TWI320518B - - Google Patents

Info

Publication number
TWI320518B
TWI320518B TW095107769A TW95107769A TWI320518B TW I320518 B TWI320518 B TW I320518B TW 095107769 A TW095107769 A TW 095107769A TW 95107769 A TW95107769 A TW 95107769A TW I320518 B TWI320518 B TW I320518B
Authority
TW
Taiwan
Application number
TW095107769A
Other versions
TW200643669A (en
Inventor
Akira Ogawa
Yukihiro Ushiku
Tomomi Ino
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW200643669A publication Critical patent/TW200643669A/zh
Application granted granted Critical
Publication of TWI320518B publication Critical patent/TWI320518B/zh

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32097—Recipe programming for flexible batch
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32194—Quality prediction
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • General Factory Administration (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Devices, Machine Parts, Or Other Structures Thereof (AREA)
TW095107769A 2005-04-05 2006-03-08 Quality control system, quality control method, and method of lot-to-lot wafer processing TW200643669A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005109209A JP4693464B2 (ja) 2005-04-05 2005-04-05 品質管理システム、品質管理方法及びロット単位のウェハ処理方法

Publications (2)

Publication Number Publication Date
TW200643669A TW200643669A (en) 2006-12-16
TWI320518B true TWI320518B (zh) 2010-02-11

Family

ID=37077600

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095107769A TW200643669A (en) 2005-04-05 2006-03-08 Quality control system, quality control method, and method of lot-to-lot wafer processing

Country Status (4)

Country Link
US (1) US7463941B2 (zh)
JP (1) JP4693464B2 (zh)
CN (1) CN100424599C (zh)
TW (1) TW200643669A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI511075B (zh) * 2011-04-01 2015-12-01 Hitachi Int Electric Inc 管理裝置、基板處理系統、資料分析方法以及電腦可讀取記錄媒體
TWI557674B (zh) * 2014-09-17 2016-11-11 東芝股份有限公司 品質管理裝置及其管理方法

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* Cited by examiner, † Cited by third party
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US8041440B2 (en) * 2006-07-13 2011-10-18 Taiwan Semiconductor Manufacturing Company, Ltd. Method and system for providing a selection of golden tools for better defect density and product yield
JP2008121447A (ja) * 2006-11-09 2008-05-29 Nissan Diesel Motor Co Ltd 燃料噴射制御装置
WO2008075404A1 (ja) * 2006-12-19 2008-06-26 Systemv Management Inc., 半導体製造システム
JP5169096B2 (ja) * 2007-09-14 2013-03-27 Ｊｆｅスチール株式会社 品質予測装置、品質予測方法及び製品の製造方法
JP5169098B2 (ja) * 2007-09-14 2013-03-27 Ｊｆｅスチール株式会社 品質予測装置、品質予測方法及び製造方法
US7962440B2 (en) * 2007-09-27 2011-06-14 Rockwell Automation Technologies, Inc. Adaptive industrial systems via embedded historian data
US8002871B2 (en) * 2008-02-01 2011-08-23 Honeywell International Inc. Methods and apparatus for an oxygen furnace quality control system
US7974723B2 (en) * 2008-03-06 2011-07-05 Applied Materials, Inc. Yield prediction feedback for controlling an equipment engineering system
US7974802B2 (en) * 2008-03-07 2011-07-05 International Business Machines Corporation Photomask image inspection
JP2009257922A (ja) * 2008-04-16 2009-11-05 Jatco Ltd 自動変速機の検査方法および自動変速機の検査装置
CN102448626B (zh) * 2009-05-29 2013-12-04 株式会社村田制作所 产品分选装置及产品分选方法
CN102449645B (zh) * 2009-05-29 2016-09-28 株式会社村田制作所 产品检查装置及产品检查方法
US8437870B2 (en) * 2009-06-05 2013-05-07 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for implementing a virtual metrology advanced process control platform
JP5503564B2 (ja) * 2011-01-18 2014-05-28 東京エレクトロン株式会社 処理装置の異常判定システム及びその異常判定方法
NL2009853A (en) 2011-12-23 2013-06-26 Asml Netherlands Bv Methods and apparatus for measuring a property of a substrate.
JP5783975B2 (ja) 2012-08-29 2015-09-24 株式会社東芝 半導体製造処理システムおよび方法
US20150253762A1 (en) * 2012-09-26 2015-09-10 Hitachi Kokusai Electric Inc. Integrated management system, management device, method of displaying information for substrate processing apparatus, and recording medium
EP2976879A4 (en) * 2013-03-20 2016-10-12 Lifetime Brands Inc METHOD AND APPARATUS FOR MOBILE QUALITY MANAGEMENT INSPECTIONS
US9666417B2 (en) 2013-08-28 2017-05-30 Sakai Display Products Corporation Plasma processing apparatus and method for monitoring plasma processing apparatus
CN104794318B (zh) * 2014-01-17 2017-11-21 无锡华润上华科技有限公司 用于建立半导体器件统计模型的数据处理方法
CN105470156B (zh) * 2014-09-09 2018-09-04 中芯国际集成电路制造(上海)有限公司 一种基于rtd的量测工艺
JP6385914B2 (ja) * 2015-12-16 2018-09-05 三菱重工業株式会社 品質モニタリングシステムおよび品質モニタリング方法
JP6453805B2 (ja) 2016-04-25 2019-01-16 ファナック株式会社 製品の異常に関連する変数の判定値を設定する生産システム
CN110246775B (zh) * 2018-03-09 2022-05-03 联华电子股份有限公司 控制机台操作的装置与方法
US11335607B2 (en) 2020-07-09 2022-05-17 Tokyo Electron Limited Apparatus and methods for wafer to wafer bonding
CN114198878B (zh) * 2020-09-17 2023-08-04 青岛海信电子产业控股股份有限公司 空气质量的调节方法及智能设备
US20230258585A1 (en) * 2022-02-16 2023-08-17 Kla Corporation Semiconductor Measurements With Robust In-Line Tool Matching
CN115881529B (zh) * 2023-02-06 2023-05-12 合肥新晶集成电路有限公司 湿法刻蚀方法、装置、系统、计算机设备以及介质

