1317007 九、發明說明： 【發明所屬之技術領域】 種提供可變承載壓 力的共用散 本發明是一種共用散熱模組，特別是一 熱模組。 【先前技術】 對於小型叢細而言，特別是應―能運算領域者，當電腦運 轉速度越时撕綱概娜，喻物献有效排出 而造成電腦系統過熱時，容易產生當機而造成系統運作上的不穩定，因此 如何有效提升散熱效率為一重要的議題。 隨著科技的妙電子產品均躺_則、邁進，電齡、财面也是如 此’針對叢«言，為了提高運算效朗—I財相時配置多塊主 機板’由於域板獅嫌A，因此配置地機罐集電腦目前 多採用刀鋒式的配置方式，也就是將處職、記憶體、硬碟解電腦系統 的硬體整合到單-的主機板，或是所謂的「刀鋒」h彼此共用機箱、電 源供應器、缝、顯示器及純特源，而在—個機納，可以放入多達 20片的主機板’如此可翻高速運算與縮小配置空間，但是也因為刀鋒伺 服器的密度相當的高，因此散熱能力《響其穩定性，從而也將限制其運 算效能。 請麥照「第1圖」為習知技術之刀鋒飼服器的配置架構。具有高速運 算效能的刀鋒舰器同時擁有多塊主機板α且主機板】2如刀鋒般—片一 片直立α又置於肖機相|〇内，每塊主機板12分別設有散熱模組】4且各自 1317007 獨 為了節省配置空間，每塊主機板12彼此的間隔距離非常狹窄，各散 - 煞杈組14的尺寸受到較大的限制，以避免各主機板12在安裝時產生干涉 ' 問題。再者，由於每塊主機板丨2的散熱模組丨4為各自獨立，且由於每塊 主機板12被分配到的運算工作份量或隨之產生熱量均不完全相同，因此會 發生所有散熱模組M之散熱效能部分滿載、部分間置的情形，使得刀鋒伺 服咨然法達到預期的整體散熱效率。 另外，對於採用多張處理器卡(CPU card)的多處理器系統，或者各自具 鲁 備發熱元件的相鄰擴充介面卡，亦存在與刀鋒架構類似的問題。 【發明内容】 有鑑於此，本發明提供一種提供可變承載壓力的共用散熱模組，藉由 碰共用散熱撫組之寬度(或二散熱單元的間距），使共用散熱模組得以固定 於相鄰的二電路板間，並同時罐散熱歡施予發熱元件的承載壓力 (Loadmg Pressure)與熱傳導效率’同時散熱單元之間利用導熱棒讓彼此 的熱1互相傳導’如此可完全發揮預期的散熱效能。 • 減本發明其中一個較佳實施例’提供可變承載壓力的共用散熱模組 乃裝设於一發熱兀件之間，此二發熱元件分別位於相鄰的二電路板上，共 用散熱她包含·第-散熱單元、第二散鮮元、導熱棒、調整元件以及 彈性凡件。第-、第二散熱單元固接於該二發熱元件上；導熱棒兩端分別 連接第-散鮮讀第二散熱單元，使其得以㈣⑽並互賴量；彈性 7〇件位於導鱗-端m件可轉的設置於導熱棒上，以壓迫/鬆他彈 性元件，改變第-散鮮元與第二散熱單元施予發熱元件的承載壓力。 1317007 根據本&明射—織佳實酬，共職減組包含：分綱接於二 么,.，、轉之苐賴單兀與第二散鮮元；以及—導鱗，抽接於第一散 熱料與第—散熱單元之間，使其得以互通熱量，·其中導熱棒具有螺紋對 應螺接第-散熱單元及/或第二散熱單元，使第一散熱單元與第二散熱單元 間得以相對位移’並改變第一散熱單元與第二散熱單元施予發熱元件的承 載壓力。 根據本發明其巾—做佳實關，第—㈡散鮮元包含自其本體延伸 之第—㈡結合部與分離的第一㈡散熱底板，此第-㈡結合部呈外&長 板狀，第-㈡散熱底板則包含U形框體狀之第一㈡結合件對應配合第一 (二)結合部。 有關本發明的較佳實施例及其功效，茲配合圖式說明如后。 【實施方式】 明參恥「第2A圖」為本發明提供可變承載壓力的共用散熱模組之第— 實施例剖面示意圖，提供可變承載壓力的共用散熱模組包含：第—散熱單 το 20、第二散熱單元3〇、導熱棒4〇、二調整元件5〇及二彈性元件⑼。 第一散熱單兀20包含底板(未標示)與連接於底板上的複數散熱鰭片（未 標示），固接於第-電路板Π0的發熱元件m上，使發熱元件⑵所產生 的熱量可以透過第一散熱單元2〇之散熱縛片消散；第二散熱單元％亦包 含底板(未標示)與連接於底板上的複數散熱鰭片（未標示），固接於第二電路 板130的4熱元件u上方，使發熱元件132所產生的熱量可以透過第二 散熱單元30之散熱鰭片消散，其中發熱元件可以為中央處理單元（cpu )、 頒示晶片或其他高發熱量的處理器。此外，位於第一散熱單元與第二气 1317007 熱單元30的中間位置分別設有第—柱體22與第二柱體幻，二柱體a、幻 分別具有接槽22丨、32丨。本發明之第—電路板、第二電路板泛指各自具備 發熱元件並平行相麟置的電路板，—域板、處·卡、或是配備發 熱元件之介面卡。 導熱棒40為具有螺紋4!的金屬棒體，其兩端分別連接於第一散熱單 元20的第-柱體22與第二散熱單元3〇的第二柱體％。請同時參閱「第 从圖」’以及「第2B圖」戶斤示導熱棒安裝於第一散熱單元之局部示意圖， 導熱棒40的兩端分別設有一或多個凸塊42，而第―、第二柱體μ、幻& 有接槽22卜功接納導熱棒4〇，同時接槽a卜切設有對應接納前述凸 塊42的嵌槽222、322及長槽223 ' 323。賴222(322)與長槽_23)沿 接槽卿2丨)之不同軸線方向延伸並彼此互通，嵌槽222(322)位於接槽 221⑽)開口邊緣’ &塊42進人嵌槽222(322)後，必須旋轉—角度才能^ 入長槽223(323)。而⑽42位於長槽223(323)中時，只要導熱棒未被旋 轉，可防止凸塊42由嵌槽222(322)脫出。導熱棒4〇與第—、 弟—往體22、 幻間具有良好的密合精度，其間可塗佈導熱膏增加熱傳導效果，如此讓第 放熱單元2〇與第二散熱單元3〇的熱量可以互相傳導。另外，為方便。。 作時旋轉導熱棒’導熱棒的中段區域可料為多紐體，如四 7 體。 —、柱 調整元件50可位韻設置在導齡⑽上；其實質上可為具有内螺纹 的螺帽’螺接妓於導熱棒4〇之螺紋上，使其可於導熱棒4q上做轴向 的位移。而彈性元件6〇則可以壓縮彈簧實現’安裝於導熱棒如的末端。 1317007 微幅旋轉調整元件50可使其在導熱棒4〇上位移，而改變壓迫彈性元件的 的程度，·當導熱棒40之兩端已安裝於第一、第二柱體a、％中，被摩迫 的彈性树轉力料—散鮮元W杨贿元件_迫= 第二散熱單元30躺發熱元件丨32麵。實質上，刺餘触未安裝^ 發航件哗丨取間時，屋迫彈性元件6〇將使整個共用散熱模組之寬度 或第放，…單το 2〇與第—散熱單凡3〇之間距)微幅增加；而安裝於發敎元 ΐ22^2) 的承載壓力就會增大，進而提高錄的效率，但必敝意承健力不可以 過大，«元件雜(erash)。^，逆向_触元件㈣卩可鬆弛彈 性兀件6〇並降低承健力。簡言之，·元件μ之位移，可壓迫/鬆弛彈 f·生讀6G ’以•第—㈡散熱單元華)施予發熱耕丨2聊)的承讎 力。 ^目對的’當調整元件5〇分別朝遠離導熱棒4〇兩端的方向旋轉位釈往 導…木40中〜周整)時’彈性元件6〇的彈力會較鬆弛，如此可以減少第一 散熱單元2〇解發熱元件丨η與第二散熱單元如辭發熱元件出的承 ^力α此藉由调整兀件50與彈性元件6〇的配合，使第-散熱單元 、第月L單凡j〇之間的間距微幅變化，進而調整散熱單元施予發熱元 件的承載壓力。 、上<第帛一散熱單關接於電路板的方式，可以利用螺絲直接穿 2第散熱早7G 2G、第二散熱單元3G，分別鎖附於第—電路板|2〇、第二 包路板1」0上。另外，導熱棒4〇中央區域可為六角柱體或齒狀結構，以便 1317007 使用者以工具施力於導熱棒40使其旋轉。再者，當被壓迫的彈性元件⑼ 能提供足夠的緊_力時，可省略螺絲的使用。而對於熟習本項技藝者而 言，下速變異構造亦屬於本發明之涵蓋範圍：導熱棒至少一端上設置鼓槽 與長槽’而弟-(―)柱體的接槽開口邊緣則設有凸塊與其配合；且嵌槽與長 槽沿導熱棒之不同軸線方向延伸並彼此互通，嵌槽位於導熱棒蠕緣。 請參照「第3圖」為本發明提供可變承麵力的共用散熱模組之第二 實施例刻面圖。本發明除了藉由調整元件5〇與彈性元件6〇兩者的配合， 使得散熱單4於改變與發熱元件的緊密程度，進而調整散熱效率的優點 外，更具有抓共用散熱模組與電路板組裝結合的優點。 