CN105774067B - A kind of component production method of composite board, electronic equipment and composite board - Google Patents
A kind of component production method of composite board, electronic equipment and composite board Download PDFInfo
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- CN105774067B CN105774067B CN201410818092.4A CN201410818092A CN105774067B CN 105774067 B CN105774067 B CN 105774067B CN 201410818092 A CN201410818092 A CN 201410818092A CN 105774067 B CN105774067 B CN 105774067B
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Abstract
The embodiment of the invention provides a kind of composite board, electronic equipment and composite board component production method, which includes: the first sheet metal layer, the second sheet metal layer and physical layer, and the first sheet metal layer includes at least one layer of first reinforcing material；It and include at least one layer of second reinforcing material；Between the first sheet metal layer and the second sheet metal layer, physical layer protrudes physical layer in the interlayer space under the first preset condition between the first sheet metal layer and the second sheet metal layer.Since physical layer is thermoplastic resin, with lighter weight, therefore the overall weight of composite board can be reduced, and when carrying out post forming processing, physical layer can be effectively prevented injection-moulded plastic and penetrate into composite board, so that the problem of preventing the deformation for the surface sheet metal layer for leading to composite board because of infiltration, so that composite board is able to maintain preferable shape, improve product quality.
Description
Technical field
This application involves the production of electronic technology field more particularly to a kind of composite board, electronic equipment and composite board
Method.
Background technique
Currently, most electronic equipment uses composite material as the making material of shell, set to reduce electronics
Standby thickness and weight, while shell is improved to the protection intensity of electronic equipment.In general, the composite board used is using identical
Reinforcement fibrous layers stacked and manufactured composite material, but the composite board heavier-weight of the structure, higher cost, and
During post forming, cannot preferably it be combined with injected plastics material.
Summary of the invention
The embodiment of the invention provides the component production method of a kind of composite board, electronic equipment and composite board, to
Solve composite board heavier-weight in the prior art, higher cost, and during post forming, it cannot be preferable with injected plastics material
The problem of ground combines.
Its specific technical solution is as follows:
A kind of composite board, comprising: the first sheet metal layer, the second sheet metal layer and physical layer, wherein
First sheet metal layer includes at least one layer of first reinforcing material；
Second sheet metal layer, and include at least one layer of second reinforcing material；
The physical layer, between first sheet metal layer and second sheet metal layer, wherein the physical layer is
It is protruded in interlayer space under one preset condition between first sheet metal layer and second sheet metal layer.
A kind of composite board, the physical layer include: the first sheet metal layer, the second sheet metal layer and physical layer, wherein
First sheet metal layer includes at least one layer of first reinforcing material；
Second sheet metal layer, and include at least one layer of second reinforcing material；
The physical layer include first part and second part, the first part be under pressure for physical layer after by institute
State the part protruded in the interlayer space constituted between the first sheet metal layer and second sheet metal layer；The second part, is located at
By in the interlayer space constituted between first sheet metal layer and second sheet metal layer, for bond first sheet metal layer with
And second sheet metal layer.
A kind of electronic equipment, comprising:
Main body；
Shell, with having the shape to match with the main body with the main body, the shell is made of composite board,
The composite board includes the first sheet metal layer, the second sheet metal layer and physical layer, and first sheet metal layer includes at least one layer first
Increase material material, second sheet metal layer includes at least one layer of second reinforcing material, and the physical layer is located at first sheet metal layer
Between second sheet metal layer；
Wherein, the physical layer includes first part and second part, and the first part is under pressure for physical layer
Part by being protruded in the interlayer space constituted between first sheet metal layer and second sheet metal layer afterwards；Described second
Point, in by the interlayer space constituted between first sheet metal layer and second sheet metal layer, for bonding described first
Sheet metal layer and second sheet metal layer.
A kind of component production method of composite board, comprising:
Under preset temperature, former composite board is depressed into second thickness from first thickness in preset die, so that entity
Layer is protruded from the interlayer space that the first sheet metal layer and the second sheet metal layer are constituted by thermal softening, wherein the first sheet metal layer packet
Containing at least one layer of first reinforcing material, second sheet metal layer includes at least one layer of second reinforcing material；
Injected plastics material is filled into the cavity between former composite board and the preset die, obtains the component, wherein
The part of the protrusion of the physical layer is in conjunction with the injected plastics material.
Explanation in the specific embodiment for the technical effect reference book that technical solution of the present invention is realized.
Detailed description of the invention
Fig. 1 is one of structural schematic diagram of composite board a kind of in the embodiment of the present invention；
Fig. 2 is a kind of second structural representation of composite board in the embodiment of the present invention；
Fig. 3 is a kind of structural schematic diagram of the physical layer in the embodiment of the present invention in composite board；
Fig. 4 is the connection schematic diagram of physical layer and molded portion in the embodiment of the present invention；
Fig. 5 is the schematic diagram that composite board is suppressed in preset die in the embodiment of the present invention；
Fig. 6 is the structural schematic diagram of a kind of electronic equipment in the embodiment of the present invention；
Fig. 7 is the structural schematic diagram of a kind of electronic equipment shell in the embodiment of the present invention；
Fig. 8 is a kind of flow chart of the production method of the component of composite board in the embodiment of the present invention；
Fig. 9 is the schematic diagram that composite board suppresses first part in preset die in the embodiment of the present invention；
Figure 10 is the schematic diagram for filling molded portion in the embodiment of the present invention into cavity.
Specific embodiment
A kind of embodiment:
The embodiment of the invention provides a kind of composite board, which includes: the first sheet metal layer, the second sheet metal layer and reality
Body layer, the first sheet metal layer include at least one layer of first reinforcing material；Second sheet metal layer is parallel with the first sheet metal layer, and includes at least
One layer of second reinforcing material；Physical layer is between the first sheet metal layer and the second sheet metal layer, wherein physical layer is in the first default item
It can be protruded in the interlayer space between the first sheet metal layer and the second sheet metal layer under part.
In the embodiment of the present invention, since the composite board by the first sheet metal layer, the second sheet metal layer and is located at the first plate
Physical layer composition between layer and the second sheet metal layer, and the material of physical layer can be used thermoplastic resin, the first of physical layer
Surface is in contact with the first sheet metal layer, and second surface is in contact with the second sheet metal layer.Pass through the first sheet metal layer and the second sheet metal layer
So that the composite board has preferable flintiness.
In addition, there is lighter weight, therefore composite board can be reduced since physical layer can be thermoplastic resin material
Overall weight, and when carrying out post forming processing, physical layer can be effectively prevented injection-moulded plastic and penetrate into composite board, from
And the problem of leading to the deformation of the sheet metal layer on composite board surface because of infiltration is prevented, so that composite board is able to maintain preferable shape
Shape improves product quality.
Further, since physical layer can be thermoplastic resin, therefore in the case where meeting shell hardness, it can reduce by the first plate
The number of plies of reinforcing material required for material layer and/or the second sheet metal layer uses shell made of the composite board so as to reduce
Weight, also reduce cost of manufacture.
