丄j厶ΖτΖϋΟ 九、發明說明： 【發明所屬之技術領域】 、本發明是有關於一種旋壓蓋檢測裝置及具該裝置之 測試機台’特別是指—種用以測試半導體元件之自動化測 【先前技術】 10 15 20 、，在半導體元件的品管檢測過程中，為判定其好壞， 必須經由通電及輸入訊號測試，士。圖i所示，係顯示傳統 丄式半導體70件的測試機台3，其是包括〆作為基礎之載 ° 30在本例中，載台3〇上配置有數組測試璋川在此 '為例），以及供應待測半導體元件進入各測試埠3 1 及輸送測試完畢的半導體元件脫離的輸送裝置32;每一 測成蜂31上置放有一測試電路板33，-測試電路板33 上原本安裝半導體元件之位置均分別安裝—承載待測半導 體構件的連接器基座33〇，各 分逆接益基座330分別具有複 數電極’供電性連接該半導體元件的所有對應接觸部。測 成機台3另設置有一上下移動之機械臂34用以返緊半導 體疋件丄且每—機械臂34底端連接-上蓋340。 目則的測試方法為將待測構件（即前述半導體元件 入連接器基座330中，隨即妝μ “ _ 隨即將上盍340下壓並如圖2所 不’利用上盖底面341 ήίιίΤϊΐΑΓτ、 ' 的下延部分342將待測半導體元件 2向下迫緊’確保其與連 逑接态330腳位之導電連結，接 輸入測試訊號進行的測試作業。 由於每一測試埠3 1都 1都配置有一組機械臂34 ,且各測 5 1322266 試皡3!均需依賴輸送裝置32,將待測半導體元件送入各 測試埠3卜及輸送測試完畢的半導體元件脫離；為避免 機械臂34行進方向與輸送裝置32之空間配置發生衝突， 因此會採取彼此行進方向垂直配置之設計。亦即，測試蜂 5 10 31沿機台的X軸方向排列，輸送裳置32沿Y方向饋入 及輸出待測元件，機械臂34則沿Z方向升降。 士此不僅測試機台的機構設計無可避免地較為複 雜’製造成本也相對較高；且因佔用空間較大，在廠房中 亦ό k成生產線配置空間的利用效率降低，更進一步，影 響受測元件的搬運動線規劃。 ， 【發明内容】丄j厶ΖτΖϋΟ IX, invention description: [Technical field of the invention], the present invention relates to a spinning cover detecting device and a testing machine having the device 'in particular, an automatic test for testing semiconductor components [Prior Art] 10 15 20, in the quality inspection process of semiconductor components, in order to judge its quality, it must be tested by power-on and input signals. As shown in Fig. i, the test machine 3 of a conventional 70-piece semiconductor is shown, which includes a crucible as a base. In this example, an array is placed on the stage 3, and the test is performed here. And a feeding device 32 for supplying the semiconductor element to be tested into each test 埠3 1 and transporting the tested semiconductor component; a test circuit board 33 is placed on each of the test bees 31, and the test circuit board 33 is originally installed The positions of the semiconductor elements are respectively mounted - a connector base 33A carrying the semiconductor components to be tested, and each of the sub-return bases 330 has a plurality of electrodes respectively electrically connected to all corresponding contacts of the semiconductor element. The measuring machine 3 is further provided with a mechanical arm 34 for moving up and down to return the semiconductor member, and the bottom end of each of the mechanical arms 34 is connected to the upper cover 340. The test method is to put the member to be tested (that is, the aforementioned semiconductor component into the connector base 330, and then the makeup μ " _ will be pressed down the upper 340 and not as shown in FIG. 2 using the upper cover 341 ή ι ί ί ί, The lower extension portion 342 presses the semiconductor component 2 to be tested downwards to ensure that it is electrically connected to the pin connection of the connection state 330, and is connected to the test operation for inputting the test signal. Since each test 埠 3 1 is configured There is a set of mechanical arms 34, and each test 5 1322266 test ! 