對此，本實施顺前-實施例社要差異處，在於為了簡化散模組固 接於電路板之發熱元件上的組裝動作，因此第一散熱單元2〇與第二散熱單 元30上分別增加了第一散熱底板7〇與第二散熱底板8〇，而為了分別與第 -散熱底板70、第二散細請結合，第一散熱單元2〇與第二散熱單元 30也作了些許變更。 分離的第-散熱底板70是預先安裝在發熱元件122上，並與第一電路 板⑽結合固定；第一散熱單元2〇本體背侧則形成兩個外凸長板狀的第— 結合部24。為了與第-散熱單元2〇結合，第—散熱底板％具有與第一結 合㈣互相對應的第-結合件72，此第一結合件72為由第—散熱底板7〇 外凸延伸的U形框體，第一址人邶 、、、° 口 口1 24可由弟一結合件72的開口端滑入結 合’讓第一散熱單元20固定於第一散熱底板7〇上。 元件132上，並與第二電 同樣的’第二散熱底板8〇是預先安裝在發熱夭 10 1317007 路板130結合固定；第-邶_ _ 心早7"3()本體背侧則形成兩個外凸長板狀的第 —結合部34。為了與第二散熱單 士人…一 '' 、-、α &，弟一散熱底板80具有與第二 結合部34互相對應的第二杜人件 … 口件82 ’此弟二結合件⑽為由第二散熱底板 8〇外凸延伸的（J形框體，第二結人 一 σ σ 由弟一結合件82的開口端滑入 結合，讓第二散熱單元30固定於第二散熱底板8〇上。 對於已預先裝設嶋第—、第二電路板丨2_，由於兩電路板丨卻、 3〇之間距已固疋，因此第一㈡結合部％㈣與第一㈡結合件聊)之 結合機制，將使共用散熱模組安裝至兩電路上之過程更為簡易。 為使第一(二)結合部24(34)固定於第一(二燁合件72(82)内，第一(二） 件72(82)内或第一(―)結合部24(3句上可進一步設置凹减合結構或彈 I*生構件(圖均未示）^ 另外，於上述二例中，第一㈡柱體並非絕對必要，第―、第二散熱單 元只要具有其他對應結合導鱗之結構即可，。 杯照「第4圖」為本發明提供可變承載壓力的共用散熱模組之 乐二實施例分解圖’其與上—實_之主要差異，在於本例未納入調整元 件」平性凡件。導熱棒40中段為六角柱體、兩端具有螺紋Μ，而第一散熱 一 巾的第—柱體22與第二散熱單元30中的第二柱體32亦具有螺紋 妾槽(324另—未標不)與導熱棒4〇相互配合；適量的導熱膏可塗佈於前述 、紋部4立以提升導熱效果。上述構件之具有特定螺紋方向，當導熱棒4〇 ϋ方向旋轉’其兩端將同時旋入第一柱體η與第二柱體犯，當導熱棒 4〇向另—方向旋轉，其兩端將同時旋出第一柱體22與第二柱體32。如此， 1317007 藉由導熱棒40盥第 130之間距即可被2 Γ元2啊之靖旋轉，第…二散熱單元 為便利導_之_#; ^卩如賴触讀職度可频幅改變。 本例中 ’、乍、中段亦可為六角柱體以外之多角柱體。 弟（―)植體並非絕對必要，第一 他對應導熱棒螺紋之結 ^ 1L早U具有其 上導雜7¾ A h螺轉’即能達到相同效果。其次，基本 乃_接方式連接於第— 方彳、自位 乐一政-早疋之間，僅需一端以螺接 方式連接，即可在導熱 _ 才U彳田改贫弟一、第二散熱單元的間距。 方面’ Μ财實施辦，各觀件職細减合結構可以相 反的凸凹結構取代，同時彈性元件之大小與位置可相對應地改變，此類結 構替代亦應《於本翻之技術思想與保護範圍内。 例如，第一柱體22與第二柱體32也可以為實心柱 體，在此狀況之下 導熱棒40兩端具有配合第一柱體μ與第二柱體32 習知之結合機制使導熱棒4〇兩端能分別緊密接合第 32，而不至於脫落。 的凹槽，並匹配有其他 —柱體22與第二柱體 上述的第一結合部24、第二結合部34與第一結合件72、第二結人件 82巧以相互對調形成相反的嵌合滑動機構，即外凸長板狀的& — 一 ' (-丨 結合部位於第一（二）散熱底板上，U形框體狀的第一(二社人件則 位於第一（二)散熱單元本體背側。所以在將第—散熱單 、〜一卫 …、平' 弟-散^ 熱單元30組裝於第一散熱底板70、第二散熱底板8〇時，可以藉由其配 合，採用滑動的方式以提升組裝的便利性，進而大幅減少组裝所 需的時間。 12 1317007 最後，雖然前述實施例均以雙彈性元件為例，但在實際應用 . 上，單—彈性元件已足夠達到改變共用散熱模組寬度的效果；而 :二才牛輿第一/第一柱體之連接’至少使第—、第二散熱單元具有 相對位移之效果即可，另—可為固定式連接。當然，多組調整元 件與彈性元件應屬本發明之簡單變異。 •雖然本發明的技術内容已經讀佳實_聽如上，然其並非用以限 定本發明，任何熟習此技藝者，在不脫離本發明之精神所作些許之更動與 •=飾，皆應涵蓋於本發明的範嘴内，因此本發明之保護範圍當視後附之申 请專利範圍所界定者為準。 【圖式簡單說明】 第丨圖為習知技術之刀鋒伺服器的配置架構。 第μ圖為提供可變承健力的制散域組之第—實關剖面示音 圖。 圖為第2Α圖中導熱棒安裝於第—散熱單元之局部示意圖。 &圖為提t、可艾承載壓力的共用散熱模組之第二實施例剖面示意圖。 ”圖為射、可t承載壓力的制散熱模組之第三實施例分解圖。 【主要元件符號說明】 ⑴：機箱 12 :主機板 14 ·_散熱模組 20 :第一散熱單元 13 1317007 第一柱體 、321 :接槽 、322 :嵌槽 、323 :長槽 第一結合部 第二散熱單元 第二柱體 :螺紋接槽 第二結合部 導熱棒 螺紋 凸塊 調整元件 彈性元件 第一散熱底板 第一結合件 弟二散熱底板 第二結合件 :第一電路板 :第二電路板 、132 :發熱元件1317007 IX. Description of the Invention: [Technical Field] The present invention provides a shared heat dissipation module, particularly a thermal module. [Prior Art] For small clusters, especially those who should be able to operate in the field, when the computer runs faster, the more the computer is expelling, the more effective it is, and the computer system is overheated, it is easy to cause the system to crash. Operational instability, so how to effectively improve the efficiency of heat dissipation is an important issue. With the technology of the wonderful electronic products are lying _ then, step forward, the age of electricity, financial aspects are also so 'for the cluster « words, in order to improve the efficiency of the operation - I financial phase configuration of multiple motherboards" because the domain board Lion suspected A, Therefore, the configuration of the ground tank set computer currently uses a blade-like configuration, that is, the hardware of the service, memory, and hard disk solution computer system is integrated into the single-board, or the so-called "blade" h