CN105774067A - Composite panel, electronic equipment and manufacturing method of part of composite panel - Google Patents
Composite panel, electronic equipment and manufacturing method of part of composite panel Download PDFInfo
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- CN105774067A CN105774067A CN201410818092.4A CN201410818092A CN105774067A CN 105774067 A CN105774067 A CN 105774067A CN 201410818092 A CN201410818092 A CN 201410818092A CN 105774067 A CN105774067 A CN 105774067A
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Abstract
The embodiment of the invention provides a composite panel, electronic equipment and a manufacturing method of a part of the composite panel. The sheet material comprises a first panel layer, a second panel layer and a physical layer. The first panel layer comprises at least a layer of first reinforced material and comprises at least a layer of second reinforced material. The physical layer is positioned between the first panel layer and the second panel layer. The physical layer bulges out of an interlayer space between the first panel layer and the second panel layer under a first preset condition. As the physical layer is thermoplastic resin and has light weight, the whole weight of the composite panel can be reduced. During secondary molding treatment, the physical layer can effectively prevent injection molded plastic from infiltrating the composite panel. Thus, the problem of deformation of the surface panel layer of the composite panel due to infiltration is prevented, the composite panel can remain a good shape, and product quality is raised.
Description
Technical field
The application relates to electronic technology field, particularly relates to the manufacture method of a kind of composite board, electronic equipment and composite board.
Background technology
At present, most electronic equipment all uses composite as the making material of housing, in order to reduce thickness and the weight of electronic equipment, improves the shell protection intensity to electronic equipment simultaneously.Generally, the composite board of use is adopt identical reinforcement fibrous layers to carry out the stacking composite made, but the composite board heavier-weight of this structure, relatively costly, and in post forming process, can not be combined preferably with injected plastics material.
Summary of the invention
Embodiments provide the parts manufacture method of a kind of composite board, electronic equipment and composite board, in order to solve composite board heavier-weight in prior art, relatively costly, and in post forming process, the problem can not being combined preferably with injected plastics material.
Its concrete technical scheme is as follows:
A kind of composite board, including: the first sheet metal layer, the second sheet metal layer and physical layer, wherein,
Described first sheet metal layer, comprises at least one of which the first reinforcing material；
Described second sheet metal layer, and comprise at least one of which the second reinforcing material；
Described physical layer, between described first sheet metal layer and described second sheet metal layer, wherein, protrudes under described physical layer is pre-conditioned first from the mezzanine space between described first sheet metal layer and described second sheet metal layer.
A kind of composite board, described physical layer includes: the first sheet metal layer, the second sheet metal layer and physical layer, wherein,
Described first sheet metal layer, comprises at least one of which the first reinforcing material；
Described second sheet metal layer, and comprise at least one of which the second reinforcing material；
Described physical layer comprises Part I and Part II, and described Part I is by the part protruded in the mezzanine space constituted between described first sheet metal layer and described second sheet metal layer after physical layer is under pressure；Described Part II, by, in the mezzanine space constituted between described first sheet metal layer and described second sheet metal layer, being used for bonding described first sheet metal layer and described second sheet metal layer.
A kind of electronic equipment, including:
Main body；
Housing, have, with described main body, there is the shape matched with described main body, described housing is made up of composite board, described composite board includes the first sheet metal layer, the second sheet metal layer and physical layer, described first sheet metal layer comprises at least one of which first and increases material material, described second sheet metal layer comprises at least one of which the second reinforcing material, and described physical layer is between described first sheet metal layer and described second sheet metal layer；
Wherein, described physical layer comprises Part I and Part II, and described Part I is by the part protruded in the mezzanine space constituted between described first sheet metal layer and described second sheet metal layer after physical layer is under pressure；Described Part II, by, in the mezzanine space constituted between described first sheet metal layer and described second sheet metal layer, being used for bonding described first sheet metal layer and described second sheet metal layer.
A kind of parts manufacture method of composite board, including:
Under preset temperature, former composite board is depressed into the second thickness from the first thickness in preset die, so that physical layer is protruded from the mezzanine space that the first sheet metal layer and the second sheet metal layer are constituted by thermal softening, wherein, described first sheet metal layer comprises at least one of which the first reinforcing material, and described second sheet metal layer comprises at least one of which the second reinforcing material；
Filling injected plastics material in the cavity between former composite board and described preset die, obtain described parts, wherein, the part of the protrusion of described physical layer is combined with described injected plastics material.
The technique effect that technical solution of the present invention realizes is with reference to the explanation in the detailed description of the invention of description.
Accompanying drawing explanation
Fig. 1 is one of structural representation of a kind of composite board in the embodiment of the present invention；
Fig. 2 is in the embodiment of the present invention the two of the structural representation of a kind of composite board；
Fig. 3 is the structural representation of the physical layer in the embodiment of the present invention in a kind of composite board；
Fig. 4 is the connection diagram of physical layer and molded portion in the embodiment of the present invention；
Fig. 5 is the schematic diagram that in the embodiment of the present invention, composite board is suppressed in preset die；
Fig. 6 is the structural representation of a kind of electronic equipment in the embodiment of the present invention；
Fig. 7 is the structural representation of a kind of electronic equipment casing in the embodiment of the present invention；
Fig. 8 is the flow chart of the manufacture method of the parts of a kind of composite board in the embodiment of the present invention；
Fig. 9 is the schematic diagram that in the embodiment of the present invention, composite board suppresses Part I in preset die；
Figure 10 is the schematic diagram filling molded portion in the embodiment of the present invention in cavity.
Detailed description of the invention
A kind of embodiment:
Embodiments providing a kind of composite board, this sheet material includes: the first sheet metal layer, the second sheet metal layer and physical layer, and the first sheet metal layer comprises at least one of which the first reinforcing material；Second sheet metal layer is parallel with the first sheet metal layer, and comprises at least one of which the second reinforcing material；Physical layer is between the first sheet metal layer and the second sheet metal layer, wherein, can protrude under physical layer is pre-conditioned first from the mezzanine space between the first sheet metal layer and the second sheet metal layer.
In the embodiment of the present invention, owing to described composite board is made up of the first sheet metal layer, the second sheet metal layer and the physical layer between the first sheet metal layer and the second sheet metal layer, and the material of physical layer can use thermoplastic resin, first surface and first sheet metal layer of physical layer contact, and second surface and the second sheet metal layer contact.By what the first sheet metal layer and the second sheet metal layer made described composite board, there is good flintiness.
Additionally, owing to physical layer can be thermoplastic resin material, there is lighter weight, therefore the overall weight of composite board can be reduced, and when carrying out post forming and processing, physical layer can effectively prevent injection-moulded plastic from penetrating in composite board, thus the problem preventing from causing the deformation of the sheet metal layer on composite board surface because of infiltration, make composite board can keep good shape, improve product quality.
In addition, owing to physical layer can be thermoplastic resin, therefore when meeting housing hardness, the number of plies of reinforcing material required for the first sheet metal layer and/or the second sheet metal layer can be reduced, thus the weight of the housing adopting this composite board to make can be reduced, also reduce cost of manufacture.
