TWI314029B - Power core devices and methods of making thereof - Google Patents

Power core devices and methods of making thereof Download PDF

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Publication number
TWI314029B
TWI314029B TW094145440A TW94145440A TWI314029B TW I314029 B TWI314029 B TW I314029B TW 094145440 A TW094145440 A TW 094145440A TW 94145440 A TW94145440 A TW 94145440A TW I314029 B TWI314029 B TW I314029B
Authority
TW
Taiwan
Prior art keywords
capacitor
layer
metal foil
planar
smt
Prior art date
Application number
TW094145440A
Other languages
English (en)
Chinese (zh)
Other versions
TW200628027A (en
Inventor
Daniel Irwin Amey Jr
Sounak Banerji
William J Borland
David Ross Mcgregor
Attiganal N Sreeram
Karl Hartmann Dietz
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of TW200628027A publication Critical patent/TW200628027A/zh
Application granted granted Critical
Publication of TWI314029B publication Critical patent/TWI314029B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H05K1/186—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
TW094145440A 2004-12-21 2005-12-21 Power core devices and methods of making thereof TWI314029B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63781704P 2004-12-21 2004-12-21
US11/289,961 US7778038B2 (en) 2004-12-21 2005-11-30 Power core devices and methods of making thereof

Publications (2)

Publication Number Publication Date
TW200628027A TW200628027A (en) 2006-08-01
TWI314029B true TWI314029B (en) 2009-08-21

Family

ID=35999575

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094145440A TWI314029B (en) 2004-12-21 2005-12-21 Power core devices and methods of making thereof

Country Status (5)

Country Link
US (1) US7778038B2 (https=)
EP (1) EP1675448A1 (https=)
JP (2) JP2006179924A (https=)
KR (1) KR100754714B1 (https=)
TW (1) TWI314029B (https=)

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US7613007B2 (en) * 2004-12-21 2009-11-03 E. I. Du Pont De Nemours And Company Power core devices
US7778038B2 (en) * 2004-12-21 2010-08-17 E.I. Du Pont De Nemours And Company Power core devices and methods of making thereof
US20060158828A1 (en) * 2004-12-21 2006-07-20 Amey Daniel I Jr Power core devices and methods of making thereof
KR100691146B1 (ko) * 2004-12-24 2007-03-09 삼성전기주식회사 적층형 캐패시터 및 적층형 캐패시터가 내장된 인쇄회로기판
US7435627B2 (en) * 2005-08-11 2008-10-14 International Business Machines Corporation Techniques for providing decoupling capacitance
US7361843B2 (en) * 2005-09-28 2008-04-22 Dell Products L.P. AC coupling of power plane sections using improved capacitance stitching material
US7504706B2 (en) * 2005-10-21 2009-03-17 E. I. Du Pont De Nemours Packaging having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof
US7701052B2 (en) * 2005-10-21 2010-04-20 E. I. Du Pont De Nemours And Company Power core devices
US7697262B2 (en) 2005-10-31 2010-04-13 Avx Corporation Multilayer ceramic capacitor with internal current cancellation and bottom terminals
US7414857B2 (en) * 2005-10-31 2008-08-19 Avx Corporation Multilayer ceramic capacitor with internal current cancellation and bottom terminals
US7919804B2 (en) * 2005-11-08 2011-04-05 Oracle America, Inc. Power distribution for high-speed integrated circuits
KR20130023362A (ko) * 2006-05-24 2013-03-07 다이니폰 인사츠 가부시키가이샤 부품 내장 배선판, 부품 내장 배선판의 제조 방법
US7336501B2 (en) * 2006-06-26 2008-02-26 Ibiden Co., Ltd. Wiring board with built-in capacitor
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US8238116B2 (en) 2007-04-13 2012-08-07 Avx Corporation Land grid feedthrough low ESL technology
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TWM335792U (en) * 2007-08-16 2008-07-01 Aflash Technology Co Ltd Device structure of IC
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US8395902B2 (en) * 2008-05-21 2013-03-12 International Business Machines Corporation Modular chip stack and packaging technology with voltage segmentation, regulation, integrated decoupling capacitance and cooling structure and process
US8446705B2 (en) * 2008-08-18 2013-05-21 Avx Corporation Ultra broadband capacitor
US9041208B2 (en) 2011-11-02 2015-05-26 Avago Technologies General Ip (Singapore) Pte. Ltd. Laminate interconnect having a coaxial via structure
CN103458608A (zh) * 2012-06-05 2013-12-18 鸿富锦精密工业（深圳）有限公司 印刷电路板
US8941434B1 (en) * 2013-07-12 2015-01-27 Samsung Display Co., Ltd. Bus encoding scheme based on non-uniform distribution of power delivery network components among I/O circuits
KR101499721B1 (ko) * 2013-08-09 2015-03-06 삼성전기주식회사 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판
MY175520A (en) * 2014-02-21 2020-07-01 Mitsui Mining & Smelting Co Ltd Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring board
US9472425B2 (en) 2015-03-19 2016-10-18 Qualcomm Incorporated Power distribution improvement using pseudo-ESR control of an embedded passive capacitor
US9673179B1 (en) 2016-07-20 2017-06-06 International Business Machines Corporation Discrete electronic device embedded in chip module
DE102018201158B4 (de) 2018-01-25 2024-08-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum bestücken einer leiterplatte

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US7778038B2 (en) * 2004-12-21 2010-08-17 E.I. Du Pont De Nemours And Company Power core devices and methods of making thereof
US7613007B2 (en) * 2004-12-21 2009-11-03 E. I. Du Pont De Nemours And Company Power core devices
US7701052B2 (en) 2005-10-21 2010-04-20 E. I. Du Pont De Nemours And Company Power core devices

Also Published As

Publication number Publication date
US7778038B2 (en) 2010-08-17
KR20060071334A (ko) 2006-06-26
JP2006179924A (ja) 2006-07-06
US20060133057A1 (en) 2006-06-22
TW200628027A (en) 2006-08-01
EP1675448A1 (en) 2006-06-28
JP2012134523A (ja) 2012-07-12
KR100754714B1 (ko) 2007-09-03

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