1305246 九、發明說明： 【發明所屬之技術領域】 抑本發明係有關一種電子襄置之散熱器，特別是指該散熱 裔的散熱風扇的固定結構，湘此散熱風扇㈣定結構，可令 該散熱風糾可拆_方式@定於錄熱器的其他構件上，從 而便於該散熱器的組襞與拆卸。 【先前技術】 近年來隨著電腦科技的突飛猛進，使得電腦之運作 速度不斷地提高，並且電腦主機内部之電子器件的發熱 功率亦不斷地攀升。為了預防電腦主機内部之電子器件 過熱’而導致電子料發生暫時性或永久性地失效，所 以提供足夠的散熱魏至電_部之電子器件將變得非 系重要以,中央處理單元（cpu)為例，中央處理單元在運 作之下’當中域理單元的溫度，—旦超出其正常的工 作Ιϋ圍時’令央處理單元極有可能會發生運算錯 誤或疋暫時性地失效，如此將導致電腦主機當機。此 外，當中央處理單元的溫度遠遠超過其正㈣工作溫度 範圍^"’甚至極材能損壞t央處理單元晶>}之内部的 電晶體’因而導致中央處理單元永久性地失效，如此一 1305246 來就必須更換中央處理單元，始能恢復電腦主機之正常 運作。 為了有效地降低電子器件於運作時所產生的熱能， 就習知技術而言，除可在電腦主機之機殼内部加裝散熱 器，用以提供熱對流形式的散熱作用以外，更可直接在 電腦主機之電源供應器、中央處理單元（C P U )及繪圖處理 單元（GPU)，甚至是晶片組等溫度容易升高之電子器件上 加裝散熱器，用以迅速移除這些電子元件於運作時所產 生的熱能。 第一圖繪示習知之一種散熱器組設於電腦裝置上的 立體組合圖。該散熱器包括該散熱器1包括一框架10， 該框架10呈平板狀，並由熱傳導率較高之銅或鋁合金等 金屬製成，且該框架10通過散熱墊或散熱膏而貼在中央 處理器表面，以便快速將中央處理器在工作時產生的熱 量吸收至框架10。而在框架10與中央處理器貼靠表面 的另一表面上設置有複數相互堆疊之散熱鰭片103,該 散熱鰭片103吸收框架10吸收之中央處理器工作時產生 的熱量，並向外輻射。為具更佳之散熱效果，該散熱鰭 片103之頂部組設有一散熱風扇104,如此在散熱風扇 1305246 l〇4吹動下，冷空氣經過散熱鰭片1〇3會吸收熱量，並 將熱量帶至電腦殼體（未圖示）外部，從而達到令中央 處理器的溫度維持在正常的工作溫度範圍内。 同時為保證框架10與中央處理器緊密接觸以保證 良好的吸熱效果，該散熱器1還設有一固持件，在本實 鉍例中為螺絲101，並且該框架10在四角位置開設有通 孔100，而電路板15亦在相應位置設有配合件，在本實 施例中為螺孔15〇，藉由螺絲1〇1穿過通孔1〇〇而鎖固 於電路板15的螺孔150内，而令框架10與中央處理器 緊密接觸。 誠然，在正常狀況下，該框架1〇的四角均凸出散熱 風扇104，如此使用者可直接利用螺絲起子（未圖示） 施力於螺絲101，而將螺絲101鎖固於電路板15的螺孔 150内，而令框架1〇與中央處理器緊密接觸。惟，為降 低該電腦裝置在運行時產生的噪聲，製造商或使用者可 能會使用比原始散熱風扇更大尺寸的散熱風扇，以求具 有更佳的散熱效果及更低的噪聲，如此該螺絲1〇1會被 該散熱風扇擋住，是以需將螺絲起子穿過該散熱風扇 104而施力於螺絲1〇1’由於該散熱風扇1〇4葉片存在， 1305246 操作者需很贿的避_散減扇104的料，因此顯 得非常不便，不利於提高組裝與維修的效率。 有繁於此’實有必要提供—種電子襄置之散熱器的 散熱風扇的固定結構’利用此散減扇的固定結構，可 令該散熱風扇以可拆卸的方式固定於該散熱器的其他構 件上，從而便於該散熱器的組裝與拆卸。 【發明内容】 因此’本發明的目的就是提供一種散熱器的散熱風 扇的固疋結構，彻此散熱風扇的m定結構，可令該散 熱風扇以可拆卸的方式較於該散熱㈣其他構件上， 從而便於該散熱器的組裝與拆卸。 馮這成上述目的，本發明係提供 m 定結構’應用於電腦等電子裝置的散熱器上，該散埶哭 料其四角之㈣螺絲組設於主機板上，該散熱器包、括 放熱鰭片模組，該散熱鰭片模組 ㈣器件表面貼合，以吸收該發熱器件工;;時產 里I亥放熱.鰭片的相對兩側設有固定該散熱器的固定 螺絲，並且該散熱則模組的另—表面套設有—固定框 架’而該㈣框架—側設有—彈性卡扣，而該散熱風扇 1305246 與散熱鰭片模組相對之表面組設有一配合架，且該配合 架一侧設有與固定框架之彈性卡扣對應之扣合部。 相較於習知技術，本發明利用在固定框架一側設置 一彈性卡扣，而在相應的配合架一侧設置一扣合部，藉 由該彈性卡扣與扣合部扣合，而將該散熱風扇組設於散 熱鰭片模組上，同理，在將該散熱器安裝於主機板上時， 還是從主機板上拆卸時，只需令該彈性卡扣與扣合部解 除扣合，並移開散熱風扇，利用螺絲起子將固定螺絲鎖 固於主機板上，如此，該散熱風扇的葉片不會妨礙螺絲 起子，從而增加組裝與拆卸的便利性。 爲使對本發明的目的、構造特徵及其功能有進一步 的瞭解，茲配合圖示詳細說明如下： 【實施方式】 請參閱第二圖所示，為實施本發明散熱風扇之固定 結構的散熱器的立體組合圖，該散熱器2組設於電子裝 置的主機板（未圖示）上，用以與主機板上之發熱器件 (如中央處理器等）配合，而將該發熱器件工作時產生 的熱量帶走，而將該發熱器件的溫度維持在正常的工作 溫度範圍内，該散熱器2通常包括一與該發熱器件表面 1305246 貼合之散熱鰭片模組23，該散熱鰭片模組23設有複數 疊加之散熱鰭片230,以增加與空氣接觸之面積，從而 加快熱量之散發，並且該散熱鰭片230底面設有支撐架 232,該支撐架232凸出該散熱鰭片230兩側，並且在其 上組設有固定螺絲233，以便藉由固定螺絲233與主機 板對應的螺孔（未圖示）鎖固，而將該散熱器2組設於 主機板上。另，為加強空氣之對流，以將熱量快速散發， 該散熱鰭片模組23上方組設有一散熱風扇20，該散熱 風扇20的外圍凸出散熱鰭片230，並位於固定螺絲233 的上方，鑒於該散熱風扇20的妨礙，在使用螺絲起子施 力於固定螺絲233時非常不便，本發明正是對該散熱風 扇2 0的固定結構進行改進，至於其他結構，習知技術多 有描述，此處不再贅述。 請參閱第三圖，為實施本發明的散熱器的立體分解 圖，該散熱器2除具上述的散熱鰭片模組23外，還包括 在該散熱鰭片模組23 —表面組設之固定框架22，與該 散熱鰭片模組23與發熱器件貼靠之表面相對，該固定框 架22套設於散熱鰭片230的外圍，並且該固定框架22 的一側凸出設有一彈性卡扣220，與該散熱鰭片模組23 11 1305246 設置固定螺絲233 —側相鄰，該彈性卡扣220為從該固 定框架22側緣凸出之翼板，其末端向該固定框架22外 側傾斜形成一扳動部222，以利於使用者施力，且該彈 性卡扣220中部與該固定框架22内部相對的表面向外凹 陷形成一卡槽223,以與配合架21的扣合部211卡合（容 後詳述）。另，該固定框架22的另一側凸出散熱鰭片230 設有樞軸221，與該固定框架22設置彈性卡扣220的一 側相對，以便與配合架21 —侧的套合部212配合，而令 該配合架21可相對該固定框架22樞轉。 該配合架21呈方形，與散熱風扇20的形狀相對應， 其中部形成一開口 213，以便空氣流通，且該配合架21 一側對應彈性卡扣220對應設有一扣合部211，在本實 施例中，該扣合部211為自該配合架21側緣凸出之一翼 板，且其末端向外彎折，以便扣合於彈性卡扣220的卡 槽223中。另，該配合架21的另一側設有套合部212， 與該配合架21設置扣合部211的一侧相對，以與固定框 架22的樞軸樞接而轉動，在本實施例中，該套合部212 從自該配合架21側緣延伸並呈弧形，且其末端形成一缺 口，以便套合於樞軸221上。再，該配合架21的四角處 12 1305246 各設有一螺孔210，以與散熱風扇20四角的螺孔200對 應，以便該散熱風扇20藉由螺絲4穿過螺絲200而將該 散熱風扇20鎖固於配合架21上。 