TWI315916B - Elektromagnetische strahlung emittierendes optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements - Google Patents

Elektromagnetische strahlung emittierendes optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements

Info

Publication number
TWI315916B
TWI315916B TW095136440A TW95136440A TWI315916B TW I315916 B TWI315916 B TW I315916B TW 095136440 A TW095136440 A TW 095136440A TW 95136440 A TW95136440 A TW 95136440A TW I315916 B TWI315916 B TW I315916B
Authority
TW
Taiwan
Prior art keywords
emittierendes
zur herstellung
verfahren zur
herstellung eines
und verfahren
Prior art date
Application number
TW095136440A
Other languages
English (en)
Other versions
TW200731569A (en
Inventor
Herbert Brunner
Kirstin Petersen
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of TW200731569A publication Critical patent/TW200731569A/zh
Application granted granted Critical
Publication of TWI315916B publication Critical patent/TWI315916B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
  • Luminescent Compositions (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
TW095136440A 2005-09-30 2006-09-29 Elektromagnetische strahlung emittierendes optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements TWI315916B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005047062 2005-09-30
DE102006004397A DE102006004397A1 (de) 2005-09-30 2006-01-31 Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements

Publications (2)

Publication Number Publication Date
TW200731569A TW200731569A (en) 2007-08-16
TWI315916B true TWI315916B (en) 2009-10-11

Family

ID=37492351

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095136440A TWI315916B (en) 2005-09-30 2006-09-29 Elektromagnetische strahlung emittierendes optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements

Country Status (8)

Country Link
US (1) US8476655B2 (zh)
EP (1) EP1929547B1 (zh)
JP (1) JP2009510741A (zh)
KR (1) KR20080059618A (zh)
CN (2) CN101834264B (zh)
DE (2) DE102006004397A1 (zh)
TW (1) TWI315916B (zh)
WO (1) WO2007036206A1 (zh)

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DE102007001706A1 (de) 2007-01-11 2008-07-17 Osram Opto Semiconductors Gmbh Gehäuse für optoelektronisches Bauelement und Anordnung eines optoelektronischen Bauelementes in einem Gehäuse
DE102007015474A1 (de) * 2007-03-30 2008-10-02 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
DE102007060206A1 (de) 2007-12-14 2009-06-18 Osram Opto Semiconductors Gmbh Anordnung mit mindestens einem optoelektronischen Halbleiterbauelement
DE102008021662A1 (de) * 2008-04-30 2009-11-05 Ledon Lighting Jennersdorf Gmbh LED mit Mehrband-Leuchtstoffsystem
JP2010027811A (ja) * 2008-07-17 2010-02-04 Glory Science Co Ltd 発光ダイオードおよび発光ダイオード輝度制御方法
FR2935543A1 (fr) * 2008-09-03 2010-03-05 Glory Science Co Ltd Unite photoemissive et procede de fabrication d'une telle unite
DE102008045925A1 (de) * 2008-09-04 2010-03-11 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils
TWI385834B (zh) * 2009-02-06 2013-02-11 Yu Nung Shen Light emitting diode chip package and manufacturing method thereof
DE102009022901A1 (de) * 2009-05-27 2010-12-02 Osram Opto Semiconductors Gmbh Optoelektronisches Modul und Verfahren zur Herstellung eines optoelektronischen Moduls
KR101795091B1 (ko) * 2009-12-30 2017-11-07 메르크 파텐트 게엠베하 물 분자에 대한 확산 장벽으로서의 포팅 화합물
US8541793B2 (en) * 2010-02-04 2013-09-24 Yu-Nung Shen Light emitting diode device and method for fabricating the same
US8669569B2 (en) * 2010-02-04 2014-03-11 Yu-Nung Shen Light emitting diode package and method for fabricating the same
DE102015214588A1 (de) * 2015-07-31 2017-02-02 Robert Bosch Gmbh Anordnung zum Messen einer Drehzahl, insbesondere eines Turboladers eines Kraftfahrzeugs
JP6632834B2 (ja) * 2015-08-24 2020-01-22 スタンレー電気株式会社 発光装置
KR102572819B1 (ko) * 2016-02-23 2023-08-30 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광모듈 제조방법 및 표시장치
JP2017199748A (ja) * 2016-04-26 2017-11-02 スタンレー電気株式会社 発光装置

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Also Published As

Publication number Publication date
US20090261365A1 (en) 2009-10-22
EP1929547B1 (de) 2009-12-02
CN101273471A (zh) 2008-09-24
CN101834264A (zh) 2010-09-15
US8476655B2 (en) 2013-07-02
TW200731569A (en) 2007-08-16
DE102006004397A1 (de) 2007-04-05
JP2009510741A (ja) 2009-03-12
DE502006005540D1 (de) 2010-01-14
KR20080059618A (ko) 2008-06-30
WO2007036206A1 (de) 2007-04-05
CN101273471B (zh) 2010-06-16
EP1929547A1 (de) 2008-06-11
CN101834264B (zh) 2013-10-30

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