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical solution of the present invention is clearly and completely described, it is clear that described embodiment is skill of the present invention
A part of the embodiment of art scheme, instead of all the embodiments.Based on the embodiment recorded in present specification, this field is general
Logical technical staff every other embodiment obtained without creative efforts, belongs to the technology of the present invention side
The range of case protection.
In the embodiment of the present invention, electronic equipment can be understood as notebook, PAD (tablet computer), mobile phone etc. electronics and set
It is standby, the embodiment of the present invention to this with no restriction.
In the embodiment of the present invention, composite board can be used for making electronic equipment casing, for example, being made of composite material
Phone housing, panel computer shell etc..Protect electronic equipment internal each in general, the shell of electronic equipment can mainly play
The effect of component, secondly, the frivolous property of shell also determines the frivolous property of the entirety of electronic equipment, therefore in the generation of electronic equipment
In the process, the frivolous property for reducing shell is also increasingly taken seriously.
In order to guarantee the intensity and frivolous property of shell, shell can all use composite board, and composite board is also referred to as compound
Material, a kind of solid material that composite material is made of two or more different physical materials, i.e., using a kind of material as matrix,
Another material is the material that reinforcement is composed, and a variety of materials make up for each other's deficiencies and learn from each other in performance, generates synergistic effect,
The comprehensive performance of composite material is set to be better than former composition material and meet a variety of different requirements.The basis material of composite material is divided into
Metal and nonmetallic two major classes, wherein there are commonly aluminium, magnesium, copper, titanium and its alloys for metallic matrix；Nonmetal basal body mainly has
Synthetic resin, rubber, ceramics, graphite, carbon etc..And common reinforcing material mainly has glass fibre, carbon fiber, boron fibre, virtue
Synthetic fibre fiber, silicon carbide fibre, asbestos fibre, whisker, wire and hard particulates etc..
In order to realize the intensity and frivolous property of shell, providing one kind in embodiments of the present invention can be to make electricity
The composite board of sub- device housings is as shown in Figure 1 a kind of structural schematic diagram of composite board provided in an embodiment of the present invention.This
Composite board in inventive embodiments includes: the first sheet metal layer 1, the second sheet metal layer 2 and physical layer 3.
In embodiments of the present invention, the first sheet metal layer 1 can form an outer surface of the shell of electronic equipment, the first plate
Material layer 1 may include at least one layer of first reinforcing material, and the first reinforcing material includes glass fibre, carbon fiber or Kafra fiber
At least one of fibrous material, naturally it is also possible to be the conjugate fiber of above-mentioned fiber, such as carbon fiber and glass fibre
Combination.
First sheet metal layer 1 at least the first fibrous layer and the second fibrous layer stack to be formed, wherein the first fibrous layer and
Have first to stack angle between two fibrous layers to stack, the first stacking angle is fiber and the second fibrous layer in the first fibrous layer
In fiber between angle.
The composition situation of the first sheet metal layer of part 1 is just enumerated below:
Situation one: in embodiments of the present invention, which can be carbon fiber, and the first sheet metal layer 1 can be
It is stacked and is formed by the first carbon fiber layer and the second carbon fiber layer, the first carbon fiber layer and the second carbon fiber layer can be according to first
It stacks angle to stack, wherein the first stacking angle is the carbon fiber in carbon fiber and the second carbon fiber layer in the first carbon fiber layer
Between angle.That is when placing the first carbon fiber layer and then placing the second carbon fiber layer, second carbon fiber
Layer intersects placement with the first carbon fiber layer, and in general, which can be 60 ° or 90 °, of course, it is possible to root
Factually the case where border, selects the first stacking angle, to guarantee the intensity of first sheet metal layer 1.
Situation two:
First reinforcing material can also be the first composite fibre of carbon fiber and glass fibre, in certain first composite fibre
Carbon fiber and the ratio of glass fibre can be adjusted according to the demand of actual product, such as in composite fibre carbon fiber with
The ratio of glass fibre can be 5:5 or 6:4 etc..
In this case, the first sheet metal layer 1, which can be, stacks structure by the first mixed fiber layer and the second mixed fiber layer
At the stacking angle between the first mixed fiber layer and the second mixed fiber layer is also possible to the first stacking folder in situation one
Angle is not described in more detail here.
In addition, it is necessary to which explanation, the first sheet metal layer 1 can also be by the first mixed fiber layer and the first carbon fiber layer heap
It is folded to be formed, it is also repeated no more herein as the mode of stacking.
Situation three:
First reinforcing material can also be glass fibre, and the first sheet metal layer 1 is by the first glass layer and second at this time
Stacking placement is carried out according to the first stacking angle between glass layer.
Certainly, herein it should also be noted that, the first sheet metal layer 1 can also be by the first glass layer and the first carbon fiber
It ties up layer to constitute, can also be and be made of the first glass layer and the first mixed fiber layer, be made of different fibrous layers
The intensity and weight of first sheet metal layer 1 have certain difference, for example, when the first sheet metal layer 1 is made of two layers of carbon fiber layer,
Then the intensity of composite board is higher, and quality is also relatively light, but cost is also correspondingly improved；If the first sheet metal layer 1 is by
When one mixed fiber layer and the first carbon fiber layer are constituted, then the intensity of composite board is also higher, and quality is also relatively light, certainly can be than complete
The intensity of carbon fiber is low, and quality also can be more heavier；If the first sheet metal layer 1 is made of glass fibre, then composite board
Intensity it is lower, and quality is also heavier, but cost can be lower.Therefore the first sheet metal layer 1 can by different synthesis modes,
The specific composition material for not limiting the first sheet metal layer in embodiments of the present invention, can be according to product in actual application
Demand selects the constituent material of the first sheet metal layer 1, for example determines the composition of the first sheet metal layer 1 according to the requirement of production cost
Material.
Certainly, the first sheet metal layer can be is made of multi-layer fiber layer, in embodiments of the present invention in the first sheet metal layer
The number of plies for the fibrous layer for including is without limitation.
Similarly, in embodiments of the present invention, the second sheet metal layer 2 is parallel with the first sheet metal layer 1, therefore the first sheet metal layer 1 and
Two sheet metal layers 2 may be constructed the upper and lower surface of shell, and the second sheet metal layer 2 includes at least one layer of second reinforcing material, the second enhancing
Material includes at least one of carbon fiber, glass fibre, Kafra fiber fibrous material, the second sheet metal layer 2 at least third
Fibrous layer and the 4th fibrous layer stack to be formed, wherein have second to stack between third fibrous layer and the 4th fiber ability mistake
Angle stacks, and the second stacking angle is the angle between the fiber in fiber and the 4th fibrous layer in third fibrous layer.
The composition situation of the second sheet metal layer of part 2 is just enumerated below:
Situation one: in embodiments of the present invention, which can be carbon fiber, and the second sheet metal layer 2 can be
It is stacked and is formed by third carbon fiber layer and the 4th carbon fiber layer, third carbon fiber layer and the 4th carbon fiber layer are stacked according to first
Angle stacks, wherein the first stacking angle is between carbon fiber in carbon fiber and the 4th carbon fiber layer in third carbon fiber layer
Angle.That is place third carbon fiber layer and then place four carbon fiber layers when, the 4th carbon fiber layer with
Third carbon fiber layer intersects, and in general, which can be 60 ° or 90 °, of course, it is possible to according to actual
Situation selects the first stacking angle, to guarantee the intensity of second sheet metal layer 2.
