TWI305734B - - Google Patents
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- Publication number
- TWI305734B TWI305734B TW95132335A TW95132335A TWI305734B TW I305734 B TWI305734 B TW I305734B TW 95132335 A TW95132335 A TW 95132335A TW 95132335 A TW95132335 A TW 95132335A TW I305734 B TWI305734 B TW I305734B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- transparent
- layer
- recovered
- surface treatment
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 162
- 239000010410 layer Substances 0.000 claims description 97
- 238000000034 method Methods 0.000 claims description 76
- 238000004381 surface treatment Methods 0.000 claims description 35
- 238000000576 coating method Methods 0.000 claims description 29
- 230000003746 surface roughness Effects 0.000 claims description 29
- 239000011248 coating agent Substances 0.000 claims description 24
- 239000002346 layers by function Substances 0.000 claims description 21
- 238000011084 recovery Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 13
- 238000004064 recycling Methods 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 12
- 238000005498 polishing Methods 0.000 claims description 12
- 239000010453 quartz Substances 0.000 claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- 239000010409 thin film Substances 0.000 claims description 10
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 9
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 8
- 238000004528 spin coating Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- 239000011247 coating layer Substances 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 239000002344 surface layer Substances 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- -1 polysiloxane Polymers 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 238000005488 sandblasting Methods 0.000 claims description 2
- 238000001039 wet etching Methods 0.000 claims description 2
- 239000004809 Teflon Substances 0.000 claims 2
- 229920006362 Teflon® Polymers 0.000 claims 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- 239000012792 core layer Substances 0.000 claims 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000035699 permeability Effects 0.000 claims 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N propylene glycol methyl ether Substances COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 238000002834 transmittance Methods 0.000 description 18
- 239000000047 product Substances 0.000 description 9
- 238000001723 curing Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 239000002699 waste material Substances 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 230000035515 penetration Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000227 grinding Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000005693 optoelectronics Effects 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- CBXWGGFGZDVPNV-UHFFFAOYSA-N so4-so4 Chemical compound OS(O)(=O)=O.OS(O)(=O)=O CBXWGGFGZDVPNV-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 229920002675 Polyoxyl Polymers 0.000 description 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N anhydrous diethylene glycol Natural products OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910019923 CrOx Inorganic materials 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000877 morphologic effect Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Surface Treatment Of Glass (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95132335A TW200812715A (en) | 2006-09-01 | 2006-09-01 | Method of surface treatment of recycled substrate and transparent substrate made by the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95132335A TW200812715A (en) | 2006-09-01 | 2006-09-01 | Method of surface treatment of recycled substrate and transparent substrate made by the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200812715A TW200812715A (en) | 2008-03-16 |
| TWI305734B true TWI305734B (enrdf_load_stackoverflow) | 2009-02-01 |
Family
ID=44768116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95132335A TW200812715A (en) | 2006-09-01 | 2006-09-01 | Method of surface treatment of recycled substrate and transparent substrate made by the same |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200812715A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI494682B (zh) * | 2009-11-18 | 2015-08-01 | Hoya Corp | 基板之再生方法、光罩基底之製造方法、附多層反射膜基板之製造方法及反射型光罩基底之製造方法 |
| TWI514624B (enrdf_load_stackoverflow) * | 2013-05-03 | 2015-12-21 |
-
2006
- 2006-09-01 TW TW95132335A patent/TW200812715A/zh unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI494682B (zh) * | 2009-11-18 | 2015-08-01 | Hoya Corp | 基板之再生方法、光罩基底之製造方法、附多層反射膜基板之製造方法及反射型光罩基底之製造方法 |
| TWI514624B (enrdf_load_stackoverflow) * | 2013-05-03 | 2015-12-21 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200812715A (en) | 2008-03-16 |
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