1305878 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種適用於電子產品殼體之製法，其係 為-種於膠層結合基材之處理方法，藉由該等複合技術， •俾使膠層表面具有極佳的耐磨性及良好的外觀性以提升電 子產品之附加價值者。 【先前技術】 # _般行動電話、PDA、遊戲機、遊戲機貯存卡、數 位手寫板、手提電腦、平板電腦、話機、電器用品··· 等等廣泛電子產品’尤其有關於可手攜帶式的電子產品， 均利用塑膠殼體來將電路板固定於其内，並達到外觀訴 求，唯該等習用殼體結構卻有改進之處。 。 具體舉例而言，如第一及二圖所示之手機結構，騎 體均以-定硬度之上蓋（9U 、下蓋（92)螺鎖或; #扣對合而成，在上蓋（91)、下蓋（92)間則固定有 電路板（9 3)，並在配合周邊結構之設置而達到電子產 品之預期功能。 該等上蓋（91)、下蓋（92)主要係以第三圖所 示之射出模具成型出來，其雖然符合大量生產之需求，作 是確有以下缺點： 一、外觀性不足：人們對於電子產品不僅係要求1使 用功能，更對於其造型、花紋、色彩及觸感等諸多特質有 1305878 所要求，可以此一體射出成型之殼體，其根本無法作出少 里多樣化之花紋、色彩變化，此乃目前射出殼體之主要缺 失。 二、易損壞：其上、下蓋（9 1) (92)為固定具 控制功效電路板之基礎’惟該上、下蓋（91)(92) 單純之一體材質根本不符吸震之要求，如上、下蓋（9 1〕 (9 2)和電路板（9 3)間未有防震結構設置下，該電 子產品在掉落地面或受到撞擊時，輕則使殼體破裂，重則 使該電路板（9 3)受外力衝撞而損壞，致使電子產品預 期之功能喪失，此乃習用技術無法突破之處。 有鑑於習用殼體因採塑膠一體射出成型製造，而有防 震性不佳及色彩變化性不多之缺點，乃以多年的專業經驗 與心得，經不斷構思、創研，乃研發出本發明。 【發明内容】 本發明之主要目的係提供：一種適用於電子產品殼體 之製法，其係於_且複合之基材成型出具立體形狀之輪 廓殼體，然後在殼體所形成的容置空間内成型膠層，使^ 膠層和輪廓殼體結合成一體，再以裁切修邊將殼體製成， 此加工方式，可增加該殼體外觀變化性外，域藉由複合 之結構來大幅增加殼體之防震性，以去除習用—體射出^ 法的不良問題，有效地增進品質，確實為殼體加工提出— 6 1305878 有效解決之新穎技術。 為使貴審查委員能進一步瞭解本發明之結構，特徵 及其他目的’玆附以較佳實施例圖式詳細說明如后： 【實施方式】 為達成前述目的，本發明步驟包括有： a) 明參閱弟四圖所示，本發明先備置一具熱可變形之 基材（10)，該基材（10)可以具有色彩及圖樣之圖 層（1 1)及透光耐磨之外層膜（i 2)組成，然後將透 光外層膜（1 2)結合於圖層（丄丄）底面而構成一體之 耐磨基材（1〇)結構； b) 請配合第五及六圖觀之，將基材（i 〇 )置入成型 模具中，藉真空吸力而定型出具立體形狀之輪廣殼體，該 輪廓殼體内具有容置空間（i 3)，並使圖層（i）係 形成於内面，外層膜（丄2)形成於外面； c) 請再配合第七及八圖觀之，然後於成型模具之上模 注入膠材，使該膠材填充於基材（丄〇)容置空間（丄3 ) 内以成型出膠層（2 G)，該膠層（2 〇)和基材（工〇) 相鄰界面係熔接結合成一體，令容置空間（丄3 )内直接 成型或置有膠層（2 0)，且使耐磨基材（丄〇 )形成於 膠層（20)外層而構成電子產品之殼體結構，俾使該基 材（1 0)能保護及美化膠層（2 〇)外觀； 13〇5878 d)將前述殼體脫模，並裁切基材（1 〇 )或膠層（2 〇 )毛邊後，即得一兼具外觀性、防震性之殼體成品，使 其可按裝於如第九圖所示之手機上，令該殼體於電子產業 附加價值大幅提升。 依本發明之特殊製程，在以下之說明即能了解進步處。 —、具外觀變化性：本發明以耐磨基材（1 〇)中介 膠層（2 0)外觀’據以強化該膠層（2 〇)之耐磨能力， 且配合基材（1 0 )中至少具有色彩及圖樣之圖層（1 1 )、 透光外層膜（1 2)之構成，當使該殼體在同時兼具色彩 豐富及立體生動活潑外觀下達到增進三維空間之視覺效 果；除此之外，本發明只須抽換不同視效之圖層（i i )， 即得製造出少量多樣化之殼體外觀，相當符合現今電子產 品之個性化需求。 二、具防震性：本發明殼體主要係由基材（1 〇)及 膠層（2 0)複合所構成，而所複合之基材（1 〇 )便具 有一定之減震性，故在受到碰撞、或掉落地面時，苴能先 吸收該等外力’減緩膠層（2 Q )受力情形，進而^習 用殼體容易破裂或損及電路板之缺點。 奉發明马使暴材 / 、匕更為容易έ士 合成-體’其可在圖層（11)塗附有膠膜， 中介設置而使膠層（20)與圖層（11)相鄰界面= 合更為容m本發明可在成型模具之上模姑附; 8 1305878 布，使該層布可在合模後對合於基材（1 〇 )容置空間（1 3)内’以形成-内裡結構；或者，於成型模具之下模中 貼附-層布，使其貼附於基材（丄Q)外，以形成一特異 觸感之殼體外裡結構。 再則’本發明可以在膠材内摻入回收之木肩、或稻草 屑、或廢塑膠粒·.等等天然纖維材質或顆粒回收料，使 本發明形成之膠層（2 0)具有環保性。當然，其亦可以 在膠材摻入硬質塑㈣、或玻璃纖維· ·#等高硬度之顆 粒材料，以改善膠層（2 0)成型之結構性。另外，其可 以在膠材内摻人抗靜電和導電性之材料，使本發明所製成 之膠層（2 0)結構更符合安全需求。 最後，如第十圖所示’本創作亦可以較具經濟性之發 泡層（3直接取代膠層（2〇)，而直接發泡成型^ 置設於輪廓殼體之容置空間（13)β，使該發泡— 0)之一面係結合基材（1 0 )、另面則能形成 丄）’其中空室（31)係可供電路板震置或供節： 之用。當然’該中空室（3 1 )形成於膠層（ 材料 面，則更能節省成本及重量。 '^内 綜上所述’依本發明之製法 备可廣泛的運用於久 子產品上，例如第Η—圖所示之電子數位板 式電 鳢結 示之遊戲機貯存卡、第十三圖所示之滑圖所 之顯示器均可以㈣的運用’本發_等膠層 ^示 9 1305878 合有相對應之耐磨基材，確能加強保護及美化膠層，藉以 突破改革習用殼體之防震性不足、外觀性不佳的缺點，是 一技術理念上的高度發明，使電子產品之產業附加價值大 幅提升，實具突破性的價值，乃一極佳發明，應符發明專 利申請要件，爰依法提出申請。惟以上所述者，僅為本發 明之一較佳實施例而已，當不能以之限定本發明實施之範 圍，即大凡依本發明申請專利範圍所作之均等變化與修 飾，皆應仍屬本發明涵蓋之範圍内，例如：本發明基材（1 0)之圖層（1 1)可以設置於殼體最外層之實施例亦可 視為本發明。1305878 IX. Description of the Invention: [Technical Field] The present invention relates to a method for manufacturing an electronic product casing, which is a processing method for bonding a rubber layer to a substrate, by which the composite technology is俾The surface of the adhesive layer has excellent wear resistance and good appearance to enhance the added value of electronic products. [Prior Art] # _ General mobile phones, PDAs, game consoles, game consoles, digital tablets, laptops, tablets, telephones, electrical appliances, etc. A wide range of electronic products, especially about hand-held The electronic products all use a plastic case to fix the circuit board therein, and achieve the appearance appeal, but the conventional housing structure has improved. . For example, as shown in the first and second