Situation two:
Second reinforcing material can also be the first composite fibre of carbon fiber and glass fibre, in certain first composite fibre
Carbon fiber and the ratio of glass fibre can be adjusted according to actual applicable cases, such as carbon fiber and glass fibre
Ratio can be 5:5 or 6:4 etc..
In this case, the second sheet metal layer 2 can be is made of the first composite fibre and the second composite fibre, and first is mixed
As soon as the stacking angle between condensating fiber layer and the second mixed fiber layer is also possible to the first stacking angle in situation, herein not
It repeats again.
In addition, it is necessary to which explanation, the second sheet metal layer 2 can also be by the first mixed fiber layer and the first carbon fiber layer heap
It is folded to be formed, it is also repeated no more herein as the mode of stacking.
Situation three:
Second reinforcing material can also be glass fibre, and the second sheet metal layer 2 is by third glass layer and the 4th at this time
It is also possible to stack angle according to first to carry out stacking placement between glass layer.
Certainly, herein it should also be noted that, the second sheet metal layer 2 can also be by third glass layer and third carbon fiber
It ties up layer to constitute, can also be and be made of third glass layer and the first mixed fiber layer, be made of different fibrous layers
The intensity and weight of second sheet metal layer 2 have certain difference, for example, the second sheet metal layer 2 is made of two layers of carbon fiber layer
When, the intensity of last composite board is higher, and quality is also relatively light, but cost is also correspondingly improved；If the second sheet metal layer 2 is
When being made of the first mixed fiber layer and third carbon fiber layer, then the intensity of composite board is also higher, and quality is also relatively light, certain meeting
Intensity than full carbon fiber is low, and quality also can be more heavier；If the second sheet metal layer 2 is made of glass fibre, then compound
The intensity of plate is lower, and quality is also heavier, but cost can be lower.Therefore the second sheet metal layer 2 can be synthesized by different
Mode does not limit the specific composition material of the second sheet metal layer 2 in embodiments of the present invention, can basis in actual application
The demand of product selects the constituent material of the second sheet metal layer 2.
Herein it is emphasized that material used in the first sheet metal layer 1 does not interfere with the second sheet metal layer 2 is made
Material, for example, the first sheet metal layer 1 use full carbon fibre material when, the second sheet metal layer 2 can be used mixed fiber layer with
Material composition of carbon fiber layer etc..So the first sheet metal layer 1 and the second sheet metal layer 2 can be according to products in actual application
Demand is adjusted.
In addition, it should also be noted that, the first sheet metal layer 1 and the second sheet metal layer 2 can also be and be made of trilaminate material,
Such as it stacked and is formed by three layers of carbon fiber, stacked by three layers of mixed fiber layer and formed, formed by triplex glass fiber stack.
Certainly, the first sheet metal layer 1 and the second sheet metal layer 2 can also be one layer or four layers or more of materials process, of the invention real
Apply the material and the number of plies for not limiting in example and constituting the first sheet metal layer 1 and the second sheet metal layer 2.Certainly, the second sheet metal layer 2 can
It is identical with the composition of the first sheet metal layer 1 to select, it can also be not identical as the composition of the first sheet metal layer 1.It herein can root
It is adjusted according to the demand of actual product.
Further, as shown in Figure 1, being additionally provided with physical layer, physical layer 3 between the first sheet metal layer 1 and the second sheet metal layer 2
Can be thermoplastic resin material, thermoplastic resin has by thermal softening, the characteristic of hardening by cooling, and chemical feature is stablized,
It either heats and cooling repeats how many times, be able to maintain stable characteristic, and in molding process, resin is through adding
The i.e. softening flowing of pressure heating, will not be chemically crosslinked, can in mold figuration, through cooling and shaping, shape needed for being made
Product.In general, the thermoplastic resin which uses can be PE- polyethylene, PVC- polyvinyl chloride, PA- polyamides
Amine, PC- polycarbonate etc..
Specifically, in embodiments of the present invention, physical layer 3 has first surface and second surface, and first surface can be with
It is in contact with the first sheet metal layer 1, second surface can be in contact with the second sheet metal layer 2.That is first surface and second surface can be with
Two contact surfaces of physical layer 3 Yu superficial layer, and the first sheet metal layer 1, the second sheet metal layer 2 and physical layer 3 be by hot pressing or
The processing mode of bonding is attached, so that composite board has preferable tightness, to improve the hardness of the product of production, together
When, due to the lighter in weight of thermoplastic resin material, therefore can also reduce the weight of product.
Optionally, it is generally the case that the area identical with the first sheet metal layer 1 and/or the second sheet metal layer 2 of physical layer 3.First
Sheet metal layer 1 and the area having the same of the second sheet metal layer 2, the then area in the physical layer 3 between the two are same.
But have in the production process of actual product, due to designing or making needs, in fact it could happen that the first sheet metal layer 1 and
Two sheet metal layers 2 have different areas, at this point, physical layer 3 can be with the area phase of the first sheet metal layer 1 or the second sheet metal layer 2
Together, it can also be different from the area of the first sheet metal layer 1 and the second sheet metal layer 2.Such as shown in Fig. 2, in this Fig. 2
In, the area of physical layer is not just identical as the area of the first sheet metal layer 1 and the second sheet metal layer 2.
Further, in embodiments of the present invention, in order to guarantee the product effect of composite board, therefore the thickness of composite board
Between 0.3mm-5mm, the density of composite board be can control in 0.5kg/cm for control3-5kg/cm3Between.
In addition, it should also be noted that, in embodiments of the present invention, between the first sheet metal layer 1 and the second sheet metal layer 2 is
It is parallel, but in actual production, can be between the first sheet metal layer 1 and the second sheet metal layer 2 it is not parallel, such as it is real
The one side of body layer 3 is inclined-plane, just not parallel between the first sheet metal layer 1 and the second sheet metal layer 2 at this time, therefore, is implemented in the present invention
The relative positional relationship between the first sheet metal layer 1 and the second sheet metal layer 2, in actual production, the first plate are not limited in example
Relative position between material layer 1 and the second sheet metal layer 2 is adjustable.
In the embodiment of the present invention, since the composite board by the first sheet metal layer 1, the second sheet metal layer 2 and is located at the first plate
Physical layer 3 between material layer 1 and the second sheet metal layer 2 forms, and thermoplastic resin, physical layer 3 can be used in the material of physical layer 3
First surface be in contact with the first sheet metal layer 1, second surface is in contact for 2 layers with the second plate.Such composite board is not only
Can make the first sheet metal layer 1 and the second sheet metal layer 2 it is even closer be combined into composite board, and the physical layer of resin material
The weight of the 3 entire composite boards also mitigated.