復請參閱第二圖，可先將該散熱風扇20利用螺絲4 依次穿過散熱風扇20四角的螺孔200及配合架21四角 的螺孔210而鎖固於配合架21上，然後將組合有散熱風 扇20的配合架21藉由套合部212套合於固定框架22 的樞軸221上，其後將固定框架22套設於散熱鰭片230 的外圍，而將散熱風扇20、配合架21及固定框架22均 組合於散熱鰭片230上方，之後將配合架21相對固定框 架22旋轉至一側，用螺絲起子3 (參第四圖）施力於固 定螺絲233而將該散熱器2組合於主機板上。最後，將 配合架21反向旋轉堆疊於固定框架22上方，同時施力 於彈性卡扣220的扳動部222，令扣合部211的邊緣卡 合於彈性卡扣220的卡槽223中，從而將散熱風扇20 穩固組設於散熱鰭片模組23上方。 請一同參閱第四圖所示，在將該散熱器2從主機板 上拆卸時，先施力於彈性卡扣220的扳動部222，令彈 性卡扣220相對固定框架22向外張開，從而令配合架 13 1305246 21的扣合部211從彈性卡扣22〇的卡槽挪令脫離，之 後旋轉配合架21’由此而將配合架21與散細扇2〇旋 轉至固定框架22的—侧，如此可將固定螺絲233露出， 攸而利用螺絲起子3而將該固定螺絲2 3 3從主機板上解 鎖’從而可將該散熱器2從主機板上整料卸下來。 純於f知技術，本發明在固定框架22 一側設 置彈性卡扣220，而在相應的配合 合部2U，葬由物以 口木21〜侧設置一扣 #由_性卡扣220與扣合部2ΐι扣合，而 將该散熱風扇20組設於散熱·鰭片模組23上，同理，在 將該散熱H 2安裝於主機板 ， 卩士 還疋從主機板上拆卸 ¥ ’只需令該彈性卡扣22n盥士人a 软 22G與扣合部211解除扣合，並 移開散熱風扇20，彻螺絲起 0將固疋螺絲233鎖固 於主機板上，或從主機板上解 仏心1 此’該散熱風扇20 的葉片不會妨礙螺絲起子3,您 利性。 攸而增加組裝與拆卸的便 的較佳實施例而已， 即凡依本發明申請專 爲本發明專利範圍所 以上所述者，僅爲本發明其中 並非用來限定本發明的實施範圍； 利範圍所作的均等變化與修飾，皆 涵蓋。 1305246 【圖式簡單說明】 第一圖為習知之散熱器組設於電腦裝置上的立體組合 圖。 第二圖為實施本發明散熱風扇之固定結構的散熱器的立 體組合圖。 第三圖為實施本發明散熱風扇之固定結構的散熱器的立 體分解圖。 第四圖為將實施本發明散熱風扇之固定結構的散熱器拆 卸的示意圖。 【主要元件符號說明】 散熱器 2 散熱風扇 20 螺孔 200 、 210 配合架 21 扣合部 211 套合部 212 開口 213 固定框架 22 彈性卡扣 220 樞軸 221 15 1305246 扳動部 222 卡槽 223 散熱鰭片模組 23 散熱鰭片 230 支撐架 232 固定螺絲 233 螺絲起子 3 螺絲 4 161305246 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a heat sink for an electronic device, and more particularly to a fixed structure of a heat dissipation fan of the heat sinking person, and the cooling fan (4) has a fixed structure The cooling air is detachable _ mode@ is set on the other components of the heatsink to facilitate the assembly and disassembly of the heat sink. [Prior Art] In recent years, with the rapid advancement of computer technology, the operation speed of computers has been continuously improved, and the heating power of electronic devices inside computer mainframes has continuously increased. In order to prevent the electronic components inside the computer host from overheating, the electronic material temporarily or permanently fails, so that sufficient heat dissipation is provided, and the electronic device will become non-essential, the central processing unit (cpu) For example, when the central processing unit is operating, the temperature of the domain unit, if it exceeds its normal working range, is very likely to cause operational errors or temporary failures, which will result in The computer host is down. In addition, when the temperature of the central processing unit far exceeds its positive (four) operating temperature range ^" 'even the pole can damage the internal transistor of the central processing unit crystal>}, thus causing the central processing unit to permanently fail, Such a 1305246 must replace the central processing unit to restore the normal operation of the computer. In order to effectively reduce the heat energy generated by the electronic device during operation, in addition to the conventional technology, a heat sink can be installed inside the casing of the computer to provide heat dissipation in the form of heat convection, and A power supply, a central processing unit (CPU), a graphics processing unit (GPU), or even a chipset such as a chipset that is equipped with a heat sink for quickly removing the electronic components during operation. The heat generated. The first figure shows a stereoscopic combination diagram of a conventional heat sink set on a computer