mobile phone structures, the riding body is covered with a fixed hardness (9U, lower cover (92) screw lock or; #扣合合合,在上盖(91) A circuit board (93) is fixed between the lower cover (92), and the intended function of the electronic product is achieved by the arrangement of the peripheral structure. The upper cover (91) and the lower cover (92) are mainly in the third figure. The injection mold shown is shaped, although it meets the needs of mass production, it has the following disadvantages: 1. Insufficient appearance: People not only require the use of functions for electronic products, but also for their shapes, patterns, colors and touches. Sense and other characteristics are required by 1305878, which can be used to shoot out the molded shell, which can not make a variety of patterns and color changes, which is the main missing of the current injection shell. Second, easy to damage: on it, The lower cover (9 1) (92) is the basis of the fixed control circuit board. 'Only the upper and lower covers (91) (92) are purely incompatible with the shock absorption requirements, such as the upper and lower covers (9 1) ( 9 2) There is no anti-shock structure between the circuit board and the circuit board (9 3) When the electronic product is dropped on the ground or impacted, the casing is broken, and the circuit board (93) is damaged by external force, which causes the expected function of the electronic product to be lost. This is a conventional technology that cannot be broken. In view of the fact that the conventional casing is manufactured by injection molding, it has the disadvantages of poor shock resistance and limited color change. It has been developed and researched for many years with professional experience and experience. SUMMARY OF THE INVENTION The main object of the present invention is to provide a method for manufacturing an electronic product casing, which is formed on a composite substrate and formed into a three-dimensional contoured casing, and then formed in the casing. Forming the adhesive layer in the accommodating space, so that the rubber layer and the contour shell are integrated into one body, and then the shell is made by cutting and trimming, and the processing method can increase the appearance variability of the shell, and the domain is compounded by The structure greatly increases the shock resistance of the casing, so as to remove the problem of the conventional-body injection method, effectively improve the quality, and indeed proposes for the shell processing - 6 1305878 effectively solved the novel technology In order to enable the reviewing committee to further understand the structure, features and other objects of the present invention, the detailed description of the preferred embodiments is as follows: [Embodiment] In order to achieve the foregoing objectives, the steps of the present invention include: a As shown in the fourth figure, the present invention first prepares a thermally deformable substrate (10) which can have a layer of color and pattern (1 1) and a transparent wear-resistant outer film. (i 2) composition, and then bonding the transparent outer layer film (12) to the bottom surface of the layer (丄丄) to form an integrated wear-resistant substrate (1〇) structure; b) please cooperate with the fifth and sixth figures, The substrate (i 〇) is placed in a molding die, and a wheel-shaped housing having a three-dimensional shape is formed by vacuum suction, and the contour housing has an accommodation space (i 3), and the layer (i) is formed on the layer The inner surface, the outer layer film (丄2) is formed on the outside; c) please