TWI305012B - Apparatus for dry treating substrates and method of dry treating substrates - Google Patents

Apparatus for dry treating substrates and method of dry treating substrates Download PDF

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Publication number
TWI305012B
TWI305012B TW095115724A TW95115724A TWI305012B TW I305012 B TWI305012 B TW I305012B TW 095115724 A TW095115724 A TW 095115724A TW 95115724 A TW95115724 A TW 95115724A TW I305012 B TWI305012 B TW I305012B
Authority
TW
Taiwan
Prior art keywords
chamber
substrate
pressure
process gas
drying
Prior art date
Application number
TW095115724A
Other languages
English (en)
Chinese (zh)
Other versions
TW200644110A (en
Inventor
Tsutomu Kikuchi
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW200644110A publication Critical patent/TW200644110A/zh
Application granted granted Critical
Publication of TWI305012B publication Critical patent/TWI305012B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW095115724A 2005-05-19 2006-05-03 Apparatus for dry treating substrates and method of dry treating substrates TWI305012B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005146864A JP2006324506A (ja) 2005-05-19 2005-05-19 基板の乾燥処理装置及び乾燥処理方法

Publications (2)

Publication Number Publication Date
TW200644110A TW200644110A (en) 2006-12-16
TWI305012B true TWI305012B (en) 2009-01-01

Family

ID=37543957

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095115724A TWI305012B (en) 2005-05-19 2006-05-03 Apparatus for dry treating substrates and method of dry treating substrates

Country Status (3)

Country Link
JP (1) JP2006324506A (ko)
KR (1) KR100767001B1 (ko)
TW (1) TWI305012B (ko)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4965358B2 (ja) * 2007-06-25 2012-07-04 大日本スクリーン製造株式会社 基板処理装置
KR100876836B1 (ko) 2007-06-29 2009-01-07 주식회사 하이닉스반도체 반도체 소자의 제조 방법
KR100905161B1 (ko) * 2008-08-20 2009-06-29 주식회사 하이닉스반도체 반도체 소자의 제조 장치
JP5371605B2 (ja) * 2008-09-25 2013-12-18 東京エレクトロン株式会社 減圧乾燥装置及び減圧乾燥方法
KR101238858B1 (ko) * 2009-07-10 2013-03-04 에이펫(주) 진공 건조기 및 이를 이용한 건조 방법
KR101135081B1 (ko) 2010-02-04 2012-04-13 세메스 주식회사 기판 처리 장치 및 방법
JP5742114B2 (ja) * 2010-05-17 2015-07-01 日産自動車株式会社 乾燥方法及び乾燥装置
US10240867B2 (en) 2012-02-01 2019-03-26 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US10690413B2 (en) 2012-02-01 2020-06-23 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US10876792B2 (en) 2012-02-01 2020-12-29 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US9970708B2 (en) 2012-02-01 2018-05-15 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US11713924B2 (en) 2012-02-01 2023-08-01 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US10088230B2 (en) 2012-11-08 2018-10-02 Tekdry International, Inc. Dryer for portable electronics
JP6093172B2 (ja) * 2012-12-26 2017-03-08 株式会社Ｓｃｒｅｅｎホールディングス 減圧乾燥装置および減圧乾燥方法
WO2014153007A1 (en) 2013-03-14 2014-09-25 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
JP6998664B2 (ja) * 2017-03-23 2022-01-18 東京エレクトロン株式会社 ガスクラスター処理装置およびガスクラスター処理方法
JP2018157233A (ja) * 2018-07-03 2018-10-04 芝浦メカトロニクス株式会社 洗浄システム、および洗浄方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08283946A (ja) * 1995-04-13 1996-10-29 Canon Inc 堆積膜製造装置及び製造方法
JPH1064873A (ja) * 1996-08-22 1998-03-06 Kosho Seisakusho:Kk ワーク処理容器への気体導入装置
JPH10256220A (ja) * 1997-03-13 1998-09-25 Matsushita Electric Ind Co Ltd 基板の乾燥装置とその運転方法
JP2001156049A (ja) * 1999-11-30 2001-06-08 Seiko Epson Corp 有機物剥離装置及び有機物剥離方法
US6828588B2 (en) * 2000-07-12 2004-12-07 Mitsubishi Materials Corporation Protective film for FPD, vapor deposition material for protective film and its production method, FPD, and manufacturing device for FPD protective film
JP4331443B2 (ja) * 2002-07-09 2009-09-16 平田機工株式会社 基板処理装置
JP3892787B2 (ja) * 2002-09-26 2007-03-14 大日本スクリーン製造株式会社 基板処理装置
JP4085870B2 (ja) * 2003-04-02 2008-05-14 株式会社日立ハイテクサイエンスシステムズ 微細構造乾燥法とその装置及びそのシステム

Also Published As

Publication number Publication date
TW200644110A (en) 2006-12-16
KR100767001B1 (ko) 2007-10-12
JP2006324506A (ja) 2006-11-30
KR20060120427A (ko) 2006-11-27

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