device. The heat sink includes the heat sink 1 including a frame 10 having a flat shape and made of metal such as copper or aluminum alloy having a high thermal conductivity, and the frame 10 is attached to the center by a heat dissipation pad or a thermal grease. The processor surface is designed to quickly absorb heat generated by the central processing unit during operation to the frame 10. On the other surface of the frame 10 and the abutting surface of the central processing unit, a plurality of heat dissipating fins 103 stacked on each other are disposed. The heat dissipating fins 103 absorb the heat generated by the central processing unit absorbed by the frame 10 and radiate outward. . For better heat dissipation, a heat dissipating fan 104 is disposed on the top of the heat dissipating fin 103. Thus, under the cooling fan 1305246 l〇4, the cold air absorbs heat through the heat dissipating fins 1〇3, and the heat is taken. It is external to the computer housing (not shown) to maintain the temperature of the central processor within the normal operating temperature range. At the same time, in order to ensure that the frame 10 is in close contact with the central processing unit to ensure a good heat absorption effect, the heat sink 1 is further provided with a holding member, which is a screw 101 in the embodiment, and the frame 10 is provided with a through hole 100 at four corner positions. The circuit board 15 is also provided with a mating member at a corresponding position. In the embodiment, the screw hole 15 is screwed into the screw hole 150 of the circuit board 15 through the through hole 1〇〇. The frame 10 is in close contact with the central processing unit. It is true that under normal conditions, the cooling fan 104 protrudes from the four corners of the frame, so that the user can directly apply the screw 101 (not shown) to the screw 101 and lock the screw 101 to the circuit board 15. Inside the screw hole 150, the frame 1 is in close contact with the central processing unit. However, in order to reduce the noise generated during operation of the computer device, the manufacturer or the user may use a cooling fan of a larger size than the original cooling fan for better heat dissipation and lower noise, so that the screw 1〇1 will be blocked by the cooling fan, so that the screwdriver needs to pass through the cooling fan 104 and apply force to the screw 1〇1'. Since the cooling fan 1〇4 blade exists, the 1305246 operator needs to avoid bribing _ Dissipating the material of the fan 104 is therefore very inconvenient and is not conducive to improving the efficiency of assembly and maintenance. There is a fixed structure of a heat dissipating fan which is required to provide a heat sink for the electronic device. With the fixing structure of the fan, the heat dissipating fan can be detachably fixed to the heat sink. On the component, thereby facilitating assembly and disassembly of the heat sink. SUMMARY OF THE INVENTION Therefore, the object of the present invention is to provide a solid-state structure of a heat-dissipating fan of a heat sink, and the m-fixing structure of the heat-dissipating fan can make the heat-dissipating fan detachably be compared with the heat-dissipating (four) other components. , thereby facilitating assembly and disassembly of