each other. Share the chassis, power supply, slot, display and pure special source, and in the case of a machine, you can put up to 20 motherboards. This can be used to speed up the operation and reduce the configuration space, but also because of the blade server. The density is quite high, so the heat dissipation capability "sounds its stability, which will also limit its computing performance. Please take "Photo 1" as the configuration structure of the knife-feeding device of the prior art. The blade warship with high-speed computing performance has multiple motherboards at the same time, and the motherboard is as good as the blade--one piece of erect α is placed in the camera phase, and each motherboard 12 is equipped with a heat dissipation module. 4 and each 1317007 alone in order to save the configuration space, each of the motherboards 12 are spaced apart from each other by a very narrow distance, and the size of each of the dispersion-groups 14 is greatly limited to avoid interference of each of the motherboards 12 during installation. . Moreover, since the heat dissipation modules 每4 of each of the motherboards 2 are independent, and since the amount of operation work or the heat generated by each of the motherboards 12 is not completely the same, all the heat modes will occur. The heat dissipation performance of the group M is partially loaded and partially interposed, so that the blade servo servo method achieves the expected overall heat dissipation efficiency. In addition, there are similar problems with the blade architecture for multiprocessor systems that use multiple CPU cards, or adjacent expansion interface cards that each have a heating element. SUMMARY OF THE INVENTION In view of this, the present invention provides a shared heat dissipation module that provides variable load bearing pressure, and the shared heat dissipation module is fixed to the phase by touching the width of the shared heat dissipation group (or the spacing of the two heat dissipation units). Between the two adjacent circuit boards, and at the same time, the heat transfer efficiency (Loadmg Pressure) and heat conduction efficiency of the heat-dissipating unit are simultaneously performed by the heat-dissipating rods to allow each other's heat 1 to conduct each other. efficacy. • Reducing one of the preferred embodiments of the present invention, the shared heat dissipation module providing variable load bearing pressure is disposed between a heating element, and the two heating elements are respectively located on the adjacent two circuit boards, and the heat dissipation is shared by the · The first heat dissipating unit, the second dispersing element, the heat conducting rod, the adjusting element, and the elastic part. The first and second heat dissipating units are fixedly connected to the two heating elements; the two ends of the heat conducting rod are respectively connected to the first-dissipative reading second heat dissipating unit, so that (4) (10) and the mutual amount are obtained; the elastic 7-piece is located at the guiding scale-end The m piece is rotatably disposed on the heat conducting rod to press/release the elastic member to change the bearing pressure of the first heat element and the second heat radiating unit to the heat generating element. 