TWI306874B - Polyimide for producing cast-on-copper laminate and method for producing thereof - Google Patents

Polyimide for producing cast-on-copper laminate and method for producing thereof Download PDF

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Publication number
TWI306874B
TWI306874B TW094129002A TW94129002A TWI306874B TW I306874 B TWI306874 B TW I306874B TW 094129002 A TW094129002 A TW 094129002A TW 94129002 A TW94129002 A TW 94129002A TW I306874 B TWI306874 B TW I306874B
Authority
TW
Taiwan
Prior art keywords
copper
dianhydride
polymer
clad laminate
group
Prior art date
Application number
TW094129002A
Other languages
English (en)
Chinese (zh)
Other versions
TW200708536A (en
Inventor
Mei Yen Wang
Peirong Kuo
Chia Huang Chang
Chienhwa Chiu
Original Assignee
Thinflex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thinflex Corp filed Critical Thinflex Corp
Priority to TW094129002A priority Critical patent/TWI306874B/zh
Priority to KR1020050098948A priority patent/KR100687387B1/ko
Publication of TW200708536A publication Critical patent/TW200708536A/zh
Application granted granted Critical
Publication of TWI306874B publication Critical patent/TWI306874B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
TW094129002A 2005-08-24 2005-08-24 Polyimide for producing cast-on-copper laminate and method for producing thereof TWI306874B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW094129002A TWI306874B (en) 2005-08-24 2005-08-24 Polyimide for producing cast-on-copper laminate and method for producing thereof
KR1020050098948A KR100687387B1 (ko) 2005-08-24 2005-10-20 동박적층판 제조용 폴리이미드 및 그의 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094129002A TWI306874B (en) 2005-08-24 2005-08-24 Polyimide for producing cast-on-copper laminate and method for producing thereof

Publications (2)

Publication Number Publication Date
TW200708536A TW200708536A (en) 2007-03-01
TWI306874B true TWI306874B (en) 2009-03-01

Family

ID=38104722

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094129002A TWI306874B (en) 2005-08-24 2005-08-24 Polyimide for producing cast-on-copper laminate and method for producing thereof

Country Status (2)

Country Link
KR (1) KR100687387B1 (ko)
TW (1) TWI306874B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102382019B1 (ko) * 2019-09-18 2022-04-01 피아이첨단소재 주식회사 폴리이미드 필름, 이의 제조방법, 및 이를 포함한 연성금속박적층판

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3689518B2 (ja) * 1997-02-18 2005-08-31 新日鐵化学株式会社 電子材料用樹脂溶液組成物
US6133408A (en) 1999-01-15 2000-10-17 Wirex Corporation Polyimide resin for cast on copper laminate and laminate produced therefrom
JP3768104B2 (ja) * 2001-01-22 2006-04-19 ソニーケミカル株式会社 フレキシブルプリント基板
KR100590719B1 (ko) * 2004-03-05 2006-06-19 주식회사 엘지화학 2층 동장 적층판의 제조방법

Also Published As

Publication number Publication date
TW200708536A (en) 2007-03-01
KR100687387B1 (ko) 2007-02-26

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