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JPH07244694A (ja) 1994-03-04 1995-09-19 Fujitsu Ltd 品質管理装置
US5629772A (en) * 1994-12-20 1997-05-13 International Business Machines Corporation Monitoring of minimum features on a substrate
JP2702466B2 (ja) * 1995-11-24 1998-01-21 山形日本電気株式会社 半導体ウェーハの生産方法及びその生産装置
CN1223393A (zh) * 1998-01-14 1999-07-21 三星电子株式会社 半导体制造设备管理系统的工艺条件控制方法
US6408219B2 (en) * 1998-05-11 2002-06-18 Applied Materials, Inc. FAB yield enhancement system
JP3926478B2 (ja) * 1998-06-01 2007-06-06 株式会社ルネサステクノロジ 半導体製造方法
JP4071449B2 (ja) * 2001-03-27 2008-04-02 株式会社東芝 センサ異常検出方法及びセンサ異常検出装置
JP2002343753A (ja) * 2001-05-21 2002-11-29 Nikon Corp シミュレーション方法及び装置、加工装置、加工システム、並びに半導体デバイス製造方法
US7698012B2 (en) * 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
JP4184638B2 (ja) * 2001-08-31 2008-11-19 株式会社東芝 半導体製造装置の寿命診断方法
US6687561B1 (en) * 2002-04-03 2004-02-03 Advanced Micro Devices, Inc. Method and apparatus for determining a sampling plan based on defectivity
JP3834546B2 (ja) * 2002-12-13 2006-10-18 株式会社東芝 測定対象パターンの選択方法、パターン検査方法、半導体装置の製造方法、プログラムおよびパターン検査装置
US8017411B2 (en) * 2002-12-18 2011-09-13 GlobalFoundries, Inc. Dynamic adaptive sampling rate for model prediction
TWI285341B (en) * 2002-12-31 2007-08-11 Powerchip Semiconductor Corp Method for analyzing in-line QC parameters
JP3699960B2 (ja) * 2003-03-14 2005-09-28 株式会社東芝 検査レシピ作成システム、欠陥レビューシステム、検査レシピ作成方法及び欠陥レビュー方法
US20050010319A1 (en) * 2003-07-09 2005-01-13 Sukesh Patel System and method for validating and visualizing APC assisted semiconductor manufacturing processes
US6947805B1 (en) * 2003-08-04 2005-09-20 Advanced Micro Devices, Inc. Dynamic metrology sampling techniques for identified lots, and system for performing same
JP4008899B2 (ja) * 2003-09-08 2007-11-14 株式会社東芝 半導体装置の製造システムおよび半導体装置の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI511075B (zh) * 2011-04-01 2015-12-01 Hitachi Int Electric Inc 管理裝置、基板處理系統、資料分析方法以及電腦可讀取記錄媒體
US9581996B2 (en) 2011-04-01 2017-02-28 Hitachi Kokusai Elecric Inc. Apparatus, method, and computer-readable medium for managing abnormality data measured in the substrate manufacturing process
TWI557674B (zh) * 2014-09-17 2016-11-11 東芝股份有限公司 品質管理裝置及其管理方法

Also Published As

Publication number Publication date
US20060235560A1 (en) 2006-10-19
CN100424599C (zh) 2008-10-08
TW200643669A (en) 2006-12-16
CN1848006A (zh) 2006-10-18
JP4693464B2 (ja) 2011-06-01
JP2006293433A (ja) 2006-10-26
US7463941B2 (en) 2008-12-09

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