For making the purpose of the embodiment of the present invention, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme is clearly and completely described, obviously, described embodiment is a part of embodiment of technical solution of the present invention, rather than whole embodiments.Based on the embodiment recorded in present specification, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of technical solution of the present invention protection.
In the embodiment of the present invention, electronic equipment can be understood as notebook, PAD (panel computer), mobile phone etc. electronic equipment, and this is not limited as by the embodiment of the present invention.
In the embodiment of the present invention, composite board may be used for making electronic equipment casing, for instance, adopt composite to make phone housing, panel computer shell etc..Generally; the shell of electronic equipment mainly can play the effect of protection electronic equipment internal all parts, secondly, and the frivolous property of entirety that the frivolous property of shell also determines electronic equipment; therefore, in the generation process of electronic equipment, the frivolous property reducing shell also increasingly comes into one's own.
In order to ensure the intensity of shell and frivolous property, shell all can adopt composite board, composite board is also referred to as composite, a kind of solid material that composite is made up of two or more different physical materials, namely with a kind of material for matrix, another kind of material is the material that reinforcement combines, and various material makes up for each other's deficiencies and learn from each other in performance, produce cooperative effect, make the combination property of composite be better than former composition material and meet various different requirement.The matrix material of composite is divided into metal and nonmetal two big classes, and wherein, what metallic matrix was conventional has aluminum, magnesium, copper, titanium and alloy thereof；Nonmetal basal body mainly has synthetic resin, rubber, pottery, graphite, carbon etc..And common reinforcing material mainly has glass fibre, carbon fiber, boron fibre, aramid fiber, silicon carbide fibre, asbestos fibre, whisker, tinsel and hard particulates etc..
In order to realize the intensity of shell and frivolous property, provide a kind of structural representation that a kind of composite board that the embodiment of the present invention provides in order to make the composite board of electronic equipment casing, can be illustrated in figure 1 in embodiments of the present invention.Composite board in the embodiment of the present invention includes: the first sheet metal layer the 1, second sheet metal layer 2 and physical layer 3.
In embodiments of the present invention, first sheet metal layer 1 can form an outer surface of the shell of electronic equipment, first sheet metal layer 1 can comprise at least one of which the first reinforcing material, first reinforcing material include glass fibre, carbon fiber or open husband tow dimension at least one fibrous material, can certainly be the conjugate fiber of above-mentioned fiber, such as the combination of carbon fiber and glass fibre.
First sheet metal layer 1 has at least the first fibrous layer and the stacking formation of the second fibrous layer, wherein, having the first stacking angle between first fibrous layer and the second fibrous layer stacking, the first stacking angle is the fiber in the first fibrous layer and the angle between the fiber in the second fibrous layer.
Just enumerate the composition situation of part the first sheet metal layer 1 below:
Situation one: in embodiments of the present invention, this first reinforcing material can be carbon fiber, first sheet metal layer 1 can be by the first carbon fiber layer and the second carbon fiber layer is stacking is formed, first carbon fiber layer and the second carbon fiber layer can be stacking according to the first stacking angle, and wherein the first stacking angle is the carbon fiber in the first carbon fiber layer and the angle between the carbon fiber in the second carbon fiber layer.That is after placing the first carbon fiber layer, when placing the second carbon fiber layer again, this second carbon fiber layer and the first carbon fiber layer intersect placement, in general, this first stacking angle can be 60 ° or 90 °, of course, it is possible to select the first stacking angle according to actual situation, to ensure the intensity of the first sheet metal layer 1.
Situation two:
First reinforcing material can also is that the first composite fibre of carbon fiber and glass fibre, carbon fiber and the ratio of glass fibre in certain first composite fibre can adjust according to the demand of actual product, such as in composite fibre, carbon fiber can be 5:5 or 6:4 etc. with the ratio of glass fibre.
In such cases, first sheet metal layer 1 can be by the first mixed fiber layer and the second mixed fiber layer is stacking constitutes, stacking angle between first mixed fiber layer and the second mixed fiber layer can also be the stacking angle of first in situation one, just repeats no more herein.
In addition, it is necessary to illustrate, the first sheet metal layer 1 can also is that by the first mixed fiber layer and the first carbon fiber layer is stacking is formed, and also repeats no more at this as stacking mode.
Situation three:
First reinforcing material can also is that glass fibre, now the first sheet metal layer 1 be by between the first glass layer and the second glass layer according to the first stacking angle to carry out stacking placement.
Certainly, herein it can further be stated that, first sheet metal layer 1 can also is that and is made up of the first glass layer and the first carbon fiber layer, can also is that and be made up of the first glass layer and the first mixed fiber layer, intensity and the weight of the first sheet metal layer 1 being made up of different fibrous layers have certain difference, such as, when first sheet metal layer 1 is made up of two-layer carbon fiber layer, then the intensity of composite board is higher, and quality is also relatively light, but cost is also correspondingly improved；If the first sheet metal layer 1 is to be made up of the first mixed fiber layer and the first carbon fiber layer, then the intensity of composite board is also higher, and quality is also relatively light, certainly can be lower than the intensity of full carbon fiber, and quality also can be more heavier；If the first sheet metal layer 1 is all be made up of glass fibre, then the intensity of composite board is relatively low, and quality is also heavier, but cost can be relatively low.Therefore the first sheet metal layer 1 can by different synthesis modes, do not limit the concrete constituent material of the first sheet metal layer in embodiments of the present invention, actual application can select according to the demand of product the constituent material of the first sheet metal layer 1, such as determine the constituent material of the first sheet metal layer 1 according to the requirement of production cost.
Certainly, the first sheet metal layer can be made up of multi-layer fiber layer, in embodiments of the present invention the fibrolaminar number of plies comprised in the first sheet metal layer is not limited.
In like manner, in embodiments of the present invention, second sheet metal layer 2 is parallel with the first sheet metal layer 1, therefore the first sheet metal layer 1 and the second sheet metal layer 2 may be constructed the upper and lower surface of shell, second sheet metal layer 2 is including at least one layer of second reinforcing material, second reinforcing material includes carbon fiber, glass fibre, open husband tow dimension at least one fibrous material, second sheet metal layer 2 has at least the 3rd fibrous layer and the 4th stacking formation of fibrous layer, wherein, it is stacking that 3rd fibrous layer and the 4th fiber have the second stacking angle between just crossing, second stacking angle is the angle between the fiber in the 3rd fibrous layer and the fiber in the 4th fibrous layer.
Just enumerate the composition situation of part the second sheet metal layer 2 below:
Situation one: in embodiments of the present invention, this second reinforcing material can be carbon fiber, second sheet metal layer 2 can be by the 3rd carbon fiber layer and the 4th carbon fiber layer is stacking is formed, 3rd carbon fiber layer and the 4th carbon fiber layer are stacking according to the first stacking angle, and wherein the first stacking angle is the angle between the carbon fiber in the 3rd carbon fiber layer and the carbon fiber in the 4th carbon fiber layer.That is after placing the 3rd carbon fiber layer, when placing four carbon fiber layers again, 4th carbon fiber layer intersects with the 3rd carbon fiber layer, in general, this first stacking angle can be 60 ° or 90 °, of course, it is possible to select the first stacking angle according to actual situation, to ensure the intensity of the second sheet metal layer 2.