In addition, the physical layer 3 of resin material has better deformation effects relative to foamed material, physical layer 3 can be made
It is protruded in interlayer space between the first sheet metal layer 1 and the second sheet metal layer 2, to enable physical layer 3 and other resinous woods
Material collection combines, while also avoiding other resin materials and filling to the interlayer space between the first sheet metal layer 1 and the second sheet metal layer 2
In, and then avoid composite board and fill deformation caused by other resin materials, improve the product qualified rate of composite board.
In addition, there is lighter weight, therefore composite board can be reduced since physical layer 3 can be thermoplastic resin material
Overall weight, and when carrying out post forming processing, physical layer 3 can be effectively prevented injection-moulded plastic and penetrate into composite board
In, to prevent the problem of leading to the deformation of the sheet metal layer on composite board surface because of infiltration so that composite board be able to maintain compared with
Good shape, improves product quality.
Further, since physical layer 3 can be thermoplastic resin, therefore in the case where meeting shell hardness, first can be reduced
The number of plies of reinforcing material required for sheet metal layer 1 and/or the second sheet metal layer 2 uses made of the composite board so as to reduce
The weight of shell, also reduces cost of manufacture.
Embodiment two:
The embodiment of the invention provides a kind of composite boards, are illustrated in figure 3 provided in an embodiment of the present invention another multiple
The structural schematic diagram of plywood material, the composite board include:
First sheet metal layer 31 includes at least one layer of first reinforcing material；
Second sheet metal layer 32, and include at least one layer of second reinforcing material；
Physical layer 33, includes first part and second part, and first part is after physical layer is under pressure by the first plate
The part protruded in the interlayer space constituted between material layer 31 and the second sheet metal layer 32；Second part is located at by the first sheet metal layer
31 and second in the interlayer space that constitutes between sheet metal layer 32, for bonding the first sheet metal layer 31 and the second sheet metal layer 32.
Specifically, the first reinforcing material includes at least one of carbon fiber, glass fibre, Kafra fiber undulation degree
Material.First sheet metal layer 31 is at least stacked and is formed by the first fibrous layer and the second fibrous layer, wherein the first fibrous layer and the second fibre
Tieing up between layer, which has first to stack angle, stacks, and the first stacking angle is in fiber and the second fibrous layer in the first fibrous layer
Angle between fiber.
Certainly, the second reinforcing material includes at least one of carbon fiber, glass fibre, Kafra fiber fibrous material.
Second sheet metal layer 32 is at least stacked and is formed by third fibrous layer and the 4th fibrous layer, wherein third fibrous layer and the 4th fiber
Have second to stack angle between layer to stack, the second stacking angle is the fibre in fiber and the 4th fibrous layer in third fibrous layer
Angle between dimension.
Wherein, the specific composition between the first sheet metal layer 31 and the second sheet metal layer 32 is detailed in example 1
Description, it is just no longer extra herein to repeat.
Further, in embodiments of the present invention, physical layer 33 includes first part and second part, is illustrated in figure 3
The structural schematic diagram of physical layer in the embodiment of the present invention, in Fig. 3, first part is after physical layer is under pressure by the first plate
The part protruded in layer 31 and the second interlayer space for constituting between sheet metal layer 32, the first part to other parts thermoplastic
Property connection.
Certainly, it in the interlayer space that second part is constituted between the first sheet metal layer 31 and the second sheet metal layer 32, is used for
It is combined with the first sheet metal layer 31 and the second sheet metal layer 32.
Specifically, due to will be by the thermoplastic resin in physical layer 33 in conjunction with other plastic materials, it is therefore desirable to
The composite board is placed in mould and is handled by post forming, first pressure and the first temperature are applied to it by mold, this
In first pressure and the first temperature be just used as the first preset condition, physical layer 33 can be made soft when reaching certain temperature
Change, and under the action of first pressure, the thermoplastic resin material of softening will be protruded from interlayer space, the part protruded at this time
With regard to forming the first part of physical layer 33.
Certainly, the part being retained between the first sheet metal layer 31 and the second sheet metal layer 32 is just used as second part.
Optionally, in embodiments of the present invention, as shown in figure 4, the composite board further include: molded portion 40, the injection molding
Part 40 is connect with the first part of physical layer 33, which is to realize heat with the other parts on electronic equipment
Modeling connection, or it is provided for the position of installation fixing screws.What needs to be explained here is that molded portion 40 can be tree
At least one of rouge, plastics, fiber and resin or the mixing material of plastics.
Specifically, in embodiments of the present invention referring to Fig. 5, number 50 represents mold, and number 40 represents molded portion, number
Word 51 represents the first part of physical layer 33, and the dotted arrow in Fig. 5, which is represented, accommodates power to the molding that composite board applies.This
When, the entity when being promoted the temperature in mold to the first temperature, between the first sheet metal layer 31 and the second sheet metal layer 32
Layer 33 will soften, and the thermoplastic resin of softening will be protruded from interlayer space, to form first of physical layer 33 in Fig. 5
Point.
After suppressing first part, the plastic material of fusing is filled into the space of mold, thus in the sky of mold
Between middle formation molded portion 40, the thickness of the molded portion 40 and composite board is identical in Fig. 5, but in reality
Production in, which may be not identical as the thickness of composite board, that is to say, that according to different products, the injection molding
The thickness of part 40 is likely larger than the thickness of composite board, it is also possible to less than the thickness of composite board, certain molded portion 40
Shape can also adjust according to different needs, and not limiting molded portion 40 in embodiments of the present invention must be Fig. 5 institute
The structure shown.Certainly, the molded portion 40 of formation can to on electronic equipment other parts realize thermoplasticity connect, or
Person provides position for the fixed device such as fixed screw.
In actual application, in order to further increase use the composite board product intensity quality, may be used also
It is outer to improve in the second outer surface spraying protective layer of the first outer surface of the first sheet metal layer 31 and/or the second sheet metal layer 32
The waterproof of shell, insulation and the performances such as wear-resisting.Wherein, the first outer surface refers to the first table in the first sheet metal layer 31 with physical layer 33
Face is parallel but the face that does not contact with first surface, and the second outer surface refers to the second surface in the second sheet metal layer 32 with physical layer 33
The face being in contact with it in parallel but not.
In the embodiment of the present invention, since the physical layer 33 in composite board is thermoplastic resin, in post forming
Cheng Zhong, the physical layer 33 of softening can form first of the interlayer space between the first sheet metal layer of protrusion and the second sheet metal layer
Point, so that the molded portion 40 formed with the plastics being molded into die space is combined, so that in the system using the composite board
Make that there is preferable molding effect during product, improves the quality of product.
What needs to be explained here is that in embodiments of the present invention, the thickness of composite board can control 0.3mm-5mm it
Between, the density of composite board can control in 0.5kg/cm3-5kg/cm3Between.It can guarantee that the composite board of production makes in this way
It uses in different equipment.
In embodiments of the present invention, a kind of composite board is provided, which includes: the first sheet metal layer 31, second
Sheet metal layer 32, physical layer 33, the physical layer 33 include first part and second part, and first part is under pressure for physical layer
Afterwards by the part protruded in the interlayer space constituted between the first sheet metal layer 31 and the second sheet metal layer 32, second part is located at first
In the interlayer space constituted before sheet metal layer 31 and the second sheet metal layer 32.That is, in embodiments of the present invention, physical layer 33
First part be protruded from interlayer space, so the first part can and the even closer combination of molded portion 40.
