JP2006179924A - 電力コアデバイス、およびその作製の方法 - Google Patents

電力コアデバイス、およびその作製の方法 Download PDF

Info

Publication number
JP2006179924A
JP2006179924A JP2005368189A JP2005368189A JP2006179924A JP 2006179924 A JP2006179924 A JP 2006179924A JP 2005368189 A JP2005368189 A JP 2005368189A JP 2005368189 A JP2005368189 A JP 2005368189A JP 2006179924 A JP2006179924 A JP 2006179924A
Authority
JP
Japan
Prior art keywords
metal foil
capacitor
planar
power core
planar capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005368189A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006179924A5 (https=
Inventor
Daniel I Amey Jr
アーウィン エイミー ジュニア ダニエル
Sounak Banerji
バネルジ ソウナック
William J Borland
ウィリアム　ジェイ．ボーランド
David Ross Mcgregor
ロス マクレガー デビッド
Attiganal N Sreeram
エヌ．スリーラム アッチガナル
Karl Hartmann Dietz
ハルトマン ディーツ カール
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2006179924A publication Critical patent/JP2006179924A/ja
Publication of JP2006179924A5 publication Critical patent/JP2006179924A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H05K1/186—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
JP2005368189A 2004-12-21 2005-12-21 電力コアデバイス、およびその作製の方法 Pending JP2006179924A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63781704P 2004-12-21 2004-12-21
US11/289,961 US7778038B2 (en) 2004-12-21 2005-11-30 Power core devices and methods of making thereof

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012034405A Division JP2012134523A (ja) 2004-12-21 2012-02-20 電力コアデバイス、およびその作製の方法

Publications (2)

Publication Number Publication Date
JP2006179924A true JP2006179924A (ja) 2006-07-06
JP2006179924A5 JP2006179924A5 (https=) 2009-02-12

Family

ID=35999575

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2005368189A Pending JP2006179924A (ja) 2004-12-21 2005-12-21 電力コアデバイス、およびその作製の方法
JP2012034405A Pending JP2012134523A (ja) 2004-12-21 2012-02-20 電力コアデバイス、およびその作製の方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012034405A Pending JP2012134523A (ja) 2004-12-21 2012-02-20 電力コアデバイス、およびその作製の方法

Country Status (5)

Country Link
US (1) US7778038B2 (https=)
EP (1) EP1675448A1 (https=)
JP (2) JP2006179924A (https=)
KR (1) KR100754714B1 (https=)
TW (1) TWI314029B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008146770A1 (ja) * 2007-05-25 2008-12-04 Toyota Jidosha Kabushiki Kaisha コンデンサ一体バスバーの製造方法および電力変換装置
JP2012134523A (ja) * 2004-12-21 2012-07-12 Cda Processing Limited Liability Company 電力コアデバイス、およびその作製の方法