Situation two:
Second reinforcing material can also is that the first composite fibre of carbon fiber and glass fibre, carbon fiber and the ratio of glass fibre in certain first composite fibre can adjust according to actual applicable cases, such as the ratio of carbon fiber and glass fibre can be 5:5 or 6:4 etc..
In such cases, the second sheet metal layer 2 can be made up of the first composite fibre and the second composite fibre, and the stacking angle between the first mixed fiber layer and the second mixed fiber layer can also be the stacking angle of first in situation one, just repeats no more herein.
In addition, it is necessary to illustrate, the second sheet metal layer 2 can also is that by the first mixed fiber layer and the first carbon fiber layer is stacking is formed, and also repeats no more at this as stacking mode.
Situation three:
Second reinforcing material can also is that glass fibre, and now the second sheet metal layer 2 is by between the 3rd glass layer and the 4th glass layer can also being to carry out stacking placement according to the first stacking angle.
Certainly, herein it can further be stated that, second sheet metal layer 2 can also is that and is made up of the 3rd glass layer and the 3rd carbon fiber layer, can also is that and be made up of the 3rd glass layer and the first mixed fiber layer, intensity and the weight of the second sheet metal layer 2 being made up of different fibrous layers have certain difference, such as, when second sheet metal layer 2 is to be made up of two-layer carbon fiber layer, the intensity of last composite board is higher, and quality is also relatively light, but cost is also correspondingly improved；If the second sheet metal layer 2 is to be made up of the first mixed fiber layer and the 3rd carbon fiber layer, then the intensity of composite board is also higher, and quality is also relatively light, certainly can be lower than the intensity of full carbon fiber, and quality also can be more heavier；If the second sheet metal layer 2 is all be made up of glass fibre, then the intensity of composite board is relatively low, and quality is also heavier, but cost can be relatively low.Therefore the second sheet metal layer 2 by different synthesis modes, can not limit the concrete constituent material of the second sheet metal layer 2 in embodiments of the present invention, can select the constituent material of the second sheet metal layer 2 in actual application according to the demand of product.
Here it is emphasized that, the material that first sheet metal layer 1 uses can't have influence on the material that the second sheet metal layer 2 uses, during the full carbon fibre material that such as the first sheet metal layer 1 uses, the second sheet metal layer 2 can use the material composition etc. of mixed fiber layer and carbon fiber layer.So the first sheet metal layer 1 and the second sheet metal layer 2 can be adjusted according to the demand of product in actual application.
It addition, also, it should be noted the first sheet metal layer 1 and the second sheet metal layer 2 can also is that and be made up of trilaminate material, such as stacking formed by three layers carbon fiber, stacking formed by three layers mixed fiber layer, formed by triplex glass fiber stack.Certainly, the first sheet metal layer 1 and the second sheet metal layer 2 can also is that the materials process of a layer or more than four layers, do not limit the material constituting the first sheet metal layer 1 and the second sheet metal layer 2 and the number of plies in embodiments of the present invention.Certainly, the second sheet metal layer 2 can select identical with the composition of the first sheet metal layer 1, it is also possible to differs with the composition of the first sheet metal layer 1.Can be adjusted according to the demand of actual product herein.
Further, as shown in Figure 1, it is additionally provided with physical layer between the first sheet metal layer 1 and the second sheet metal layer 2, physical layer 3 can be thermoplastic resin material, thermoplastic resin has the characteristic by thermal softening, hardening by cooling, and chemical feature is stable, no matter it is heating and cooling repetition how many times, the characteristic that all can remain stable for, and in the course of processing of molding, namely the pressurized heating of resin softens flowing, chemical crosslinking will not be there is, can in mould figuration, cooled sizing, prepare required form goods.In general, the thermoplastic resin that this physical layer 3 adopts can be PE-polyethylene, PVC-polrvinyl chloride, PA-polyamide, PC-polycarbonate etc..
Specifically, in embodiments of the present invention, physical layer 3 has first surface and second surface, and first surface can contact with the first sheet metal layer 1, and second surface can contact with the second sheet metal layer 2.Namely first surface and second surface can be two contact surfaces of physical layer 3 and surface layer, and first sheet metal layer the 1, second sheet metal layer 2 and physical layer 3 be attached by the processing mode of hot pressing or bonding, composite board is made to have better compactness, to improve the hardness of the product made, simultaneously, due to the lighter in weight of thermoplastic resin material, therefore, thus also can reduce the weight of product.
Optionally, it is generally the case that physical layer 3 and the first sheet metal layer 1 and/or the identical area of the second sheet metal layer 2.First sheet metal layer 1 and the second sheet metal layer 2 have identical area, then the area being in described physical layer 3 between the two is same.
But have in the production process of actual product, owing to design or making need, it is likely to occur the first sheet metal layer 1 and the second sheet metal layer 2 has different areas, now, physical layer 3 can be identical with the area of the first sheet metal layer 1 or the second sheet metal layer 2, it is also possible to is different from the area of the first sheet metal layer 1 and the second sheet metal layer 2.Such as in figure 2 it is shown, in this Fig. 2, the area of physical layer just differs with the area of the first sheet metal layer 1 and the second sheet metal layer 2.
Further, in embodiments of the present invention, in order to ensure the finished product effect of composite board, therefore the THICKNESS CONTROL of composite board is between 0.3mm-5mm, and the density of composite board can control at 0.5kg/cm3-5kg/cm3Between.
Additionally, it can further be stated that, in embodiments of the present invention, between first sheet metal layer 1 with the second sheet metal layer 2 is parallel, but in actual production, can be uneven between first sheet metal layer 1 and the second sheet metal layer 2, such as the one side of physical layer 3 is inclined-plane, now just not parallel between the first sheet metal layer 1 and the second sheet metal layer 2, therefore, not limiting the relative position relation between the first sheet metal layer 1 and the second sheet metal layer 2 in embodiments of the present invention, in actual production, the relative position between the first sheet metal layer 1 and the second sheet metal layer 2 can adjust.
In the embodiment of the present invention, owing to described composite board is made up of first sheet metal layer the 1, second sheet metal layer 2 and the physical layer 3 between the first sheet metal layer 1 and the second sheet metal layer 2, and the material of physical layer 3 can use thermoplastic resin, first surface and first sheet metal layer 1 of physical layer 3 contact, and second surface and the second sheet material 2 layers contact.Such composite board can not only make the first sheet metal layer 1 and the second sheet metal layer 2 be combined into composite board more closely, and the weight of whole composite board that the physical layer 3 of resin material also alleviates.
Additionally, the physical layer 3 of resin material has better deformation effects relative to foamed materials, physical layer 3 can be made to protrude from the mezzanine space between the first sheet metal layer 1 and the second sheet metal layer 2, so that physical layer 3 can be combined with other resin material collection, it also avoid other resin materials to fill to the mezzanine space between the first sheet metal layer 1 and the second sheet metal layer 2 simultaneously, and then avoid composite board and fill the deformation that other resin materials cause, improve the product qualified rate of composite board.