3! Depends on the transport device 32, the semiconductor components to be tested are sent to each test 埠 3 and the semiconductor components that have been tested for transport are detached; to avoid the direction of travel of the mechanical arm 34 The space configuration of the conveying device 32 conflicts, so that the design is arranged perpendicular to each other in the direction of travel. That is, the test bees 5 10 31 are arranged along the X-axis direction of the machine table, and the conveying skirt 32 is fed and output in the Y direction. The measuring element, the mechanical arm 34 is raised and lowered in the Z direction. This is not only the mechanical design of the testing machine is inevitably complicated, but also the manufacturing cost is relatively high; and because of the large space occupied, it is also in the factory. K into a production line utilization efficiency is lowered configuration space, further, impact motion transfer element under test line planning., SUMMARY OF THE INVENTION
因此，本發明之—目的 自動化檢測裝置及測試機台 本發明的另一目的，在 動化檢測裝置及測試機台。 本發明的又一目的，在 動化檢測裝置及測試機台。 ，在於提供一種結構簡單的 ) 於提供一種佔用體積小的自 提供一種製造成本低廉的自 一；疋本發明之自動化檢測裝置用以供一待測半導 體疋件測試，纟包括-基座、-上蓋及-致動裝置。其中 ^ t ^、有1供該待測半導體元件置放之置放部；上蓋 β广於該基座上，並可相對於該基座呈一可供放置/取 h待測半導體兀件之開啟狀態或一用以迫緊該半導體元 # <閉合狀$間轉動。致動裝置是用以帶動該上蓋於該開 啟狀態及該閉合狀態間樞轉。 20 丄犯266 冬發明另提供 #疋用β伹 a 體元件測試，該半導體元件具有複數導電接腳〜待剩半導 台是包括一載台、一控制裝置及一運送裝置。’該測試機 是包含.至少—：則·^ +自—， 其中該載台 s .主乂測忒埠，該測試埠具有—測$ φ 測試電路板上且右一％於甘, 別4電路板’該 Μ 旋壓蓋檢測渡置，用以氣 载待測半導體元件，其中該旋虔蓋檢測裝 用：承 座，具有一可供該待測半導體元件置放之置敌部··=基 蓋’樞設於該基座上，並可相對於該基座呈―；供放-上 10 15 取出該待測半導體元件之開啟狀態或—用以迫緊該半導體 元件之閉合狀態間轉動；及一致動裝置，用以帶動該上蓋 於該開啟狀態及該閉合狀態間枢轉。運送裝置則是用以供 該控制裝置控制地放置/取出該半導體元件至該置放部 處。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效， 在以下配合參考圖式之數個較佳實施例的詳細說明中，將 可清楚的呈現。 如圖3至圖4所示，本發明旋壓蓋檢測裝置4 一較 佳實施例包括一基座5、一樞設於該基座一端的上蓋6、 20 以及一用以驅動該上蓋樞轉的致動裝置7。 基座5具有一頂面50，在頂面50上設有一用以供一 半導體元件2置放之置放部51。在置放部51内則設有多 數電極導腳500，供待測半導體元件2之接點20與其電 性連接。在基座5之一側並設有一套筒52。 7 1322266 上蓋6之一端設有對應於套筒52之軸桿&，用以 設於該套筒52中以可相對於基座5插轉，使上蓋6相對 於該基座5呈-開啟或閉合狀態。在此需說明的是，此樞 轉結構並不限於上述套筒52及軸桿62之結構，凡可相對 ;:土座5做枢轉之等效結構皆可，由於此種樞轉結構已 為習知且為該領域具有—般知識者所輕易思及，在此不再 ^述。上盍6在相對該基座之底面6〇具有一迫緊部μ， ’肖以於閉合狀態時可迫緊待測試半導體元件2。 • I閱圖3並—併配合圖4，致動裝置7在本較佳實施 ίο例包括-可連動該轴桿62轉動之齒輪組71及一可驅動該 齒輪組7i運轉之馬達72。其中，該齒輪組Η之構造 包括複數齒輪及連接連動該等齒輪之皮帶等習知構造，在 此不再贅述；馬達72則可受控制的向對應方向運轉用以 連動該齒輪組71 » |15 請再參閱圖3，當要實際進行測試作業時，首先將上 蓋6如虛線所示旋至上述開啟狀態’使用者將待測半導體 元件2放置於該基座5之置放部51中。接著該馬達η受 控制的驅動該齒輪組71轉動並連動該軸桿62轉動而使該 上蓋6由開啟狀態樞轉至蓋合狀態（如實線所示卜使上蓋 2〇 6底面60之迫緊部61以其底部迫緊該半導體元件2 ,使 待測半導體元件2向下迫緊，確保其與基座5中之對應接 點20導電連結，接著輸入測試訊號進行測試作業。 參閱圖5，使用本發明自動化檢測裝置4之測試機台 8 ’包括複數呈直線排列的測試埠31，，每_測試璋31，上 8 1322266 置放有一測試電路33,，測試電路板33,上原本安裝半 導體元件之位置均分別安裝一承載待測半導體元件的自動 化檢測裝置4(如圖3所示）。 在該專測試璋3 1，俞、电u ⑴方一適當距離處並設有—略呈平 行的執道8 0，供一機楠眢e丨企 蛾淨81可又一控制裝置82控制地 軌:C 80往復位移。在本實施例中’該控制裝置η例如 為-内含處理器之計算機裝置，可根據内建程式進行運算 處理’以輸出對應指令或資料對該機械臂81之作動、行 程及位置等進行對應的控制。 ίο 15 實際操作時，機械臂81首先受控制裝置82致動， 依序運送待測半㈣元件至對應之測試_ Μ，的自動化檢 測裝置4基座中’一併參閱圖3’此時上蓋6是如虛線所 讀於上述之開啟狀態，以容許待測半導體元件2放置至 基座4〇之置放部中。接著，由馬達72受控制的驅動齒輪 組Η轉動並連動軸桿62轉動而使上蓋6由開啟狀態拖轉 至盖合狀態(如實線所示），使待測半導體元件2進入受測 狀態。 當然’如熟於此技術者所能輕易理解，測試淳之排 列配置並非侷限於前-實施例’如圖6本案另一較佳實施 例所不’其與前一實施例主要不同處在於：多組測試崞 π是呈環狀排列，使測試機台9略呈圓形，機械臂81則 設置於測試機纟9中央，並可受控制地旋轉用以放置/取 出半導體元件。 