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7613007B2 (en) * 2004-12-21 2009-11-03 E. I. Du Pont De Nemours And Company Power core devices
US20060158828A1 (en) * 2004-12-21 2006-07-20 Amey Daniel I Jr Power core devices and methods of making thereof
KR100691146B1 (ko) * 2004-12-24 2007-03-09 삼성전기주식회사 적층형 캐패시터 및 적층형 캐패시터가 내장된 인쇄회로기판
US7435627B2 (en) * 2005-08-11 2008-10-14 International Business Machines Corporation Techniques for providing decoupling capacitance
US7361843B2 (en) * 2005-09-28 2008-04-22 Dell Products L.P. AC coupling of power plane sections using improved capacitance stitching material
US7504706B2 (en) * 2005-10-21 2009-03-17 E. I. Du Pont De Nemours Packaging having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof
US7701052B2 (en) * 2005-10-21 2010-04-20 E. I. Du Pont De Nemours And Company Power core devices
US7697262B2 (en) 2005-10-31 2010-04-13 Avx Corporation Multilayer ceramic capacitor with internal current cancellation and bottom terminals
US7414857B2 (en) * 2005-10-31 2008-08-19 Avx Corporation Multilayer ceramic capacitor with internal current cancellation and bottom terminals
US7919804B2 (en) * 2005-11-08 2011-04-05 Oracle America, Inc. Power distribution for high-speed integrated circuits
KR20130023362A (ko) * 2006-05-24 2013-03-07 다이니폰 인사츠 가부시키가이샤 부품 내장 배선판, 부품 내장 배선판의 제조 방법
US7336501B2 (en) * 2006-06-26 2008-02-26 Ibiden Co., Ltd. Wiring board with built-in capacitor
US7709934B2 (en) * 2006-12-28 2010-05-04 Intel Corporation Package level noise isolation
US7902662B2 (en) * 2007-04-02 2011-03-08 E.I. Du Pont De Nemours And Company Power core devices and methods of making thereof
US8238116B2 (en) 2007-04-13 2012-08-07 Avx Corporation Land grid feedthrough low ESL technology
TWM335792U (en) * 2007-08-16 2008-07-01 Aflash Technology Co Ltd Device structure of IC
EP2259669A4 (en) * 2008-03-24 2011-12-28 Ngk Spark Plug Co COMPONENT WITH PCB
US8395902B2 (en) * 2008-05-21 2013-03-12 International Business Machines Corporation Modular chip stack and packaging technology with voltage segmentation, regulation, integrated decoupling capacitance and cooling structure and process
US8446705B2 (en) * 2008-08-18 2013-05-21 Avx Corporation Ultra broadband capacitor
US9041208B2 (en) 2011-11-02 2015-05-26 Avago Technologies General Ip (Singapore) Pte. Ltd. Laminate interconnect having a coaxial via structure
CN103458608A (zh) * 2012-06-05 2013-12-18 鸿富锦精密工业（深圳）有限公司 印刷电路板
US8941434B1 (en) * 2013-07-12 2015-01-27 Samsung Display Co., Ltd. Bus encoding scheme based on non-uniform distribution of power delivery network components among I/O circuits
KR101499721B1 (ko) * 2013-08-09 2015-03-06 삼성전기주식회사 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판
MY175520A (en) * 2014-02-21 2020-07-01 Mitsui Mining & Smelting Co Ltd Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring board
US9472425B2 (en) 2015-03-19 2016-10-18 Qualcomm Incorporated Power distribution improvement using pseudo-ESR control of an embedded passive capacitor
US9673179B1 (en) 2016-07-20 2017-06-06 International Business Machines Corporation Discrete electronic device embedded in chip module
DE102018201158B4 (de) 2018-01-25 2024-08-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum bestücken einer leiterplatte

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003101239A (ja) * 2001-09-27 2003-04-04 Kyocera Corp 多層配線基板
JP2003204163A (ja) * 2002-01-07 2003-07-18 Kyocera Corp 多層配線基板
JP2004202831A (ja) * 2002-12-25 2004-07-22 Kyocera Corp 複合シート、積層体およびそれらの製造方法、ならびに積層部品

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5010641A (en) 1989-06-30 1991-04-30 Unisys Corp. Method of making multilayer printed circuit board
US5161086A (en) 1989-08-23 1992-11-03 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
US5079069A (en) 1989-08-23 1992-01-07 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
US5155655A (en) 1989-08-23 1992-10-13 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
ATE124599T1 (de) 1990-04-05 1995-07-15 Dyconex Ag Herstellung von mehrschichtigen leiterplatten mit erhöhter leiterbahnendichte.
US5162977A (en) 1991-08-27 1992-11-10 Storage Technology Corporation Printed circuit board having an integrated decoupling capacitive element
US5800575A (en) 1992-04-06 1998-09-01 Zycon Corporation In situ method of forming a bypass capacitor element internally within a capacitive PCB
US5428499A (en) 1993-01-28 1995-06-27 Storage Technology Corporation Printed circuit board having integrated decoupling capacitive core with discrete elements
JP2000100985A (ja) * 1998-09-17 2000-04-07 Nitto Denko Corp 半導体素子実装用基板およびその製造方法と用途
US6214445B1 (en) * 1998-12-25 2001-04-10 Ngk Spark Plug Co., Ltd. Printed wiring board, core substrate, and method for fabricating the core substrate
US6446317B1 (en) * 2000-03-31 2002-09-10 Intel Corporation Hybrid capacitor and method of fabrication therefor
TW511409B (en) * 2000-05-16 2002-11-21 Hitachi Aic Inc Printed wiring board having cavity for mounting electronic parts therein and method for manufacturing thereof
US6407929B1 (en) 2000-06-29 2002-06-18 Intel Corporation Electronic package having embedded capacitors and method of fabrication therefor
US6346743B1 (en) 2000-06-30 2002-02-12 Intel Corp. Embedded capacitor assembly in a package
JP2002026515A (ja) * 2000-07-07 2002-01-25 Toshiba Corp プリント配線板およびその製造方法
US6611419B1 (en) 2000-07-31 2003-08-26 Intel Corporation Electronic assembly comprising substrate with embedded capacitors
JP4488684B2 (ja) 2002-08-09 2010-06-23 イビデン株式会社 多層プリント配線板
KR100755088B1 (ko) * 2003-03-28 2007-09-03 티디케이가부시기가이샤 다층 기판 및 그 제조방법
US20060158828A1 (en) 2004-12-21 2006-07-20 Amey Daniel I Jr Power core devices and methods of making thereof
US7778038B2 (en) * 2004-12-21 2010-08-17 E.I. Du Pont De Nemours And Company Power core devices and methods of making thereof
US7613007B2 (en) * 2004-12-21 2009-11-03 E. I. Du Pont De Nemours And Company Power core devices
US7701052B2 (en) 2005-10-21 2010-04-20 E. I. Du Pont De Nemours And Company Power core devices