Additionally, owing to physical layer 3 can be thermoplastic resin material, there is lighter weight, therefore the overall weight of composite board can be reduced, and when carrying out post forming and processing, physical layer 3 can effectively prevent injection-moulded plastic from penetrating in composite board, thus the problem preventing from causing the deformation of the sheet metal layer on composite board surface because of infiltration, make composite board can keep good shape, improve product quality.
In addition, owing to physical layer 3 can be thermoplastic resin, therefore when meeting housing hardness, the number of plies of reinforcing material required for the first sheet metal layer 1 and/or the second sheet metal layer 2 can be reduced, thus the weight of the housing adopting this composite board to make can be reduced, also reduce cost of manufacture.
Embodiment two:
Embodiments providing a kind of composite board, be illustrated in figure 3 the structural representation of the another kind of composite board that the embodiment of the present invention provides, this composite board includes:
First sheet metal layer 31, comprises at least one of which the first reinforcing material；
Second sheet metal layer 32, and comprise at least one of which the second reinforcing material；
Physical layer 33, comprises Part I and Part II, and Part I is by the part protruded in the mezzanine space constituted between the first sheet metal layer 31 and the second sheet metal layer 32 after physical layer is under pressure；Part II, by, in the mezzanine space constituted between the first sheet metal layer 31 and the second sheet metal layer 32, being used for bonding the first sheet metal layer 31 and the second sheet metal layer 32.
Specifically, the first reinforcing material include carbon fiber, glass fibre, open husband tow dimension at least one fibrous material.First sheet metal layer 31 is at least by the first fibrous layer and the second fibrous layer is stacking is formed, wherein, having the first stacking angle between first fibrous layer and the second fibrous layer stacking, the first stacking angle is the fiber in the first fibrous layer and the angle between the fiber in the second fibrous layer.
Certainly, the second reinforcing material include carbon fiber, glass fibre, open husband tow dimension at least one fibrous material.Second sheet metal layer 32 is at least by the 3rd fibrous layer and the 4th fibrous layer is stacking is formed, wherein, having the second stacking angle between 3rd fibrous layer and the 4th fibrous layer stacking, the second stacking angle is the angle between the fiber in the 3rd fibrous layer and the fiber in the 4th fibrous layer.
Wherein, between the first sheet metal layer 31 and the second sheet metal layer 32, specifically it is formed in description detailed in embodiment one, just no longer unnecessary herein repeats.
Further, in embodiments of the present invention, physical layer 33 includes Part I and Part II, the structural representation being illustrated in figure 3 in the embodiment of the present invention physical layer, in figure 3, Part I is that this Part I is in order to be connected with other part thermoplastic by the part protruded in the mezzanine space constituted between the first sheet metal layer 31 and the second sheet metal layer 32 after physical layer is under pressure.
Certainly, in the mezzanine space that Part II is constituted between the first sheet metal layer 31 and the second sheet metal layer 32, it is used for being combined with the first sheet metal layer 31 and the second sheet metal layer 32.
Specifically, thermoplastic resin owing to pass through in physical layer 33 is combined with other plastic materials, processed it is thus desirable to described composite board is placed in mould by post forming, by mould, it is applied the first pressure and the first temperature, here the first pressure and the first temperature are just pre-conditioned as first, physical layer 33 can be made to soften when reaching uniform temperature, and under the effect of the first pressure, the thermoplastic resin material of softening will protrude from mezzanine space, and the part now protruded is formed for the Part I of physical layer 33.
Certainly, the part between the first sheet metal layer 31 and the second sheet metal layer 32 it is retained in just as Part II.
Optionally, in embodiments of the present invention, as shown in Figure 4, this composite board also includes: molded portion 40, this molded portion 40 is connected with the Part I of physical layer 33, this molded portion 40 is to be connected in order to realizing thermoplastic with other parts on electronic equipment, or is provided for installing the position of fixing screw.Needing exist for illustrating, molded portion 40 can be at least one in the composite material of resin, plastics, fiber and resin or plastics.
Specifically, in embodiments of the present invention referring to Fig. 5, numeral 50 represents mould, and numeral 51 represents molded portion, and numeral 52 represents the Part I of physical layer 3, and the dotted arrow in Fig. 5 represents the matched moulds that composite board is applied and adds holding force.Now, when the temperature in mould is risen to the first temperature, the physical layer 33 between the first sheet metal layer 31 and the second sheet metal layer 32 will soften, and the thermoplastic resin of softening will protrude from mezzanine space, thus forming the Part I of physical layer 33 in Fig. 5.
After suppressing Part I, the plastic material of fusing is filled in the space of mould, thus forming molded portion 40 in the space of mould, this molded portion 40 is identical with the thickness of composite board in Figure 5, but in actual production, the thickness that this molded portion 40 is likely to composite board differs, that is according to different products, the thickness of this molded portion 40 is likely larger than the thickness of composite board, it is likely to the thickness less than composite board, the shape of certain molded portion 40 can also adjust according to different demands, not limiting molded portion 40 in embodiments of the present invention must be the structure shown in Fig. 5.Certainly, the molded portion 40 of formation can be connected in order to realizing thermoplasticity with other parts on electronic equipment, or provides position for fixing devices such as fixing screws.
In actual application; in order to improve the quality of the intensity of the product adopting this composite board further; can also at the second outer surface spraying protective layer of the first outer surface of the first sheet metal layer 31 and/or the second sheet metal layer 32, to improve the waterproof of shell, insulation and the performance such as wear-resisting.Wherein, the first outer surface refers to parallel with the first surface of physical layer 33 in the first sheet metal layer 31 but that do not contact face with first surface, and the second outer surface refers to face that is parallel with the second surface of physical layer 33 in the second sheet metal layer 32 but that be not in contact with it.
In the embodiment of the present invention, owing to the physical layer 33 in composite board is thermoplastic resin, therefore, in post forming process, the physical layer 33 of softening can form the Part I of the mezzanine space protruded between the first sheet metal layer and the second sheet metal layer, thus the molded portion 40 formed with the plastics being injected in die space is combined so that in the process making product adopt this composite board, there is good molding effect, improve the quality of product.
Needing exist for illustrating, in embodiments of the present invention, the thickness of composite board can control between 0.3mm-5mm, and the density of composite board can control at 0.5kg/cm3-5kg/cm3Between.So ensure that the composite board of production uses on different equipment.
In embodiments of the present invention, provide a kind of composite board, this composite board includes: first sheet metal layer the 31, second sheet metal layer 32, physical layer 33, this physical layer 33 comprises Part I and Part II, Part I is by the part protruded in the mezzanine space constituted between the first sheet metal layer 31 and the second sheet metal layer 32 after physical layer is under pressure, and Part II is arranged in the mezzanine space constituted before the first sheet metal layer 31 and the second sheet metal layer 32.It is to say, in embodiments of the present invention, the Part I of physical layer 33 protrudes from mezzanine space, so this Part I can be combined more closely with molded portion 40.