In addition, due to the first part of 33 evagination of physical layer, when filling molded portion 40 into mold 50, molded portion
40 will not permeate in the interlayer space between the first sheet metal layer 31 and the second sheet metal layer 32, therefore avoid molded portion 40
The problem of leading to composite board deformation occurs, is infiltrated into interlayer space, so that the finished product for improving entire composite board is qualified
Rate improves product quality.
Embodiment three:
Based on the same inventive concept, a kind of electronic equipment is additionally provided in the embodiment of the present invention, Fig. 6 show of the invention real
The structural schematic diagram of electronic equipment provided by example is applied, which includes main body 61 and shell 62.
Main body 61 may include the main component of electronic equipment, for example, main body 61 may include processor, thermal component,
Signal emitting-source, display unit etc..And shell 62 can be the shell of 61 outer surface of burden main body, such as mobile phone shell,
The shell etc. of notebook.In general, shell 62 has the shape to match with main body 61, to be preferably nested with main body,
To protect the component in main body 61, and better protective effect is played to electronic equipment.
Specifically, shell 62 is made of composite board, composite board (as shown in Figure 3) includes the first sheet metal layer 31, second
Sheet metal layer 32 and physical layer 33, physical layer 33 is between the first sheet metal layer 31 and the second sheet metal layer 32.
Physical layer 33 includes first part and second part, and first part is after physical layer 33 is under pressure by the first plate
The part protruded in the interlayer space constituted between material layer 31 and the second sheet metal layer 32, second part are located at 31 He of the first sheet metal layer
In the interlayer space constituted between second sheet metal layer 32, for bonding the first sheet metal layer 31 and the second sheet metal layer 32.
First sheet metal layer 31, the second sheet metal layer 32 and physical layer 33 can be to be formed by the processing mode of hot pressing or bonding
Composite board, composite board at this time can be Sandwith panel made of composite material.Wherein, the material of physical layer 33 can be thermoplastic resin
Rouge.
In the actual implementation process, can be determined according to hardness expected from shell 62 and weight the first sheet metal layer 31 and/or
Second sheet metal layer 32 uses the specific number of plies of reinforcing material, so as to obtain the shell of different hardness and different weight
Body 62, so that shell 62 realizes that collocation uses from the electronic equipment of different types.
Specifically, the second reinforcing material in the first reinforcing material and the second sheet metal layer 32 in the first sheet metal layer 31
It may include at least one of carbon fiber, glass fibre, Kafra fiber fibrous material.
Further, the first sheet metal layer 31 is at least stacked and is formed by the first fibrous layer and the second fibrous layer, the second sheet metal layer
32 are stacked and are formed by third fibrous layer and the 4th fibrous layer.Wherein, the first fibrous layer and the second fibrous layer are stacked according to first
Angle stacks, and the first stacking angle is the angle between the fiber in fiber and the second fibrous layer in the first fibrous layer.Third
Fibrous layer and the 4th fibrous layer stack angle according to second and stack, and the second stacking angle is the fiber and the 4th in third fibrous layer
The angle between fiber in fibrous layer.Certainly, there is no mutual between the first stacking angle and the second stacking angle
Influence, that is, first stacking angle with second stack angle be can be identical or different.
In addition, it is necessary to which explanation, the first sheet metal layer 31 and the second sheet metal layer 32 are specifically constituted in example 1
Detailed description has been carried out, details are not described herein again.
Further, in embodiments of the present invention, physical layer 33 includes first part and second part, specific such as embodiment
Shown in Fig. 3 in one, in Fig. 3, first part is after physical layer 33 is under pressure by the first sheet metal layer 31 and the second sheet metal layer
The part protruded in the interlayer space constituted between 32, the first part to molded portion 40 (as shown in Figure 4) thermoplasticity
Connection.
Certainly, it in the interlayer space that second part is constituted between the first sheet metal layer 31 and the second sheet metal layer 32, is used for
Bond the first sheet metal layer 31 and the second sheet metal layer 32.
Specifically, due to will be by the thermoplastic resin in physical layer 33 in conjunction with other plastic materials, it is therefore desirable to
The composite board is placed in mould and is handled by post forming, first pressure and the first temperature are applied to it by mold, when
When reaching certain temperature physical layer 33 can soften, and under the action of first pressure, the thermoplastic resin material of softening will be from
It is protruded in interlayer space, forms the first part of physical layer 33.
Certainly, the part being retained between the first sheet metal layer 31 and the second sheet metal layer 32 is just used as second part.
Optionally, the shell 62 further includes molded portion 40 in embodiments of the present invention, Fig. 4 institute of specific figure embodiment one
Show, molded portion 40, which connect with the first part of physical layer 33, which is to set with electronics
Standby upper other parts realize thermoplastic connection, or are provided for the position of fixing screws.
In actual application, in order to further ensure the intensity and beauty of shell 62, the shell of the electronic equipment
62 further include: coating, note invest at least one surface of shell 62, wherein coating is the material for being sprayed on 62 surface of shell
Material is formed.Specifically, in the first outer surface of the composite board for making shell 62 and/or the second outer surface sprayed protection
Layer, to improve the waterproof of shell 62, insulation and the performances such as wear-resisting.Wherein, the first outer surface refers in the first sheet metal layer 31 with
One surface is parallel but the face that does not contact with first surface, the second outer surface refer to it is parallel with second surface in the second sheet metal layer 32 but
The face not being in contact with it.
In the embodiment of the present invention, since the physical layer 33 in composite board is thermoplastic resin, in post forming
The physical layer 33 of Cheng Zhong, softening can form first part, thus the injection molding portion formed with the plastics being molded into die space
Divide 40 to combine, so that there is preferable molding effect during using the production product of the composite board, improves product
Quality.
Further, it is illustrated in figure 7 the structural representation in the embodiment of the present invention by shell 62 and equipment body 61 after fixed
Figure, in Fig. 7, the shallower part of color is corresponding 62 part of shell of composite board, and the deeper part of color is then electronics
61 part of main body of equipment, the part that white line frame takes is then to realize the region flushed in composite board and main body, and compound
The other parts that material is contacted with main body 61 are overlapping regions.
What needs to be explained here is that flushing region is exactly the molded portion 40 by composite board and the plastics in main body 61
The direct thermoplastic connection of material.Wherein, color it is shallower and be embedded into the deeper part of color be composite board first part with
The top view effect for the part that molded portion 40 is formed after combining.
Certainly, overlapping regions is then the part that the plastic material in composite board and main body 61 is directly connected to.It needs exist for
Illustrate, is the structure in a kind of actual production in this structure shown in Fig. 7, and can be according to not in actual production
With demand flush region and overlapping regions design composite board.
The embodiment of the invention provides a kind of electronic equipment, the shell 62 of the electronic equipment contain the first sheet metal layer 31,
Second sheet metal layer 32 and the physical layer 33 between the first sheet metal layer 31 and the second sheet metal layer 32, due to the physical layer 33
For the heated thermoplastic resin that can soften, therefore in the case where meeting 62 hardness of shell, can reduce first sheet metal layer 31 and/
Or the number of plies of reinforcing material required for second sheet metal layer 32, and the overall quality of thermoplastic resin is lighter, so as to
Reduce the overall weight using shell 62 made of the composite board, also reduces cost of manufacture.
