a heating element. The non-thermoelectric separation type metal substrate comprises: a wiring layer; a dielectric layer is disposed in a patterned metal plate disposed under the dielectric sleeve; and at least one heat conducting hole </ RTI> through the circuit layer and the dielectric layer and connected to the patterned metal plate, At least one of the heat conduction holes is provided with a heat conductive material, and the heat conductive material is in contact with the patterned metal plate. 2. The non-thermoelectric separation type metal substrate according to claim 1, wherein the at least one heat conduction hole penetrates the circuit layer and the dielectric layer in a through hole mounting manner. 3. The non-thermoelectric separation type metal substrate according to claim 2 or 2, wherein the heat conductive material comprises a plating hole or a metal paste. 4. The non-thermoelectric separation type metal substrate according to claim i, wherein an insulating layer is disposed under the patterned metal plate. 5. If you apply for a patent scope! The non-thermoelectric separation type metal substrate according to the item, wherein the heat generating component comprises an integrated circuit component or a light emitting diode. 6. The non-thermoelectric separation type metal substrate according to claim 1, wherein the non-thermoelectric electric shunting gold secret plate comprises a gold-plated printed circuit board. 7. A light-emitting element comprising: a heat-generating component; a heat-conducting label; the heating element is disposed above the heat pad; and a non-thermoelectrically separated metal substrate comprising: - a circuit layer wherein the heat conduction The pad is disposed on a dielectric layer disposed below the circuit layer; the 90,000-patterned metal plate is disposed under the dielectric layer; and 10
TW99213987U 2010-07-22 2010-07-22 Metal substrate of non-thermoelectric separation type and light emitting element having metal substrate of non-thermoelectric separation type TWM393796U (en)

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DE201020008793 DE202010008793U1 (en) 2010-07-22 2010-10-13 Non-thermoelectric separate metal substrate and luminous element comprising such

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