the heat sink. For the above purpose, the present invention provides a m-structured structure for use on a heat sink of an electronic device such as a computer, and the four corners of the four-corner screw are disposed on a motherboard, and the radiator package includes a heat-insulated fin. a chip module, the heat dissipating fin module (4) device surface is attached to absorb the heat generating device;; when the product is released, the opposite sides of the fin are provided with fixing screws for fixing the heat sink, and the heat is dissipated The other surface of the module is provided with a fixing frame, and the (four) frame is provided with an elastic buckle, and the surface of the cooling fan 1305246 opposite to the heat dissipation fin module is provided with a matching frame, and the matching is performed. One side of the frame is provided with a fastening portion corresponding to the elastic buckle of the fixed frame. Compared with the prior art, the present invention utilizes an elastic buckle on one side of the fixing frame, and a fastening portion on one side of the corresponding matching frame, by which the elastic buckle and the fastening portion are fastened, The cooling fan assembly is disposed on the heat dissipation fin module. Similarly, when the heat sink is mounted on the motherboard, when the motherboard is removed from the motherboard, the elastic buckle and the fastening portion are only released. And remove the cooling fan, and use a screwdriver to lock the fixing screw to the motherboard. Thus, the blade of the cooling fan does not interfere with the screwdriver, thereby increasing the convenience of assembly and disassembly. In order to further understand the object, structural features and functions of the present invention, the following detailed description will be given with reference to the accompanying drawings: [Embodiment] Please refer to the second figure, which is a heat sink for implementing the fixing structure of the cooling fan of the present invention. The heat sink 2 is disposed on a motherboard (not shown) of the electronic device for cooperating with a heat generating device (such as a central processing unit) on the motherboard, and the heat generating device is generated when the heat generating device is operated. The heat sink 2 is disposed to maintain the temperature of the heat generating device within a normal operating temperature range. The heat sink 2 generally includes a heat sink fin module 23 that is attached to the heat generating device surface 1305246. The heat sink fin module 23 A plurality of heat-dissipating fins 230 are disposed to increase the area of contact with the air, thereby accelerating the heat dissipation, and the bottom surface of the heat-dissipating fin 230 is provided with a support frame 232 protruding from both sides of the heat-dissipating fin 230. And a fixing screw 233 is disposed on the upper portion thereof to be locked by a screw hole (not shown) corresponding to the main plate by the fixing screw 233, and the heat sink 2 is assembled on the main board. In addition, in order to enhance the convection of the air to dissipate the heat quickly, a heat dissipating fan 20 is disposed above the heat dissipating fin module 23, and the heat dissipating fan 20 protrudes from the heat dissipating