Embodiment three:
The embodiment of the invention also provides a kind of component production methods of composite board, are illustrated in figure 8 implementation of the present invention
The flow chart of this method in example, comprising:
Former composite board is depressed into second thickness from first thickness in preset die under preset temperature by S801；
For first, before former composite board is depressed into second thickness from first thickness in preset die, further includes:
At least one layer of fibrous layer is placed, places physical layer in the upper surface of at least one layer of fibrous layer of placement, and in physical layer upper surface
At least one layer of fibrous layer is placed, obtains the first composite board, the first composite board specifically obtained is as shown in Figure 1.First is answered
Plywood material is pressed into former composite board according to preset condition.
In embodiments of the present invention, the first sheet metal layer is at least stacked and is formed by the first fibrous layer and the second fibrous layer,
In, have first to stack angle between the first fibrous layer and the second fibrous layer and stack, the first stacking angle is in the first fibrous layer
Fiber and the second fibrous layer in fiber between angle.It is to intersect to stack when being briefly exactly fibrous layer stacking.Together
Reason, the second sheet metal layer at least stacks and formed by third fibrous layer and the 4th fibrous layer, third fibrous layer and the 4th fibrous layer it
Between have second to stack angle to stack, the second stacking angle be fiber in fiber and the 4th fibrous layer in third fibrous layer it
Between angle.
Briefly, if multi-layer fiber is placed, such as 2 layers of fiber are placed for the first time, then first
After layer fiber places completion, the resin of layer can be coated in the upper surface of first layer fiber, then place second again
Layer fiber, can make preferably to bond between each layer fiber by the resin between every layer of fiber in this way.Certainly, compacting here
Exactly make preferably bond between each layer fiber and resin, to guarantee the strong of the first sheet metal layer and the second sheet metal layer
Degree.
First sheet metal layer can be to be made of full carbon fiber, is also possible to the composite fibre structure by carbon fiber and glass fibre
At can also be and be made of full glass fibre, the specific composition of first sheet metal layer and the second sheet metal layer is in example 1
It has been be described in detail that, details are not described herein again.
In general, the thickness of the first sheet metal layer and the second sheet metal layer can be pressed into 0.2mm or so, in this way can
Guarantee the intensity of the first sheet metal layer, can also reduce the weight of the first sheet metal layer to the greatest extent, that is, simultaneously with respect to the
The quality and weight of one sheet metal layer and the second sheet metal layer.First sheet metal layer and the second sheet metal layer are accomplished more
It is frivolous.
After being fabricated to the first sheet metal layer and the second sheet metal layer, the first sheet metal layer, physical layer, the second sheet metal layer are pressed
According to being sequentially stacked up.What needs to be explained here is that physical layer is clipped between the first sheet metal layer and the second sheet metal layer.Physical layer
Can be thermoplastic resin material, thermoplastic resin has by thermal softening, the characteristic of hardening by cooling, and chemical feature is stablized,
It either heats and cooling repeats how many times, be able to maintain stable characteristic, and in molding process, resin is through adding
The i.e. softening flowing of pressure heating, will not be chemically crosslinked, can in mold figuration, through cooling and shaping, shape needed for being made
Product.In general, the physical layer use thermoplastic resin can be PE- polyethylene, PVC- polyvinyl chloride, PA- polyamide,
PC- polycarbonate etc..
Certainly, the thickness of physical layer is probably 1.1mm or so.It can change the thickness of the physical layer in specific production process
Degree.
The first sheet metal layer, physical layer, the second sheet metal layer are stacked complete after form the first composite board, can be according to
The demand of design is cropped to suitable size to the first composite board, forms final former composite board, then will ultimately form
Composite board be placed into preset die.
Here the thickness of the former composite board obtained is generally a thickness between 0.3mm-5mm, the composite board
Density is 0.5kg/cm3-5kg/cm3Between a density.
Further, which is the groove body with certain depth, which is just placed on preset die
In slot, the width of the slot of the preset die is greater than the width of composite board, and the depth of the slot of preset die is less than former composite plate
The thickness of material.That is, will have a sky in the slot after in the slot that former composite board is placed into preset die
Chamber, and former composite board is higher than the depth of the slot of preset die.
In order to enable the physical layer between the first sheet metal layer and the second sheet metal layer can be by thermal softening, it is therefore desirable to make to preset
Temperature reaches certain preset temperature in the slot of mold, so that the physical layer of the resin material in composite board is made to reach softening,
But the preset temperature can not be such that the physical layer of resin material melts.Such as the physical layer, when being resin material, this is default
Temperature is generally 80 DEG C.
What needs to be explained here is that if then the preset temperature is exactly when the material that physical layer uses is not resin material
Make the temperature of the material softening.
After physical layer is heated to preset temperature, needs the upper and lower surface of preset die while applying preset pressure,
It is real after applying preset pressure since the physical layer between the first sheet metal layer and the second sheet metal layer is by thermal softening
Body layer will protrude between the first sheet metal layer and the first sheet metal layer, so that structure shown in Fig. 9 is formed, in Fig. 9, the tree of softening
Rouge material protrudes between the first sheet metal layer and the second sheet metal layer.
It is just that original is multiple in the process of compacting since the thickness of former composite board is greater than the depth of the slot of preset die
Plywood material is pressed onto the thickness with groove depth, that is, former composite board is depressed into second thickness from first thickness.In the present invention
Any value of the difference between 0.01mm-3.0mm in embodiment between first thickness and second thickness.
For example, former composite board with a thickness of 1.5mm, the depth of the slot of preset die is 1.3mm, therefore original is multiple
After plywood material is placed into the slot of preset die, which will be higher by slot 0.2mm.Due to the width of the slot of preset die
Greater than the width of composite board, therefore after applying preset pressure to former composite board, there is the resin material of 0.2mm thickness will be from
It is protruded between first sheet metal layer and the second sheet metal layer, to form structure shown in Fig. 9.
S802 fills injected plastics material into the cavity between former composite board and preset die, obtains component.
Former composite board is pressed into structure shown in Fig. 9 in S801, at this time the first part of the composite board
It is protruded from the interlayer space that the first sheet metal layer is formed with the second sheet metal layer.Due to the width of the slot of preset die be greater than it is compound
The width of plate, even if therefore physical layer the first part of protrusion is formed after pressure, but there is also one around first part
Then the plastics of fusing either resin material is filled into preset die by the channel being arranged in preset die by fixed cavity
Slot cavity in, at this time first part and injection cavity in plastics either resin material thermoplastic can be connected to one
It rises, to form structure as shown in Figure 10.After physical layer and the resin material of injection either plastic material are cooling,
The product finally obtained is exactly component provided in an embodiment of the present invention.
Further, in embodiments of the present invention, after obtaining component, it can spray and protect at least one outer surface of component
Protective material.