由於上述構造中’上蓋僅需作一簡單的旋動無須 20 1322266Accordingly, the present invention is directed to an automatic detecting device and a testing machine. Another object of the present invention is to activate a detecting device and a testing machine. Still another object of the present invention is to activate a detecting device and a testing machine. The invention provides a simple structure for providing a self-contained low-cost self-contained one; the automatic detecting device of the invention is used for testing a semiconductor component to be tested, including a pedestal, Upper cover and - actuation device. Wherein, there is a placement portion for the semiconductor component to be tested; the upper cover β is wider than the base, and is capable of placing/receiving a semiconductor component to be tested relative to the base. Open state or one for pressing the semiconductor element # < closed shape $ between rotations. The actuating device is configured to drive the upper cover to pivot between the open state and the closed state. 20 丄 266 Winter invention provides another 疋 伹 伹 伹 伹 伹 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 'The test machine is included. At least -: then ^^ + from -, where the stage s. main test, the test 埠 has - measured $ φ test on the circuit board and the right one is less than Gan, other 4 The circuit board 'the squeezing cover detects the ferrite for the airborne semiconductor component to be tested, wherein the squeegee cover is mounted: the socket has a host for the semiconductor component to be tested. The base cover is pivotally disposed on the base and can be disposed relative to the base; the release-upper 10 15 takes the open state of the semiconductor component to be tested or - for tightening the closed state of the semiconductor component Rotating; and an actuating device for driving the upper cover to pivot between the open state and the closed state. The transport device is for the control device to controlly place/remove the semiconductor component to the placement portion. The above and other technical contents, features, and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. As shown in FIG. 3 to FIG. 4, a preferred embodiment of the spin cover detecting device 4 of the present invention includes a base 5, an upper cover 6, 20 pivoted at one end of the base, and a pivoting mechanism for driving the upper cover. Actuating device 7. The susceptor 5 has a top surface 50 on which a placement portion 51 for receiving a semiconductor component 2 is disposed. A plurality of electrode pins 500 are provided in the placement portion 51 for electrically connecting the contacts 20 of the semiconductor component 2 to be tested. A sleeve 52 is provided on one side of the base 5. 7 1322266 One end of the upper cover 6 is provided with a shaft & corresponding to the sleeve 52 for being inserted into the sleeve 52 to be inserted relative to the base 5, so that the upper cover 6 is opened with respect to the base 5 Or closed state. It should be noted that the pivoting structure is not limited to the structure of the sleeve 52 and the shaft 62, and the equivalent structure of the earth seat 5 can be pivoted. Since the pivoting structure has been It is easy to think for the sake of knowing and for those who have general knowledge in the field, and will not be described here. The upper jaw 6 has a pressing