1317007 According to this &ample-weaving good reward, the total job reduction group includes: the sub-class is connected to two, .,, the transfer is based on the single and the second loose element; and - the guide scale, drawn on the first A heat dissipating material and the first heat dissipating unit are allowed to exchange heat, wherein the heat conducting rod has a thread corresponding to the screwing-heating unit and/or the second heat dissipating unit, so that the first heat dissipating unit and the second heat dissipating unit can be The relative displacement 'and changes the load carrying pressure of the first heat dissipating unit and the second heat radiating unit to the heat generating component. According to the invention, the towel is made to be a good one, and the first (two) loose element comprises a first (two) joint portion extending from the body thereof and a separated first (two) heat sink base plate, and the first (b) joint portion is an outer & The first (second) heat-dissipating bottom plate comprises a U-shaped frame-shaped first (two) joint member corresponding to the first (two) joint portion. Preferred embodiments of the present invention and their effects are described below in conjunction with the drawings. [Embodiment] FIG. 2A is a cross-sectional view of a first embodiment of a shared heat dissipation module with variable load bearing pressure. The shared heat dissipation module providing variable load bearing pressure includes: a first heat dissipation unit το 20. The second heat dissipating unit 3〇, the heat conducting rod 4〇, the second adjusting element 5〇 and the two elastic elements (9). The first heat dissipation unit 20 includes a bottom plate (not shown) and a plurality of heat dissipation fins (not shown) connected to the bottom plate, and is fixed to the heat generating component m of the first circuit board ,0, so that the heat generated by the heat generating component (2) can be The heat dissipation tab of the first heat dissipation unit 2 is dissipated; the second heat dissipation unit % further includes a bottom plate (not labeled) and a plurality of heat dissipation fins (not labeled) connected to the bottom plate, and are fixed to the second circuit board 130. Above the thermal element u, the heat generated by the heating element 132 can be dissipated through the heat dissipating fins of the second heat dissipating unit 30, wherein the heating element can be a central processing unit (cpu), a wafer or other high heat generating processor. In addition, the first column 22 and the second column body are respectively disposed at intermediate positions of the first heat dissipating unit and the second gas 1317007 thermal unit 30, and the two cylinders a and the phantom respectively have the connecting grooves 22丨 and 32丨. The first circuit board and the second circuit board of the present invention generally refer to circuit boards each having a heat generating component and being parallel to each other, a domain board, a card, or an interface card equipped with a heat generating component. The heat conducting rod 40 is a metal rod having a thread 4!, and its two ends are respectively connected to the first cylinder 22 of the first heat radiating unit 20 and the second cylinder % of the second heat radiating unit 3''. Please also refer to the "Picture from the figure" and "Block 2B" to show the heat conduction rod mounted on the first heat dissipation