fin 230 and is located above the fixing screw 233. In view of the obstruction of the cooling fan 20, it is very inconvenient to apply the force of the fixing screw 233 by using a screwdriver. The present invention is an improvement of the fixing structure of the cooling fan 20, and other structures are well described in the prior art. I won't go into details here. Referring to the third embodiment, in order to implement the heat dissipating heat sink of the present invention, the heat sink 2 includes the heat dissipating fin module 23 and the surface of the heat dissipating fin module 23. The frame 22 is opposite to the surface of the heat dissipating fin module 23 and the heat generating device. The fixing frame 22 is sleeved on the outer periphery of the heat dissipating fin 230, and one side of the fixing frame 22 is convexly provided with an elastic buckle 220. The heat-dissipating fin module 23 11 1305246 is disposed adjacent to the side of the fixing screw 233. The elastic buckle 220 is a wing protruding from the side edge of the fixing frame 22, and the end thereof is inclined toward the outside of the fixing frame 22 to form a The clamping portion 222 is configured to facilitate the user to apply a force, and a surface of the elastic buckle 220 opposite to the inner surface of the fixing frame 22 is outwardly recessed to form a latching groove 223 for engaging with the engaging portion 211 of the engaging frame 21 ( Details later). In addition, the other side of the fixing frame 22 protrudes from the fins 230 and is provided with a pivot 221 opposite to the side of the fixing frame 22 where the elastic buckle 220 is disposed so as to cooperate with the sleeve portion 212 on the side of the mating bracket 21 The mating frame 21 is pivotable relative to the fixed frame 22. The mating frame 21 has a square shape, and corresponds to the shape of the heat dissipating fan 20, wherein an opening 213 is formed in the middle portion for air circulation, and a latching portion 211 is correspondingly disposed on one side of the mating frame 21 corresponding to the elastic latch 220. For example, the fastening portion 211 is a flap protruding from the side edge of the mating frame 21, and the end thereof is bent outward to be engaged in the slot 223 of the elastic buckle 220. The other side of the mating frame 21 is provided with a fitting portion 212 opposite to the side where the engaging portion 21 is provided with the engaging portion 211, and is pivotally pivoted to the pivot of the fixing frame 22, in this embodiment. The sleeve portion 212 extends from the side edge of the mating frame 21 and has an arc shape, and a notch is formed at the end thereof so as to fit over the pivot shaft 221. Further, a screw hole 210 is defined in each of the corners 12 1305246 of the mating frame 21 to correspond to the screw hole 200 at the four corners of the heat dissipating fan 20, so that the cooling fan 20 locks the cooling fan 20 by the screw 4 passing through the screw 200. Fastened to the mating frame 21. Referring to the second figure, the cooling fan 20 can be firstly screwed through the screw holes 200 at the four corners of the cooling fan 20 and the screw holes 210 at the four corners of the matching frame 20 to be locked on the mating frame 21, and then combined. The mating