portion μ opposite to the bottom surface 6 of the base, so that the semiconductor element 2 to be tested can be forced to be pressed in the closed state. • Referring to Figure 3 and - in conjunction with Figure 4, the actuator 7 includes, in the preferred embodiment, a gear set 71 that can rotate the shaft 62 and a motor 72 that can drive the gear set 7i to operate. The configuration of the gear set includes a plurality of gears and a conventional structure such as a belt connecting the gears, and will not be described herein; the motor 72 can be controlled to operate in a corresponding direction for interlocking the gear set 71 » Referring to FIG. 3 again, when the test operation is to be actually performed, the upper cover 6 is first rotated to the above-mentioned open state as indicated by a broken line. The user places the semiconductor component 2 to be tested in the placement portion 51 of the base 5. Then, the motor η is controlled to drive the gear set 71 to rotate and interlock the rotation of the shaft 62 to pivot the upper cover 6 from the open state to the closed state (as shown by the solid line, the bottom cover 60 of the upper cover 2 〇 6 is tight. The portion 61 presses the semiconductor element 2 with its bottom portion, and the semiconductor element 2 to be tested is pressed downward to ensure that it is electrically connected with the corresponding contact 20 in the susceptor 5, and then the test signal is input for testing. Referring to FIG. 5, The test machine 8' using the automatic detecting device 4 of the present invention includes a plurality of test cymbals 31 arranged in a line, each _ test 璋 31, a test circuit 33 is placed on the upper 8 1322266, and the test circuit board 33 is mounted on the semiconductor. The positions of the components are respectively mounted with an automatic detecting device 4 carrying the semiconductor component to be tested (as shown in Fig. 3). In the special test 璋3 1, Yu, electric u (1) is at an appropriate distance and is provided - slightly parallel The commander 80, for a machine, can be controlled by another control device 82 to control the ground track: C 80 reciprocating displacement. In the present embodiment, the control device η is, for example, a processor. Computer device, which can be built according to the built-in program The row operation processing 'controls the operation, the stroke, the position, and the like of the robot arm 81 by outputting the corresponding command or data. ίο 15 In actual operation, the robot arm 81 is first actuated by the control device 82 to sequentially transport the half to be tested. (4) Component to corresponding test _ Μ, the automatic detection device 4 in the pedestal 'refer to FIG. 3' at this time, the upper cover 6 is read in the above-mentioned open state as a dotted line to allow the semiconductor component 2 to be tested to be placed on the pedestal Then, the driving gear set controlled by the motor 72 rotates and interlocks the shaft 62 to rotate, so that the upper cover 6 is dragged from the open state to the closed state (as indicated by the solid