TWI319341B - Copper powder - Google Patents

Copper powder

Info

Publication number
TWI319341B
TWI319341B TW095103991A TW95103991A TWI319341B TW I319341 B TWI319341 B TW I319341B TW 095103991 A TW095103991 A TW 095103991A TW 95103991 A TW95103991 A TW 95103991A TW I319341 B TWI319341 B TW I319341B
Authority
TW
Taiwan
Prior art keywords
copper powder
ppm
ions
particle diameter
weatherability
Prior art date
Application number
TW095103991A
Other languages
English (en)
Other versions
TW200631703A (en
Inventor
Tomoya Yamada
Koji Hirata
Original Assignee
Dowa Electronics Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Electronics Materials Co Ltd filed Critical Dowa Electronics Materials Co Ltd
Publication of TW200631703A publication Critical patent/TW200631703A/zh
Application granted granted Critical
Publication of TWI319341B publication Critical patent/TWI319341B/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05Metallic powder characterised by the size or surface area of the particles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00Making metallic powder or suspensions thereof
    • B22F9/16Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/20Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from solid metal compounds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302Cu as the principal constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22BPRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B15/00Obtaining copper
    • C22B15/0063Hydrometallurgy
    • C22B15/0084Treating solutions
    • C22B15/0089Treating solutions by chemical methods
    • C22B15/0091Treating solutions by chemical methods by cementation
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/02Alloys based on copper with tin as the next major constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00Supplementary information concerning processes or compositions relating to powder metallurgy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/20Recycling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Paints Or Removers (AREA)
TW095103991A 2005-02-18 2006-02-07 Copper powder TWI319341B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005041712A JP4490305B2 (ja) 2005-02-18 2005-02-18 銅粉

Publications (2)

Publication Number Publication Date
TW200631703A TW200631703A (en) 2006-09-16
TWI319341B true TWI319341B (en) 2010-01-11

Family

ID=36911226

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095103991A TWI319341B (en) 2005-02-18 2006-02-07 Copper powder

Country Status (5)

Country Link
US (2) US20060185474A1 (zh)
JP (1) JP4490305B2 (zh)
KR (1) KR101236246B1 (zh)
CN (1) CN1876281B (zh)
TW (1) TWI319341B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8116341B2 (en) * 2007-05-31 2012-02-14 Electro Scientific Industries, Inc. Multiple laser wavelength and pulse width process drilling
US9439293B2 (en) * 2007-11-21 2016-09-06 Xerox Corporation Galvanic process for making printed conductive metal markings for chipless RFID applications
US10384314B2 (en) * 2015-04-22 2019-08-20 Hitachi Metals, Ltd. Metal particle and method for producing the same, covered metal particle, and metal powder
JP6597008B2 (ja) * 2015-07-16 2019-10-30 株式会社村田製作所 積層セラミックコンデンサ及び積層セラミックコンデンサの製造方法
JP6451679B2 (ja) * 2016-03-24 2019-01-16 カシオ計算機株式会社 銅ナノ粒子の製造方法
WO2018025562A1 (ja) * 2016-08-03 2018-02-08 株式会社Adeka 銅粉の製造方法
RU2691474C1 (ru) * 2018-08-15 2019-06-14 Марина Владимировна Пузанова Медный порошок для очистки технического тетрахлорида титана от примеси окситрихлорида ванадия

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2286237A (en) * 1940-06-15 1942-06-16 Metals Disintegrating Co Copper powder
US2294895A (en) * 1940-07-15 1942-09-08 Glidden Co Copper powder
NL301992A (zh) * 1963-01-02
JPS62140305A (ja) * 1985-12-13 1987-06-23 古河電気工業株式会社 導電性ペ−スト
JPS6355807A (ja) * 1986-08-27 1988-03-10 古河電気工業株式会社 導電性ペ−スト
IT1196620B (it) * 1986-09-11 1988-11-16 Metalli Ind Spa Lega metallica a base di rame di tipo perfezionato,particolarmente per la costruzione di componenti elettronici
JPH0784605B2 (ja) 1988-05-17 1995-09-13 福田金属箔粉工業株式会社 銅微粉末の製造方法
JPH02200746A (ja) 1989-01-27 1990-08-09 Sumitomo Metal Mining Co Ltd リードフレーム用銅合金材の製造方法
JPH0557324A (ja) 1991-08-29 1993-03-09 Nippon Steel Corp 圧延材の加熱装置
US5470373A (en) * 1993-11-15 1995-11-28 The United States Of America As Represented By The Secretary Of The Navy Oxidation resistant copper
US6679937B1 (en) * 1997-02-24 2004-01-20 Cabot Corporation Copper powders methods for producing powders and devices fabricated from same
JP2911429B2 (ja) 1997-06-04 1999-06-23 三井金属鉱業株式会社 銅微粉末の製造方法

Also Published As

Publication number Publication date
US20060185474A1 (en) 2006-08-24
CN1876281A (zh) 2006-12-13
CN1876281B (zh) 2013-10-16
US20090050857A1 (en) 2009-02-26
US7909908B2 (en) 2011-03-22
TW200631703A (en) 2006-09-16
KR20060093045A (ko) 2006-08-23
JP2006225731A (ja) 2006-08-31
KR101236246B1 (ko) 2013-02-22
JP4490305B2 (ja) 2010-06-23

Similar Documents

Publication Publication Date Title
TWI319341B (en) Copper powder
TW200621404A (en) Flaky copper power, producing method thereof and conductive paste
MX2008001423A (es) Grasa termicamente conductora.
EP3628417A4 (en) COPPER ALLOY PARTICLES, SURFACE COATED COPPER BASED PARTICLES AND MIXED PARTICLES
TW200631701A (en) Metal power for electrically conductive paste and electrically conductive paste
WO2010101418A3 (en) Composition for conductive paste containing nanometer-thick metal microplates
WO2005076752A3 (en) Metal oxide particle and its uses
TW200710203A (en) Alloy powder as raw material for inorganic functional material, and fluorescent material
WO2002050342A3 (en) Composite plating film and a process for forming the same
WO2006076534A3 (en) Method of making composite particles with tailored surface characteristics
CA2520084A1 (en) Iron-based mixed powder for powder metallurgy and sintered body
MX2018011711A (es) Aleacion de cobre para equipo electronico y electrico, tira de placa de aleacion de cobre para equipo electronico y electrico, componente para equipo electronico y electrico, terminal, barra colectora y pieza movil para rele.
SG147433A1 (en) Method for producing fine metal, alloy and composite powders
IL185094A0 (en) Methods for spherically granulating and agglomerating metal particles and the metal particle prepared thereby, anodes made from the metal particles
HK1079903A1 (en) Methods for producing agglomerates of zinc powders and articles incorporating said agglomerates
WO2006099510A3 (en) Method for producing ultra-fine metal flakes
WO2010003036A3 (en) Thixotropic conductive composition
GB0800194D0 (en) Alloys, bulk metallic glass, and methods of forming the same
WO2001090677A3 (en) Coated metal particles to enhance shaped charge
WO2008136355A1 (ja) 銅合金系摺動材料および銅合金系摺動部材
EP2772558A3 (en) Sintered alloy and manufacturing method thereof
WO2010035258A3 (en) Discrete metallic copper nanoparticles
TW200602502A (en) Copper alloy
MY134399A (en) Metallic powder for powder metallurgy and iron-based sintered body
WO2006017327A3 (en) Electrocodeposition of lead free tin alloys