Additionally, Part I due to physical layer 33 evagination, when filling molded portion 40 in mould 50, molded portion 40 will not permeate in the mezzanine space between the first sheet metal layer 31 and the second sheet metal layer 32, therefore avoid molded portion 40 and infiltrate into the problem causing composite board to deform upon in mezzanine space, thus improving the product qualified rate of whole composite board, improve product quality.
Embodiment three:
Based on same inventive concept, additionally providing a kind of electronic equipment in the embodiment of the present invention, Fig. 6 show the structural representation of the electronic equipment that the embodiment of the present invention provides, and this electronic equipment includes main body 61 and housing 62.
Main body 61 can comprise the critical piece of electronic equipment, for instance, main body 61 can include processor, thermal component, signal emitting-source, display unit etc..And housing 62 can be the shell of burden main body 61 outer surface, for instance the shell of mobile phone, notebook shell etc..Generally, housing 62 has the shape matched with main body 61, in order to better and main body nested arrangements, thus protecting the parts in main body 61, and electronic equipment plays better protective effect.
Concrete, housing 62 is made up of composite board, and composite board (as shown in Figure 3) includes the first sheet metal layer the 31, second sheet metal layer 32 and physical layer 33, and physical layer 33 is between the first sheet metal layer 31 and the second sheet metal layer 32.
Physical layer 33 comprises Part I and Part II, Part I is by the part protruded in the mezzanine space constituted between the first sheet metal layer 31 and the second sheet metal layer 32 after physical layer 33 is under pressure, in the mezzanine space that Part II is constituted between the first sheet metal layer 31 and the second sheet metal layer 32, it is used for bonding the first sheet metal layer 31 and the second sheet metal layer 32.
First sheet metal layer the 31, second sheet metal layer 32 and physical layer 33 can be form composite board by the processing mode of hot pressing or bonding, and composite board now can be Sandwith panel made of composite material.Wherein, the material of physical layer 33 can be thermoplastic resin.
Realize in process actual, can determine that the first sheet metal layer 31 and/or described second sheet metal layer 32 use the concrete number of plies of reinforcing material according to the intended hardness of housing 62 and weight, it is thus possible to obtain the housing 62 of different hardness and different weight such that it is able to make housing 62 realize collocation from the electronic equipment of different types and use.
Specifically, the first reinforcing material in the first sheet metal layer 31 and the second reinforcing material in the second sheet metal layer 32 can comprise carbon fiber, glass fibre, open husband tow dimension at least one fibrous material.
Further, the first sheet metal layer 31 is at least by the first fibrous layer and the second fibrous layer is stacking is formed, and the second sheet metal layer 32 is by the 3rd fibrous layer and the 4th fibrous layer is stacking is formed.Wherein, the first fibrous layer and the second fibrous layer are stacking according to the first stacking angle, and the first stacking angle is the fiber in the first fibrous layer and the angle between the fiber in the second fibrous layer.3rd fibrous layer and the 4th fibrous layer are stacking according to the second stacking angle, and the second stacking angle is the angle between the fiber in the 3rd fibrous layer and the fiber in the 4th fibrous layer.Certainly, not havinging mutual impact between the first stacking angle and the second stacking angle, namely the first stacking angle and the second stacking angle can identical can also differ.
In addition, it is necessary to concrete being formed in embodiment one and have been carried out describing in detail, just repeat no more at this of explanation, the first sheet metal layer 31 and the second sheet metal layer 32.
Further, in embodiments of the present invention, physical layer 33 includes Part I and Part II, specifically shown in the Fig. 3 in embodiment one, in figure 3, Part I is that this Part I is in order to be connected with molded portion 40 (as shown in Figure 4) thermoplasticity by the part protruded in the mezzanine space constituted between the first sheet metal layer 31 and the second sheet metal layer 32 after physical layer 33 is under pressure.
Certainly, in the mezzanine space that Part II is constituted between the first sheet metal layer 31 and the second sheet metal layer 32, it is used for bonding the first sheet metal layer 31 and the second sheet metal layer 32.
Specifically, thermoplastic resin owing to pass through in physical layer 33 is combined with other plastic materials, processed it is thus desirable to described composite board is placed in mould by post forming, by mould, it is applied the first pressure and the first temperature, physical layer 33 can be made to soften when reaching uniform temperature, and under the effect of the first pressure, the thermoplastic resin material of softening will protrude from mezzanine space, form the Part I of physical layer 33.
Certainly, the part between the first sheet metal layer 31 and the second sheet metal layer 32 it is retained in just as Part II.
Optionally, this housing 62 also includes molded portion 40 in embodiments of the present invention, shown in Fig. 4 of concrete figure embodiment one, molded portion 40, this molded portion 40 is connected with the Part I of physical layer 33, this molded portion 40 is to be connected in order to realizing thermoplastic with other parts on electronic equipment, or is provided for the position of fixing screw.
In actual application, in order to be further ensured that the intensity of housing 62 and attractive in appearance, the housing 62 of this electronic equipment also includes: cover layer, and note invests at least one surface of housing 62, and wherein, cover layer is that the material being sprayed on housing 62 surface is formed.Specifically, it is being used for making the first outer surface of composite board and/or the second outer surface spraying protective layer of housing 62, to improve the waterproof of housing 62, insulation and the performance such as wear-resisting.Wherein, the first outer surface refers to parallel with first surface in the first sheet metal layer 31 but that do not contact face with first surface, and the second outer surface refers to face that is parallel with second surface in the second sheet metal layer 32 but that be not in contact with it.
In the embodiment of the present invention, owing to the physical layer 33 in composite board is thermoplastic resin, therefore, in post forming process, the physical layer 33 of softening can form Part I, thus the molded portion 40 formed with the plastics being injected in die space is combined so that in the process making product adopt this composite board, there is good molding effect, improve the quality of product.
Further, it is illustrated in figure 7 in the embodiment of the present invention by structural representation after fixing with equipment body 61 of housing 62, in the figure 7, the shallower part of color is housing 62 part that composite board is corresponding, the deeper part of color is then main body 61 part of electronic equipment, the part that white lines frame takes is then the region realizing in composite board and main body flushing, and other parts that composite contacts with main body 61 are overlapping regions.
Need exist for illustrating, flush region and be through the molded portion 40 of composite board and be connected with the direct thermoplastic of the plastic material in main body 61.Wherein, color is shallower and be embedded into the top view effect of part formed after the Part I that the deeper part of color is composite board is combined with molded portion 40.
Certainly, overlapping regions is then the part that composite board is directly connected to the plastic material in main body 61.Needing exist for illustrating, the structure shown in this Fig. 7 is the structure in a kind of actual production, and can flush region and overlapping regions according to what different demands designed composite board in actual production.
