TWI319486B - Modularized device interface - Google Patents

Modularized device interface

Info

Publication number
TWI319486B
TWI319486B TW095139927A TW95139927A TWI319486B TW I319486 B TWI319486 B TW I319486B TW 095139927 A TW095139927 A TW 095139927A TW 95139927 A TW95139927 A TW 95139927A TW I319486 B TWI319486 B TW I319486B
Authority
TW
Taiwan
Prior art keywords
device interface
modularized device
modularized
interface
Prior art date
Application number
TW095139927A
Other languages
English (en)
Other versions
TW200732683A (en
Inventor
Frank B Parrish
Derek M Castellano
Brian Brecht
Original Assignee
Teradyne Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teradyne Inc filed Critical Teradyne Inc
Publication of TW200732683A publication Critical patent/TW200732683A/zh
Application granted granted Critical
Publication of TWI319486B publication Critical patent/TWI319486B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW095139927A 2005-10-28 2006-10-27 Modularized device interface TWI319486B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/261,962 US7541819B2 (en) 2005-10-28 2005-10-28 Modularized device interface with grounding insert between two strips

Publications (2)

Publication Number Publication Date
TW200732683A TW200732683A (en) 2007-09-01
TWI319486B true TWI319486B (en) 2010-01-11

Family

ID=37671187

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095139927A TWI319486B (en) 2005-10-28 2006-10-27 Modularized device interface

Country Status (5)

Country Link
US (1) US7541819B2 (zh)
JP (1) JP5265371B2 (zh)
KR (1) KR101264123B1 (zh)
TW (1) TWI319486B (zh)
WO (1) WO2007050865A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7504822B2 (en) * 2005-10-28 2009-03-17 Teradyne, Inc. Automatic testing equipment instrument card and probe cabling system and apparatus
US7884627B2 (en) * 2006-12-29 2011-02-08 Formfactor, Inc. Stiffener assembly for use with testing devices
DE102008034918B4 (de) 2008-07-26 2012-09-27 Feinmetall Gmbh Elektrische Prüfeinrichtung für die Prüfung eines elektrischen Prüflings sowie elektrisches Prüfverfahren
US8878560B2 (en) 2010-12-30 2014-11-04 Taiwan Semiconductor Manufacturing Company, Ltd. High frequency probing structure
US8841931B2 (en) * 2011-01-27 2014-09-23 Taiwan Semiconductor Manufacturing Company, Ltd. Probe card wiring structure
TW201314233A (zh) * 2011-09-21 2013-04-01 Hon Hai Prec Ind Co Ltd 測試卡
KR101281823B1 (ko) * 2012-11-30 2013-07-04 주식회사 아이티엔티 고정형 파워 보드와 교체형 코어 보드를 포함하는 자동 테스트 장치
US10381707B2 (en) * 2016-02-04 2019-08-13 Advantest Corporation Multiple waveguide structure with single flange for automatic test equipment for semiconductor testing
US10128592B1 (en) * 2017-05-12 2018-11-13 Northrop Grumman Systems Corporation Integrated circuit interface and method of making the same
US11651910B2 (en) 2020-12-10 2023-05-16 Teradyne, Inc. Inductance control system
US11862901B2 (en) 2020-12-15 2024-01-02 Teradyne, Inc. Interposer