Specifically, in order to enable component has better intensity, and preferably wear-resisting, waterproofness etc., it can suppress
The outer surface of component afterwards sprays one layer of protection materials, such as sprays one layer of coloured enamel, not only can improve component
Wear-resisting, waterproofness, and can be with the aesthetics of lifting component.
Certainly, further finishing processing can also be carried out to obtained component in embodiments of the present invention to obtain
Installation component on an electronic device, such as the processing for the additional process such as polished component, polished, herein just not into
The explanation of one step.
Generally, a kind of part production method of composite board is provided in embodiments of the present invention, this method comprises:
Under preset temperature, former composite board is depressed into second thickness from first thickness in preset die, finally to former composite board
Injected plastics material is filled in cavity between preset die, the component needed.Since physical layer is thermoplastic resin, have
Lighter weight, therefore the overall weight of composite board can be reduced, and when carrying out post forming processing, physical layer can effectively be prevented
Only injection-moulded plastic penetrates into composite board, to prevent asking for the deformation for the surface sheet metal layer for leading to composite board because of infiltration
Topic, so that composite board is able to maintain preferable shape, improves part quality.
Although the preferred embodiment of the application has been described, but one of ordinary skilled in the art once knows substantially
Creative concept, then additional changes and modifications may be made to these embodiments.It is wrapped so the following claims are intended to be interpreted as
It includes preferred embodiment and falls into all change and modification of the application range.
Obviously, those skilled in the art can carry out various modification and variations without departing from the essence of the application to the application
Mind and range.In this way, if these modifications and variations of the application belong to the range of the claim of this application and its equivalent technologies
Within, then the application is also intended to include these modifications and variations.
Claims (29)
1. a kind of composite board characterized by comprising the first sheet metal layer, the second sheet metal layer and physical layer, wherein
First sheet metal layer includes at least one layer of first reinforcing material；
Second sheet metal layer, and include at least one layer of second reinforcing material；
The physical layer, between first sheet metal layer and second sheet metal layer, wherein the physical layer is pre- first
It is protruded in interlayer space under the conditions of if between first sheet metal layer and second sheet metal layer.
2. composite board as described in claim 1, which is characterized in that first reinforcing material includes carbon fiber, glass fibers
At least one of dimension, Kafra fiber fibrous material.
3. composite board as claimed in claim 2, which is characterized in that first sheet metal layer at least by the first fibrous layer and
Second fibrous layer stacks to be formed, wherein has first to stack angle heap between first fibrous layer and second fibrous layer
Folded, the first stacking angle is the folder between the fiber in fiber and second fibrous layer in first fibrous layer
Angle.
4. composite board as described in claim 1, which is characterized in that second reinforcing material includes carbon fiber, glass fibers
At least one of dimension, Kafra fiber fibrous material.
5. composite board as claimed in claim 4, which is characterized in that second sheet metal layer at least by third fibrous layer and
4th fibrous layer stacks to be formed, wherein and stating between third fibrous layer and the 4th fibrous layer, which has second to stack angle, stacks,
The second stacking angle is the angle between the fiber in fiber and the 4th fibrous layer in the third fibrous layer.
6. composite board as described in claim 1, which is characterized in that the physical layer is specially thermoplastic resin material.
7. the composite board as described in claim any in claim 1-6, which is characterized in that the composite board with a thickness of
0.3mm-5mm, the density of the composite board are 0.5kg/cm3-5kg/cm3。
8. a kind of composite board, which is characterized in that the physical layer includes: the first sheet metal layer, the second sheet metal layer and physical layer,
Wherein,
First sheet metal layer includes at least one layer of first reinforcing material；
Second sheet metal layer, and include at least one layer of second reinforcing material；
The physical layer includes first part and second part, and the first part is after physical layer is under pressure by described the
The part protruded in the interlayer space constituted between one sheet metal layer and second sheet metal layer；The second part is located at by institute
It states in the interlayer space constituted between the first sheet metal layer and second sheet metal layer, for bonding first sheet metal layer and institute
State the second sheet metal layer.
9. composite board as claimed in claim 8, which is characterized in that first reinforcing material includes carbon fiber, glass fibers
At least one of dimension, Kafra fiber fibrous material.
10. composite board as claimed in claim 8, which is characterized in that first sheet metal layer at least by the first fibrous layer with
And second fibrous layer stack to be formed, wherein between first fibrous layer and second fibrous layer have first stack angle
It stacks, the first stacking angle is the folder between the fiber in fiber and second fibrous layer in first fibrous layer
Angle.
11. composite board as claimed in claim 8, which is characterized in that second reinforcing material includes carbon fiber, glass fibers
At least one of dimension, Kafra fiber fibrous material.
12. composite board as claimed in claim 8, which is characterized in that second sheet metal layer at least by third fibrous layer with
And the 4th fibrous layer stack to be formed, wherein between the third fibrous layer and the 4th fibrous layer have second stack angle
It stacks, the second stacking angle is the folder between the fiber in fiber and the 4th fibrous layer in the third fibrous layer
Angle.
13. the composite board as described in claim any in claim 8-12, which is characterized in that the composite board with a thickness of
0.3mm-5mm, the density of the composite board are 0.5kg/cm3-5kg/cm3。
14. composite board as claimed in claim 8, which is characterized in that further include:
Molded portion, the molded portion are connect with first part's thermoplasticity of the physical layer.
15. composite board as claimed in claim 14, which is characterized in that the material of the molded portion includes resin, or
The mixing material of fiber and resin.
16. a kind of electronic equipment characterized by comprising
Main body；
Shell has the shape that matches with the main body, and the shell is made of composite board, and the composite board includes the
One sheet metal layer, the second sheet metal layer and physical layer, first sheet metal layer include that at least one layer first increases material material, second plate
Material layer includes at least one layer of second reinforcing material, the physical layer be located at first sheet metal layer and second sheet metal layer it
Between；
Wherein, the physical layer include first part and second part, the first part be physical layer be under pressure after by
The part protruded in the interlayer space constituted between first sheet metal layer and second sheet metal layer；The second part, position
In by the interlayer space constituted between first sheet metal layer and second sheet metal layer, for bonding first sheet metal layer
And second sheet metal layer.
17. electronic equipment as claimed in claim 16, which is characterized in that first reinforcing material and second enhancing
Material includes at least one of carbon fiber, glass fibre, Kafra fiber fibrous material.
18. electronic equipment as claimed in claim 16, which is characterized in that first sheet metal layer at least by the first fibrous layer with
And second fibrous layer stack to be formed, wherein state between the first fibrous layer and second fibrous layer have first stack angle heap
Folded, the first stacking angle is the folder between the fiber in fiber and second fibrous layer in first fibrous layer
Angle.
19. electronic equipment as claimed in claim 16, which is characterized in that second sheet metal layer at least by third fibrous layer with
And the 4th fibrous layer stack to be formed, wherein state between third fibrous layer and the 4th fibrous layer have second stack angle heap
Folded, the second stacking angle is the folder between the fiber in fiber and the 4th fibrous layer in the third fibrous layer
Angle.
20. electronic equipment as claimed in claim 16, which is characterized in that the composite board further include:
Molded portion, the molded portion are connect with first part's thermoplasticity of the physical layer.