frame 21 of the heat dissipating fan 20 is sleeved on the pivot 221 of the fixing frame 22 by the sleeve portion 212, and then the fixing frame 22 is sleeved on the outer periphery of the heat dissipating fin 230, and the cooling fan 20 and the mating frame 21 are disposed. And the fixing frame 22 is assembled on the heat radiating fin 230, and then the mating frame 21 is rotated to one side with respect to the fixing frame 22, and the fixing screw 233 is applied by a screwdriver 3 (refer to FIG. 4) to combine the heat sink 2 On the motherboard. Finally, the mating frame 21 is reversely rotated and stacked on the fixed frame 22, and the edge of the engaging portion 211 is engaged with the latching portion 223 of the elastic buckle 220. Therefore, the cooling fan 20 is stably disposed above the heat dissipation fin module 23 . As shown in the fourth figure, when the heat sink 2 is detached from the main board, the pulling portion 222 of the elastic buckle 220 is first applied to cause the elastic buckle 220 to open outward relative to the fixed frame 22. Therefore, the engaging portion 211 of the engaging frame 13 1305246 21 is disengaged from the slot of the elastic buckle 22 , and then the rotating bracket 21 ′ rotates the engaging frame 21 and the loose fan 2 至 to the fixed frame 22 . On the side, the fixing screw 233 can be exposed, and the fixing screw 2 3 3 can be unlocked from the main board by the screwdriver 3, so that the heat sink 2 can be detached from the main board. Purely known as the technology, the present invention is provided with an elastic buckle 220 on the side of the fixed frame 22, and in the corresponding mating portion 2U, the burial object is provided with a buckle on the side of the mouth 21~ side by the _ sex buckle 220 and buckle The heat sink fan 20 is assembled on the heat dissipation fin module 23, and the heat sink H 2 is mounted on the motherboard, and the gentleman is also removed from the motherboard. The elastic buckle 22n gentleman a soft 22G and the fastening portion 211 are unfastened, and the cooling fan 20 is removed, and the fixing screw 233 is fixed to the main board or the main board. Solve the heart 1 This 'the blade of the cooling fan 20 does not interfere with the screwdriver 3, you are good. </ RTI> </ RTI> </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; Equal changes and modifications are covered. 1305246 [Simple description of the diagram] The first figure is a three-dimensional combination diagram of a conventional heat sink set on a computer device. The second figure is a perspective view of a heat sink of a heat sink embodying the fixed structure of the heat radiating fan of the present invention. The third figure is a perspective exploded view of a heat sink embodying the fixing structure of the heat radiating fan of the present invention. The fourth figure is a schematic view of the heat sink in which the fixing structure of the heat radiating fan of the present invention is removed. [Main component symbol description] Heatsink 2 Cooling fan 20 Screw hole 200, 210 Mating frame 21 Fastening part 211 Fitting part 212 Opening 213 Fixing frame 22 Elastic snap 220 Pivot 221 15 1305246 Pulling part 222 Card slot 223 Cooling Fin module 23 heat sink fin 230 support frame 232 fixing screw 233 screwdriver 3 screw 4 16