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3560907A (en) * 1968-05-17 1971-02-02 Peter V N Heller Test connector for microminiature circuits
US3611128A (en) * 1968-07-26 1971-10-05 Hitachi Ltd Probe header for testing integrated circuits
US4045737A (en) * 1975-12-22 1977-08-30 Charles Wheeler Coberly Integrated circuit probe
US4161692A (en) 1977-07-18 1979-07-17 Cerprobe Corporation Probe device for integrated circuit wafers
US4922191A (en) * 1988-11-30 1990-05-01 General Dynamics Corporation, Electronics Division Electronic testing equipment interconnection assembly
JP2502939Y2 (ja) * 1991-08-19 1996-06-26 日本アビオニクス株式会社 Ｉｃのバ―ンイン用ボ―ド装置
US5386346A (en) * 1991-08-29 1995-01-31 Hubbell Incorporated Circuit card assembly with shielding assembly for reducing EMI emissions
DE69429480T2 (de) 1993-09-09 2002-08-08 Ausimont S.P.A., Mailand/Milano Mehrschichtstrukturen aus fluorierten und nicht-fluorierten thermoplastischen Polymeren
TW273635B (zh) 1994-09-01 1996-04-01 Aesop
EP0788729A4 (en) 1994-10-28 1998-06-03 Micromodule Systems Inc PROGRAMMABLE HIGH DENSITY ELECTRONIC TEST DEVICE
US5621333A (en) 1995-05-19 1997-04-15 Microconnect, Inc. Contact device for making connection to an electronic circuit device
US6034533A (en) 1997-06-10 2000-03-07 Tervo; Paul A. Low-current pogo probe card
US6166553A (en) 1998-06-29 2000-12-26 Xandex, Inc. Prober-tester electrical interface for semiconductor test
JP3586106B2 (ja) 1998-07-07 2004-11-10 株式会社アドバンテスト Ｉｃ試験装置用プローブカード
JP2000088920A (ja) 1998-09-08 2000-03-31 Hitachi Electronics Eng Co Ltd 検査装置用インターフェイスユニット
US6579804B1 (en) 1998-11-30 2003-06-17 Advantest, Corp. Contact structure and production method thereof and probe contact assembly using same
US6462532B1 (en) * 2000-01-07 2002-10-08 Third Millennium Test Solutions Automated testing equipment having a modular offset test head with split backplane
US7262611B2 (en) 2000-03-17 2007-08-28 Formfactor, Inc. Apparatuses and methods for planarizing a semiconductor contactor
AU2001296101A1 (en) * 2000-07-06 2002-01-14 Igor Anatolievich Abrosimov Interface device with stored data on transmission lines characteristics
US6420888B1 (en) 2000-09-29 2002-07-16 Schlumberger Technologies, Inc. Test system and associated interface module
US6617867B2 (en) 2000-11-29 2003-09-09 Teradyne, Inc. Mechanism for clamping device interface board to peripheral
JP2002222839A (ja) 2001-01-29 2002-08-09 Advantest Corp プローブカード
US6525552B2 (en) 2001-05-11 2003-02-25 Kulicke And Soffa Investments, Inc. Modular probe apparatus
US6489795B1 (en) * 2001-05-18 2002-12-03 Anthony G. Klele High-frequency test probe assembly for microcircuits and associated methods
KR20020096094A (ko) 2001-06-16 2002-12-31 삼성전자 주식회사 테스터 헤드용 프로브 카드
US20030077932A1 (en) * 2001-10-22 2003-04-24 Lewinnek David W. Floating blind mate interface for automatic test system
US6972578B2 (en) 2001-11-02 2005-12-06 Formfactor, Inc. Method and system for compensating thermally induced motion of probe cards
JP2005513443A (ja) * 2001-12-14 2005-05-12 インテスト　アイピー　コーポレイション テストヘッドと共に用いる接続モジュール、テストヘッドと被テスト装置との間の相互接続を提供するインタフェーステストヘッドシステム、テストヘッドを被テスト装置に接続する方法、テストヘッドシステムを変更する方法、およびテストヘッドシステムを組み立てる方法
JP4050139B2 (ja) * 2002-12-19 2008-02-20 アンリツ株式会社 電子デバイス測定治具
CN100480718C (zh) * 2003-04-04 2009-04-22 爱德万测试株式会社 连接单元、测试头以及测试装置
JP2005017121A (ja) 2003-06-26 2005-01-20 Micronics Japan Co Ltd プローブカード
US6984974B2 (en) * 2003-11-17 2006-01-10 Venturedyne, Ltd. Independently-adjustable circuit board carrier
DE602004021469D1 (de) 2004-04-05 2009-07-23 Verigy Pte Ltd Singapore Vorrichtung zum lösbaren Verbinden eines Interfaces an einer Testeinrichtung
US7230437B2 (en) 2004-06-15 2007-06-12 Formfactor, Inc. Mechanically reconfigurable vertical tester interface for IC probing
KR20080012253A (ko) 2004-12-02 2008-02-11 에스브이 프로브 피티이 엘티디 분할된 기판을 구비하는 프로브 카드
US7147499B1 (en) 2005-10-19 2006-12-12 Verigy Ipco Zero insertion force printed circuit assembly connector system and method
US7504822B2 (en) 2005-10-28 2009-03-17 Teradyne, Inc. Automatic testing equipment instrument card and probe cabling system and apparatus

Also Published As

Publication number Publication date
JP5265371B2 (ja) 2013-08-14
JP2009513982A (ja) 2009-04-02
US7541819B2 (en) 2009-06-02
TW200732683A (en) 2007-09-01
KR20080074893A (ko) 2008-08-13
US20070096755A1 (en) 2007-05-03
WO2007050865A1 (en) 2007-05-03
KR101264123B1 (ko) 2013-05-14

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