Embodiments provide a kind of electronic equipment, the housing 62 of this electronic equipment contains the first sheet metal layer 31, second sheet metal layer 32 and the physical layer 33 between the first sheet metal layer 31 and the second sheet metal layer 32, owing to described physical layer 33 is the thermoplastic resin that can soften that is heated, therefore when meeting housing 62 hardness, the number of plies of reinforcing material required for described first sheet metal layer 31 and/or described second sheet metal layer 32 can be reduced, and the oeverall quality of thermoplastic resin is lighter, thus the overall weight of the housing 62 adopting this composite board to make can be reduced, also reduce cost of manufacture.
Embodiment three:
The embodiment of the present invention additionally provides the parts manufacture method of a kind of composite board, the flow chart being illustrated in figure 8 in the embodiment of the present invention the method, including:
S801, under preset temperature, is depressed into second thickness from the first thickness by former composite board in preset die；
First, before former composite board is depressed into the second thickness from the first thickness in preset die, also include: place at least one of which fibrous layer, physical layer is placed at the fibrolaminar upper surface of at least one of which placed, and place at least one of which fibrous layer at physical layer upper surface, obtaining the first composite board, the first composite board specifically obtained is as shown in Figure 1.First composite board is pressed into former composite board according to pre-conditioned.
In embodiments of the present invention, first sheet metal layer is at least by the first fibrous layer and the second fibrous layer is stacking is formed, wherein, having the first stacking angle between first fibrous layer and the second fibrous layer stacking, the first stacking angle is the fiber in the first fibrous layer and the angle between the fiber in the second fibrous layer.Be exactly briefly fibrous layer stacking time be intersect stacking.In like manner, second sheet metal layer is at least by the 3rd fibrous layer and the 4th fibrous layer is stacking is formed, having the second stacking angle between 3rd fibrous layer and the 4th fibrous layer stacking, the second stacking angle is the angle between the fiber in the 3rd fibrous layer and the fiber in the 4th fibrous layer.
Briefly, if place be multi-layer fiber time, such as first time placement is 2 layers of fiber, then after ground floor fiber has been placed, the resin of layer can be coated with at the upper surface of ground floor fiber, then place second layer fiber again, so can make better to bond between each layer fiber by the resin between every layer of fiber.Certainly, compacting here makes can better bond between each layer fiber and resin exactly, thus ensureing the first sheet metal layer and the intensity of the second sheet metal layer.
First sheet metal layer can be made up of full carbon fiber, can also be made up of the composite fibre of carbon fiber Yu glass fibre, can also is that and be made up of full glass fibre, this first sheet metal layer and being specifically formed in embodiment one of the second sheet metal layer describe in detail, just repeat no more at this.
In general, the thickness of the first sheet metal layer and the second sheet metal layer can be pressed into about 0.2mm, so namely can ensure that the intensity of the first sheet metal layer, can also farthest reduce the weight of the first sheet metal layer, namely simultaneously with respect to the quality of the first sheet metal layer and the second sheet metal layer and weight.First sheet metal layer and the second sheet metal layer can be accomplished more frivolous.
After being fabricated to the first sheet metal layer and the second sheet metal layer, the first sheet metal layer, physical layer, the second sheet metal layer are stacked up in order.Needing exist for illustrating, physical layer is to be clipped between the first sheet metal layer and the second sheet metal layer.Physical layer can be thermoplastic resin material, thermoplastic resin has the characteristic by thermal softening, hardening by cooling, and chemical feature is stable, no matter it is heating and cooling repetition how many times, the characteristic that all can remain stable for, and in the course of processing of molding, namely the pressurized heating of resin softens flowing, and chemical crosslinking will not occur, it is possible to figuration in mould, cooled sizing, prepares the goods of required form.In general, the thermoplastic resin that this physical layer adopts can be PE-polyethylene, PVC-polrvinyl chloride, PA-polyamide, PC-polycarbonate etc..
Certainly, the thickness of physical layer the chances are about 1.1mm.Concrete production process can change the thickness of this physical layer.
First sheet metal layer, physical layer, stacking the completing of the second sheet metal layer are being subsequently formed the first composite board, according to the demand of design, the first composite board can be cropped to applicable size, form final former composite board, then the composite board ultimately formed is placed in preset die.
The thickness of the former composite board obtained here is generally a thickness between 0.3mm-5mm, and the density of this composite board is 0.5kg/cm3-5kg/cm3Between a density.
Further, this preset die is have the cell body of certain depth, and this former composite board is just placed in the groove of preset die, and the width of the groove of this preset die is greater than the width of composite board, and the degree of depth of the groove of preset die is less than the thickness of former composite board.It is to say, after being placed in the groove of preset die by former composite board, this groove will exist a cavity, and former composite board is higher than the degree of depth of groove of preset die.
So that the physical layer between the first sheet metal layer and the second sheet metal layer can be subject to thermal softening, it is thus desirable to make temperature in the groove of preset die reach certain preset temperature, so that the physical layer of the resin material in composite board reaches softening, but the physical layer that this preset temperature can not make resin material melts.Such as this physical layer is when being resin material, this preset temperature is generally 80 DEG C.
Needing exist for illustrating, if the material that physical layer uses not is resin material, then this preset temperature is exactly the temperature making this material softening.
After physical layer is heated to preset temperature, the upper and lower surface needing preset die applies preset pressure simultaneously, due to the physical layer between the first sheet metal layer and the second sheet metal layer by thermal softening, therefore after applying preset pressure, physical layer will protrude between the first sheet metal layer and the first sheet metal layer, thus forming the structure shown in Fig. 9, in fig .9, the resin material of softening protrudes between the first sheet metal layer and the second sheet metal layer.
It is greater than the degree of depth of the groove of preset die due to the thickness of former composite board, therefore in the process of compacting, just former composite board is pressed onto the thickness with groove depth, namely former composite board is depressed into the second thickness from the first thickness.Difference between first thickness and the second thickness is any value between 0.01mm-3.0mm in embodiments of the present invention.
For example, the thickness of former composite board is 1.5mm, and the degree of depth of the groove of preset die is 1.3mm, and after being therefore placed in the groove of preset die by former composite board, this composite board will exceed groove 0.2mm.Owing to the width of groove of preset die is more than the width of composite board, therefore after former composite board is applied preset pressure, there is resin material thick for 0.2mm will protrude between the first sheet metal layer and the second sheet metal layer, thus forming the structure shown in Fig. 9.
S802, fills injected plastics material in the cavity between former composite board and preset die, obtains parts.
Former composite board being pressed into the structure shown in Fig. 9 in S801, now the Part I of this composite board protrudes from the mezzanine space that the first sheet metal layer and the second sheet metal layer are formed.Owing to the width of the groove of preset die is greater than the width of composite board, even if therefore physical layer is subsequently formed the Part I of protrusion by pressure, but there is also certain cavity around Part I, then pass through the passage arranged in preset die and plastics or the resin material of fusing are filled in the cavity of groove of preset die, now Part I can thermoplastic link together with the plastics injected in cavity or resin material, thus forming structure as shown in Figure 10.After the resin material or plastic material cools down of physical layer and injection, the product finally obtained is exactly the parts that the embodiment of the present invention provides.
Further, in embodiments of the present invention, after obtaining parts, it is possible at least one outer surface sprayed protection material of parts.