unit. The two ends of the heat conduction rod 40 are respectively provided with one or more bumps 42 and The second cylinder μ, the phantom & has a receiving groove 22 for receiving the heat conducting rod 4 〇, and the connecting groove a is provided with the fitting grooves 222, 322 and the long groove 223 ' 323 corresponding to the receiving the protruding block 42. The 222 (322) and the long slot _23) extend in different axial directions of the slot and communicate with each other, and the slot 222 (322) is located at the opening edge of the slot 221 (10)) and the block 42 enters the slot 222 After (322), it is necessary to rotate the angle to enter the long slot 223 (323). When (10) 42 is located in the long slot 223 (323), the bump 42 can be prevented from coming out of the recess 222 (322) as long as the heat conducting rod is not rotated. The thermal conductive rod 4〇 has good adhesion precision with the first, the younger-to-body 22, and the magical space, and the thermal conductive paste can be coated to increase the heat conduction effect, so that the heat of the first heat releasing unit 2〇 and the second heat radiating unit 3 can be Conduct each other. Also, for convenience. . Rotating the heat-conducting rod during operation 'The middle section of the heat-conducting rod can be multi-colored, such as four-body. - the column adjusting member 50 can be placed on the lead-in stage (10); it can be substantially a screw having an internal thread screwed onto the thread of the heat conducting rod 4〇 so that it can be used as a shaft on the heat conducting rod 4q The displacement of the direction. The elastic member 6 can be compressed by a spring to be mounted on the end of the thermally conductive rod. 1317007 The micro-rotation adjusting member 50 can be displaced on the heat-conducting rod 4 to change the degree of pressing the elastic member. When the two ends of the heat-conducting rod 40 are installed in the first and second cylinders a, %, The forced elastic tree to force the material - the fresh element W Yang bribe components _ forced = the second heat sink unit 30 lying heating element 丨 32 faces. In essence, when the thorns are not installed, the e-force member 6 〇 will make the width or the first part of the shared heat-dissipating module, ... single το 2〇 and the first heat-dissipating unit 3〇 The distance between the two increases slightly; the bearing pressure installed on the hairpin 22^2) will increase, which will improve the efficiency of recording, but it must not be too strong, "erash." ^, the reverse _ touch element (four) 卩 can relax the elastic element 6 〇 and reduce the bearing strength. In short, the displacement of the component μ can be used to compress/relax the bomb f·sheng 6G ’ to • (2) the heat-dissipating unit Hua) to give the heat to work. ^ When the adjusting element 5 旋转 is rotated away from the ends of the heat conducting rod 4 〇, respectively, toward the guide ... wood 40 ~ week, the elastic force of the elastic member 6 较 will be loose, so that the first can be reduced The heat dissipating unit 2 dissipates the heating element 丨η and the second heat dissipating unit, such as the bearing element α of the regenerative element. By adjusting the cooperation of the element 50 and the elastic element 6〇, the first heat dissipating unit and the first month L The spacing between j〇 varies slightly, and