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003101239A (ja) * 2001-09-27 2003-04-04 Kyocera Corp 多層配線基板
JP2003204163A (ja) * 2002-01-07 2003-07-18 Kyocera Corp 多層配線基板
JP2004202831A (ja) * 2002-12-25 2004-07-22 Kyocera Corp 複合シート、積層体およびそれらの製造方法、ならびに積層部品

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012134523A (ja) * 2004-12-21 2012-07-12 Cda Processing Limited Liability Company 電力コアデバイス、およびその作製の方法
WO2008146770A1 (ja) * 2007-05-25 2008-12-04 Toyota Jidosha Kabushiki Kaisha コンデンサ一体バスバーの製造方法および電力変換装置
JP2008295227A (ja) * 2007-05-25 2008-12-04 Toyota Motor Corp コンデンサ一体バスバーの製造方法および電力変換装置
US8112853B2 (en) 2007-05-25 2012-02-14 Toyota Jidosha Kabushiki Kaisha Method of manufacturing capacitor-integrated busbar

Also Published As

Publication number Publication date
US7778038B2 (en) 2010-08-17
KR20060071334A (ko) 2006-06-26
TWI314029B (en) 2009-08-21
US20060133057A1 (en) 2006-06-22
TW200628027A (en) 2006-08-01
EP1675448A1 (en) 2006-06-28
JP2012134523A (ja) 2012-07-12
KR100754714B1 (ko) 2007-09-03

Similar Documents

Publication Publication Date Title
JP2012134523A (ja) 電力コアデバイス、およびその作製の方法
US7613007B2 (en) Power core devices
US7701052B2 (en) Power core devices
KR100812515B1 (ko) 용량성/저항성 디바이스 및 이러한 디바이스를 통합하는인쇄 배선 기판, 그리고 그 제작 방법
KR101045505B1 (ko) 다층 프린트 배선판
US7548432B2 (en) Embedded capacitor structure
CN1822358B (zh) 电容器材料、电路化衬底及其制法、电总成及信息处理系统
JP5351149B2 (ja) プリント配線板のビルドアップ層への薄膜キャパシタの統合方法
US20040209398A1 (en) Semiconductor package, method of manufacturing the same, and semiconductor device
US7705691B2 (en) Capacitor interconnection
US7449381B2 (en) Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate
KR100754712B1 (ko) 전력 코어 장치 및 그 제조 방법
US7429510B2 (en) Method of making a capacitive substrate using photoimageable dielectric for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate
KR100816623B1 (ko) 전력 코어 장치 및 그 제조 방법
US7456459B2 (en) Design of low inductance embedded capacitor layer connections
JP4841234B2 (ja) ビアアレイキャパシタ内蔵配線基板の製造方法
CN1797761A (zh) 电源芯线器件及其制造方法
CN1815730A (zh) 电源芯器件及其制造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081222

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20081222

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090716

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20111018