cooperate with the seventh and eighth figures, and then inject the glue on the molding die to fill the substrate (丄〇). Inside the space (丄3) to form a glue layer (2 G), the glue layer (2 〇) and the substrate (worker) adjacent The surface is welded and integrated into one body, so that the adhesive layer (20) is directly formed or placed in the accommodating space (丄3), and the wear resistant substrate (丄〇) is formed on the outer layer of the adhesive layer (20) to constitute an electronic product. The shell structure enables the substrate (10) to protect and beautify the appearance of the adhesive layer (2 〇); 13〇5878 d) demold the shell and cut the substrate (1 〇) or the rubber layer (2 〇) After the burrs, the finished product with both appearance and shock resistance can be installed on the mobile phone as shown in Figure 9, which greatly increases the added value of the casing in the electronics industry. According to the special process of the present invention, the progress can be understood in the following description. - Appearance variability: The present invention uses an abrasion-resistant substrate (1 〇) to form an adhesive layer (20) to enhance the wear resistance of the adhesive layer (2 〇), and to match the substrate (10) The layer (1 1 ) and the transparent outer layer (12) having at least a color and a pattern can achieve a visual effect of enhancing the three-dimensional space when the shell has both a rich color and a vivid and lively appearance; In addition, the present invention only needs to replace the layers (ii) of different visual effects, that is, to produce a small variety of shell appearances, which is quite in line with the individual needs of today's electronic products. Second, with shock resistance: the casing of the present invention is mainly composed of a composite of a substrate (1 〇) and a rubber layer (20), and the composite substrate (1 〇) has a certain shock absorption property, so When it is bumped or dropped on the ground, it can absorb the external force first to slow down the stress of the rubber layer (2 Q), and then the housing is easy to break or damage the circuit board. In the invention of the horse to make the material /, 匕 is easier to synthesize the body - the body ' can be coated on the layer (11) with a film, the intermediate layer so that the glue layer (20) and the layer (11) adjacent interface = More than the present invention can be attached to the molding die; 8 1305878 cloth, so that the layer can be bonded to the substrate (1 )) accommodating space (1 3) after the mold is closed to form - Inner structure; or, a layer of cloth is attached to the mold under the molding die to be attached to the outside of the substrate (丄Q) to form a shell structure with a specific tactile sensation. Furthermore, the present invention can incorporate a recycled wood shoulder, or a straw fiber, or a waste plastic pellet, or the like into a natural fiber material or a particulate reclaimed material in the rubber material, so that the rubber layer (20) formed by the present invention is environmentally friendly. Sex. Of course, it is also possible to incorporate a high-hardness granular material such as hard plastic (4) or glass fiber··# in the rubber material to improve the structural properties of the rubber layer (20). In addition, it can incorporate antistatic and conductive materials into the rubber material, so that the rubber layer (20) structure made by the present invention is more in line with safety requirements. Finally, as shown in the tenth figure, 'this creation can also be more economical foam layer (3 