the load carrying pressure of the heat radiating element to the heating element is adjusted. , the first < the first heat sink is connected to the circuit board, you can use the screw to directly wear the second heat dissipation 7G 2G, the second heat dissipation unit 3G, respectively, attached to the first circuit board | 2 〇, the second package The board is 1"0. In addition, the central portion of the heat conducting rod 4 can be a hexagonal cylinder or a toothed structure so that the user of the 1317007 can apply a force to the thermal conductive rod 40 to rotate it. Furthermore, the use of the screw can be omitted when the compressed elastic element (9) provides sufficient tension. For those skilled in the art, the down-speed variation structure is also covered by the present invention: the heat-conducting rod is provided with a drum groove and a long groove at at least one end, and the edge of the groove opening of the brother-(-) cylinder is provided. The bump cooperates with the slot; and the slot and the slot extend along different axial directions of the heat conducting bar and communicate with each other, and the slot is located at the creeping edge of the heat conducting bar. Please refer to FIG. 3 for a plan view of a second embodiment of a shared heat dissipation module with variable bearing force. In addition to the cooperation of the adjusting element 5〇 and the elastic element 6〇, the heat dissipation unit 4 has the advantages of changing the tightness of the heat generating element and adjusting the heat dissipation efficiency, and has the function of capturing the shared heat dissipation module and the circuit board. The advantages of assembly and bonding. In this regard, the difference between the present embodiment and the embodiment is that in order to simplify the assembly operation of the bulk module fixed on the heat generating component of the circuit board, the first heat radiating unit 2 and the second heat radiating unit 30 are respectively increased. The first heat dissipation substrate 7A and the second heat dissipation substrate 8 are combined, and the first heat dissipation unit 2A and the second heat dissipation unit 30 are also slightly modified in order to be combined with the first heat dissipation substrate 70 and the second dispersion. The separated first heat dissipating bottom plate 70 is pre-mounted on the heat generating component 122 and fixed in combination with the first circuit board (10); the first heat dissipating unit 2 is formed on the back side of the main body to form two first and second long plate-shaped first joint portions 24 . In order to be combined with the first heat dissipating unit 2, the first heat dissipating bottom plate has a first joint member 72 corresponding to the first joint (four), and the first joint member 72 is a U shape extending outward from the first heat dissipating bottom plate 7 The frame body, the first site 邶, , , ° mouth 1 24 can be slid into the joint by the open end of the joint member 72 to allow the first heat sink unit 20 to be fixed to the first heat sink base 7 。. The second heat dissipating bottom plate 8 on the element 132 and the same as the second electric power is pre-installed on the heat generating 夭 10 1317007, and the road plate 130 is fixed and fixed; the first - 邶 _ _ heart early 7 " 3 () the back side of the body forms two