TWI306154B - - Google Patents
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- Publication number
- TWI306154B TWI306154B TW95124686A TW95124686A TWI306154B TW I306154 B TWI306154 B TW I306154B TW 95124686 A TW95124686 A TW 95124686A TW 95124686 A TW95124686 A TW 95124686A TW I306154 B TWI306154 B TW I306154B
- Authority
- TW
- Taiwan
- Prior art keywords
- probe
- signal
- grounding
- circuit board
- ground
- Prior art date
Links
- 239000000523 sample Substances 0.000 claims description 125
- 230000005540 biological transmission Effects 0.000 claims description 57
- 238000012360 testing method Methods 0.000 claims description 32
- 229910000679 solder Inorganic materials 0.000 claims description 25
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 239000007769 metal material Substances 0.000 claims description 6
- 238000005253 cladding Methods 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 3
- 230000035939 shock Effects 0.000 claims description 2
- 241000283973 Oryctolagus cuniculus Species 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 10
- 238000005259 measurement Methods 0.000 description 9
- 230000008054 signal transmission Effects 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 7
- 239000004020 conductor Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001595 contractor effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95124686A TW200804822A (en) | 2006-07-06 | 2006-07-06 | High-frequency probe card and transmission line for high-frequency probe card |
| SG200702176-9A SG138517A1 (en) | 2006-07-06 | 2007-03-23 | High-frequency probe card and transmission line for high-frequency probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95124686A TW200804822A (en) | 2006-07-06 | 2006-07-06 | High-frequency probe card and transmission line for high-frequency probe card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200804822A TW200804822A (en) | 2008-01-16 |
| TWI306154B true TWI306154B (enExample) | 2009-02-11 |
Family
ID=39004448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95124686A TW200804822A (en) | 2006-07-06 | 2006-07-06 | High-frequency probe card and transmission line for high-frequency probe card |
Country Status (2)
| Country | Link |
|---|---|
| SG (1) | SG138517A1 (enExample) |
| TW (1) | TW200804822A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8816713B2 (en) | 2011-07-22 | 2014-08-26 | Mpi Corporation | Probe card having adjustable high frequency signal transmission path for transmission of high frequency signal |
| TWI512300B (zh) * | 2013-07-15 | 2015-12-11 | Mpi Corp | Cantilever high frequency probe card |
| TWI572867B (zh) * | 2015-06-05 | 2017-03-01 | Mpi Corp | Probe module with feedback test function (2) |
| TWI576590B (zh) * | 2015-07-03 | 2017-04-01 | Mpi Corp | Cantilever high frequency probe card |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI407106B (zh) * | 2009-09-17 | 2013-09-01 | Mpi Corp | High frequency cantilever probe card |
| CN103858218B (zh) * | 2011-07-06 | 2017-02-15 | 塞莱敦体系股份有限公司 | 具有一探针装置的测试系统及转位机构 |
| TW202035995A (zh) * | 2019-03-18 | 2020-10-01 | 旺矽科技股份有限公司 | 探針裝置 |
| TWI707145B (zh) * | 2019-09-24 | 2020-10-11 | 松翰股份有限公司 | 用於影像感測晶片之探針卡的探針頭結構 |
| CN120610148B (zh) * | 2025-08-11 | 2025-10-28 | 广州广合科技股份有限公司 | 一种线路板插损测试方法 |
-
2006
- 2006-07-06 TW TW95124686A patent/TW200804822A/zh unknown
-
2007
- 2007-03-23 SG SG200702176-9A patent/SG138517A1/en unknown
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8816713B2 (en) | 2011-07-22 | 2014-08-26 | Mpi Corporation | Probe card having adjustable high frequency signal transmission path for transmission of high frequency signal |
| TWI512300B (zh) * | 2013-07-15 | 2015-12-11 | Mpi Corp | Cantilever high frequency probe card |
| TWI572867B (zh) * | 2015-06-05 | 2017-03-01 | Mpi Corp | Probe module with feedback test function (2) |
| TWI576590B (zh) * | 2015-07-03 | 2017-04-01 | Mpi Corp | Cantilever high frequency probe card |
Also Published As
| Publication number | Publication date |
|---|---|
| SG138517A1 (en) | 2008-01-28 |
| TW200804822A (en) | 2008-01-16 |
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