directly replaces the rubber layer (2〇), and direct foam molding ^ is placed in the housing space of the contour shell (13 β, so that one of the foaming—0) is bonded to the substrate (10), and the other surface can be formed into a crucible)] wherein the empty chamber (31) is used for the circuit board to be shocked or provided for use. Of course, the hollow chamber (3 1 ) is formed on the rubber layer (the material surface is more cost-effective and weight-saving. '^In the above, the method according to the invention can be widely applied to the long-term product, for example, Η 图 图 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子Corresponding wear-resistant substrates can strengthen the protection and beautify the rubber layer, so as to break through the shortcomings of the shock-proof and poor appearance of the reformed shell, which is a high-invention of the technical concept and the added value of the electronic products. A substantial improvement, a breakthrough value, is an excellent invention, should meet the requirements of the invention patent application, and apply in accordance with the law. However, the above is only a preferred embodiment of the present invention, when it can not be The scope of the present invention is defined by the scope of the present invention, and the layer (1 1) of the substrate (10) of the present invention may be included in the scope of the present invention. Setting The outermost layer of the casing can be regarded as an embodiment of the present invention.
10 Γ305878 【圖式簡單說明】 第一圖：係習用手機之分解示意圖。 第二圖：係習用手機之組合外觀示意圖。 第三圖：係習用手機殼體於模具中射出成型示意圖。 第四圖：係本發明基材之分解示意圖。 第五圖：係本發明成型基材之示意圖。 第六圖：係本發明基材成型出輪廓殼體之立體示意圖。 第七圖：係本發明輪廓殼體置於成型模具之示意圖。 第八圖：係本發明膠層之成型示意圖。 第九圖：係本發明實施於手機之實施例示意圖。 第十圖：係本發明結合發泡材之實施例示意圖。 第十一圖：係本發明實施於電子數位板之實施例示意圖。 第十二圖：係本發明實施於貯存卡之實施例示意圖。 第十三圖：係本發明實施於滑鼠之實施例示意圖。 第十四圖：係本發明實施於顯示器之實施例示意圖。 【主要元件符號說明】 (1 0 )基材 （1 1 )圖層 (1 2 )外層膜 （1 3)容置空間 (2 0)膠層 (3 0 )發泡層 （3 1 )中空室 (9 1 )上蓋 （9 2)下蓋 (9 3)電路板 1110 Γ 305878 [Simple description of the diagram] The first picture: a schematic diagram of the breakdown of the used mobile phone. The second picture shows the appearance of the combination of the used mobile phones. The third figure is a schematic diagram of the injection molding of the conventional mobile phone case in the mold. Figure 4 is a schematic exploded view of the substrate of the present invention. Figure 5 is a schematic view of a shaped substrate of the present invention. Figure 6 is a perspective view showing the outline of the substrate of the present invention. Figure 7 is a schematic view showing the contoured casing of the present invention placed on a forming mold. Figure 8 is a schematic view showing the formation of the adhesive layer of the present invention. Ninth Diagram: A schematic diagram of an embodiment of the present invention implemented in a mobile phone. Fig. 10 is a schematic view showing an embodiment of the present invention in combination with a foamed material. Eleventh Embodiment: A schematic diagram of an embodiment of the present invention implemented in an electronic tablet. Twelfth Diagram: A schematic diagram of an embodiment of the present invention implemented on a storage card. Thirteenth Diagram: A schematic diagram of an embodiment of the present invention implemented in a mouse. Figure 14 is a schematic view showing an embodiment of the present invention implemented in a display. [Main component symbol description] (1 0) substrate (1 1 ) layer (1 2 ) outer layer film (1 3) accommodation space (20) glue layer (30) foam layer (3 1) hollow chamber ( 9 1) Upper cover (9 2) Lower cover (9 3) Circuit board 11