A first joint portion 34 having a convex long plate shape. In order to cooperate with the second heat-dissipating singer...a', -, α &, a heat-dissipating bottom plate 80 has a second duo member corresponding to the second joint portion 34. The mouth piece 82 'this two-piece joint member (10) is The second heat dissipating bottom plate 8 is convexly extended (the J-shaped frame body, the second junction σ σ is slidably joined by the open end of the splicing member 82, and the second heat dissipating unit 30 is fixed to the second heat dissipating bottom plate 8 〇上. For the pre-installed 嶋 first, the second circuit board 丨 2_, because the two boards are 丨, the distance between the three 已 has been fixed, so the first (two) joint part% (four) and the first (two) combination pieces) The combination of the mechanism will make the process of installing the shared cooling module on the two circuits easier. In order to fix the first (two) joint portion 24 (34) in the first (two joint member 72 (82), the first (two) member 72 (82) or the first (") joint portion 24 (3) In the sentence, the concave reduction structure or the elastic I* raw member may be further provided (not shown). In addition, in the above two cases, the first (second) cylinder is not absolutely necessary, and the first and second heat dissipation units have other corresponding The structure of the guide scale can be combined. The cup picture "Fig. 4" is an exploded view of the embodiment of the shared heat dissipation module of the present invention, which provides a variable load bearing pressure, and the main difference between the above and the above is the present example. The adjusting element is not included in the flat part. The middle part of the heat conducting rod 40 is a hexagonal cylinder, and the two ends have a threaded turn, and the first cylinder 22 of the first heat dissipation and the second cylinder 32 of the second heat dissipation unit 30 Also has a threaded groove (324 other - not marked) and the heat conductive rod 4 〇 cooperate; an appropriate amount of thermal paste can be applied to the aforementioned, the portion 4 to enhance the heat conduction effect. The above components have a specific thread direction, when the heat conduction The rotation of the rod 4〇ϋ direction 'the two ends will be simultaneously screwed into the first cylinder η and the second cylinder, when the heat conducting rod 4 is turned to the other direction Rotating, both ends will simultaneously unscrew the first cylinder 22 and the second cylinder 32. Thus, 1317007 can be rotated by 2 Γ 2 2 by the heat conduction rod 40 盥 130, the second heat dissipation The unit is a convenient guide _ _#; ^ 卩 赖 触 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 Necessary, the first one corresponds to the junction of the heat-conducting rod thread ^ 1L early U has its upper guide impurity 73⁄4 A h screw turn 'that can achieve the same effect. Secondly, the basic _ connection method is connected to the first square, the self-position music one Between the government and the early squad, only one end needs to be screwed together, that is, in the heat conduction _ 彳 U 彳 田 change the poor first brother, the second heat sink spacing. The structure can be replaced by the opposite convex and concave structure, and the size and position of the elastic element can be changed correspondingly. Such