Specifically; so that parts have better intensity; and better wear-resisting, water proofing property etc.; the outer surface of parts after pressing can spray one layer of protection material; such as one layer of coloured enamel of spraying; so it is possible not only to improve wear-resisting, the water proofing property of parts, and also can the aesthetic property of lifting piece.
Certainly, the parts obtained can also be carried out further polish process in embodiments of the present invention thus obtaining the parts installed on an electronic device, for example, parts are polished, the process of the additional process such as polishing, herein just no longer further instruction.
Generally, provide the part manufacture method of a kind of composite board in embodiments of the present invention, the method includes: under preset temperature, former composite board is depressed into the second thickness from the first thickness in preset die, cavity between the most backward former composite board and preset die is filled injected plastics material, obtains the parts needed.Owing to physical layer is thermoplastic resin, there is lighter weight, therefore the overall weight of composite board can be reduced, and when carrying out post forming and processing, physical layer can effectively prevent injection-moulded plastic from penetrating in composite board, thus the problem preventing from causing the deformation of the surface plate sheet material layers of composite board because of infiltration so that composite board can keep good shape, improves part quality.
Although having been described for the preferred embodiment of the application, but one of ordinary skilled in the art is once know basic creative concept, then these embodiments can be made other change and amendment.So, claims are intended to be construed to include preferred embodiment and fall into all changes and the amendment of the application scope.
Obviously, the application can be carried out various change and modification without deviating from spirit and scope by those skilled in the art.So, if these amendments of the application and modification belong within the scope of the application claim and equivalent technologies thereof, then the application is also intended to comprise these change and modification.
Claims (29)
1. a composite board, it is characterised in that including: the first sheet metal layer, the second sheet metal layer and physical layer, wherein,
Described first sheet metal layer, comprises at least one of which the first reinforcing material；
Described second sheet metal layer, and comprise at least one of which the second reinforcing material；
Described physical layer, between described first sheet metal layer and described second sheet metal layer, wherein, protrudes under described physical layer is pre-conditioned first from the mezzanine space between described first sheet metal layer and described second sheet metal layer.
2. composite board as claimed in claim 1, it is characterised in that described first reinforcing material includes carbon fiber, glass fibre, open husband tows at least one fibrous material in dimension.
3. composite board as claimed in claim 2, it is characterized in that, described first sheet metal layer is at least by the first fibrous layer and the second fibrous layer is stacking is formed, wherein, having the first stacking angle between described first fibrous layer and described second fibrous layer stacking, described first stacking angle is the fiber in described first fibrous layer and the angle between the fiber in described second fibrous layer.
4. composite board as claimed in claim 1, it is characterised in that described second reinforcing material includes carbon fiber, glass fibre, open husband tows at least one fibrous material in dimension.
5. composite board as claimed in claim 4, it is characterized in that, described second sheet metal layer is at least by the 3rd fibrous layer and the 4th fibrous layer is stacking is formed, wherein, stating that to have the second stacking angle between the 3rd fibrous layer and described 4th fibrous layer stacking, described second stacking angle is the angle between the fiber in described 3rd fibrous layer and the fiber in described 4th fibrous layer.
6. composite board as claimed in claim 1, it is characterised in that described physical layer is specially thermoplastic resin material.
7. composite board as described in arbitrary claim in claim 1-6, it is characterised in that described composite board thickness is 0.3mm-5mm, and the density of described composite board is 0.5kg/cm3-5kg/cm3。
8. a composite board, it is characterised in that described physical layer includes: the first sheet metal layer, the second sheet metal layer and physical layer, wherein,
Described first sheet metal layer, comprises at least one of which the first reinforcing material；
Described second sheet metal layer, and comprise at least one of which the second reinforcing material；
Described physical layer comprises Part I and Part II, and described Part I is by the part protruded in the mezzanine space constituted between described first sheet metal layer and described second sheet metal layer after physical layer is under pressure；Described Part II, by, in the mezzanine space constituted between described first sheet metal layer and described second sheet metal layer, being used for bonding described first sheet metal layer and described second sheet metal layer.
9. composite board as claimed in claim 8, it is characterised in that described first reinforcing material includes carbon fiber, glass fibre, open husband tows at least one fibrous material in dimension.
10. composite board as claimed in claim 8, it is characterized in that, described first sheet metal layer is at least by the first fibrous layer and the second fibrous layer is stacking is formed, wherein, having the first stacking angle between described first fibrous layer and described second fibrous layer stacking, described first stacking angle is the fiber in described first fibrous layer and the angle between the fiber in described second fibrous layer.
11. composite board as claimed in claim 8, it is characterised in that described second reinforcing material includes carbon fiber, glass fibre, open husband tows at least one fibrous material in dimension.
12. composite board as claimed in claim 8, it is characterized in that, described second sheet metal layer is at least by the 3rd fibrous layer and the 4th fibrous layer is stacking is formed, wherein, having the second stacking angle between described 3rd fibrous layer and described 4th fibrous layer stacking, described second stacking angle is the angle between the fiber in described 3rd fibrous layer and the fiber in described 4th fibrous layer.
13. composite board as described in arbitrary claim in claim 8-12, it is characterised in that the thickness of described composite board is 0.3mm-5mm, and the density of described composite board is 0.5kg/cm3-5kg/cm3。
14. composite board as claimed in claim 8, it is characterised in that also include:
Molded portion, described molded portion is connected with the Part I thermoplasticity of described physical layer.
15. composite board as claimed in claim 14, it is characterised in that the material of described molded portion includes at least one in the composite material of resin, plastics, fiber and resin or plastics.
16. an electronic equipment, it is characterised in that including:
Main body；
Housing, have, with described main body, there is the shape matched with described main body, described housing is made up of composite board, described composite board includes the first sheet metal layer, the second sheet metal layer and physical layer, described first sheet metal layer comprises at least one of which first and increases material material, described second sheet metal layer comprises at least one of which the second reinforcing material, and described physical layer is between described first sheet metal layer and described second sheet metal layer；
Wherein, described physical layer comprises Part I and Part II, and described Part I is by the part protruded in the mezzanine space constituted between described first sheet metal layer and described second sheet metal layer after physical layer is under pressure；Described Part II, by, in the mezzanine space constituted between described first sheet metal layer and described second sheet metal layer, being used for bonding described first sheet metal layer and described second sheet metal layer.
17. electronic equipment as claimed in claim 16, it is characterised in that described first reinforcing material and described second reinforcing material include carbon fiber, glass fibre, opens husband tows at least one fibrous material in dimension.
18. electronic equipment as claimed in claim 16, it is characterized in that, described first sheet metal layer is at least by the first fibrous layer and the second fibrous layer is stacking is formed, wherein, stating that to have the first stacking angle between the first fibrous layer and described second fibrous layer stacking, described first stacking angle is the fiber in described first fibrous layer and the angle between the fiber in described second fibrous layer.