21. the electronic equipment as described in claim any in claim 16-20, which is characterized in that the shell further include:
Coating, note invest at least one surface of the shell, wherein the coating is by being sprayed on the surface of shell
Material is formed.
22. a kind of component production method of composite board characterized by comprising
Under preset temperature, former composite board is depressed into second thickness from first thickness in preset die so that physical layer by
Thermal softening is protruded from the interlayer space that the first sheet metal layer and the second sheet metal layer are constituted, wherein first sheet metal layer includes extremely
Few one layer of first reinforcing material, second sheet metal layer include at least one layer of second reinforcing material；
Injected plastics material is filled into the cavity between former composite board and the preset die, obtains the component, wherein described
The part of the protrusion of physical layer is in conjunction with the injected plastics material.
23. method as claimed in claim 22, which is characterized in that first reinforcing material and second reinforcing material
Including at least one of carbon fiber, glass fibre, Kafra fiber fibrous material.
24. method as claimed in claim 22, which is characterized in that by the former composite board in preset die from first
Thickness is depressed into before second thickness, further includes:
At least one layer of fibrous layer is placed, in the upper surface placement physical layer of at least one layer of fibrous layer of the placement, and
At least one layer of fibrous layer is placed in the physical layer upper surface, obtains the first composite board, wherein the fibre of the physical layer lower surface
Layer is tieed up as first sheet metal layer, the fibrous layer of the physical layer upper surface is as second sheet metal layer；
First composite board is pressed into the former composite board according to preset condition.
25. method as claimed in claim 22, which is characterized in that first sheet metal layer is at least by the first fibrous layer and
Two fibrous layers stack to be formed, wherein stating between the first fibrous layer and second fibrous layer, which has first to stack angle, stacks, institute
Stating the first stacking angle is the angle between fiber in fiber and second fibrous layer in first fibrous layer.
26. method as claimed in claim 22, which is characterized in that second sheet metal layer is at least by third fibrous layer and
Four fibrous layers stack to be formed, wherein stating between third fibrous layer and the 4th fibrous layer, which has second to stack angle, stacks, institute
Stating the second stacking angle is the angle between fiber in fiber and the 4th fibrous layer in the third fibrous layer.
27. the method as described in any claim of claim 22-26, which is characterized in that it is described original composite board with a thickness of
0.3mm-5mm, the density of the composite board are 0.5kg/cm3-5kg/cm3。
28. method as claimed in claim 22, which is characterized in that the difference between the first thickness and the second thickness
Any value between 0.01mm-3.0mm.
29. method as claimed in claim 22, which is characterized in that further include:
In at least one outer surface sprayed protection material of the composite board.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015050437A JP2016078432A (en) | 2014-10-21 | 2015-03-13 | Composite plate material, electronic device, and method for manufacturing component of composite plate material |
| US14/659,822 US9868271B2 (en) | 2014-10-21 | 2015-03-17 | Composite sheet, electronic apparatus and method for producing a component from composite sheet |
| DE102015104668.7A DE102015104668A1 (en) | 2014-10-21 | 2015-03-26 | COMPOSITE LAYER, ELECTRONIC DEVICE AND METHOD FOR PRODUCING A COMPONENT FROM A COMPOSITE LAYER |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420611689 | 2014-10-21 | ||
| CN2014206116897 | 2014-10-21 |
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| Publication Number | Publication Date |
|---|---|
| CN105774067A CN105774067A (en) | 2016-07-20 |
| CN105774067B true CN105774067B (en) | 2019-02-05 |
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|---|---|---|---|
| CN201420838586.4U Withdrawn - After Issue CN204414676U (en) | 2014-10-21 | 2014-12-24 | A kind of composite board and electronic equipment |
| CN201410818092.4A Active CN105774067B (en) | 2014-10-21 | 2014-12-24 | A kind of component production method of composite board, electronic equipment and composite board |
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| Application Number | Title | Priority Date | Filing Date |
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Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2016078432A (en) | 2014-10-21 | 2016-05-16 | 北京聯想軟體有限公司 | Composite plate material, electronic device, and method for manufacturing component of composite plate material |
| CN204414676U (en) * | 2014-10-21 | 2015-06-24 | 联想(北京)有限公司 | A kind of composite board and electronic equipment |
| CN106696312A (en) * | 2017-01-25 | 2017-05-24 | 合肥联宝信息技术有限公司 | Embedded forming technology for composite board, composite board and forming milling cutter |
| CN106945230A (en) * | 2017-05-04 | 2017-07-14 | 泰逸电子（昆山）有限公司 | A kind of preparation technology of notebook computer casing |
| CN110091519B (en) * | 2018-01-29 | 2024-05-07 | 李璐璐 | Cementing mold |
| CN108767035A (en) * | 2018-05-31 | 2018-11-06 | 大连交通大学 | A kind of carbon fibers/fiberglass base multilayer solar panel and preparation method thereof |
| WO2020014936A1 (en) * | 2018-07-20 | 2020-01-23 | 五行科技股份有限公司 | Sheet-shaped member, composite molded member and fabrication method for composite molded member |
| CN109203358A (en) * | 2018-09-19 | 2019-01-15 | 合肥联宝信息技术有限公司 | A kind of structure of composite material |
| CN111361228B (en) * | 2018-12-26 | 2022-05-13 | 比亚迪股份有限公司 | Electronic equipment glass shell, preparation method thereof and electronic equipment |
| CN112824099A (en) * | 2019-11-20 | 2021-05-21 | 虞霞 | Composite plate, shell with composite plate and manufacturing method of composite plate |
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| JPH09272134A (en) * | 1996-04-04 | 1997-10-21 | Mitsui Toatsu Chem Inc | Composite injection molded matter and manufacture thereof |
| JP2009173027A (en) * | 2007-12-26 | 2009-08-06 | Toray Ind Inc | Manufacturing method of composite molded product |
| CN103507205A (en) * | 2012-06-29 | 2014-01-15 | 联想(北京)有限公司 | Preparation method of workpiece |
| CN204414676U (en) * | 2014-10-21 | 2015-06-24 | 联想(北京)有限公司 | A kind of composite board and electronic equipment |
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2014
- 2014-12-24 CN CN201420838586.4U patent/CN204414676U/en not_active Withdrawn - After Issue
- 2014-12-24 CN CN201410818092.4A patent/CN105774067B/en active Active
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| JPH09272134A (en) * | 1996-04-04 | 1997-10-21 | Mitsui Toatsu Chem Inc | Composite injection molded matter and manufacture thereof |
| JP2009173027A (en) * | 2007-12-26 | 2009-08-06 | Toray Ind Inc | Manufacturing method of composite molded product |
| CN103507205A (en) * | 2012-06-29 | 2014-01-15 | 联想(北京)有限公司 | Preparation method of workpiece |
| CN204414676U (en) * | 2014-10-21 | 2015-06-24 | 联想(北京)有限公司 | A kind of composite board and electronic equipment |
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| Publication number | Publication date |
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| CN204414676U (en) | 2015-06-24 |
| CN105774067A (en) | 2016-07-20 |
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