structural replacement should also be within the technical idea and protection scope of the present invention. For example, the first cylinder 22 and the second The cylinder 32 can also be a solid cylinder. Under this condition, the heat conducting rod 40 has a matching end. The bonding mechanism between the cylinder μ and the second cylinder 32 is such that the ends of the heat conducting rod 4 can be tightly joined to the 32nd portion, respectively, without falling off. The groove is matched with the other - the cylinder 22 and the second cylinder are as described above. The first joint portion 24 and the second joint portion 34 are opposite to the first joint member 72 and the second knot member 82 to form an opposite fitting sliding mechanism, that is, a convex long plate shape & The 丨 joint is located on the first (two) heat sink bottom plate, and the first part of the U-shaped frame body (the second member is located on the back side of the first (two) heat sink unit body. Therefore, the first heat sink, the one heat... When the flat heat-dissipating unit 30 is assembled on the first heat-dissipating bottom plate 70 and the second heat-dissipating base plate 8 , the sliding can be used to improve the assembly convenience, thereby greatly reducing the assembly requirements. time. 12 1317007 Finally, although the foregoing embodiments all take the case of a double elastic element, in practical applications, the single-elastic element is sufficient to achieve the effect of changing the width of the shared heat-dissipating module; The connection of the cylinders 'is at least the effect that the first and second heat dissipating units have relative displacement, and the other may be a fixed connection. Of course, multiple sets of adjustment elements and elastic elements should be a simple variation of the present invention. • Although the technical content of the present invention has been read as described above, it is not intended to limit the present invention, and any person skilled in the art, without departing from the spirit of the present invention, should be included in the The scope of the present invention is defined by the scope of the appended claims. [Simple description of the diagram] The figure is the configuration structure of the blade server of the prior art. The Fig. μ is a diagram of the first-real section of the dispersing domain group providing variable bearing force. The figure is a partial schematic view of the heat-dissipating rod mounted on the first heat-dissipating unit in the second drawing. The figure is a schematic cross-sectional view of a second embodiment of a shared heat dissipation module that carries the pressure and the load. The figure is an exploded view of the third embodiment of the heat-dissipating module capable of carrying pressure. [Main component symbol description] (1): chassis 12: motherboard 14 · _ heat dissipation module 20: first heat dissipation unit 13 1317007 a cylinder, 321 : a groove, 322: a groove, 323: a long groove, a first joint, a second heat dissipation unit, a second cylinder: a threaded groove, a second joint, a heat conducting rod, a threaded projection, an elastic element, a first heat dissipation The first joint of the bottom plate and the second joint of the heat sink base plate: the first circuit board: the second circuit board, 132: the heating element