19. electronic equipment as claimed in claim 16, it is characterized in that, described second sheet metal layer is at least by the 3rd fibrous layer and the 4th fibrous layer is stacking is formed, wherein, stating that to have the second stacking angle between the 3rd fibrous layer and described 4th fibrous layer stacking, described second stacking angle is the angle between the fiber in described 3rd fibrous layer and the fiber in described 4th fibrous layer.
20. electronic equipment as claimed in claim 16, it is characterised in that described composite board also includes:
Molded portion, described molded portion is connected with the Part I thermoplasticity of described physical layer.
21. electronic equipment as described in arbitrary claim in claim 16-20, it is characterised in that described housing also includes:
Cover layer, note invests at least one surface of described housing, and wherein, described cover layer is formed by the material being sprayed on described surface of shell.
22. the parts manufacture method of a composite board, it is characterised in that including:
Under preset temperature, former composite board is depressed into the second thickness from the first thickness in preset die, so that physical layer is protruded from the mezzanine space that the first sheet metal layer and the second sheet metal layer are constituted by thermal softening, wherein, described first sheet metal layer comprises at least one of which the first reinforcing material, and described second sheet metal layer comprises at least one of which the second reinforcing material；
Filling injected plastics material in the cavity between former composite board and described preset die, obtain described parts, wherein, the part of the protrusion of described physical layer is combined with described injected plastics material.
23. method as claimed in claim 22, it is characterised in that described first reinforcing material and described second reinforcing material include carbon fiber, glass fibre, opens husband tows at least one fibrous material in dimension.
24. method as claimed in claim 22, it is characterised in that before described former composite board is depressed into the second thickness from the first thickness in preset die, also include:
Place at least one of which fibrous layer, the fibrolaminar upper surface of at least one of which in described placement places described physical layer, and place at least one of which fibrous layer at described physical layer upper surface, obtain the first composite board, wherein, the fibrous layer of described physical layer lower surface is as described first sheet metal layer, and the fibrous layer of described physical layer upper surface is as described second sheet metal layer；
Described first composite board is pressed into described former composite board according to pre-conditioned.
25. method as claimed in claim 22, it is characterized in that, described first sheet metal layer is at least by the first fibrous layer and the second fibrous layer is stacking is formed, wherein, stating that to have the first stacking angle between the first fibrous layer and described second fibrous layer stacking, described first stacking angle is the fiber in described first fibrous layer and the angle between the fiber in described second fibrous layer.
26. method as claimed in claim 22, it is characterized in that, described second sheet metal layer is at least by the 3rd fibrous layer and the 4th fibrous layer is stacking is formed, wherein, stating that to have the second stacking angle between the 3rd fibrous layer and described 4th fibrous layer stacking, described second stacking angle is the angle between the fiber in described 3rd fibrous layer and the fiber in described 4th fibrous layer.
27. the method as described in claim as arbitrary in claim 22-26, it is characterised in that the thickness of described former composite board is 0.3mm-5mm, the density of described composite board is 0.5kg/cm3-5kg/cm3。
28. method as claimed in claim 22, it is characterised in that the difference between described first thickness and described second thickness is any value between 0.01mm-3.0mm.
29. method as claimed in claim 22, it is characterised in that also include:
At least one outer surface sprayed protection material at described composite board.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015050437A JP2016078432A (en) | 2014-10-21 | 2015-03-13 | Composite plate material, electronic device, and method for manufacturing component of composite plate material |
| US14/659,822 US9868271B2 (en) | 2014-10-21 | 2015-03-17 | Composite sheet, electronic apparatus and method for producing a component from composite sheet |
| DE102015104668.7A DE102015104668A1 (en) | 2014-10-21 | 2015-03-26 | COMPOSITE LAYER, ELECTRONIC DEVICE AND METHOD FOR PRODUCING A COMPONENT FROM A COMPOSITE LAYER |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420611689 | 2014-10-21 | ||
| CN2014206116897 | 2014-10-21 |
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| CN105774067A true CN105774067A (en) | 2016-07-20 |
| CN105774067B CN105774067B (en) | 2019-02-05 |
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| CN201420838586.4U Withdrawn - After Issue CN204414676U (en) | 2014-10-21 | 2014-12-24 | A kind of composite board and electronic equipment |
| CN201410818092.4A Active CN105774067B (en) | 2014-10-21 | 2014-12-24 | A kind of component production method of composite board, electronic equipment and composite board |
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| CN201420838586.4U Withdrawn - After Issue CN204414676U (en) | 2014-10-21 | 2014-12-24 | A kind of composite board and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106696312A (en) * | 2017-01-25 | 2017-05-24 | 合肥联宝信息技术有限公司 | Embedded forming technology for composite board, composite board and forming milling cutter |
| CN106945230A (en) * | 2017-05-04 | 2017-07-14 | 泰逸电子（昆山）有限公司 | A kind of preparation technology of notebook computer casing |
| CN108767035A (en) * | 2018-05-31 | 2018-11-06 | 大连交通大学 | A kind of carbon fibers/fiberglass base multilayer solar panel and preparation method thereof |
| CN109076713A (en) * | 2018-07-20 | 2018-12-21 | 五行科技股份有限公司 | A kind of manufacturing method of tabular component, composite molding component and composite molding component |
| CN109203358A (en) * | 2018-09-19 | 2019-01-15 | 合肥联宝信息技术有限公司 | A kind of structure of composite material |
| CN110091519A (en) * | 2018-01-29 | 2019-08-06 | 李璐璐 | A kind of splicing mold |
| CN111361228A (en) * | 2018-12-26 | 2020-07-03 | 比亚迪股份有限公司 | Electronic equipment glass shell, preparation method thereof and electronic equipment |
| CN112824099A (en) * | 2019-11-20 | 2021-05-21 | 虞霞 | Composite plate, shell with composite plate and manufacturing method of composite plate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204414676U (en) * | 2014-10-21 | 2015-06-24 | 联想(北京)有限公司 | A kind of composite board and electronic equipment |
| JP2016078432A (en) | 2014-10-21 | 2016-05-16 | 北京聯想軟體有限公司 | Composite plate material, electronic device, and method for manufacturing component of composite plate material |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106696312A (en) * | 2017-01-25 | 2017-05-24 | 合肥联宝信息技术有限公司 | Embedded forming technology for composite board, composite board and forming milling cutter |
| CN106945230A (en) * | 2017-05-04 | 2017-07-14 | 泰逸电子（昆山）有限公司 | A kind of preparation technology of notebook computer casing |
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| CN108767035A (en) * | 2018-05-31 | 2018-11-06 | 大连交通大学 | A kind of carbon fibers/fiberglass base multilayer solar panel and preparation method thereof |
| CN109076713A (en) * | 2018-07-20 | 2018-12-21 | 五行科技股份有限公司 | A kind of manufacturing method of tabular component, composite molding component and composite molding component |
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| CN112824099A (en) * | 2019-11-20 | 2021-05-21 | 虞霞 | Composite plate, shell with composite plate and manufacturing method of composite plate |
Also Published As
| Publication number | Publication date |
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| CN204414676U (en) | 2015-06-24 |
| CN105774067B (en) | 2019-02-05 |
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