line), so that the test is to be tested. The semiconductor component 2 enters the state to be tested. Of course, as can be easily understood by those skilled in the art, the arrangement of the test cartridges is not limited to the previous embodiment. FIG. 6 is another preferred embodiment of the present invention. The main difference of the embodiment is that a plurality of sets of tests 崞 π are arranged in a ring shape, so that the test machine 9 is slightly rounded, and the mechanical arm 81 is disposed at the center of the test machine , 9 and can be controlled to rotate for placement / Take out the semiconductor element Due to the above configuration 'cover only a brief swirling without 201,322,266
如習知結構，藉由機械臂連動上蓋而佔用莫大空 機台之體積獲得大幅縮減；且因結'‘二J 造成本大為降低。尤其，如前述實施例所示， =需/設置成直線排列或環狀排列，均可藉由機械:; /放置+導體兀件2,因此，較傳統的測 配置更具彈性，從而達成本案之所有目的。 ° 惟以上所述者，僅為本發明之較佳實施例而已一 不此以此限定本發明實施之範圍，即大凡依本發明申心 ίο 15 20 利範圍及發明說明内容所作之簡單的等效變化與修飾，月比 仍屬本發明專利涵蓋之範圍内。 白 【圖式簡單說明】 圖！是習用測試機台之部分結構示意圖； 圖2是一平面示意圖，說明圖1中的機械臂下壓迫 緊一待測半導體元件； 5兑明本發明自動化檢測裝置 說明圖3自動化檢測裝置中 圖3是一結構示意圖 一較佳實施例； 圖4是一平面示意圖 的棍轉結構； 圖5是-平面示意圖，說明設置有多數本發明檢測 裝置之一測試機台；及 圖6是一平®示意圖，說明本發明測試機台的另一 較佳實施例。 10 1322266 【主要元件符號說明】 2...元件 4...檢測裝置 5、330…基座 6、340…上蓋 7...致動裝置 5 20…接點 30…載台 31、3Γ...測試埠 32...輸送裝置 33、33’...測試電路板 • 34、81...機械臂 5 0…頂面 51...置放部 52...套筒 10 60、34 1…底面 61...迫緊部 6 2…轴桿 71...齒輪組 72…馬達 8、9…測試機台 80...執道 82...控制裝置 330...連接器 342…下延部分 15 500...電極導腳 11As is known in the art, the volume of the large empty machine table is greatly reduced by the robot arm interlocking the upper cover; and the size is reduced due to the knot ''two J'. In particular, as shown in the foregoing embodiments, = need to be arranged in a linear arrangement or a circular arrangement, which can be made by mechanical:; / placement + conductor element 2, so that it is more flexible than the conventional measurement configuration, thereby achieving the present case. All purposes. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple scope of the invention and the description of the invention. The effect of modification and modification, the monthly ratio is still within the scope of the invention patent. White [Simple illustration] Figure! FIG. 2 is a schematic plan view showing the mechanical arm of FIG. 1 pressing down a semiconductor component to be tested; 4 is a schematic view of a preferred embodiment; FIG. 4 is a plan view of a stick-turn structure; FIG. 5 is a plan view showing a test machine provided with a plurality of detection devices of the present invention; and FIG. Another preferred embodiment of the test machine of the present invention is illustrated. 10 1322266 [Description of main component symbols] 2...Component 4...Detection device 5,330...Base 6, 340... Upper cover 7... Actuation device 5 20... Contact 30... Stages 31, 3Γ. .. test 埠 32... conveying device 33, 33'... test circuit board • 34, 81... robot arm 50... top surface 51... placement portion 52... sleeve 10 60, 34 1...bottom surface 61...engagement portion 6 2...shaft 71...gear set 72...motor 8,9...test machine 80...executor 82...control device 330...connector 342...deferred part 15 500...electrode lead 11